CN116026297A - Hemispherical resonator gyroscope and packaging method thereof - Google Patents
Hemispherical resonator gyroscope and packaging method thereof Download PDFInfo
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- CN116026297A CN116026297A CN202211468850.5A CN202211468850A CN116026297A CN 116026297 A CN116026297 A CN 116026297A CN 202211468850 A CN202211468850 A CN 202211468850A CN 116026297 A CN116026297 A CN 116026297A
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Abstract
The invention relates to the technical field of gyroscopes, and provides a hemispherical resonator gyroscope and a packaging method thereof, wherein a fused quartz piece is blown by adopting a height Wen Pendeng to form a hemispherical resonator with a supporting rod; fusing the hemispherical harmonic oscillator with the substrate through the support rod, and arranging a wire on the substrate; printing a packaging side plate and a packaging top cover by adopting ceramic materials in a layering manner so as to sinter the packaging side plate and the packaging top cover to form an integral structure, and arranging wires on the integral structure of the packaging side plate and the packaging top cover; metal coating is carried out on the surface of the hemispherical resonator and the distributed electrode of the packaging top cover by a magnetron sputtering method, so that a capacitor is formed at the hemispherical resonator and the distributed electrode of the packaging top cover; the packaging side plate and the substrate are connected together in an anodic bonding mode, so that the packaging side plate is communicated with the substrate conductor, wafer-level packaging of the hemispherical resonator gyroscope is realized, impurities and gas are prevented from being introduced into the gyroscope, and the vacuum degree and the quality factor of the gyroscope are ensured.
Description
Technical Field
The invention relates to the technical field of gyroscopes, in particular to a hemispherical resonator gyroscope and a packaging method thereof.
Background
Hemispherical resonator gyroscopes are a type of coriolis vibrating gyroscope that uses the radial vibratory standing wave precession of the hemispherical shell lip to sense the rotation of the base. The device has high measurement precision, super stability and reliability, good vibration property and shock resistance, and can be widely applied to satellites, space vehicles and inertial navigation systems as key components of inertial measurement units and stable control of postures.
At present, the packaging technology of the hemispherical resonator gyroscope mainly adopts a metal tube shell for parallel seal welding, and protective gas is introduced in the welding process to protect a welding seam molten pool so as to reduce oxidation of the welding seam molten pool, so that the welding seam is uniformly and attractive in molding. However, introducing the protective gas is difficult to ensure that the hemispherical resonator gyroscope is packaged in a high vacuum environment, so that the quality factor of the hemispherical resonator gyroscope is affected.
Disclosure of Invention
The invention provides a hemispherical resonator gyroscope and a packaging method thereof, which are used for solving the defects that impurity gas is easy to introduce in the packaging process of the hemispherical resonator gyroscope in the prior art and the vacuum degree and accuracy of the hemispherical resonator gyroscope are difficult to ensure, and realizing high-quality production of the hemispherical resonator gyroscope.
The invention provides a packaging method of a hemispherical resonator gyroscope, which comprises the following steps:
blowing the fused silica sheet with height Wen Pendeng to form a hemispherical resonator with support rods;
fusing the hemispherical harmonic oscillator with the substrate through the support rod, and arranging a wire on the substrate;
printing a packaging side plate and a packaging top cover by adopting ceramic materials in a layering manner so as to sinter the packaging side plate and the packaging top cover to form an integral structure, and arranging wires on the integral structure of the packaging side plate and the packaging top cover;
metal coating is carried out on the surface of the hemispherical resonator and the distributed electrode of the packaging top cover by a magnetron sputtering method, so that a capacitor is formed at the hemispherical resonator and the distributed electrode of the packaging top cover;
the package side plate and the substrate are connected together in an anodic bonding mode, so that the package side plate and the substrate conductor are communicated.
A first through hole is formed in the substrate, and a metal material is poured into the first through hole;
and a second through hole corresponding to the first through hole is formed through the packaging side plate and the packaging top cover, and a metal material is poured into the second through hole, so that the packaging side plate and the substrate are communicated through the metal material in the first through hole and the second through hole.
And the metal materials poured into the first through hole and the second through hole are gold or aluminum.
The packaging top cover is connected with an external circuit through gold wire bonding or aluminum wire bonding, so that the external circuit drives the hemispherical resonator gyroscope.
When the packaging side plate and the packaging top cover are printed in a layered mode, a resistor, a capacitor or a wire can be added to enable the packaging side plate to be communicated with the substrate conductor and enable the packaging top cover to be electrically connected with an external circuit.
The invention also provides a hemispherical resonator gyroscope comprising:
the vibration structure comprises a substrate and a hemispherical resonator, wherein a supporting rod is arranged in the hemispherical resonator, and the hemispherical resonator is connected with the substrate through the supporting rod;
the packaging shell comprises a packaging side plate and a packaging top cover, wherein the packaging top cover is arranged at one end of the packaging side plate and is electrically connected with the packaging side plate; the packaging side plate is arranged along the circumferential direction of the base plate and is electrically connected with the base plate, and the hemispherical resonator is positioned in a vacuum chamber formed by the base plate, the packaging side plate and the packaging top cover together.
The substrate is provided with a first through hole, and a metal conductor is arranged in the first through hole;
the packaging top cover and the packaging side plate are provided with second through holes in a penetrating mode, and metal conductors are arranged in the second through holes so that the substrate is electrically connected with the packaging side plate.
The first through hole and the second through hole are corresponding in structural size and position relation.
The material of encapsulation top cap with the material of encapsulation curb plate is ceramic.
The substrate and the hemispherical resonator are made of quartz.
According to the packaging method of the hemispherical resonator gyroscope, the packaging side plate and the packaging top cover are printed in layers by adopting the ceramic materials, the packaging side plate and the packaging top cover are sintered to form an integral structure, and the packaging side plate and the substrate are connected together in an anodic bonding mode, so that wafer-level packaging of the hemispherical resonator gyroscope is realized, the packaging process does not involve other protective gases, the hemispherical resonator gyroscope can be ensured to be packaged in a high-vacuum environment, and the quality factor of the hemispherical resonator gyroscope is further improved. The method and the device effectively solve the problem that when the hemispherical resonator gyroscope in the prior art adopts a metal tube shell to carry out parallel seal welding, protective gas is introduced to protect a weld pool, so that the hemispherical resonator gyroscope cannot be packaged in a high vacuum environment.
The hemispherical resonator gyroscope provided by the invention is prepared by adopting the packaging method of the hemispherical resonator gyroscope, so that all the advantages are included.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for packaging a hemispherical resonator gyroscope provided by the invention;
FIG. 2 is a schematic diagram of a hemispherical resonator gyroscope according to the present invention;
fig. 3 is a schematic structural layout diagram of mass production of hemispherical resonator gyroscopes according to the present invention.
Reference numerals:
100. a vibrating structure; 110. hemispherical harmonic oscillator; 111. a support rod; 120. a substrate; 121. a first through hole;
200. packaging the shell; 210. packaging side plates; 211. a second through hole; 220. packaging the top cover;
300. wafer-level fused quartz plates;
400. a ceramic sheet;
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the embodiments of the present application will be understood by those of ordinary skill in the art in a specific context.
In the examples herein, a first feature "on" or "under" a second feature may be either the first and second features in direct contact, or the first and second features in indirect contact via an intermediary, unless expressly stated and defined otherwise. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Embodiments of the present invention are described below with reference to fig. 1 to 3. It should be understood that the following description is only illustrative of embodiments of the invention and is not intended to limit the invention in any way.
Referring to fig. 1 and 2, an embodiment of the present invention provides a method for packaging a hemispherical resonator gyroscope, including the following steps:
s1: the fused silica sheet is taken to be high Wen Chuizhi to form a hemispherical resonator 110 with support bars 111;
s2: fusing hemispherical resonator 110 with substrate 120 via support bar 111, and providing a wire on substrate 120;
s3: printing the package side plate 210 and the package top cover 220 by layers of ceramic materials to sinter the package side plate 210 and the package top cover 220 to form an integral structure, and arranging wires on the integral structure of the package side plate 210 and the package top cover 220;
s4: metal plating is performed on the surface of the hemispherical resonator 110 and the distributed electrode of the packaging top cover 220 by a magnetron sputtering method, so that a capacitor is formed at the distributed electrodes of the hemispherical resonator 110 and the packaging top cover 220;
s5: the package side plate 210 and the substrate 120 are connected together by anodic bonding, allowing the package side plate 210 and the substrate 120 to be in conductive communication.
It can be appreciated that, in the packaging method of the hemispherical resonator gyroscope provided by the embodiment of the invention, a ceramic material containing a large amount of alkali metal ions is used as a wafer level packaging material, and green ceramics are printed in layers, that is, laminated to form the packaging side plate 210 and the packaging top cover 220, so that the packaging side plate 210 and the packaging top cover 220 are sintered at a low temperature to form a whole. Finally, the substrate, the package side plates 210 and the package top cover 220 are bonded together by means of anodic bonding. Bonded rear hemispherical resonator 110 is located within the vacuum cavity. According to the invention, the vacuum packaging and protection of the hemispherical resonator gyroscope are realized through wafer-level packaging, so that the impact and damage of the external world on the hemispherical resonator gyroscope in the subsequent hemispherical resonator gyroscope assembly process can be effectively reduced, the quality factor of the hemispherical resonator gyroscope is improved, and the influence of external electromagnetic interference on the driving and detection signals of the hemispherical resonator gyroscope is reduced.
Specifically, in step S2, when the wires are provided on the substrate 120, the first through hole 121 may be formed on the substrate 120, and a metal material such as gold or aluminum may be poured into the first through hole 121.
In step S3, when wires are disposed on the integral structure of the package side plate 210 and the package top cover 220, a second through hole 220 corresponding to the first through hole 121 is formed through the package side plate 210 and the package top cover 220, and a metal material, which may be gold or aluminum, is poured into the second through hole 220, so that the conductivity of the metal material may be improved, and the package side plate 210 and the substrate 120 are in conductive communication through the metal material in the first through hole 121 and the second through hole 220.
The size of the second through hole 220 is consistent with the size of the electrode PAD point on the surface of the substrate 120 and the hemispherical resonator 110, so that the hemispherical resonator 110 is electrically connected with the package side plate 210 and the package top cover 220.
Wherein, the package top cover 220 is connected with an external circuit through gold wire bonding or aluminum wire bonding, so that the external circuit drives the hemispherical resonator gyroscope.
In some embodiments of the present invention, referring to fig. 2, a wafer-level hemispherical resonator 110 having a support bar 111 is formed by using a molten quartz plate through a height Wen Chuizhi, a substrate 120 in a shape of a Chinese character 'hui' is formed by using a molten quartz plate through laser cutting, the substrate 120 and the hemispherical resonator 110 are fused, the support bar 111 is disposed in an inner cavity of the hemispherical resonator 110 to support the hemispherical resonator 110, and an external electrode is formed by processing the hemispherical resonator 110 by using magnetron sputtering, thereby forming a vibrating structure 100.
The package side plate 210 is formed in a shape like a Chinese character 'hui' by using a ceramic plate containing a large amount of alkali metal ions through laser cutting, the package top cover 220 is manufactured by using a ceramic plate containing a large amount of alkali metal ions through a laser punching technology, the thickness of the package side plate 210 and the package top cover 220 can be controlled through layered printing, namely, lamination control of a plurality of layers of ceramic plates, and finally, the package side plate 210 and the package top cover 220 are sintered at a low temperature to form a wafer-level package ceramic whole.
A plurality of second through holes 211 are formed in the packaging top cover 220 and penetrate through the packaging side plate, first through holes 121 are uniformly formed in the substrate 120, the first through holes 121 correspond to the second through holes 211 and are electrically connected, metal materials are used for filling the second through holes 211 in a screen printing or mask printing mode, the metal materials are also filled into the first through holes 121, the metal materials can be gold or aluminum, conductivity of the metal materials can be improved, and the packaging top cover 220 is connected with the outside through gold wire bonding.
The PAD points of the electrodes on the surfaces of the package side plate 210, the package top cover 220, the substrate 120 and the hemispherical resonator 110 are in one-to-one correspondence, and a first through hole 121 and a second through hole 211 which are penetrated by the poured metal material are formed to realize electrical connection.
Finally, the integrated packaging side plate 210 and the packaging top cover 220 of the wafer-level packaging ceramic are fused with the substrate 120 of the vibration structure 100 in an anodic bonding mode, and the hemispherical resonator 110 is placed in an inner cavity formed by the packaging side plate 210 and the packaging top cover 220, so that the hemispherical resonator 110 can be fully surrounded to realize wafer-level packaging, and the vacuum degree of the hemispherical resonator gyroscope is ensured. The package top 220 is electrically connected to the outside to transmit the signal of the hemispherical resonator 110.
The package side plate 210 and the package top cover 220 of the ceramic material are bonded with the base plate 120 of the quartz material, so that vacuum requirements are met, impurities and gas are not introduced, vacuum degree in the gyroscope can be guaranteed, the influence of various noises such as external electromagnetic interference and the like on an output signal in the testing and using processes of the gyroscope can be reduced due to the material characteristics of the ceramic, and the accuracy and quality of the gyroscope are further improved.
Referring to fig. 2, according to the method of the present invention, a hemispherical resonator gyroscope is further provided, which includes a vibrating structure 100 and a package housing 200, where the package housing 200 encloses the vibrating structure 100.
The vibration structure 100 includes a substrate 120 and a hemispherical resonator 110, a support bar 111 is disposed in the hemispherical resonator 110, and the hemispherical resonator 110 is connected to the substrate 120 through the support bar 111. The package housing 200 includes a package side plate 210 and a package top cover 220, wherein the package top cover 220 is disposed at one end of the package side plate 210 and is electrically connected with the package side plate 210; the package side plate 210 is disposed along the circumferential direction of the substrate 120 and electrically connected to the substrate 120, and the hemispherical resonator 110 is located in a vacuum chamber formed by the substrate 120, the package side plate 210 and the package top cover 220. The packaging top cover 220 is also electrically connected with the outside to transmit electric signals, and compared with the traditional hemispherical resonator gyroscope, the hemispherical resonator gyroscope provided by the invention has the advantages that the structure is simpler, the packaging is easier to clean, and the vacuum degree can be improved.
Referring to fig. 2, a first through hole 121 is formed on a substrate 120, and a metal conductor is disposed in the first through hole 121; the second through holes are formed in the package top cover 220 and the package side plate 210 in a penetrating manner, and metal conductors are arranged in the second through holes, so that the substrate 120 and the package side plate 210 are electrically connected, electric signals can be transmitted among the substrate 120, the package side plate 210 and the package top cover 220, and vibration conditions of the hemispherical resonator 110 can be transmitted to the outside through the package top cover 220. Further, the first through hole 121 and the second through hole have corresponding structural dimensions and positional relationships, so as to simplify the structure of the substrate 120, the package side plate 210 and the package top cover 220 and improve the transmission efficiency of the electrical signal.
In some embodiments of the present invention, the materials of the package top cover 220 and the package side plate 210 are both ceramics; both the substrate 120 and the hemispherical resonator 110 are made of quartz. The packaging shell 200 of the ceramic and the vibration structure 100 of the quartz can realize wafer level packaging in an anodic bonding mode, impurities and gas can be prevented from being introduced during packaging, the vacuum degree of the gyroscope is guaranteed, the material characteristics of the ceramic can reduce the influence of various noises such as external electromagnetic interference and the like on an output signal of the quartz hemispherical resonator 110 in the testing and using processes, and the accuracy of the gyroscope is improved.
Referring to fig. 1 to 3, in some embodiments of the present invention, gyroscopes may be manufactured in batch, and according to the above-described packaging method and structure of hemispherical resonator gyroscopes, alignment patterns are respectively depicted by using a wafer-level fused quartz plate 300 and a wafer-level ceramic plate 400, so that the structures can be in one-to-one correspondence during subsequent fusion.
The wafer level fused silica sheet 300 is formed into a semi-finished quartz sheet having a plurality of vibration structures 100 by the height Wen Chuizhi, and the vibration structures 100 are uniformly distributed according to the size of the quartz sheet 300.
And then the wafer-level ceramic wafer 400 is used for manufacturing a ceramic wafer packaging shell semi-finished product of the packaging shell 200 formed by the packaging side plates 210 and the packaging top cover 220, the packaging shell 200 is uniformly distributed and arranged according to the size of the wafer-level ceramic wafer 400 and the distribution of the vibration structures 100, the structures in the ceramic wafer semi-finished product and the ceramic wafer packaging shell semi-finished product are in one-to-one correspondence with each other with the aid of alignment patterns, and the PAD points on each sealing shell 200 and each vibration structure 100 are in one-to-one correspondence with each other, so that the vibration structures 100 and the packaging shell 200 are convenient to electrically connect.
And placing the semi-finished quartz plate product with a plurality of vibration structures 100 and the semi-finished ceramic plate package shell product with the package shell 200 in a bonding machine for vacuum anodic bonding, so that the semi-finished quartz plate product and the semi-finished ceramic plate package shell product are bonded together, and bonding each vibration structure 100 and each package shell 200 in the two semi-finished quartz plate product and the semi-finished ceramic plate package shell product in a one-to-one correspondence manner to form a plurality of hemispherical gyroscopes.
And a plurality of gyroscopes bonded with the semi-finished quartz chip and the semi-finished ceramic chip package shell are diced into a plurality of single gyroscopes by a dicing process, so that batch manufacturing of the gyroscopes is completed.
The implementation is that the wafer-level fused quartz plate 300 and the wafer-level ceramic plate 400 are manufactured into a plurality of vibration structures 100 and packaging processes of the packaging shell 200 respectively, compared with the prior art, the vacuum degree and the quality of the gyroscopes are guaranteed, and the consistency of the gyroscopes in the same batch is guaranteed.
It should be noted that, the technical solutions in the embodiments of the present invention may be combined with each other, but the basis of the combination is based on the fact that those skilled in the art can realize the combination; when the combination of the technical solutions contradicts or cannot be realized, it should be considered that the combination of the technical solutions does not exist, i.e. does not fall within the scope of protection of the present invention.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The packaging method of the hemispherical resonator gyroscope is characterized by comprising the following steps of:
blowing the fused silica sheet with height Wen Pendeng to form a hemispherical resonator with support rods;
fusing the hemispherical harmonic oscillator with the substrate through the support rod, and arranging a wire on the substrate;
printing a packaging side plate and a packaging top cover by adopting ceramic materials in a layering manner so as to sinter the packaging side plate and the packaging top cover to form an integral structure, and arranging wires on the integral structure of the packaging side plate and the packaging top cover;
metal coating is carried out on the surface of the hemispherical resonator and the distributed electrode of the packaging top cover by a magnetron sputtering method, so that a capacitor is formed at the hemispherical resonator and the distributed electrode of the packaging top cover;
the package side plate and the substrate are connected together in an anodic bonding mode, so that the package side plate and the substrate conductor are communicated.
2. The packaging method of hemispherical resonator gyroscope according to claim 1, wherein a first through hole is formed in the substrate, and a metal material is poured into the first through hole;
and a second through hole corresponding to the first through hole is formed through the packaging side plate and the packaging top cover, and a metal material is poured into the second through hole, so that the packaging side plate and the substrate are communicated through the metal material in the first through hole and the second through hole.
3. The method of packaging a hemispherical resonator gyroscope of claim 2, wherein the metal material poured into the first via and the second via is gold or aluminum.
4. The method of packaging a hemispherical resonator gyroscope of claim 1, wherein the packaging cap is connected to an external circuit by gold wire bonding or aluminum wire bonding, so that the external circuit drives the hemispherical resonator gyroscope.
5. The method of claim 1, wherein resistors, capacitors, or wires are added to connect the package side plates to the substrate conductors and to electrically connect the package top cover to external circuitry when the package side plates and the package top cover are printed in layers.
6. A hemispherical resonator gyroscope manufactured by the packaging method of the hemispherical resonator gyroscope according to any one of claims 1 to 5, comprising:
the vibration structure comprises a substrate and a hemispherical resonator, wherein a supporting rod is arranged in the hemispherical resonator, and the hemispherical resonator is connected with the substrate through the supporting rod;
the packaging shell comprises a packaging side plate and a packaging top cover, wherein the packaging top cover is arranged at one end of the packaging side plate and is electrically connected with the packaging side plate; the packaging side plate is arranged along the circumferential direction of the base plate and is electrically connected with the base plate, and the hemispherical resonator is positioned in a vacuum chamber formed by the base plate, the packaging side plate and the packaging top cover together.
7. The hemispherical resonator gyroscope of claim 6, wherein,
the substrate is provided with a first through hole, and a metal conductor is arranged in the first through hole;
the packaging top cover and the packaging side plate are provided with second through holes in a penetrating mode, and metal conductors are arranged in the second through holes so that the substrate is electrically connected with the packaging side plate.
8. The hemispherical resonator gyroscope of claim 7, wherein the first through hole and the second through hole are each of a corresponding size and positional relationship.
9. The hemispherical resonator gyroscope of claim 6, wherein the package top cover and the package side plates are both ceramic.
10. The hemispherical resonator gyroscope of claim 6, wherein the substrate and the hemispherical resonator are both quartz.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211468850.5A CN116026297A (en) | 2022-11-22 | 2022-11-22 | Hemispherical resonator gyroscope and packaging method thereof |
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| CN202211468850.5A CN116026297A (en) | 2022-11-22 | 2022-11-22 | Hemispherical resonator gyroscope and packaging method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117570951A (en) * | 2024-01-17 | 2024-02-20 | 中国船舶集团有限公司第七〇七研究所 | Resonant gyroscope, mold and blowing method of resonant gyroscope |
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2022
- 2022-11-22 CN CN202211468850.5A patent/CN116026297A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117570951A (en) * | 2024-01-17 | 2024-02-20 | 中国船舶集团有限公司第七〇七研究所 | Resonant gyroscope, mold and blowing method of resonant gyroscope |
| CN117570951B (en) * | 2024-01-17 | 2024-04-05 | 中国船舶集团有限公司第七〇七研究所 | Resonant gyroscope, mold and blowing method of resonant gyroscope |
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