CN116043310A - Horizontal electroplating device with ultrasonic assembly - Google Patents

Abstract

The invention relates to the technical field of electroplating devices, in particular to a horizontal electroplating device with an ultrasonic assembly. Mainly comprises an upper anode box, a lower anode box and an electroplating bath. Wherein, be provided with first positive pole subassembly and first ultrasonic wave subassembly in the last positive pole box, first ultrasonic wave subassembly sets up the top at first positive pole subassembly. The lower anode box is internally provided with a second anode component and a second ultrasonic component, and the second ultrasonic component is arranged below the second anode component. Electrolyte is contained in the electroplating bath, the upper anode box and the lower anode box are both placed in the electroplating bath, a containing space for containing plates is formed between the upper anode box and the lower anode box, and the plates can move in the containing space. The horizontal electroplating device with the ultrasonic assembly is simple in structure, can improve the uniformity of a plating layer on a product to be electroplated, improves the quality and yield of the product to be electroplated, and saves the cost.

Description

Horizontal electroplating device with ultrasonic assembly

Technical Field

The invention relates to the technical field of electroplating devices, in particular to a horizontal electroplating device with an ultrasonic assembly.

Background

At present, an anode of an electroplating device is set as an insoluble anode under most conditions, and in the electroplating process, because the insoluble anode is used, electrolyte in an anode region is electrolyzed to separate out oxygen, oxygen bubbles are formed in the electroplating liquid, the bubbles slowly grow along with the time, the oxygen bubbles can move to a cathode region, the surface coating of a piece to be plated in the cathode region is easy to cause cavities, and then the phenomenon of uneven electroplating is caused, so that the quality and the yield of a product to be electroplated are influenced.

In the prior art, bubbles are gradually floated and burst through natural pressure difference under normal atmospheric pressure, so that the burst rate of the bubbles is slow and the efficiency is low, and the uniformity of the electroplated product is affected.

Therefore, there is a need to design a horizontal electroplating device with an ultrasonic assembly to solve the above technical problems.

Disclosure of Invention

The invention aims to provide a horizontal electroplating device with an ultrasonic assembly, which has a simple structure, can improve the uniformity of a plating layer on a product to be electroplated, improves the quality and yield of the product to be electroplated, and saves the cost.

To achieve the purpose, the invention adopts the following technical scheme:

the present invention provides a horizontal electroplating device with an ultrasonic assembly, comprising:

the upper anode box is internally provided with a first anode assembly and a first ultrasonic assembly, and the first ultrasonic assembly is arranged above the first anode assembly;

the lower anode box is internally provided with a second anode assembly and a second ultrasonic assembly, and the second ultrasonic assembly is arranged below the second anode assembly;

plating bath, electrolyte has been held in the plating bath, go up the positive pole box with lower positive pole box is all placed in the plating bath, just go up the positive pole box with form the accommodation space that is used for holding the sheet material between the positive pole box down, the sheet material can be in the accommodation space internal motion.

As an alternative solution of the horizontal plating apparatus having the ultrasonic assembly, the first anode assembly includes a first insoluble anode, the first ultrasonic assembly is disposed directly above the first insoluble anode, and the first ultrasonic assembly is capable of emitting ultrasonic waves to break bubbles on the first insoluble anode.

As an alternative technical scheme of the horizontal electroplating device with the ultrasonic assembly, a first groove is formed in the inner wall of the upper anode box, and the side edge of the first ultrasonic assembly is embedded in the first groove.

As an alternative technical scheme of the horizontal electroplating device with the ultrasonic assemblies, a plurality of first ultrasonic assemblies are arranged, and the plurality of first ultrasonic assemblies are uniformly distributed right above the first insoluble anode.

As an alternative solution of the horizontal electroplating device with the ultrasonic assembly, the first anode assembly further includes a first ionic membrane, the first ionic membrane is disposed directly below the first insoluble anode, and the first ionic membrane is used for penetrating metal ions.

As an alternative technical scheme of the horizontal electroplating device with the ultrasonic assembly, the first anode assembly further comprises a first shielding plate, a plurality of first through holes are formed in the first shielding plate, and the first shielding plate is arranged under the first ionic membrane.

As an alternative to a horizontal plating apparatus having an ultrasonic assembly, the frequencies of the first ultrasonic assembly and the second ultrasonic assembly are set to 25KHz-130KHz.

As an alternative to the horizontal plating apparatus having the ultrasonic wave assembly, at least one of the upper anode casing and the lower anode casing is provided with an inclined surface along which at least one of a part of the first anode assembly or a part of the second anode assembly is inclined.

As an alternative technical scheme of the horizontal electroplating device with the ultrasonic assembly, the horizontal electroplating device with the ultrasonic assembly further comprises a first spray pipe and a second spray pipe, wherein the first spray pipe and the second spray pipe are respectively arranged on two sides of a plate material, and the first spray pipe and the second spray pipe are symmetrically arranged relative to the plate material.

As an alternative solution of the horizontal plating apparatus with an ultrasonic assembly, the horizontal plating apparatus with an ultrasonic assembly further includes a clamp for clamping the plate material.

The beneficial effects of the invention at least comprise:

the invention provides a horizontal electroplating device with an ultrasonic assembly, which mainly comprises an upper anode box, a lower anode box and an electroplating bath. Wherein, be provided with first positive pole subassembly and first ultrasonic wave subassembly in the last positive pole box, first ultrasonic wave subassembly sets up the top at first positive pole subassembly. The lower anode box is internally provided with a second anode component and a second ultrasonic component, and the second ultrasonic component is arranged below the second anode component. Electrolyte is contained in the electroplating bath, the upper anode box and the lower anode box are both placed in the electroplating bath, a containing space for containing plates is formed between the upper anode box and the lower anode box, and the plates can move in the containing space. By additionally arranging the first ultrasonic assembly and the second ultrasonic assembly respectively in the upper anode box and the lower anode box, when ultrasonic waves pass through bubbles, on one hand, the bubbles are subjected to great sound pressure effect due to the effect of compressing substance molecules in liquid by sound wave vibration, and the pressure can reach 0.3MPa-1MPa generally. Before the bubbles are subjected to the action of ultrasonic waves, the bubbles are only subjected to atmospheric pressure, after the ultrasonic waves are applied to the bubbles, the ultrasonic waves vibrate to compress the bubbles, the pressure born by the bubbles is increased, and the bubbles are promoted to be broken. On the other hand, ultrasonic vibration can break up bubbles, so that the bubbles are sparse and do not come together, and the pressure of the bubbles can be made smaller than the atmospheric pressure to expand and collapse. In addition, the ultrasonic waves emitted by the first ultrasonic assembly and the second ultrasonic assembly provide energy for the electrolyte, so that molecules and ions in the liquid medicine generate certain acceleration, the kinetic energy of the molecules and the ions is increased, the mass transfer efficiency of the electrolyte is improved, and metal ions generated after the molecules in the electrolyte are ionized can reach a cathode region as soon as possible and are electroplated and attached on a plate material, so that the electroplating efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following description will briefly explain the drawings needed in the description of the embodiments of the present invention, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the contents of the embodiments of the present invention and these drawings without inventive effort for those skilled in the art.

Fig. 1 is a schematic structural diagram of a horizontal electroplating apparatus with an ultrasonic assembly according to an embodiment of the present invention.

Reference numerals

100. An upper anode box; 110. a first anode assembly; 120. a first ultrasonic assembly; 130. a first insoluble anode; 140. a first ionic membrane; 150. a first shutter; 1501. a first through hole;

200. a lower anode box; 210. a second anode assembly; 220. a second ultrasonic assembly; 230. a second insoluble anode; 240. a second ionic membrane; 250. a second shutter; 2501. a second through hole; 260. an inclined surface;

300. plate material; 400. a first nozzle; 500. a second nozzle; 600. a clamp; 700. and (5) air bubbles.

Detailed Description

In order to make the technical problems solved, the technical scheme adopted and the technical effects achieved by the invention more clear, the technical scheme of the invention is further described below by a specific embodiment in combination with the attached drawings.

In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

As shown in fig. 1, the present embodiment provides a horizontal plating apparatus with an ultrasonic assembly, which mainly includes an upper anode box 100, a lower anode box 200, and a plating tank. Wherein, the upper anode box 100 is provided therein with a first anode assembly 110 and a first ultrasonic assembly 120, and the first ultrasonic assembly 120 is disposed above the first anode assembly 110. A second anode assembly 210 and a second ultrasonic assembly 220 are disposed within the lower anode cartridge 200, the second ultrasonic assembly 220 being disposed below the second anode assembly 210. Electrolyte is contained in the electroplating bath, the upper anode box 100 and the lower anode box 200 are both placed in the electroplating bath, a containing space for containing the plate 300 is formed between the upper anode box 100 and the lower anode box 200, and the plate 300 can move in the containing space.

Based on the above design, in the present embodiment, the frequencies of the first ultrasonic assembly 120 and the second ultrasonic assembly 220 are each set to 25KHz-130KHz. In the present embodiment, the first anode assembly 110 includes a first insoluble anode 130, the first ultrasonic assembly 120 is disposed directly above the first insoluble anode 130, and the first ultrasonic assembly 120 is capable of emitting ultrasonic waves to break up the bubbles 700 on the first insoluble anode 130. The second anode assembly 210 includes a second insoluble anode 230, and the second ultrasonic assembly 220 is disposed directly under the second insoluble anode 230, and the second ultrasonic assembly 220 is capable of emitting ultrasonic waves to break up the bubbles 700 on the second insoluble anode 230.

Further, the first anode assembly 110 further includes a first ion membrane 140, the first ion membrane 140 is disposed directly under the first insoluble anode 130, the second anode assembly 210 further includes a second ion membrane 240, the second ion membrane 240 is disposed above the second insoluble anode 230, and the first ion membrane 140 and the second ion membrane 240 are both used for penetrating metal ions, so that the metal ions can reach the cathode region where the plate 300 is located, and are attached to the surface of the plate 300 by electroplating. The arrangement of the first ultrasonic assembly 120 and the second ultrasonic assembly 220 can reduce the risk of the first ion membrane 140 and the second ion membrane 240 being blocked by the air bubbles 700, and improve the plating efficiency.

Specifically, during the electroplating process, the reaction of the electrolyzed water occurs on the first insoluble anode 130 and the second insoluble anode 230, namely: 2H (H) ₂ 0→4H ⁺ +O ₂ ↑+4e ^- Thus, oxygen bubbles 700 are generated, and if a large amount of oxygen bubbles 700 are accumulated inside the upper and lower anode boxes 100 and 200 and cannot effectively leave the anode region, the oxygen bubbles 700 will affect the distribution of electric lines of force, thereby affecting the copper deposition distribution of the object to be plated (plate 300) in the cathode region, thereby reducing copper plating uniformity and product qualityThe rate. In this embodiment, by adding the first ultrasonic assembly 120 and the second ultrasonic assembly 220 to the upper anode box 100 and the lower anode box 200 respectively, when the ultrasonic waves pass through the air bubble 700, on one hand, the air bubble 700 is subjected to a great sound pressure effect due to the compression effect of the molecules of substances in the liquid caused by the vibration of the sound waves, and the pressure can reach 0.3MPa-1MPa generally. Before the air bubble 700 is subjected to the ultrasonic wave, the air bubble 700 is only subjected to the atmospheric pressure, and after the ultrasonic wave is applied to the air bubble 700, the ultrasonic wave vibration compresses the air bubble 700, the pressure applied to the air bubble 700 is increased, and the air bubble 700 is caused to collapse. On the other hand, ultrasonic vibration can break up the bubbles 700, so that the bubbles 700 are sparse and do not come together, and the pressure of the bubbles 700 can be made lower than the atmospheric pressure to expand and collapse. Moreover, the ultrasonic waves emitted by the first ultrasonic assembly 120 and the second ultrasonic assembly 220 in this embodiment can provide energy for the electrolyte, so that molecules and ions in the electrolyte generate certain acceleration, and the kinetic energy of the molecules and ions is increased, thereby improving the mass transfer efficiency of the electrolyte, and metal ions generated after the ionization of the molecules in the electrolyte can reach the cathode region as soon as possible and be electroplated and attached on the plate 300, thereby improving the electroplating efficiency. This example uses electroplated copper as an example, namely Cu ²⁺ 2e ^- ＝Cu。

Alternatively, the plate 300 in the present embodiment may be provided as a semiconductor silicon wafer, or may be provided as a PCB board, a ceramic board, or the like. The first ultrasonic assembly 120 and the second ultrasonic assembly 220 may be commercially available ultrasonic generators capable of emitting a certain frequency, and the specific structure of the inside of the ultrasonic generators is not further described in this embodiment.

In this embodiment, a first groove is disposed on the inner wall of the upper anode box 100, the side edge of the first ultrasonic assembly 120 is embedded in the first groove, a second groove is disposed on the inner wall of the lower anode box 200, and the side edge of the second ultrasonic assembly 220 is embedded in the second groove. In this way, the stability and reliability of the first ultrasonic assembly 120 and the second ultrasonic assembly 220 can be improved, and the phenomenon that the first ultrasonic assembly 120 and the second ultrasonic assembly 220 shake unstably during operation can be avoided. Of course, the operator may detachably fix the first ultrasonic assembly 120 to the inner wall of the upper anode casing 100 and the second ultrasonic assembly 220 to the inner wall of the lower anode casing 200 by using screws or bolts.

In some alternative embodiments, the first ultrasonic assembly 120 and the second ultrasonic assembly 220 are all provided in plurality, the plurality of first ultrasonic assemblies 120 are uniformly distributed right above the first insoluble anode 130, and the plurality of second ultrasonic assemblies 220 are uniformly distributed right below the second insoluble anode 230, so that the defoaming efficiency of the first ultrasonic assembly 120 and the second ultrasonic assembly 220 can be improved, the phenomenon of bubble 700 dead zone is avoided, and the uniformity of product electroplating is improved.

As shown in fig. 1, in the present embodiment, the first anode assembly 110 further includes a first shielding plate 150, a plurality of first through holes 1501 are formed in the first shielding plate 150, and the first shielding plate 150 is disposed directly under the first ion membrane 140. The second anode assembly 210 further includes a second shielding plate 250, wherein a plurality of second through holes 2501 are formed in the second shielding plate 250, and the second shielding plate 250 is disposed directly under the second ion membrane 240. Metal ions in the electrolyte can penetrate through the first ionic membrane 140 and pass through the first through hole 1501 to reach the cathode region and be electroplated on the upper surface of the plate 300; the metal ions in the electrolyte can also pass through the second ion membrane 240 and pass through the second through holes 2501 to reach the cathode region and be plated to the lower surface of the sheet material 300. The arrangement of the first shutter 150 and the second shutter 250 can prevent the bubbles 700 in the upper anode cassette 100 and the lower anode cassette 200 from moving to the cathode region.

As shown in fig. 1, in the present embodiment, at least one of the upper anode cartridge 100 and the lower anode cartridge 200 is provided with an inclined surface 260, and at least one of a portion of the first anode assembly 110 or a portion of the second anode assembly 210 is disposed obliquely along the inclined surface 260. For example, in the present embodiment, the lower anode case 200 is provided with the inclined surface 260, and the second ion membrane 240 and the second shutter 250 are provided obliquely as an example, so that the bubbles 700 generated in the lower anode case 200 can float and collect on one side of the inclined surface 260, i.e., the upper left corner of the inclined surface 260 in fig. 1, and thus the phenomenon that the bubbles 700 clog the second ion membrane 240 can be prevented from occurring.

With continued reference to fig. 1, in the present embodiment, the horizontal plating apparatus with an ultrasonic assembly further includes a first nozzle 400 and a second nozzle 500, the first nozzle 400 and the second nozzle 500 are respectively disposed on two sides of the sheet 300, and the first nozzle 400 and the second nozzle 500 are symmetrically disposed with respect to the sheet 300. The above arrangement can realize that when the plate 300 is electroplated, the spraying pipes are continuously arranged on two surfaces of the plate to spray the electrolyte, and the spraying of the electrolyte also improves the circulation replacement of the electrolyte in the cathode area, so that the condition that the electrolyte near the plate 300 has fewer metal cations is avoided, and the electroplating quality and efficiency can be improved.

As shown in fig. 1, the horizontal plating apparatus with an ultrasonic assembly further includes a clamp 600, and the clamp 600 is used to clamp the plate 300. The clamp 600 clamps the plate 300 and can drive the plate 300 to penetrate through the cathode region, namely, the plate 300 is clamped by the clamp 600 and then placed in the cathode region along with the clamp 600, and can be taken out along with the clamp 600 after electroplating is completed, so that convenience and rapidness are realized.

Specifically, the horizontal electroplating device with the ultrasonic assembly further comprises a driving member, and the driving member is in driving connection with the fixture 600, so that the plate 300 can enter the electroplating equipment and reach the corresponding cathode region for electroplating, and then comes out of the electroplating equipment to complete electroplating, thereby realizing the automation of electroplating of the electroplating equipment.

Optionally, the fixture 600 and the driving member are respectively provided with a plurality of driving members, so that the horizontal electroplating device with the ultrasonic assembly can electroplate a plurality of plates 300 at one time, thereby saving electroplating time and improving working efficiency of the horizontal electroplating device with the ultrasonic assembly.

Alternatively, the driving member in this embodiment may be provided by a motor-driven steel belt.

It is to be understood that the foregoing is only illustrative of the presently preferred embodiments of the invention and the technical principles that have been developed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.

Note that in the description of this specification, a description of reference to the terms "some embodiments," "other embodiments," and the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims (10)

1. A horizontal plating apparatus having an ultrasonic assembly, comprising:

an upper anode box (100), wherein a first anode assembly (110) and a first ultrasonic assembly (120) are arranged in the upper anode box (100), and the first ultrasonic assembly (120) is arranged above the first anode assembly (110);

a lower anode box (200), wherein a second anode assembly (210) and a second ultrasonic assembly (220) are arranged in the lower anode box (200), and the second ultrasonic assembly (220) is arranged below the second anode assembly (210);

plating bath, hold electrolyte in the plating bath, go up positive pole box (100) with lower positive pole box (200) are all placed in the plating bath, just go up positive pole box (100) with form the accommodation space that is used for holding sheet material (300) between lower positive pole box (200), sheet material (300) can be in the accommodation space internal motion.

2. The horizontal electroplating device with an ultrasonic assembly of claim 1, wherein the first anode assembly (110) comprises a first insoluble anode (130), the first ultrasonic assembly (120) is disposed directly above the first insoluble anode (130), the first ultrasonic assembly (120) is capable of emitting ultrasonic waves to break bubbles (700) on the first insoluble anode (130).

3. The horizontal plating apparatus with ultrasonic assembly according to claim 2, wherein a first groove is provided on an inner wall of the upper anode box (100), and a side of the first ultrasonic assembly (120) is embedded in the first groove.

4. The horizontal plating apparatus with ultrasonic assembly according to claim 2, wherein the plurality of first ultrasonic assemblies (120) is provided, and the plurality of first ultrasonic assemblies (120) are uniformly distributed right above the first insoluble anode (130).

5. The horizontal electroplating device with an ultrasonic assembly of claim 2, wherein the first anode assembly (110) further comprises a first ionic membrane (140), the first ionic membrane (140) being disposed directly below the first insoluble anode (130), the first ionic membrane (140) being configured to permeate metal ions.

6. The horizontal plating apparatus with ultrasonic assembly according to claim 5, wherein the first anode assembly (110) further comprises a first shielding plate (150), a plurality of first through holes (1501) are formed in the first shielding plate (150), and the first shielding plate (150) is disposed right under the first ion membrane (140).

7. The horizontal plating apparatus with ultrasonic assembly according to any one of claims 1-6, wherein the frequencies of the first ultrasonic assembly (120) and the second ultrasonic assembly (220) are each set to 25KHz-130KHz.

8. The horizontal plating apparatus with ultrasonic assembly according to claim 1, wherein at least one of the upper anode box (100) and the lower anode box (200) is provided with an inclined surface (260), and at least one of a part of the first anode assembly (110) or a part of the second anode assembly (210) is arranged obliquely along the inclined surface (260).

9. The horizontal plating apparatus with ultrasonic assembly according to claim 1, further comprising a first nozzle (400) and a second nozzle (500), the first nozzle (400) and the second nozzle (500) being disposed on both sides of the slab (300), respectively, and the first nozzle (400) and the second nozzle (500) being disposed symmetrically with respect to the slab (300).

10. The horizontal plating apparatus with ultrasonic assembly according to claim 1, further comprising a clamp (600), the clamp (600) for clamping the plate material (300).

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