CN116053186A - Compatible wafer carrying platform device - Google Patents
Compatible wafer carrying platform device Download PDFInfo
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- CN116053186A CN116053186A CN202310141902.6A CN202310141902A CN116053186A CN 116053186 A CN116053186 A CN 116053186A CN 202310141902 A CN202310141902 A CN 202310141902A CN 116053186 A CN116053186 A CN 116053186A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a compatible wafer carrying table device which comprises a supporting table surface and a product carrying table, wherein the product carrying table is arranged at the middle position on the supporting table surface through a carrying table base, a plurality of supporting seats with arc structures are uniformly arranged on the supporting table surface on the outer side of the product carrying table along the circumferential direction, two leveling mechanisms are arranged on the supporting seats, one leveling mechanism is positioned on one side close to the product carrying table, and the other leveling mechanism is positioned on one side far away from the product carrying table. The invention fills up the blank of the design of the bare wafer loading platform device and the wafer belt processing platform device, and adds a smoothing mechanism to smooth the bare wafer and the wafer belt; according to the invention, different smoothing devices and adjustment can be selected according to the product warpage height and the product size, and disassembly and assembly are not required.
Description
Technical Field
The invention relates to the technical field related to wafer processing, in particular to a compatible wafer carrying platform device.
Background
Through the mass retrieval, discovery prior art publication number is CN217444361U, a quartzy rotatory adsorption carrier is disclosed, from last to including the quartzy carrier plate of cutting into, the quartz mounting panel, the carrier base, rotating electrical machines and rotation axis backing plate down in proper order, the intermediate position on the rotation axis backing plate is installed to the rotating electrical machines, the drive end at rotating electrical machines top is connected with the carrier base drive of top and is set up, install the quartz mounting panel on the carrier base, the quartzy carrier plate of cutting into is installed to the top inboard of quartz mounting panel, evenly install a plurality of sucking disc support along the circumferencial direction on the carrier base, install the sucking disc on the sucking disc support. The invention provides a carrying platform for adsorbing and fixing a processed product by wafer cutting equipment, solves the problem of adsorption flatness, firmly adsorbs the product and has uniform adsorption force, and simultaneously provides an illumination light source, improves the positioning accuracy by matching a backlight with an image, and greatly improves the positioning accuracy by matching a rotating shaft with a grating ruler system.
In the current market, the processing carriers of bare wafers (8 inch and 12 inch) and wafer strips Fame (8 inch wafer strips and 12inch wafer strips) correspond to different product sizes and product warping modes, taking the wafer strips Fame as an example, most of the processing carriers are subjected to back cutting and front pressing plates, the processing carriers and the pressing plates are replaced to be mainly used, and the wafer products are mainly subjected to precise processing technologies such as grooving, trimming and the like in the laser processing process, and the operation is convenient, so that the following problems exist in the above modes:
in the process of replacing the carrier according to products with different sizes, as the requirements of the processing technology of the wafer products are strict, the perpendicularity of a processing light path and the processing carrier device is less than 0.01mm, and the flatness change can be caused after the processing carrier device is disassembled, and an included angle can appear between the processing light path and a corrected cutting light path, so that the flatness of the processing carrier device and the perpendicularity of the processing light path are corrected again after the actual size of the product is measured according to an image system after trial cutting is required. Therefore, the wafer products are switched to different types or series of products in the production process, the device is long in disassembly and assembly time, the correction workload is large, and the product processing batch is poor under the condition that operators miss or miss.
And forming a vacuum loop area between a main product and a carrying table surface in the processing of the bare wafer, and countering warping by forming pressure difference on two sides of the product. In the wafer tape Fame processing, the influence of Fame warpage on wafer processing is prevented, so that not only wafer warpage but also Fame warpage is to be dealt with, and the wafer tape Fame processing cannot be satisfied only by vacuum adsorption. Since the connection between the wafer and Fame is mainly through a layer of adhesive blue film, there is no rigidity of the connection. So processing is mainly carried out through the bottom in the current market, and the front is smooth the mode to Fame through the clamp plate, but the clamp plate mode smooths the warpage, can make wafer processing carrier device mechanism complicated, and personnel get and put the product inconvenient, maintenance and change of product model consume too much manpower and time, do not have the real-time observation processing simultaneously, cut optical state, to unusual processing inspection trouble etc..
In view of the above-mentioned drawbacks, the present inventors have actively studied and innovated to create a compatible wafer stage device, which has a more industrially useful value.
Disclosure of Invention
In order to solve the above technical problems, an object of the present invention is to provide a compatible wafer stage device.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the utility model provides a compatible wafer carrier device, includes supporting mesa and product carrier, and the product carrier passes through the intermediate position of carrier base installation on supporting mesa, evenly is provided with the supporting seat of a plurality of arc structure along the circumferencial direction on the supporting mesa in the product carrier outside, installs two on the supporting seat and smoothes the mechanism, and one of them smoothes the mechanism and lies in one side that is close to the product carrier, and another smoothes the mechanism and lies in one side that keeps away from the product carrier.
As a further improvement of the invention, the leveling mechanism comprises a cylinder mounting base plate, a lifting cylinder and a pressing plate, wherein the lifting cylinder is mounted on the supporting seat through the cylinder mounting base plate, a piston rod at the top of the lifting cylinder is connected with the pressing plate above, and the pressing plate can be in contact with the edge of the product carrier or the edge of the supporting seat.
As a further development of the invention, the first side of the pressure plate is connected to the lower piston rod by means of a first connecting arm mechanism, and the second side of the pressure plate is connected to the lower cylinder mounting base plate and the piston rod by means of a second connecting arm mechanism.
As a further improvement of the invention, the first connecting arm mechanism comprises a first connecting block and a second connecting block, the piston rod is connected with the first connecting block above, the first side of the first connecting block is connected with the second connecting block above through a rotating shaft, and the second connecting block is connected with the first side of the pressing plate above through the rotating shaft; the second connecting arm mechanism comprises a third connecting block and a fourth connecting block, the second side of the pressing plate is connected with the first side of the third connecting block below through a rotating shaft, the middle part of the third connecting block is connected with the fourth connecting block below through a rotating shaft, the fourth connecting block is connected with the second side of the first connecting block below through a rotating shaft, and the second side of the third connecting block is connected with the cylinder mounting substrate below through a rotating shaft.
As a further improvement of the invention, the bottom of the cylinder mounting substrate is also provided with a substrate adjusting block, the substrate adjusting block is arranged on the supporting seat, and the substrate adjusting block is connected with the cylinder mounting substrate above through a plurality of substrate adjusting screws.
As a further improvement of the invention, the outer side of the product carrying platform is uniformly provided with four supporting seats with arc structures along the circumferential direction.
As a further development of the invention, the smoothing mechanism close to the product carrier is located at a side position on the support base, and the other smoothing mechanism far from the product carrier is located at an intermediate position on the support base.
By means of the scheme, the invention has at least the following advantages:
1. the invention fills up the blank of the design of the bare wafer loading platform device and the wafer belt processing platform device, and adds a smoothing mechanism to smooth the bare wafer and the wafer belt;
2. according to the invention, different smoothing devices and adjustment can be selected according to the product warpage height and the product size, and disassembly and assembly are not required;
3. the invention is compatible with the processing of multiple products with multiple sizes, is convenient for the processing and the changing of the switching equipment, and saves the labor cost;
4. the invention avoids repeated debugging and repeated work, has simple structure and lower cost, is convenient for personnel to maintain and improves the working efficiency.
The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a compatible wafer carrier apparatus according to the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic view of the smoothing mechanism of FIG. 1 or FIG. 2;
FIG. 4 is a schematic view of a part of the structure of the product carrier, the support base and the smoothing mechanism in the normal state of the invention;
FIG. 5 is a schematic view of the smoothing mechanism of FIG. 4;
FIG. 6 is a schematic view of a partial structure of the product carrier, support base and smoothing mechanism in the working state of the invention;
FIG. 7 is a schematic view of the smoothing mechanism of FIG. 6.
In the drawings, the meaning of each reference numeral is as follows.
The support table top 1, the carrier base 2, the product carrier 3, the support seat 4, the leveling mechanism 5, the air cylinder mounting substrate 6, the substrate adjusting block 7, the substrate adjusting screw 8, the lifting air cylinder 9, the piston rod 10, the first connecting block 11, the second connecting block 12, the pressing plate 13, the third connecting block 14, the fourth connecting block 15 and the rotating shaft 16.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
In order to make the present invention better understood by those skilled in the art, the following description will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present invention.
Examples
As shown in figures 1 to 7 of the drawings,
the utility model provides a compatible wafer carrier device, includes supporting table face 1 and product carrier 3, and product carrier 3 passes through the intermediate position of platform base 2 installation on supporting table face 1, evenly is provided with the supporting seat 4 of a plurality of arc structure along circumferencial direction on the supporting table face 1 in the product carrier 3 outside, installs two on the supporting seat 4 and smoothes mechanism 5, and one of them smoothes mechanism 5 and is located the one side that is close to product carrier 3, and another smoothes mechanism 5 and is located the one side that keeps away from product carrier 3. Wherein the smoothing mechanism 5 close to the product carrier 3 is located at a side position on the support base 4, and the other smoothing mechanism 5 far from the product carrier 3 is located at an intermediate position on the support base 4.
Specific explanation of the smoothing mechanism 5:
the leveling mechanism 5 comprises an air cylinder mounting substrate 6, a lifting air cylinder 9 and a pressing plate 13, wherein the lifting air cylinder 9 is mounted on the supporting seat 4 through the air cylinder mounting substrate 6, a piston rod 10 at the top of the lifting air cylinder 9 is connected with the pressing plate 13 above, and the pressing plate 13 can be in contact with the edge of the product carrying table 3 or the edge of the supporting seat 4. The bottom of cylinder mounting base plate 6 still is provided with base plate regulating block 7, and base plate regulating block 7 installs on supporting seat 4, and base plate regulating block 7 is connected with cylinder mounting base plate 6 of top through a plurality of base plate adjusting screw 8.
The first side of the pressing plate 13 is connected to the piston rod 10 below through a first connecting arm mechanism, and the second side of the pressing plate 13 is connected to the cylinder mounting substrate 6 below and the piston rod 10 through a second connecting arm mechanism. The first connecting arm mechanism comprises a first connecting block 11 and a second connecting block 12, the piston rod 10 is connected with the first connecting block 11 above, the first side of the first connecting block 11 is connected with the second connecting block 12 above through a rotating shaft 16, and the second connecting block 12 is connected with the first side of the pressing plate 13 above through the rotating shaft 16; the second connecting arm mechanism comprises a third connecting block 14 and a fourth connecting block 15, the second side of the pressing plate 13 is connected with the first side of the third connecting block 14 below through a rotating shaft 16, the middle part of the third connecting block 14 is connected with the fourth connecting block 15 below through the rotating shaft 16, the fourth connecting block 15 is connected with the second side of the first connecting block 11 below through the rotating shaft 16, and the second side of the third connecting block 14 is connected with the cylinder mounting substrate 6 below through the rotating shaft 16.
Referring to fig. 1-2, a compatible wafer stage apparatus includes a support table 1, a product stage 3, and a support base 4. The main characteristics are as follows: the product carrying platform 3 is fixed on the supporting table board 1 through bolts, so that the assembly device is fixed on a motion shaft of the equipment, and the whole breadth of the product is processed by matching with other shafts of the equipment. The product carrier 3 is used for supporting processed products, is compatible with 8inch and 12inch bare wafers and 8inch wafer belts, is fixed to the products through the adsorption grooves, and forms a vacuum cavity between the adsorption grooves and the products to cope with warping of the wafer products. The support base 4 is used for supporting 12inch wafer tape products, and simultaneously fixing the smoothing mechanism 5. The smoothing mechanism 5 is used for coping with the warp of the wafer tape of the processed product.
The lifting cylinder 9 of the smoothing mechanism 5 is fixed on the supporting seat 4 through the cylinder mounting substrate 6, and meanwhile, the device buffer cushion is fixed on the piston rod 10 of the lifting cylinder 9 and used for absorbing vibration generated by movement of the lifting Z device, so that the movement silencing effect of the lifting Z device is realized. The first connecting arm mechanism and the second connecting arm mechanism are fixed on the lifting cylinder 9 and the cylinder mounting substrate 6 serving as main bodies through a hinge structure mode, and the first connecting block 11, the second connecting block 12, the third connecting block 14 and the fourth connecting block 15 can all realize two-degree-of-freedom movement through the rotation of the rotating shaft 16 and the mutual limit matching mode of the pressing plate 13. As shown in fig. 4 and 5, in a normal state, when the piston rod 10 of the lifting cylinder 9 is in a retracted state, the first connection block 11, the second connection block 12, the third connection block 14 and the fourth connection block 15 form an angle as shown in fig. 4 and 5, and the pressing plate 13 forms an included angle with the horizontal direction, so that products are prevented conveniently and unnecessary collision is not generated.
As shown in fig. 6 and 7, in the working state, when the piston rod 10 of the lifting cylinder 9 is in the extended state, the first connection block 11, the second connection block 12, the third connection block 14 and the fourth connection block 15 form an angle as shown in fig. 6 and 7, and the pressing plate 13 is parallel to the horizontal direction or forms a negative included angle, so that the warping of the wafer belt can be completely smoothed.
The substrate adjusting block 7 and the substrate adjusting screw 8 are mainly adjusted to lift the air cylinder 9, and the warping heights of products with different thicknesses can be dealt with according to the horizontal heights of the pressing plate 13, the product carrying table 3 and the supporting seat 4. As shown in fig. 6 and 7, in the working state of the leveling mechanism 5, the pressing plate 13 is in surface contact with the product carrier 3 and the support base 4.
The invention can realize two series of bare wafers (8 inch and 12 inch) and wafer belts (8 inch and 12 inch), and four products are compatible to be processed, and other types of products are processed, so that after the carrier is corrected to be vertical to the optical path cutting at one time, a series of problems of the carrier is not required to be replaced at a later stage, the perpendicularity and the like are corrected again, and unnecessary property loss caused by bad batch processing of the products is avoided.
The invention mainly solves the processing compatibility of the wafer belts (8 inch and 12 inch) and the problem of complicated warping and smoothing of the wafer belts, and the simple mechanical smoothing device is used for carrying out sectional smoothing on the situation that the wafer belts warp at different heights and cannot be thick, so that the process of processing the wafer is prevented from being influenced by the warping of the wafer belts, the front same side of a processing and smoothing mechanism is realized, the manual product taking and placing of a product is facilitated, the working condition of equipment is debugged, the processing state and the processing precision of the equipment are observed, the processing performance is corrected in time, the manufacturing cost of the equipment is reduced, the structure of the equipment is simplified, the maintenance and the maintenance of later personnel are facilitated, the working efficiency of the equipment is improved, and the processing capacity of the equipment is improved.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features being indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected: can be mechanically or electrically connected: the terms are used herein to denote any order or quantity, unless otherwise specified.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims (7)
1. The utility model provides a compatible wafer carrier device, includes supporting table (1) and product carrier (3), product carrier (3) are installed through carrier base (2) intermediate position on supporting table (1), a serial communication port, evenly be provided with supporting seat (4) of a plurality of arc structure along the circumferencial direction on supporting table (1) in product carrier (3) outside, install two on supporting seat (4) and smooth mechanism (5), one of them smooth mechanism (5) are located one side near product carrier (3), another smooth mechanism (5) are located one side of keeping away from product carrier (3).
2. A compatible wafer carrier apparatus according to claim 1, wherein the leveling mechanism (5) comprises a cylinder mounting base plate (6), a lifting cylinder (9) and a pressing plate (13), the lifting cylinder (9) is mounted on the supporting seat (4) through the cylinder mounting base plate (6), a piston rod (10) at the top of the lifting cylinder (9) is connected with the pressing plate (13) above, and the pressing plate (13) can be in contact with the edge of the product carrier (3) or the edge of the supporting seat (4).
3. A compatible wafer carrier apparatus according to claim 2, characterized in that a first side of the pressure plate (13) is connected to the lower piston rod (10) by means of a first connecting arm mechanism, and a second side of the pressure plate (13) is connected to the lower cylinder mounting substrate (6) and the piston rod (10) by means of a second connecting arm mechanism.
4. A compatible wafer carrier apparatus according to claim 3, characterized in that the first connection arm mechanism comprises a first connection block (11) and a second connection block (12), the piston rod (10) is connected to the first connection block (11) above, a first side of the first connection block (11) is connected to the second connection block (12) above by a rotation shaft (16), and the second connection block (12) is connected to a first side of the pressure plate (13) above by a rotation shaft (16); the second connecting arm mechanism comprises a third connecting block (14) and a fourth connecting block (15), wherein the second side of the pressing plate (13) is connected with the first side of the third connecting block (14) below through a rotating shaft (16), the middle part of the third connecting block (14) is connected with the fourth connecting block (15) below through the rotating shaft (16), the fourth connecting block (15) is connected with the second side of the first connecting block (11) below through the rotating shaft (16), and the second side of the third connecting block (14) is connected with the cylinder mounting substrate (6) below through the rotating shaft (16).
5. The compatible wafer carrier apparatus of claim 2, wherein a substrate adjusting block (7) is further provided at the bottom of the cylinder mounting substrate (6), the substrate adjusting block (7) is mounted on the supporting base (4), and the substrate adjusting block (7) is connected with the cylinder mounting substrate (6) above through a plurality of substrate adjusting screws (8).
6. A compatible wafer carrier apparatus as claimed in claim 1, characterized in that the outer side of the product carrier (3) is provided with four support seats (4) of arcuate configuration uniformly along the circumferential direction.
7. A compatible wafer carrier apparatus according to claim 1, wherein the leveling mechanism (5) close to the product carrier (3) is located at a side position on the support base (4), and the other leveling mechanism (5) far from the product carrier (3) is located at an intermediate position on the support base (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310141902.6A CN116053186A (en) | 2023-02-21 | 2023-02-21 | Compatible wafer carrying platform device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310141902.6A CN116053186A (en) | 2023-02-21 | 2023-02-21 | Compatible wafer carrying platform device |
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| CN116053186A true CN116053186A (en) | 2023-05-02 |
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| CN202310141902.6A Pending CN116053186A (en) | 2023-02-21 | 2023-02-21 | Compatible wafer carrying platform device |
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| CN (1) | CN116053186A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116544175A (en) * | 2023-07-07 | 2023-08-04 | 芯达半导体设备(苏州)有限公司 | Compatible clamping and wafer sweeping mechanism for multiple wafers |
-
2023
- 2023-02-21 CN CN202310141902.6A patent/CN116053186A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116544175A (en) * | 2023-07-07 | 2023-08-04 | 芯达半导体设备(苏州)有限公司 | Compatible clamping and wafer sweeping mechanism for multiple wafers |
| CN116544175B (en) * | 2023-07-07 | 2023-09-12 | 芯达半导体设备(苏州)有限公司 | Compatible clamping and wafer sweeping mechanism for multiple wafers |
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