CN115997097A - 热交换器 - Google Patents

热交换器 Download PDF

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Publication number
CN115997097A
CN115997097A CN202180053671.2A CN202180053671A CN115997097A CN 115997097 A CN115997097 A CN 115997097A CN 202180053671 A CN202180053671 A CN 202180053671A CN 115997097 A CN115997097 A CN 115997097A
Authority
CN
China
Prior art keywords
heat exchange
heat
heat exchanger
exchange medium
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180053671.2A
Other languages
English (en)
Chinese (zh)
Inventor
文后卓也
冈崎庆彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
T Rad Co Ltd
Original Assignee
Toyo Radiator Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Radiator Co Ltd filed Critical Toyo Radiator Co Ltd
Publication of CN115997097A publication Critical patent/CN115997097A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202180053671.2A 2020-09-14 2021-09-09 热交换器 Pending CN115997097A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020154190 2020-09-14
JP2020-154190 2020-09-14
PCT/JP2021/034017 WO2022054963A1 (ja) 2020-09-14 2021-09-09 熱交換器

Publications (1)

Publication Number Publication Date
CN115997097A true CN115997097A (zh) 2023-04-21

Family

ID=80632198

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180053671.2A Pending CN115997097A (zh) 2020-09-14 2021-09-09 热交换器

Country Status (4)

Country Link
JP (1) JPWO2022054963A1 (https=)
CN (1) CN115997097A (https=)
DE (1) DE112021004801T5 (https=)
WO (1) WO2022054963A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1148772B1 (en) * 2000-04-19 2009-12-23 Thermal Form & Function Inc. Cold plate utilizing fin with evaporating refrigerant
JP2003343985A (ja) * 2002-05-27 2003-12-03 Komatsu Electronics Inc プレート状熱交換器
EP1918668B1 (de) * 2006-10-27 2010-06-02 Behr GmbH & Co. KG Vorrichtung zur Aufnahme eines Fluids mittels Kapillarkräften und Verfahren zur Herstellung der Vorrichtung
JP2010203694A (ja) * 2009-03-04 2010-09-16 Showa Denko Kk 液冷式冷却装置
JP2011091301A (ja) * 2009-10-26 2011-05-06 Toyota Industries Corp 液冷式冷却装置
JP2016003778A (ja) * 2014-06-13 2016-01-12 富士電機株式会社 ループ型サーモサイフォン
CN106716041B (zh) * 2014-09-19 2019-02-15 株式会社T.Rad 热交换器用波纹散热片
JP2019219139A (ja) * 2018-06-22 2019-12-26 株式会社ティラド 熱交換器用コルゲートフィン

Also Published As

Publication number Publication date
WO2022054963A1 (ja) 2022-03-17
JPWO2022054963A1 (https=) 2022-03-17
DE112021004801T5 (de) 2023-07-27

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