CN1160764C - Dusting device for treatment of glass chip or chip - Google Patents
Dusting device for treatment of glass chip or chip Download PDFInfo
- Publication number
- CN1160764C CN1160764C CNB01124819XA CN01124819A CN1160764C CN 1160764 C CN1160764 C CN 1160764C CN B01124819X A CNB01124819X A CN B01124819XA CN 01124819 A CN01124819 A CN 01124819A CN 1160764 C CN1160764 C CN 1160764C
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- CN
- China
- Prior art keywords
- dedusting chamber
- ash
- top electrode
- handling equipment
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/427—Stripping or agents therefor using plasma means only
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- General Physics & Mathematics (AREA)
- Drying Of Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
Abstract
A dusting device for treatment of glass chip or chip comprises a lower electrode on which the glass substrate or wafer applied with a photoresist is placed, an upper electrode forming an electric field together with the lower electrode, a gas slit or gas pipe to supply a gas into the chambers, a safety lid producing a sealed atmosphere together with an outside wall, a power supply device to form an electric field on the upper electrode and lower electrode, an insulator interposed between the upper electrode and the outside wall of the chamber to prevent electric contact, and an evacuation outlet to discharge photoresist evaporated in the chambers outside of the chambers.
Description
Technical field
The present invention relates to a kind of device that is used to produce semiconductor device, and be particularly related to a kind of ash handling equipment that is used to handle glass substrate or wafer.
Background technology
On the wafer surface of producing semiconductor device, or on the glass substrate surface of production LCD, used the pattern that photoresist (photo-resist) forms functional film, wherein the pattern of film forms by developing method, and the photoresist that remains in then on wafer or the glass substrate surface is removed by the ash disposal process.
In recent years, used the plasma ash handling equipment, it makes their calcification and gaseous emission is arrived their vaporization outdoor to the etched part of photoresist plasma irradiating.If use this device, cleaning course can not damage and pollute untreated part, and cleaning process can be simplified, and is beneficial to the periphery cleaning.Thus, recently the plasma ash handling equipment is introduced into the process that is used for the substrate that Active Matrix LCD At uses of handling gradually.
Fig. 1 illustrates in general traditional ash handling equipment of the glass substrate that is used for LCD, and Fig. 2 is the cutaway view along I-I line intercepting among Fig. 1.
The traditional ash handling equipment that is used for the glass substrate of LCD is provided with a plurality of dedusting chamber 10 therein and is used for the transport sector (not shown) of transmission glass substrate 13 between dedusting chamber 10.Equally, on surge chamber (buffer chamber) 15 planes that are arranged between the dedusting chamber 10.Bottom electrode 17 is arranged in the dedusting chamber 10, and glass substrate 13 is installed on bottom electrode 17, is used for forming electric field with top electrode, and wherein top electrode will be described hereinafter.Glass substrate 13 is installed on the bottom electrode 17 by the insertion opening that is formed on dedusting chamber's 10 1 sides by transport sector.
In Fig. 1, the direction indication glass substrate 13 of arrow is inserted into direction of insertion in the dedusting chamber 10 by surge chamber 15.
To illustrate that below wherein photoresist 11 is applied on the surface of glass substrate 13 by using traditional ash handling equipment to realize the process of ash disposal.
At first, glass substrate 13 is inserted in the dedusting chamber 10, is used for by the transport sector (not shown), carries out ash disposal as transfer arm and handles, and be installed on the bottom electrode 17, and wherein photoresist 11 is applied on the surface of glass substrate 13.
Then, when the installation of glass substrate 13, transport sector is pulled out from dedusting chamber.Provide except that the air supply pipe 19a and the air supply part 19 of ash gas from being arranged on dedusting chamber 10 then, and be evenly distributed on the whole surface of top electrode 23 by distribution of gas dish (gas diffsion plate) 21.
Then, when power supply 25 closed a floodgate, electric field was formed between top electrode 23 and the bottom electrode 17, and gas the utmost point 23 (the dotted line direction among Fig. 2) on the direction of bottom electrode 17 is mobile from power on along electric field.As a result, be applied to glass substrate 13 lip-deep photoresists 11 and be vaporized, and outside exhaust outlet 27 is discharged into dedusting chamber 10.
In the drawings, Reference numeral 10a refers to the outer wall of dedusting chamber 10.
Yet, there is such problem, promptly above-mentioned traditional ash handling equipment itself is complicated, bulky and expensive.Especially, because the configuration of dedusting chamber is because surge chamber and restricted, thus be necessary to guarantee big relatively working space, and the internal structure complexity of dedusting chamber, and the production of device and cost are in a disadvantageous position.
Summary of the invention
The present invention in order to solve top problem, like this, an object of the present invention is just: by omitting the surge chamber between the dedusting chamber of being arranged in traditional ash handling equipment, simplify the structure of ash handling equipment.
Another object of the present invention is: improve space availability ratio by stacked dedusting chamber vertically, and by being connected the various device that uses before and after the ash disposal process, and can realize their continuous processing.
Another purpose of the present invention is: the outer wall by using dedusting chamber is as the top electrode of dedusting chamber, and the air supply source with slit or pipe shape is set, and simplifies total.
To achieve these goals, provide a kind of ash handling equipment, comprising: bottom electrode, the object of ash disposal is installed on the bottom electrode in dedusting chamber, wherein photoresist is applied on the object of ash disposal; Top electrode is used for forming electric field with described bottom electrode; Power supply, it is used for forming electric field between described top electrode and described bottom electrode; Wherein, described top electrode constitutes the last outer wall of dedusting chamber; And described ash handling equipment also comprises: air cleft, and it is arranged on the side in the described dedusting chamber and is positioned under the described top electrode, is used for from the air supply part air feed in described dedusting chamber, and wherein air supply part is arranged on outside the described dedusting chamber; Safety head, it is arranged on the described top electrode, is used for forming sealed environment with the outer wall of described dedusting chamber in described dedusting chamber; Insulator, it inserts between other outer walls of the last outer wall of the dedusting chamber that is made of described top electrode and described dedusting chamber, is used to prevent electrically contacting each other; And exhaust outlet, it is discharged into the photoresist of vaporizing in the described dedusting chamber outside the described dedusting chamber.
Wherein, described ash disposal to as if glass substrate.
Wherein, described ash disposal to as if wafer.
Wherein, utilize the tracheae device will supply in the described dedusting chamber except that ash gas from described air supply part.
Description of drawings
Embodiments of the invention will describe with reference to the accompanying drawings, wherein:
Fig. 1 shows the traditional ash handling equipment that is used for the glass of liquid crystal display substrate;
Fig. 2 is the cutaway view along I-I line intercepting among Fig. 1;
Fig. 3 shows the ash handling equipment that is used for the glass of liquid crystal display substrate of the present invention; And
Fig. 4 is the longitudinal sectional view that is used for the single ash handling equipment of glass of liquid crystal display substrate of the present invention.
Embodiment
Specify the present invention referring now to accompanying drawing.
In the following description, produce wafer in the semiconductor device be considered to the production LCD in the identical thing of glass substrate, like this, no longer explanation is used to handle the ash handling equipment of wafer.
Fig. 3 illustrates in general the ash handling equipment that is used for the glass of liquid crystal display substrate according to of the present invention.As shown in Figure 3, ash handling equipment of the present invention has the structure of vertically stacked.The surge chamber that omits in traditional ash handling equipment is feasible.Last dedusting chamber 100 and following dedusting chamber 101 are stacked continuously with such state, and promptly they are installed on the lifting frame (lift) 300, are used to open dedusting chamber and following dedusting chamber.For in little space, guaranteeing left and right working space, and before and after ash disposal is handled, by connecting the various device that uses as in etching process, cleaning process and the similar process, and can handle continuously, this structure is very favorable.
Reference numeral 200 and 201 refers to safety head, form sealed environment with the outer wall 100a and the 101a of dedusting chamber, and Reference numeral 400 refers to support.
Fig. 4 is the longitudinal sectional view of the unit ash handling equipment of Fig. 3.As shown in Figure 4, unit of the present invention ash handling equipment comprises: bottom electrode 117, glass substrate 113 is installed on it, and have the photoresist 111 that forms pattern and be applied on the glass substrate; Top electrode 123 is used for forming electric field with bottom electrode 117; Air cleft or tracheae 220 are used for air feed in dedusting chamber 100; Safety head 200 is arranged on the top electrode 123, is used for forming sealed environment with the outer wall 100a of dedusting chamber; Power supply 125 is used for forming electric field between top electrode 123 and bottom electrode 117; Insulator 210 inserts between the outer wall 100a of top electrode 123 and dedusting chamber, is used to prevent electrically contacting each other; With floss hole 127, the photoresist that is used for vaporizing in dedusting chamber is discharged into outside the described dedusting chamber 100.
Below the ash disposal process will be described, and wherein be applied to glass substrate 113 lip-deep photoresists 111 and remove by using ash handling equipment according to the present invention.
Ash handling equipment of the present invention has such shape, wherein has a plurality of dedusting chamber vertically stacked of same structure, and the ash disposal process of carrying out in unit dedusting chamber will be described hereinafter.
At first, glass substrate 113 inserts in the dedusting chamber 100, be used for carrying out the ash disposal process by transport sector device (not shown) such as transfer arm, and glass substrate 113 is installed on the bottom electrode 117, and wherein photoresist 111 is applied on the surface of glass substrate 113.
Then, when the installation of glass substrate 113, transport sector is pulled out from dedusting chamber 100.Then, except that the air supply part (not shown) of ash gas from being arranged on dedusting chamber 100 provides by air cleft 220, and on (the dotted arrow direction among Fig. 4) the whole surface in the dedusting chamber 100 that evenly distributes and the bottom of top electrode 123.
At this moment, air cleft 220 is formed on the outer wall of dedusting chamber 100, and can be replaced by tracheae.Like this, compare with traditional structure, air cleft 220 has simple structure, make except that ash gas and be applied to space between top electrode 123 and the bottom electrode 117 in phase, and in traditional structure, the distribution of gas dish is arranged on the top electrode 23 and removes ash gas with even distribution.
Then, when power supply 125 closed a floodgate, electric field was formed between top electrode 123 and the bottom electrode 117, and gas the utmost point 123 is mobile on the direction of bottom electrode 117 from power on along electric field.As a result, be applied to glass substrate 113 lip-deep photoresists 111 and be evaporated, and be discharged into outdoor by exhaust outlet 127.
In the drawings, insulator 210 is inserted between the outer wall 100a of top electrode 123 and dedusting chamber, is used to prevent electrically contacting each other.Because in the present invention, top electrode 123 is as the last outer wall of dedusting chamber 100, if two chambers contact with each other, the combined floodgate by power supply has prevented to form electric field between two electrodes 123 and 117.Insulating material is unrestricted, as long as it has common insulation function.
Equally, as mentioned above, safety head 200 is used for forming with the outer wall 100a of dedusting chamber 100 sealed environment of dedusting chamber.Safety head 200 is by forming with outer wall 100a identical materials, or has the intensity similar to outer wall 100a, and safety head 200 has the function that protection dedusting chamber 100 avoids external impact.It is not subjected to particular restriction.
Compare with conventional art, processing sequence has following difference.
(1) omitted surge chamber
Traditionally, because surge chamber flatly is arranged between separately the dedusting chamber, working in little space is difficult to realize, but according to the present invention, has omitted surge chamber, thereby can guarantee big relatively working space.
(2) dedusting chamber has the structure of vertically stacked
Traditionally, a plurality of dedusting chamber flatly are provided with, but according to the present invention, because omitted surge chamber, and a plurality of dedusting chamber are vertically stacked, can guarantee big relatively working space, and between ash disposal is handled or in the process after this, by the various device that uses in the connection processing process, can handle continuously.
(3) multifunctional electrodes
Traditionally, top electrode is arranged in the dedusting chamber separately, but according to the present invention, because top electrode has constituted an outer wall of dedusting chamber, so top electrode has caused the simplification of dedusting chamber's structure, also has the necessary function that forms electric field simultaneously.
(4) omit the distribution of gas dish
Traditionally, the distribution of gas dish is used for evenly distributing and removes ash gas, wherein removes ash gas and enters in the dedusting chamber from outside air supply source, but in the present invention, by air cleft or tracheae are set, and directly provide except that ash gas by a side of dedusting chamber and the bottom of top electrode, thus simplified structure.
As mentioned above, the preferred embodiments of the present invention relate to the ash handling equipment that is used for the glass of liquid crystal display substrate, although do not have shown in the drawingsly, the present invention can be as the ash handling equipment of process semiconductor wafers.Thus, except ash disposal object difference, structure, function and the advantage that causes are equal to each other together, so the ash handling equipment that is used to handle wafer will no longer be described.
According to ash handling equipment of the present invention, omit surge chamber and come simplified structure, improved space availability ratio by stacked dedusting chamber vertically, and,, can handle continuously by the various device that uses in the connection processing process by before and after handling in ash disposal.
Equally, according to the present invention, because the outside of dedusting chamber is as the top electrode of dedusting chamber, and the air supply source that is provided with slit or conduit types simplifies total, can realize cheap and has the ash handling equipment that improves treatment effeciency.
In short, ash handling equipment according to the present invention comprises: bottom electrode, glass substrate or wafer are installed on it, and wherein photoresist is applied on glass substrate or the wafer; Top electrode is used for forming electric field with described bottom electrode; Air cleft or tracheae are used for air feed in described dedusting chamber; Safety head is arranged on the described top electrode, is used for forming sealed environment with the outer wall of described dedusting chamber; Power supply is used for forming electric field between described top electrode and described bottom electrode; Insulator inserts between the outer wall of described top electrode and described dedusting chamber, is used to prevent electrically contacting each other; And floss hole, the photoresist that is used for vaporizing in described dedusting chamber is discharged into outside the described dedusting chamber.
The object of ash disposal is glass substrate preferably.
Equally, the object of ash disposal wafer preferably.
Equally, will be provided in the dedusting chamber from air supply part except that ash gas by the tracheae device.
Claims (4)
1. ash handling equipment comprises:
Bottom electrode (117) is equipped with the object (113) of ash disposal on the bottom electrode in dedusting chamber (100), wherein photoresist is applied on the object of ash disposal;
Top electrode (123) is used for forming electric field with described bottom electrode;
Power supply (125), it is used for forming electric field between described top electrode and described bottom electrode;
It is characterized in that,
Described top electrode constitutes the last outer wall of dedusting chamber; And
Described ash handling equipment also comprises:
Air cleft (220), it is arranged on the side in the described dedusting chamber and is positioned under the described top electrode, is used for from the air supply part air feed in described dedusting chamber, and wherein air supply part is arranged on outside the described dedusting chamber;
Safety head (200), it is arranged on the described top electrode, is used for forming sealed environment with the outer wall of described dedusting chamber in described dedusting chamber;
Insulator (210), it inserts between other outer walls (100a) of the last outer wall of the dedusting chamber that is made of described top electrode and described dedusting chamber, is used to prevent electrically contacting each other; With
Exhaust outlet (127), it is discharged into the photoresist of vaporizing in the described dedusting chamber outside the described dedusting chamber.
2. ash handling equipment according to claim 1 is characterized in that, described ash disposal to as if glass substrate.
3. ash handling equipment according to claim 1 is characterized in that, described ash disposal to as if wafer.
4. ash handling equipment according to claim 1 is characterized in that, utilizes the tracheae device will supply in the described dedusting chamber except that ash gas from described air supply part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR36457/2000 | 2000-06-29 | ||
| KR36457/00 | 2000-06-29 | ||
| KR1020000036457A KR20010044058A (en) | 2000-06-29 | 2000-06-29 | Ashing apparatus for processing glass substrate or waper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1342999A CN1342999A (en) | 2002-04-03 |
| CN1160764C true CN1160764C (en) | 2004-08-04 |
Family
ID=19674795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB01124819XA Expired - Fee Related CN1160764C (en) | 2000-06-29 | 2001-06-29 | Dusting device for treatment of glass chip or chip |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2002100619A (en) |
| KR (1) | KR20010044058A (en) |
| CN (1) | CN1160764C (en) |
| TW (1) | TW574730B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100683255B1 (en) * | 2005-08-11 | 2007-02-15 | 주식회사 래디언테크 | Plasma processing apparatus and exhausting device |
| KR100717866B1 (en) * | 2006-03-15 | 2007-05-14 | 주식회사 디엠에스 | Device for transfer of flat display panel |
| US10354844B2 (en) | 2017-05-12 | 2019-07-16 | Asm Ip Holding B.V. | Insulator structure for avoiding abnormal electrical discharge and plasma concentration |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59163827A (en) * | 1983-03-09 | 1984-09-14 | Toshiba Corp | Plasma etching device |
| JP2656511B2 (en) * | 1987-11-25 | 1997-09-24 | 株式会社日立製作所 | Plasma etching equipment |
| JP2550368B2 (en) * | 1987-11-25 | 1996-11-06 | 株式会社日立製作所 | Magnetic field plasma etching system |
| JP2797667B2 (en) * | 1990-07-13 | 1998-09-17 | 住友金属工業株式会社 | Plasma etching equipment |
| JP3113836B2 (en) * | 1997-03-17 | 2000-12-04 | 東京エレクトロン株式会社 | Plasma processing equipment |
| JP3598717B2 (en) * | 1997-03-19 | 2004-12-08 | 株式会社日立製作所 | Plasma processing equipment |
-
2000
- 2000-06-29 KR KR1020000036457A patent/KR20010044058A/en not_active Application Discontinuation
-
2001
- 2001-06-28 TW TW90115852A patent/TW574730B/en not_active IP Right Cessation
- 2001-06-29 JP JP2001197916A patent/JP2002100619A/en active Pending
- 2001-06-29 CN CNB01124819XA patent/CN1160764C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002100619A (en) | 2002-04-05 |
| KR20010044058A (en) | 2001-06-05 |
| CN1342999A (en) | 2002-04-03 |
| TW574730B (en) | 2004-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: WEIHAI DIANMEISHI OPTO-MECHATRONICS CO., LTD. Effective date: 20140227 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140227 Address after: Gyeonggi Do, South Korea Patentee after: D.M.S. Co., Ltd. Patentee after: Weihai dianmei Shiguang electromechanical Co Ltd Address before: Gyeonggi Do, South Korea Patentee before: D.M.S. Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040804 Termination date: 20190629 |