CN116000812A - Device and method for regulating and controlling middle gap and measuring polishing force in non-contact polishing - Google Patents
Device and method for regulating and controlling middle gap and measuring polishing force in non-contact polishing Download PDFInfo
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- CN116000812A CN116000812A CN202211733264.9A CN202211733264A CN116000812A CN 116000812 A CN116000812 A CN 116000812A CN 202211733264 A CN202211733264 A CN 202211733264A CN 116000812 A CN116000812 A CN 116000812A
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- 238000005498 polishing Methods 0.000 title claims abstract description 226
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- 230000003287 optical effect Effects 0.000 claims abstract description 95
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
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- 230000000694 effects Effects 0.000 claims abstract description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
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- 229920002635 polyurethane Polymers 0.000 claims description 2
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- 229910002027 silica gel Inorganic materials 0.000 claims description 2
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Abstract
The invention provides a device and a method for regulating and controlling a gap and measuring polishing force in non-contact polishing, which are used for regulating and controlling the polishing gap and measuring the polishing force in non-contact polishing in the field of advanced optical manufacturing. The device comprises: spindle, polishing tool, optical element, fixture, connection plate, force sensor, and stage. In the method, when the polishing tool is in an unpolished state, the contact state between the polishing tool and the optical element is judged by a force sensor and is positioned to an initial gap; in the polishing state, the gap between the polishing tool and the optical element is regulated and stabilized according to the polishing force measured by the force sensor. The invention provides a method for precisely measuring and regulating a polishing gap in the field of advanced optical manufacturing non-contact polishing, which is beneficial to maintaining stable polishing effect in the polishing process and obtaining an ultra-smooth optical surface.
Description
Technical Field
The invention belongs to the technical field of advanced optical manufacturing, and particularly relates to a device and a method for regulating and controlling the middle gap and measuring the polishing force in non-contact polishing.
Background
In the field of advanced optical manufacturing, advanced science and technology and large science devices represented by gravitational wave detection, synchronous radiation light sources based on short wave wavelength and the like rapidly develop, strict requirements are put on the surface roughness of an optical element, the full-band surface roughness of the optical element is required to reach the nanometer or even sub-nanometer level, and the surface and sub-surface damage of the optical element is controlled. However, conventional contact polishing can inevitably cause surface scratches or subsurface damage to the optical element, and non-contact polishing is a way of effectively improving the surface roughness of the optical element, and can be used in the final process of manufacturing the ultra-smooth optical element, such as an elastic emission processing technology. As described in chinese patent publication CN10534560a, the gap between the polishing tool and the optical element is critical for the polishing effect in its application scenario. The initial gap between the polishing tool and the optical element in the non-contact polishing is difficult to measure accurately, and the polishing gap is difficult to maintain constant for a long time due to the problems of ambient temperature, shafting heating and the like in the polishing process, which results in that a stable material removal function cannot be obtained, which is unfavorable for realizing deterministic polishing. At present, the gap measurement mode has methods such as optical detection and feeler gauge detection, but the optical detection mode with higher requirements on environment is extremely difficult due to the existence of polishing solution. The feeler gauge can only be used as a clearance measurement method in a non-polishing state, and cannot monitor the non-contact polishing state in real time. In terms of maintenance of the polishing gap, it is currently mainly the case that a high-resolution shaft is used to improve the positioning accuracy, but the polishing gap also changes when the temperature changes. In order to solve the above problems, the present invention provides a device and a method for adjusting and controlling the gap and polishing force in non-contact polishing, which measure the gap between a polishing tool and an optical element in real time, and help to obtain a stable material removal function so as to achieve deterministic polishing.
Disclosure of Invention
The invention provides a device and a method for regulating and controlling a gap and measuring polishing force in non-contact polishing, which are used for solving the problems that a polishing gap between a polishing tool and an optical element is difficult to measure and the gap is kept stable in non-contact polishing in the field of advanced optical manufacturing. The polishing gap measuring device can accurately measure the polishing gap, can be applied in combination with an elastic emission processing technology, maintains the polishing gap to be constant based on measurement of polishing force, is beneficial to obtaining a stable material removal function, and ensures long-time stability and deterministic polishing.
The technical scheme adopted by the invention is as follows: the device comprises a main shaft, a polishing tool, an optical element, a clamp, a connecting plate, a force sensor and an objective table, wherein,
the main shaft is connected with the polishing tool, and the polishing tool is rotated and moved in the vertical direction by controlling the main shaft;
the optical element is arranged on the connecting plate through the clamp, the connecting plate is fixedly connected with the force sensor and is arranged on the objective table, and the object can move in the horizontal direction through controlling the objective table;
further, the polishing tool can be in any rotationally symmetrical shape such as sphere, ellipsoid, spherical crown, cylinder, etc., the material can be any flexible material such as polyurethane, rubber, silica gel, etc., or any wear-resistant material such as polytetrafluoroethylene, etc., and the polishing tool can also be a nozzle in various shapes.
Further, the optical element and the connecting plate can be mounted by a clamp, or by wax bonding or vacuum chuck, etc.
Further, the optical element may be any shape of a plane, a sphere, a free-form surface, or the like.
Further, the number of the placed force sensors can be one or more, the placed positions of the force sensors can be any position below the optical element, the force sensors can be force sensors for measuring forces in different directions, such as single-axis force sensors, multi-axis force sensors or shearing force sensors, the force sensors can be various force sensors depending on strain gauges, various force sensors depending on piezoelectric effect, and the like, and when the force sensors are combined, component forces of polishing forces in different directions can be obtained through force decomposition and synthesis.
Further, the stage is used to carry the optical element and the force sensor, and the stage may be a two-axis horizontal displacement stage, a three-axis displacement stage, or a displacement stage having multiple degrees of freedom.
Further, the spindle, the polishing tool, the optical element, the clamp, the connecting plate, the force sensor and the object stage can be integrally arranged in the polishing groove, or a part of the spindle, the polishing tool, the optical element, the clamp, the connecting plate, the force sensor and the object stage can be arranged in the polishing groove, the polishing groove can be filled with any kind of polishing liquid or water, and the polishing tool can also be in the form of a nozzle for spraying the polishing liquid onto the surface of the optical element.
Further, a method for regulating and measuring the polishing force in the non-contact polishing is divided into two parts by using the device for regulating and measuring the polishing force in the non-contact polishing: first, in the non-polishing state, the polishing tool is gradually close to the optical element by controlling the up-and-down movement of the spindle until the force sensor displays an indication, at which time the polishing tool just contacts the optical element. When the polishing tool is made of flexible materials or the contact force is extremely small, the contact process between the polishing tool and the surface of the optical element can not cause any damage to the optical element; and then in a polishing state, rotating the polishing tool at a certain speed at a certain height from the surface of the optical element, wherein hydrodynamic pressure, shearing force and the like exist between the polishing tool and the optical element due to the existence of liquid, selecting a proper force sensor according to the type of the measured polishing force, and adjusting the gap between the polishing tool and the optical element according to the indication of the polishing force, wherein the polishing force can be obtained through theoretical simulation calculation superposition experiment calibration. When the polishing tool is a nozzle, the fluid ejected from the nozzle at a high speed also generates a certain pressure and shearing force on the surface of the optical element, which is related to the distance between the nozzle and the optical element and the ejection angle, and the gap between the polishing tool and the optical element can be adjusted according to the indication of the polishing force. The measuring and regulating method can be manual, and corresponding programs can be written and built in a machine tool control system, so that the automation of measuring and regulating is realized.
In order to achieve the above object, the present invention provides a method for regulating and controlling the polishing force in non-contact polishing, comprising the steps of:
step a: selecting a force displacement sensor with proper variety, range and precision, and adjusting the main shaft and the objective table to enable the polishing tool and the optical element to be positioned at proper initial relative positions;
step b: the spindle is controlled to move so that the polishing tool gradually approaches the optical element until the force sensor displays an indication, the polishing tool just contacts the optical element at the moment, and the coordinate where the polishing tool is positioned at the moment is recorded as A (x according to the indication of the machine tool 1 ,y 1 ,z 1 )；
Step c: in the non-contact polishing, the polishing tool is lifted vertically relative to the optical element by a distance D, i.e., the polishing tool is moved to a coordinate B (x 1 ,y 1 ,z 1 +d) to achieve an initial polishing gap;
step d: the main shaft is controlled to rotate the polishing tool, and the force sensor can measure the polishing force F at the moment 1 . When the positioning error or the ambient temperature changes during the movement of the machine tool, the indication of the polishing force changes to F 2 Then searching the indication number of the polishing force as F according to the polishing force reference value obtained by theoretical simulation calculation superposition experiment calibration 2 Polishing gap D at the time 1 The polishing tool was moved in the vertical direction to a coordinate C (x 1 ,y 1 ,z 1 +2D-D 1 ) At a position where the indication of the polishing force is maintained at F 1 Constant. When the regulation and control mode is manual, the coordinates of the polishing tool are manually regulated, the gap is kept constant, and the self-defined polishing process of the gap changing in real time can be completed according to experimental requirements. When the regulation and control mode is automatic, the process is completed by machine tool control software, and the process automation is favorable for long-time stable large-area deterministic polishing.
The invention has the beneficial effects that:
the invention provides a method for measuring and regulating the polishing gap between a polishing tool and an optical element based on the polishing force existing between the polishing tool and the optical element in a non-contact polishing state, which can accurately measure the polishing gap in the polishing process in real time and realize the gap regulation in the polishing process.
Drawings
FIG. 1 is a block diagram showing an overall structure of a gap adjusting and polishing force measuring device in non-contact polishing;
FIG. 2 is a front view of a gap-conditioning and polishing force measuring device in non-contact polishing;
fig. 3 is a top view of a gap-adjusting and polishing force measuring device in non-contact polishing.
The reference numerals in the drawings mean: 1 is a main shaft; 2 is a polishing tool; 3 is an optical element; 4 is a clamp; 5 is a connecting plate; 6 is a force sensor; 7 is a stage.
Detailed Description
Embodiments of the present invention will be further described with reference to the accompanying drawings and specific examples, but are not intended to limit the scope of the invention.
As shown in fig. 1, a device for regulating and measuring polishing force in non-contact polishing comprises a main shaft 1, a polishing tool 2, an optical element 3, a clamp 4, a connecting plate 5, a force sensor 6 and a stage 7. Wherein the spindle 1 is connected with the polishing tool 2, the optical element 3 is mounted on the connection plate 5 through the clamp 4, and the connection plate 5 and the force sensor 6 are mounted on the stage 7. The relative height between the polishing tool 2 and the optical element 3 can be adjusted by controlling the spindle 1, and the movement of the optical element 3 in the horizontal direction can be achieved by controlling the stage 7. The force sensor 6 is placed below the optical element 3. The stage 7 is a horizontal displacement platform for carrying the optical element 3 and the force sensor 6. The main shaft 1, the polishing tool 2, the optical element 3, the clamp 4, the connecting plate 5, the force sensor 6 and the object stage 7 are integrally arranged in a polishing groove, and the polishing groove is filled with polishing liquid. The measuring method is divided into two parts: first, in the non-polished state, the polishing tool 2 is gradually brought close to the optical element 3 by controlling the up-and-down movement of the spindle 1 until the indication of the force sensor 6 appears, at which time the polishing tool 2 just touches the optical element 3. And then in the polishing state, the polishing tool 2 rotates at a certain speed at a certain height from the surface of the optical element 3, hydrodynamic pressure, shearing force and the like exist between the polishing tool 2 and the optical element 3 due to the existence of liquid, and a gap between the polishing tool 2 and the optical element 3 is adjusted according to the indication of the polishing force, wherein the polishing force can be obtained through theoretical simulation calculation and superposition experiment calibration.
The clearance regulation and polishing force measurement method between the polishing tool and the optical element in the non-contact polishing in the advanced optical manufacturing field can realize clearance measurement of micrometer or even nanometer according to the precision of the sensor and the motion precision of the machine tool.
The invention provides a method for regulating and controlling the middle gap and measuring the polishing force in non-contact polishing, which comprises the following steps:
step a: the force sensor 6 is a shear force sensor with the measuring range of 0-1N and the precision of 0.001N. The polishing tool 2 selects a spherical polishing wheel, and the material is polytetrafluoroethylene. The optical element 3 is selected from planar optical elements, and the force sensor 6 is located directly below the optical element 3. The polishing groove contains 50nm of SiO 2 The polishing liquid was immersed in the optical element 3 at a concentration of 10%. The polishing gap adjusting mode is selected manually, and the spindle 1 and the objective table 7 are firstly adjusted to enable the polishing tool 2 and the optical element 3 to be positioned at proper relative positions;
step b: controlling the spindle 1 to move so that the polishing tool 2 gradually approaches the optical element 3, and when the indication of the shearing force sensor changes in 0-0.001N, the polishing tool 2 just contacts the optical element 3, and recording the coordinate where the polishing tool 2 is positioned at the moment as A (0, 5) according to the indication of the machine tool;
step c: in the non-contact polishing, the polishing tool 2 is lifted up by a certain distance of 100 μm in the vertical direction with respect to the optical element 3, that is, the polishing tool 2 is moved to a position of coordinates B (0,0,5.1);
step d: the spindle 1 was controlled to rotate the polishing tool 2 at 300rpm, and the force sensor 6 measured the polishing shear force at this time to be 0.03N. When the polishing force is 0.035N, which is found by the superposition experiment calibration according to the previous theoretical simulation calculation, the clearance between the polishing tool and the optical element is 80 μm, and the polishing tool is moved in the vertical direction to the coordinate C (0,0,5.12), at which time the clearance between the polishing tool 2 and the optical element 3 is 100 μm.
While the invention has been described with respect to specific embodiments thereof, it will be appreciated that the invention is not limited thereto, but rather encompasses modifications and substitutions within the scope of the present invention as will be appreciated by those skilled in the art.
Claims (10)
1. The utility model provides a gap regulation and control and polishing force measuring device in non-contact polishing which characterized in that: the device comprises a main shaft (1), a polishing tool (2), an optical element (3), a clamp (4), a connecting plate (5), a force sensor (6) and an objective table (7), wherein,
the main shaft (1) is connected with the polishing tool (2), and the polishing tool is rotated and moved in the vertical direction by controlling the main shaft;
the optical element (3) is arranged on the connecting plate (5) through the clamp (4), the connecting plate (5) is fixedly connected with the force sensor (6) and is arranged on the objective table (7), and the object can move in the horizontal direction through controlling the objective table.
2. The non-contact polishing gap adjusting and polishing force measuring device according to claim 1, wherein: the polishing tool (2) can be in any rotationally symmetrical shape such as sphere, ellipsoid, spherical crown and cylinder, the material can be any wear-resistant material such as polyurethane, rubber, silica gel or polytetrafluoroethylene, and the polishing tool (2) can also be a nozzle in various shapes.
3. The non-contact polishing gap adjusting and polishing force measuring device according to claim 1, wherein: the optical element (3) and the connecting plate (5) can be mounted by a clamp (4), or can be bonded by wax or can be fixed by adopting a vacuum chuck.
4. The non-contact polishing gap adjusting and polishing force measuring device according to claim 1, wherein: the optical element (3) can be any shape of plane, sphere, free-form surface.
5. The non-contact polishing gap adjusting and polishing force measuring device according to claim 1, wherein: the number of the placed force sensors (6) can be one or more, the placed positions of the force sensors can be any position below the optical element, the force sensors can be single-axis force sensors, multi-axis force sensors or force sensors for measuring forces in different directions by shearing force sensors, the force sensors can be various force sensors depending on strain gauges and various force sensors depending on piezoelectric effect, and when the force sensors are combined, component forces of polishing forces in different directions can be obtained through force decomposition and synthesis.
6. The non-contact polishing gap adjusting and polishing force measuring device according to claim 1, wherein: the stage (7) is used for carrying the optical element (3) and the force sensor (6), and the stage (7) can be a two-axis horizontal displacement platform, a three-axis displacement platform or a displacement platform with multiple degrees of freedom.
7. The non-contact polishing gap adjusting and polishing force measuring device according to claim 1, wherein: the spindle (1), the polishing tool (2), the optical element (3), the clamp (4), the connecting plate (5), the force sensor (6) and the object stage (7) can be integrally arranged in a polishing groove, or a part of the polishing groove can be arranged in the polishing groove, any kind of polishing liquid or water can be filled in the polishing groove, and the polishing tool (2) can also be in a nozzle form to spray the polishing liquid onto the surface of the optical element.
8. A non-contact polishing middle gap regulating and polishing force measuring method, using a non-contact polishing middle gap regulating and polishing force measuring device according to any one of claims 1 to 7, characterized in that: the measuring method is divided into two parts: firstly, in a non-polishing state, the polishing tool (2) gradually approaches the optical element (3) by controlling the up-and-down movement of the spindle (1) until the force sensor (6) displays a number, and at the moment, the polishing tool (2) just contacts the optical element (3); when the polishing tool (2) is made of a flexible material or has extremely small contact force, the contact process between the polishing tool (2) and the surface of the optical element (3) does not cause any damage to the optical element (3); then, in a polishing state, the polishing tool (2) rotates at a certain speed at a certain height from the surface of the optical element (3), hydrodynamic pressure and shearing force exist between the polishing tool (2) and the optical element (3) due to the existence of liquid, a proper force sensor is selected according to the type of the measured polishing force, and a gap between the polishing tool (2) and the optical element (3) is adjusted according to the indication of the polishing force, wherein the polishing force can be obtained through theoretical simulation calculation and superposition experiment calibration; when the polishing tool (2) is a nozzle, the fluid ejected from the nozzle at high speed can generate certain pressure and shearing force on the surface of the optical element (3), and the pressure and shearing force are related to the distance between the nozzle and the optical element (3), and the gap between the polishing tool (2) and the optical element (3) can be adjusted according to the indication of the polishing force; the measuring and regulating method can be manual, and corresponding programs can be written and built in a machine tool control system, so that the automation of measuring and regulating is realized.
9. The non-contact polishing gap adjusting and polishing force measuring method as set forth in claim 8, wherein: the method comprises the following specific steps:
step a: selecting a force sensor (6) with proper variety, range and precision, and adjusting the main shaft (1) and the objective table (7) to enable the polishing tool (2) and the optical element (3) to be positioned at proper initial relative positions;
step b: the spindle (1) is controlled to move so that the polishing tool (2) gradually approaches the optical element (3) until the force sensor (6) displays the indication, at the moment, the polishing tool (2) just contacts the optical element (3), and the coordinate where the polishing tool is positioned at the moment is recorded as A (x) according to the indication of the machine tool 1 ,y 1 ,z 1 )；
Step c: in the non-contact polishing, the polishing tool (2) is lifted vertically relative to the optical element (3) by a distance D, i.e. the polishing tool is moved to a coordinate B (x) 1 ,y 1 ,z 1 +d) to achieve an initial polishing gap;
step d: the main shaft is controlled to rotate the polishing tool, and the force sensor can measure the polishing force F at the moment 1 The method comprises the steps of carrying out a first treatment on the surface of the When the positioning error or the ambient temperature changes during the movement of the machine tool, the indication of the polishing force changes to F 2 Then searching the indication number of the polishing force as F according to the polishing force reference value obtained by theoretical simulation calculation superposition experiment calibration 2 Polishing gap D at the time 1 The polishing tool was moved in the vertical direction to a coordinate C (x 1 ,y 1 ,z 1 +2D-D 1 ) At a position where the indication of the polishing force is maintained at F 1 Constant; when the regulation and control mode is manual, the coordinates of the polishing tool are manually regulated, the gap is kept constant, and the self-defined polishing process of the gap changing in real time can be completed according to the experimental requirement; when the regulation and control mode is automatic, the process is completed by machine tool control software, and the process automation is favorable for long-time stable large-area deterministic polishing.
10. The non-contact polishing intermediate space conditioning and polishing force measurement method according to claim 8 or 9, characterized in that: the method can be applied to the field of advanced optical manufacturing non-contact polishing, and is used for measuring and regulating the gap between a polishing tool and an optical element and the polishing force during non-contact polishing.
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