CN115996555A - Preparation method of double-sided EMI pattern - Google Patents
Preparation method of double-sided EMI pattern Download PDFInfo
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- CN115996555A CN115996555A CN202310135555.6A CN202310135555A CN115996555A CN 115996555 A CN115996555 A CN 115996555A CN 202310135555 A CN202310135555 A CN 202310135555A CN 115996555 A CN115996555 A CN 115996555A
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Abstract
The invention relates to the technical field of building waterproofing, in particular to a preparation method of double-sided EMI patterns, which sequentially comprise the following structures: the preparation method comprises the following steps of: firstly, conducting single-sided photosensitive film pasting on a conductive material; covering a protective film on the back surface, and exposing the photosensitive film; preparing a single-sided conductive circuit through development, etching and film stripping; etching/dissolving the base material of the membrane material by using the liquid medicine; further conducting material circuit etching on the product, removing the photosensitive film and tearing off the back protection film; etching the conductive material on the back from the front, and carrying out laser on the double-sided conductive material in a laser mode, wherein the laser can penetrate through the whole material of the conductive material on the front, the substrate and the conductive material on the back by adjusting the energy of the laser; the invention can solve the problems of reduced shielding efficiency and moire caused by the misalignment of the front pattern and the back pattern.
Description
Technical Field
The invention relates to the field of electromagnetic shielding, in particular to a preparation method of a double-sided EMI pattern.
Background
It is shown that the conducting material lines with the same pattern are respectively manufactured on the front side and the back side of the substrate, so that the shielding effectiveness of the shielding film can be improved, and the effect is even higher than that of conducting material patterns with double thickness on the same side. The traditional method for preparing the double-sided conductive material circuit comprises the steps of preparing a double-sided conductive material film, coating a photosensitive film on the conductive material, exposing the photosensitive film on the front side and the back side simultaneously or respectively, and preparing the conductive material circuit through development, etching and film stripping, or respectively preparing two shielding films with the same pattern, and then bonding.
The traditional process for preparing the double-sided conductive material circuit has the defects that due to the fact that the front and back sides are required to be exposed, certain precision errors exist in the front and back sides of the double-sided conductive material circuit, or two shielding films are attached, attaching errors exist in attaching, attaching precision is lower than exposure precision, patterns on the front and back sides cannot be completely overlapped, shielding effectiveness is affected, mole lines can be generated, and visual effect is affected.
Disclosure of Invention
The invention aims to provide a preparation method of double-sided EMI patterns, which solves the problems that the double-sided patterns cannot be completely overlapped and the mole patterns cannot be completely overlapped.
In order to achieve the above purpose, the present invention provides the following technical solutions: a preparation method of a double-sided EMI pattern, the double-sided EMI pattern sequentially comprises the following structures from top to bottom: the preparation method comprises the following steps of:
(1) Firstly, conducting single-sided photosensitive film pasting on a conductive material;
(2) Covering a protective film on the back surface, and exposing the photosensitive film;
(3) Preparing a single-sided conductive circuit through development, etching and film stripping;
(4) Etching/dissolving the base material of the membrane material by using the liquid medicine to prepare an upper layer conductive material circuit;
(5) Further conducting material circuit etching on the product, removing the photosensitive film and tearing off the back protection film;
(6) Etching the conductive material on the back from the front to realize superposition of the conductive material lines on the front and the back;
(7) Adopting a laser mode, referring to the design pattern, carrying out laser on the double-sided conductive material, and carrying out laser on an unnecessary area;
(8) The laser can penetrate through the whole material of the front conductive material, the base material and the back conductive material by adjusting the energy of the laser, so that the patterns on the front surface and the back surface are completely consistent.
Preferably, the conductive material in step (1) is one of a metal material and an organic conductive material.
Preferably, the application method in the step (1) adopts one of a hot press application method and a coating method.
Preferably, the substrate in the step (4) is a glass substrate, and the liquid medicine adopts hydrofluoric acid.
Preferably, the base material in the step (4) is COP, and the liquid medicine adopts any one of dimethylbenzene, dichloromethane, tetrahydronaphthalene and decalin.
Preferably, the substrate in the step (4) is PET, the liquid medicine adopts an organic solvent, and the organic solvent adopts any one of cresol, nitrobenzene, trichloroacetic acid and chlorophenol.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention protects the substrate by using the photosensitive film and the conductive material, so that the pattern of the substrate is consistent with the circuit of the conductive material; and further conducting material circuit etching is carried out on the product, finally removing the photosensitive film, tearing off the back protective film, and etching the back conducting material from the front because the patterns of the front conducting material circuit and the base material are consistent, wherein the etched patterns are consistent with the patterns of the front conducting material circuit, so that perfect superposition of the front conducting material circuit and the back conducting material circuit is realized, and the reduction of shielding effectiveness and mole patterns are avoided.
2. The invention adopts a laser mode to refer to the design pattern, and the double-sided conductive material is subjected to laser, so that unnecessary areas are subjected to laser. The laser can penetrate through the whole material of the front conductive material, the base material and the back conductive material by adjusting the energy of the laser, patterns on the front surface and the back surface can be directly made at the same time in a laser mode, and the patterns on the front surface and the back surface are completely consistent.
Drawings
FIG. 1 is a schematic representation of the preparation of the structure of the present invention.
In the figure: a substrate 1, a conductive layer 2, a photosensitive film 3 and a protective film 4.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the present invention provides a technical solution: a preparation method of a double-sided EMI pattern, the double-sided EMI pattern sequentially comprises the following structures from top to bottom: the preparation method comprises the following steps of:
(1) Firstly, conducting single-sided photosensitive film pasting on a conductive material; the conductive material can be copper, silver and other metal materials, including silver paste, nano silver wires and the like, and can also be organic conductive materials and the like; the application mode can be hot pressing application or coating;
(2) The back surface is covered with a protective film for protecting the conductive material and preventing scratch and chemical etching; then exposing the photosensitive film;
(3) Preparing a single-sided conductive circuit through development, etching and film stripping;
(4) Etching/dissolving the base material of the membrane material by using the liquid medicine to prepare an upper layer conductive material circuit;
specifically, if the substrate is a glass substrate, hydrofluoric acid and the like can be used for etching the glass substrate, if the substrate is COP, xylene, dichloromethane, tetrahydronaphthalene, decalin and other organic solvents can be used for dissolving, if the substrate is PET, cresol, nitrobenzene, trichloroacetic acid, chlorophenol and other organic solvents can be used for dissolving,
because the upper layer conductive material circuit is manufactured, the photosensitive film and the conductive material play a role in protecting the base material, and the pattern of the base material is consistent with the conductive material circuit;
(5) Further conducting material circuit etching on the product, removing the photosensitive film and tearing off the back protection film;
(6) Etching the conductive material on the back from the front to realize superposition of the conductive material lines on the front and the back;
specifically, since the front conductive material line and the substrate pattern are consistent, the etched pattern is also consistent with the front conductive material line pattern by etching the back conductive material from the front. Therefore, perfect superposition of the front and back conductive material circuits is realized, and the reduction of shielding effectiveness and mole patterns are avoided.
(7) Adopting a laser mode, referring to the design pattern, carrying out laser on the double-sided conductive material, and carrying out laser on an unnecessary area;
(8) The laser can penetrate through the whole material of the front conductive material, the base material and the back conductive material by adjusting the energy of the laser, so that the patterns on the front surface and the back surface are completely consistent.
Specifically, the patterns on the front side and the back side can be directly made at the same time in a laser mode, and the patterns on the front side and the back side are completely consistent.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A method for preparing a double-sided EMI pattern, characterized by: the double-sided EMI pattern comprises the following structures in order from top to bottom: the preparation method comprises the following steps of:
(1) Firstly, conducting single-sided photosensitive film pasting on a conductive material;
(2) Covering a protective film on the back surface, and exposing the photosensitive film;
(3) Preparing a single-sided conductive circuit through development, etching and film stripping;
(4) Etching/dissolving the base material of the membrane material by using the liquid medicine to prepare an upper layer conductive material circuit;
(5) Further conducting material circuit etching on the product, removing the photosensitive film and tearing off the back protection film;
(6) Etching the conductive material on the back from the front to realize superposition of the conductive material lines on the front and the back;
(7) Adopting a laser mode, referring to the design pattern, carrying out laser on the double-sided conductive material, and carrying out laser on an unnecessary area;
(8) The laser can penetrate through the whole material of the front conductive material, the base material and the back conductive material by adjusting the energy of the laser, so that the patterns on the front surface and the back surface are completely consistent.
2. The method for preparing a double-sided EMI pattern according to claim 1, wherein: the conductive material in the step (1) is one of a metal material and an organic conductive material.
3. The method for preparing a double-sided EMI pattern according to claim 1, wherein: the application mode in the step (1) adopts one of a hot-press application mode and a coating mode.
4. The method for preparing a double-sided EMI pattern according to claim 1, wherein: the base material in the step (4) is a glass base material, and the liquid medicine adopts hydrofluoric acid.
5. The method for preparing a double-sided EMI pattern according to claim 1, wherein: the base material in the step (4) is COP, and the liquid medicine adopts any one of dimethylbenzene, dichloromethane, tetrahydronaphthalene and decalin.
6. The method for preparing a double-sided EMI pattern according to claim 1, wherein: the base material in the step (4) is PET, the liquid medicine adopts an organic solvent, and the organic solvent adopts any one of cresol, nitrobenzene, trichloroacetic acid and chlorophenol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310135555.6A CN115996555A (en) | 2023-02-20 | 2023-02-20 | Preparation method of double-sided EMI pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310135555.6A CN115996555A (en) | 2023-02-20 | 2023-02-20 | Preparation method of double-sided EMI pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115996555A true CN115996555A (en) | 2023-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310135555.6A Pending CN115996555A (en) | 2023-02-20 | 2023-02-20 | Preparation method of double-sided EMI pattern |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115996555A (en) |
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2023
- 2023-02-20 CN CN202310135555.6A patent/CN115996555A/en active Pending
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