JPWO2022054963A1 - - Google Patents
Info
- Publication number
- JPWO2022054963A1 JPWO2022054963A1 JP2022548383A JP2022548383A JPWO2022054963A1 JP WO2022054963 A1 JPWO2022054963 A1 JP WO2022054963A1 JP 2022548383 A JP2022548383 A JP 2022548383A JP 2022548383 A JP2022548383 A JP 2022548383A JP WO2022054963 A1 JPWO2022054963 A1 JP WO2022054963A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020154190 | 2020-09-14 | ||
| PCT/JP2021/034017 WO2022054963A1 (ja) | 2020-09-14 | 2021-09-09 | 熱交換器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022054963A1 true JPWO2022054963A1 (https=) | 2022-03-17 |
Family
ID=80632198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022548383A Pending JPWO2022054963A1 (https=) | 2020-09-14 | 2021-09-09 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022054963A1 (https=) |
| CN (1) | CN115997097A (https=) |
| DE (1) | DE112021004801T5 (https=) |
| WO (1) | WO2022054963A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002107023A (ja) * | 2000-04-19 | 2002-04-10 | Thermal Form & Function Llc | 冷却剤を蒸発させるフィンを用いた冷板 |
| EP1918668A1 (de) * | 2006-10-27 | 2008-05-07 | Behr GmbH & Co. KG | Vorrichtung zur Aufnahme eines Fluids mittels Kapillarkräften und Verfahren zur Herstellung der Vorrichtung |
| JP2010203694A (ja) * | 2009-03-04 | 2010-09-16 | Showa Denko Kk | 液冷式冷却装置 |
| JP2011091301A (ja) * | 2009-10-26 | 2011-05-06 | Toyota Industries Corp | 液冷式冷却装置 |
| JP2016003778A (ja) * | 2014-06-13 | 2016-01-12 | 富士電機株式会社 | ループ型サーモサイフォン |
| WO2016043340A1 (ja) * | 2014-09-19 | 2016-03-24 | 株式会社ティラド | 熱交換器用コルゲートフィン |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003343985A (ja) * | 2002-05-27 | 2003-12-03 | Komatsu Electronics Inc | プレート状熱交換器 |
| JP2019219139A (ja) * | 2018-06-22 | 2019-12-26 | 株式会社ティラド | 熱交換器用コルゲートフィン |
-
2021
- 2021-09-09 WO PCT/JP2021/034017 patent/WO2022054963A1/ja not_active Ceased
- 2021-09-09 DE DE112021004801.5T patent/DE112021004801T5/de active Pending
- 2021-09-09 CN CN202180053671.2A patent/CN115997097A/zh active Pending
- 2021-09-09 JP JP2022548383A patent/JPWO2022054963A1/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002107023A (ja) * | 2000-04-19 | 2002-04-10 | Thermal Form & Function Llc | 冷却剤を蒸発させるフィンを用いた冷板 |
| EP1918668A1 (de) * | 2006-10-27 | 2008-05-07 | Behr GmbH & Co. KG | Vorrichtung zur Aufnahme eines Fluids mittels Kapillarkräften und Verfahren zur Herstellung der Vorrichtung |
| JP2010203694A (ja) * | 2009-03-04 | 2010-09-16 | Showa Denko Kk | 液冷式冷却装置 |
| JP2011091301A (ja) * | 2009-10-26 | 2011-05-06 | Toyota Industries Corp | 液冷式冷却装置 |
| JP2016003778A (ja) * | 2014-06-13 | 2016-01-12 | 富士電機株式会社 | ループ型サーモサイフォン |
| WO2016043340A1 (ja) * | 2014-09-19 | 2016-03-24 | 株式会社ティラド | 熱交換器用コルゲートフィン |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022054963A1 (ja) | 2022-03-17 |
| CN115997097A (zh) | 2023-04-21 |
| DE112021004801T5 (de) | 2023-07-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20230531 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240904 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20240904 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20240904 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20251007 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251128 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20260113 |