CN116080214A - White copper-clad plate for LED and preparation method thereof - Google Patents

White copper-clad plate for LED and preparation method thereof Download PDF

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Publication number
CN116080214A
CN116080214A CN202211409253.5A CN202211409253A CN116080214A CN 116080214 A CN116080214 A CN 116080214A CN 202211409253 A CN202211409253 A CN 202211409253A CN 116080214 A CN116080214 A CN 116080214A
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China
Prior art keywords
parts
resin
clad plate
led
copper
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CN202211409253.5A
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Chinese (zh)
Inventor
王丽亚
栾好帅
刘俊秀
史晓杰
秦伟峰
李凌云
刘政
付军亮
徐凤
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SHANDONG JINBAO ELECTRONICS CO Ltd
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SHANDONG JINBAO ELECTRONICS CO Ltd
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Priority to CN202211409253.5A priority Critical patent/CN116080214A/en
Publication of CN116080214A publication Critical patent/CN116080214A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
    • B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
    • B29B15/10—Coating or impregnating independently of the moulding or shaping step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B29C70/44—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using isostatic pressure, e.g. pressure difference-moulding, vacuum bag-moulding, autoclave-moulding or expanding rubber-moulding
    • B29C70/443—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using isostatic pressure, e.g. pressure difference-moulding, vacuum bag-moulding, autoclave-moulding or expanding rubber-moulding and impregnating by vacuum or injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D7/00—Producing flat articles, e.g. films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/416—Reflective
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
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    • B32—LAYERED PRODUCTS
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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Abstract

The invention belongs to the technical field of copper-clad plates, and particularly relates to a white copper-clad plate for an LED and a preparation method thereof, wherein the raw material components comprise 40-60 parts of resin, 3-7 parts of curing agent, 0.05-0.10 part of catalyst, 90-11 parts of filler and 180-200 parts of solvent; the resin comprises bisphenol A type No Fu Lake resin, and the filler comprises aluminum hydroxide and/or titanium dioxide. The glue solution component of the copper-clad plate uses bisphenol A type No Fu Lake resin as main resin, the crosslinking density of a cured product is high, tg is correspondingly improved, the heat resistance and chemical resistance are correspondingly improved, the proportion of the resin is increased by adding BT resin, the thermosetting property is improved, and meanwhile, the copper-clad plate has higher reflectivity, the luminous efficiency is improved, and the service life of a product is further prolonged.

Description

White copper-clad plate for LED and preparation method thereof
Technical Field
The invention relates to a white copper-clad plate for an LED and a preparation method thereof, and belongs to the technical field of copper-clad plates.
Background
Light Emitting Diodes (LEDs) have been recently being a new green light source product, being a wave of research in the global world, and LED technology is actively developed and market is being developed in various countries of the world. The LED product is widely applied to our life, and the characteristics of high energy conservation and high luminous efficiency are widely applied to the fields of illumination, indication, decoration and the like. The LED product structure is formed by directly attaching a light-emitting element to an electrode of a PCB and then packaging the light-emitting element with resin. As a base material for mounting components, a copper-clad plate is an important component. The traditional copper-clad plate base material is mostly transparent, is easy to transmit light and has no light reflection function, and light can transmit from the back of the plate, so that energy is wasted, the brightness is reduced, and the luminous efficiency and the service life of a product are greatly influenced.
Therefore, the copper-clad plate which is not easy to transmit light and even has a reflecting function is provided, and the technical problem which is needed to be solved by the technicians in the field is solved.
Disclosure of Invention
Aiming at the problems that the existing copper-clad plate is mostly transparent, light transmission is quite easy, and the light reflection function is not achieved, the white copper-clad plate for the LED and the preparation method thereof are provided, component materials different from the existing copper-clad plate are adopted, bisphenol A type No Fu Lake resin is used as main resin, the heat resistance, chemical resistance and the like of Tg and plates are improved, the thermosetting property is improved, meanwhile, the high reflectivity is achieved, and the service life of products is prolonged.
The technical scheme for solving the technical problems is as follows:
the white copper-clad plate for the LED comprises the following raw material components of 40-60 parts of resin, 3-7 parts of curing agent, 0.05-0.10 part of catalyst, 90-11 parts of filler and 180-200 parts of solvent; the resin comprises bisphenol A type No Fu Lake resin, and the filler comprises aluminum hydroxide and/or titanium dioxide.
Based on the technical scheme, the invention can also make the following improvements:
further, the resin also includes BT resin.
Further, the curing agent is diamino diphenyl sulfone curing agent, and the catalyst is imidazole.
Further, the solvent includes butanone and cyclohexanone.
The invention also provides a preparation method of the white copper-clad plate for the LED, which comprises the following steps:
(1) At normal temperature, adding 20-30 parts of bisphenol A type nor Fu Lake resin, 20-30 parts of BT resin, 3-7 parts of diaminodiphenyl sulfone, 53-67 parts of butanone solvent and 53-67 parts of cyclohexanone solvent into a container in parts by weight, and stirring to fully dissolve the components;
(2) Adding 0.05-0.10 part of imidazole into the mixed solution in the step (1) in parts by weight at normal temperature, and stirring to fully dissolve the imidazole;
(3) Adding 15-17 parts of aluminum hydroxide and 80-90 parts of titanium dioxide into the mixed solution in the step (2) in parts by weight, uniformly stirring, and fully emulsifying;
(4) Adding 18-25 parts of butanone solvent and 18-25 parts of cyclohexanone solvent into the mixed solution in the step (3) in parts by weight, regulating the viscosity, and uniformly stirring to obtain a glue solution;
(5) The glass fiber cloth is fully and uniformly soaked with the glue solution obtained in the step (4), and the prepreg (PP) is prepared by treatment;
(6) And (5) laminating the prepreg covered copper foil obtained in the step (5) to obtain the white copper-clad plate for the LED.
Further, in the step (5), the glue solution is uniformly distributed on the glass fiber cloth, and the glass fiber cloth is baked for 6-10min by an oven at 180-190 ℃ to obtain the prepreg.
Further, in the step (5), the appearance of the prepreg is uniform, and the gelling time of the prepreg is 120-130s.
Further, in the step (6), the obtained prepregs are stacked, copper foils are covered on two sides, hot pressing is carried out for 3 hours at the temperature of 160-210 ℃ under the pressure of 7-35MPa in a vacuum press, and heat preservation is carried out for 2 hours, so that the white copper-clad plate for the LED is obtained.
The invention has the advantages that: the glue solution component of the copper-clad plate is different from the component of the existing white copper-clad plate for LEDs, bisphenol A type No Fu Lake resin is used as main resin, the resin contains more than two epoxy groups, the crosslinking density of a cured product is high, tg is correspondingly improved, the heat resistance and the chemical resistance are correspondingly improved, and the use amount of the glue solution is about 30% of that of the common epoxy resin, so that a better comprehensive effect can be obtained. According to the invention, the BT resin is added to improve the resin proportion, so that the thermosetting property is improved, and meanwhile, the copper-clad plate has higher reflectivity, the luminous efficiency is improved, and the service life of the product is prolonged. The invention adopts main resin different from the existing white copper-clad plate, and the curing agent, the catalyst, the solvent and the filler are combined for proportioning, thereby providing another possibility for preparing the white copper-clad plate for the LED. The copper-clad plate provided by the invention has Tg (DSC) of >210 ℃, heat resistance of >10 minutes (288 ℃), T288 of >120 minutes, peel strength of >0.9N/mm, flame retardance reaching FV-0 level, water absorption of <0.10%, and excellent performance.
Detailed Description
The principles and features of the present invention are described below in connection with the following examples which are provided for the purpose of illustrating the invention and are not intended to limit the scope of the invention.
Example 1
A preparation method of a white copper-clad plate for an LED comprises the following steps:
(1) At normal temperature, adding 20 parts of bisphenol A type nor Fu Lake resin, 20 parts of BT resin, 3 parts of diaminodiphenyl sulfone, 53 parts of butanone solvent and 53 parts of cyclohexanone solvent into a container in parts by weight, and stirring to fully dissolve the components;
(2) Adding 0.05 part of imidazole into the mixed solution in the step (1) in parts by weight at normal temperature, and stirring to fully dissolve the imidazole;
(3) Adding 15 parts of aluminum hydroxide and 90 parts of titanium dioxide into the mixed solution obtained in the step (2) in parts by weight, uniformly stirring, and fully emulsifying;
(4) Adding 18 parts of butanone solvent and 18 parts of cyclohexanone solvent into the mixed solution obtained in the step (3) in parts by weight, regulating the viscosity, and uniformly stirring to obtain a glue solution; gel time 394s was measured.
(5) Completely and uniformly infiltrating the glass fiber cloth with the glue solution obtained in the step (4), and baking the glass fiber cloth for 10min by a 185 ℃ oven to obtain the PP with uniform appearance, controlling the PP gel time to 125s and the glue content to 59 percent;
(6) And (3) stacking 6 PP (polypropylene) prepared in the step (5) according to requirements, covering 18-micrometer copper foil on two sides, hot-pressing for 3 hours at the temperature of 160-210 ℃ under the pressure of 7-35MPa in a vacuum press, and preserving heat for 2 hours to obtain the white copper-clad plate for the LED.
Example 2
A preparation method of a white copper-clad plate for an LED comprises the following steps:
(1) At normal temperature, adding 25 parts of bisphenol A type nor Fu Lake resin, 25 parts of BT resin, 5 parts of diaminodiphenyl sulfone, 59 parts of butanone solvent and 59 parts of cyclohexanone solvent into a container in parts by weight, and stirring to fully dissolve the components;
(2) Adding 0.08 part of imidazole into the mixed solution in the step (1) in parts by weight at normal temperature, and stirring to fully dissolve the imidazole;
(3) Adding 16 parts of aluminum hydroxide and 85 parts of titanium dioxide into the mixed solution obtained in the step (2) in parts by weight, uniformly stirring, and fully emulsifying;
(4) Adding 20 parts of butanone solvent and 20 parts of cyclohexanone solvent into the mixed solution in the step (3) in parts by weight, regulating the viscosity, and uniformly stirring to obtain a glue solution; gel time 407s was measured.
(5) Completely and uniformly infiltrating the glass fiber cloth with the glue solution obtained in the step (4), and baking the glass fiber cloth for 8min by a 185 ℃ baking oven to obtain the PP with uniform appearance, controlling the PP gel time to 120s and the glue content to 57%;
(6) And (3) stacking 6 PP (polypropylene) prepared in the step (5) according to requirements, covering 18-micrometer copper foil on two sides, hot-pressing for 3h at 160-210 ℃ under 7-35MPa in a vacuum press, and preserving heat for 2h to obtain the white copper-clad plate for the LED.
Example 3
A preparation method of a white copper-clad plate for an LED comprises the following steps:
(1) At normal temperature, adding 27 parts of bisphenol A type nor Fu Lake resin, 27 parts of BT resin, 7 parts of diaminodiphenyl sulfone, 63 parts of butanone solvent and 63 parts of cyclohexanone solvent into a container in parts by weight, and stirring to fully dissolve the components;
(2) Adding 0.10 part of imidazole into the mixed solution in the step (1) in parts by weight at normal temperature, and stirring to fully dissolve the imidazole;
(3) Adding 17 parts of aluminum hydroxide and 80 parts of titanium dioxide into the mixed solution obtained in the step (2) in parts by weight, uniformly stirring, and fully emulsifying;
(4) Adding 25 parts of butanone solvent and 25 parts of cyclohexanone solvent into the mixed solution in the step (3) in parts by weight, regulating the viscosity, and uniformly stirring to obtain a glue solution; gel time 403s was measured.
(5) Completely and uniformly infiltrating the glass fiber cloth with the glue solution obtained in the step (4), and baking the glass fiber cloth for 6min by a 185 ℃ baking oven to obtain uniform PP appearance, controlling the PP gel time to 127s and the glue content to 56%;
(6) And (3) stacking 6 PP (polypropylene) prepared in the step (5) according to requirements, covering 18-micrometer copper foil on two sides, hot-pressing for 3h at 160-210 ℃ under 7-35MPa in a vacuum press, and preserving heat for 2h to obtain the white copper-clad plate for the LED.
Comparative example
A preparation method of a copper-clad plate comprises the following steps:
(1) Weighing the components of the glue solution according to the parts by weight: fully mixing and uniformly stirring 35 parts of aromatic epoxy resin, 39 parts of BT resin, 1 part of diaminodiphenyl sulfone, 70 parts of butanone solvent, 50 parts of cyclohexanone solvent, 0.12 part of imidazole, 20 parts of aluminum hydroxide and 100 parts of titanium pigment filler to obtain a glue solution;
(2) Completely and uniformly infiltrating the glass fiber cloth with the glue solution obtained in the step (1), and baking the glass fiber cloth for 5min by a baking oven at 200 ℃ to obtain the PP glue content of 63%;
(3) 2 PP prepared in the step (2) is overlapped according to the requirement, 18-micrometer copper foil is covered on two sides, and the white copper-clad plate for the LED can be obtained after hot pressing for 1.5 hours at the temperature of 150 ℃ under the pressure of 3MPa in a vacuum press.
The test method comprises the following steps:
(1) Dielectric constant: GB/T4722-2017-8.5;
(2) Dielectric loss (10G): GB/T4722-2017-8.5;
(3)Tg(DSC)：GB/T 4722-2017-6.7.1；
(4)T288：GB/T 4722-2017-6.11；
(5) Peel strength (N/mm): GB/T4722-2017-7.2.1;
(6) Flame retardancy: GB/T4722-2017-6.4.1;
(7) Water absorption (%): GB/T4722-20179.2.
The test experimental data of each example and comparative example are shown in table 1.
Table 1 test experimental data for each of examples and comparative examples
Test item Example 1 Example 2 Example 3 Comparative example
Dielectric constant 3.80 3.82 3.85 4.21
Dielectric loss (10G) 0.0062 0.0063 0.0064 0.011
Tg(DSC)/℃ 213 214 210 178
T288/min >120 >120 >120 60
Peel strength N/mm 1.07 1.03 0.98 0.63
Flame retardancy FV-0 FV-0 FV-0 FV-0
Water absorption (%) 0.08 0.08 0.08 0.13
288 ℃ heat resistant (min) 10 10 10 8
As can be seen by comparing the test experimental data in Table 1, the copper clad laminate Tg (DSC) >210 ℃ and heat resistance >10 minutes (288 ℃) and T288>120 minutes of examples 1-3, peel strength >0.9N/mm, flame retardance reaching FV-0 grade and water absorption <0.10%.
Examples 1 to 3 have significantly improved heat resistance, peel strength, tg, etc. as compared with comparative example 1, and other basic indices of examples 1 to 3 are also superior to those of comparative example 1. Therefore, the invention provides the novel copper-clad plate and the preparation method thereof, and compared with other copper-clad plates, the novel copper-clad plate has higher Tg and T288, and other indexes are not reduced.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.

Claims (8)

1. The white copper-clad plate for the LED is characterized by comprising the following raw material components of 40-60 parts of resin, 3-7 parts of curing agent, 0.05-0.10 part of catalyst, 90-11 parts of filler and 180-200 parts of solvent; the resin comprises bisphenol A type No Fu Lake resin, and the filler comprises aluminum hydroxide and/or titanium dioxide.
2. The white copper-clad plate for LED of claim 1, wherein said resin further comprises BT resin.
3. The white copper-clad laminate for LED of claim 1, wherein the curing agent is diamino diphenyl sulfone curing agent and the catalyst is imidazole.
4. The white copper-clad plate for LED of claim 1, wherein said solvent comprises butanone and cyclohexanone.
5. A method for producing a white copper-clad plate for LED according to any one of claims 1 to 4, comprising the steps of:
(1) At normal temperature, adding 20-30 parts of bisphenol A type nor Fu Lake resin, 20-30 parts of BT resin, 3-7 parts of diaminodiphenyl sulfone, 53-67 parts of butanone solvent and 53-67 parts of cyclohexanone solvent into a container in parts by weight, and stirring to fully dissolve the components;
(2) Adding 0.05-0.10 part of imidazole into the mixed solution in the step (1) in parts by weight at normal temperature, and stirring to fully dissolve the imidazole;
(3) Adding 15-17 parts of aluminum hydroxide and 80-90 parts of titanium dioxide into the mixed solution in the step (2) in parts by weight, uniformly stirring, and fully emulsifying;
(4) Adding 18-25 parts of butanone solvent and 18-25 parts of cyclohexanone solvent into the mixed solution in the step (3) in parts by weight, regulating the viscosity, and uniformly stirring to obtain a glue solution;
(5) The glass fiber cloth is fully and uniformly soaked with the glue solution obtained in the step (4), and the prepreg is prepared by treatment;
(6) And (5) laminating the prepreg covered copper foil obtained in the step (5) to obtain the white copper-clad plate for the LED.
6. The method according to claim 5, wherein in the step (5), the glue solution is uniformly distributed on the glass fiber cloth, and the glass fiber cloth is baked for 6-10min in an oven at 180-190 ℃ to obtain the prepreg.
7. The method of claim 6, wherein the prepreg gel time in step (5) is 120-130s.
8. The preparation method of the LED white copper-clad plate according to claim 5, wherein in the step (6), the obtained prepregs are stacked, copper foils are covered on two sides, and the white copper-clad plate for the LED is obtained by hot pressing for 3 hours at the temperature of 160-210 ℃ under the pressure of 7-35MPa in a vacuum press, and heat preservation for 2 hours.
CN202211409253.5A 2022-11-11 2022-11-11 White copper-clad plate for LED and preparation method thereof Pending CN116080214A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103562309A (en) * 2011-05-31 2014-02-05 三菱瓦斯化学株式会社 Resin composition, prepreg and laminate
CN109532150A (en) * 2018-11-03 2019-03-29 昌邑市创通电子科技有限公司 A kind of new and improved flexible copper clad substrate
CN110018613A (en) * 2018-01-09 2019-07-16 味之素株式会社 Resin combination

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103562309A (en) * 2011-05-31 2014-02-05 三菱瓦斯化学株式会社 Resin composition, prepreg and laminate
CN110018613A (en) * 2018-01-09 2019-07-16 味之素株式会社 Resin combination
CN109532150A (en) * 2018-11-03 2019-03-29 昌邑市创通电子科技有限公司 A kind of new and improved flexible copper clad substrate

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