CN115988754B

CN115988754B - Printed circuit board circuit manufacturing method based on semi-additive method

Info

Publication number: CN115988754B
Application number: CN202310275560.7A
Authority: CN
Inventors: 李建辉; 方映; 夏东
Original assignee: Suining Ruijiexing Technology Co ltd
Current assignee: Suining Ruijiexing Technology Co ltd
Priority date: 2023-03-21
Filing date: 2023-03-21
Publication date: 2023-06-16
Anticipated expiration: 2043-03-21
Also published as: CN115988754A

Abstract

The invention discloses a printed circuit board circuit manufacturing method based on a semi-additive method, which relates to the technical field of printed circuit boards and comprises the following steps: s1, cutting: cutting the substrate into a preset size; s2, chemical nickel plating: coarsening a substrate; then, a plurality of substrates with suckers are automatically placed in the transfer frame by using a stacking device; then all the suckers in the transfer frame are automatically taken out by using a dismounting device; s24, chemical reaction: sequentially moving the transfer frame into a plurality of tanks, and respectively performing presoaking, activating, post-soaking, nickel plating and cleaning; s25, drying: after drying, taking out all the substrates in the transfer frame; s3, line: through film pasting, exposure and development; s4, pattern electroplating: electroplating and depositing a copper layer to form a wire; s5, film stripping; s6, rapid etching: and etching and removing the exposed nickel layer by using a rapid etching liquid to obtain the conducting wire. The nickel layer is formed between the copper layer and the substrate, and the copper layer is prevented from being stripped from the substrate.

Description

Printed circuit board circuit manufacturing method based on semi-additive method

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a circuit of a printed circuit board based on a semi-additive method.

Background

With the development of society and science, electronic products are increasingly miniaturized, and the development trend also causes the development of printed circuit boards for realizing connection of different devices and substrates for packaging semiconductor chips to be light, thin, short and small under the premise of ensuring good electrical performance and thermal performance. To meet the above requirements, a finer line of smaller size and a thinner insulating layer are technical conditions that must be satisfied. Three main types of methods are classified according to the line formation method, namely a subtractive method, a semi-additive method and a full-additive method, for line production.

In the semi-additive method, an insulating substrate is used, a metal layer called a seed layer is formed on the insulating layer, a plating resist layer is formed on the surface of the insulating layer, and thereafter, exposure and development are performed to form a plating resist pattern. Then, electroplating copper is carried out on the part which is not covered by the plating resist, the plating resist is stripped, and the seed layer is etched and removed to form a circuit. The method generally deposits a seed layer through electroless copper plating, and the copper layer obtained through electroless copper deposition is thin and easy to etch, so that the side etching of the circuit is reduced to a certain extent relatively, and the method can be used for manufacturing a printed circuit board with fine circuits. However, electroless copper is deposited on an insulating substrate, and delamination and blistering are likely to occur due to insufficient adhesion of the electroless copper layer to the substrate.

Disclosure of Invention

In order to solve the defects in the prior art, the invention provides a manufacturing method of a printed circuit board circuit based on a half-addition method, which is characterized in that a nickel layer is formed between a copper layer and a substrate, so that the copper layer is prevented from being stripped from the substrate.

In order to achieve the object of the invention, the following scheme is adopted:

a method for manufacturing a printed circuit board circuit based on a semi-additive method comprises the following steps:

s1, cutting: cutting a substrate into a preset size, wherein the substrate is made of glass fiber cloth impregnated with epoxy resin;

s2, chemical nickel plating:

s21, coarsening: coarsening the substrate;

s22, stacking: placing a substrate on the top of a sucker and adsorbing, and automatically placing a plurality of substrates with suckers in a transfer frame by using a stacking device;

s23, disassembly: all the suckers in the transfer frame are automatically taken out by using the dismounting device, so that a preset gap is reserved between two adjacent substrates;

s24, chemical reaction: sequentially moving the transfer frame into a plurality of tanks by using a clamping transfer device, and respectively performing presoaking, activating, post-dipping, nickel plating and cleaning;

s25, drying: after drying, taking out all the substrates in the transfer frame;

s3, line: the method comprises the steps of film pasting, exposure and development, wherein the film pasting is to thermally press a layer of photosensitive dry film on the surface of a nickel layer of a substrate, the exposure is to expose partial areas of the photosensitive dry film, and the development is to remove areas which are not exposed;

s4, pattern electroplating: electroplating and depositing a copper layer on the exposed area of the photosensitive dry film to form a wire;

s5, film stripping: removing the photosensitive dry film by using a strong alkaline solution;

s6, rapid etching: and after the photosensitive dry film is removed, etching and removing the exposed nickel layer by using a rapid etching liquid to obtain the conducting wire.

Further, the transfer frame comprises two symmetrical inverted U-shaped frames, two symmetrical U-shaped handles, a plurality of rotating rods and a plurality of stop rods, each U-shaped handle is horizontally arranged, two ends of each U-shaped handle are connected with the two inverted U-shaped frames, the rotating rods and two ends of each stop rod are fixedly connected to the inner wall of each inverted U-shaped frame, a plurality of rotating blocks are rotatably arranged on the rotating rods, the tops of the outer ends of the rotating blocks are abutted to the stop rods, steps are arranged at the tops of the inner ends of the rotating blocks, the stacking device comprises a first conveying table and a jacking assembly, the first conveying table is used for sequentially conveying a plurality of substrates with suckers to the positions right below the transfer frame, and the jacking assembly is used for lifting the substrates and placing the substrates on the corresponding steps; the stacking method in step S22 specifically includes: the transfer frame is placed on the top of the first conveying table in advance and fixed; placing the substrate on the top of the sucker and adsorbing the substrate, and sequentially conveying the plurality of substrates with the sucker to the position right below the transfer frame by the first conveying table; the jacking assemblies sequentially lift the substrate, and after the substrate exceeds the corresponding steps, the jacking assemblies are lowered to the original positions, and in the process, the substrate is placed on the corresponding steps.

Further, a vertical box is arranged on the inner wall of the inverted U-shaped frame, vertical rods are arranged on the inner wall of the vertical box, a plurality of first automatic telescopic rods are sequentially arranged in the vertical box from top to bottom, the inner walls of the vertical rods are clung to corresponding rotating blocks, and when the first automatic telescopic rods are extended, the first automatic telescopic rods are used for fixing the tops of corresponding substrates; in step S22, after the substrate is placed in the transfer frame, the first automatic telescopic rod is fully extended to fix the corresponding substrate.

Further, a plurality of assembly grooves are formed in the bottom of the sucker, one end of each assembly groove horizontally penetrates through the sucker, in the step S22, all suckers in the transfer frame face the same direction, and the opening ends of the assembly grooves face one U-shaped handle.

Further, the dismounting device comprises a connecting frame and a plurality of second automatic telescopic rods arranged on one side of the connecting frame, the front ends of the second automatic telescopic rods are provided with vacuum adsorption holes, and the positions of the second automatic telescopic rods are in one-to-one correspondence with the suckers in the transferring frame; the disassembling method of step S23 specifically includes: the second automatic telescopic rod is extended so as to be inserted into the corresponding assembly groove and start to be adsorbed; the sucking disc stops adsorbing the base plate, and the second automatic telescopic rod retracts to the original position to finish the separation of the base plate and the sucking disc.

Further, a distance changing mechanism is arranged in the connecting frame and used for adjusting the distance between a plurality of second automatic telescopic rods, the dismounting device further comprises a motor, four chain wheels, chains, a limiting frame, a sliding block, two stand columns and a second conveying table, the four chain wheels are rotationally arranged on the supporting plate, the motor is connected with one chain wheel, the chains are sleeved on the peripheries of the four chain wheels, the two stand columns are symmetrically arranged at the top of the base, two ends of the limiting frame are in sliding fit with the stand columns, a sliding groove is arranged in the middle of the limiting frame, one side of the sliding block is fixedly connected with the other side of the connecting frame, the sliding block is slidingly arranged in the sliding groove, and the other side of the sliding block is rotationally connected with the chains; the disassembling method in step S23 specifically further includes: after the separation of the substrate and the sucker is completed, the distance-changing mechanism enlarges the distance between a plurality of second automatic telescopic rods; the motor drives the chain wheel to enable the sliding block and the connecting frame on the sliding block to move along with the chain, and the connecting frame is always vertical under the action of the limiting frame; when the bottom sucker contacts the second conveying table, the second automatic telescopic rod stops adsorbing the sucker, the second automatic telescopic rod of the sucker penetrates through the roller of the second conveying table, and the bottom sucker is trapped at the top of the roller of the second conveying table and conveyed through the roller; after the topmost suction cup is conveyed by the roller, the connecting frame returns to the original position.

Further, an avoidance groove is formed in the middle of the first conveying table along the length direction of the first conveying table, the conveying tail end of the second conveying table is in butt joint with the conveying front end of the first conveying table, in step S22, the roughened substrate is placed on the top of the sucker of the second conveying table and then conveyed to the first conveying table, and the sucker is located in the avoidance groove.

Further, in step S25, the method of taking out all the substrates in the transfer frame includes: placing the dried transfer frame on the top of a first conveying table and fixing the transfer frame; the first automatic telescopic rod is fully retracted into the vertical box; the jacking component is lifted, and all the substrates in the transfer frame are higher than the transfer frame; and taking all the substrates away.

Further, the jack-up subassembly includes automatic lifter and locates the roof at its top, and the roof top is equipped with a plurality of stoppers, and the region that a plurality of stoppers enclose matches with the sucking disc.

The invention has the beneficial effects that:

1. the invention forms a nickel layer between the copper layer and the substrate, and uses sodium m-nitrobenzenesulfonate as a nickel etchant by utilizing the difference of copper and nickel. Sodium nitrobenzenesulfonate is not corrosive to copper, and because side etching of copper layer wires is avoided, fine lines with regular cross-sectional shapes can be obtained. Meanwhile, the bonding force between the nickel and the epoxy resin substrate is better than that between the nickel and the epoxy resin substrate, so that the problem that the semi-additive wire is easy to peel off from the substrate is avoided.

2. Through the cooperation of transfer frame, first transport platform, jack-up subassembly three, can stack a plurality of base plates in the transfer frame voluntarily, prepare for the follow-up base plate carries out electroless nickel plating to this process does not need artifical the participation.

3. The sucker in the transfer frame can be taken out by utilizing the dismounting device, so that a certain gap is reserved between two adjacent substrates, and the subsequent substrates can be ensured to be subjected to chemical nickel plating smoothly; the dismounting device can also place the fetched suckers on the second conveying table in sequence so as to be reused.

Drawings

FIG. 1 is a first transfer table configuration diagram of an embodiment;

FIG. 2 is a block diagram of an embodiment;

FIG. 3 is a transfer frame block diagram of an embodiment;

FIG. 4 is a top view of a transfer frame of an embodiment;

FIG. 5 is a cross-sectional view at A in FIG. 4;

FIG. 6 is a rear view of a transfer frame with a substrate placed thereon according to an embodiment;

FIG. 7 is a cross-sectional view at B in FIG. 6;

FIG. 8 is a front view of the removal device of the embodiment with the suction cup in the transfer frame just removed;

FIG. 9 is a right side view of the removal device of the embodiment with the suction cup in the transfer frame just removed;

FIG. 10 is a block diagram showing the disassembling device of the embodiment when the suction cup is placed on the second conveying table;

FIG. 11 is a diagram of a second transfer table configuration of an embodiment;

FIG. 12 is a schematic view of a substrate of an embodiment;

FIG. 13 is a schematic view of forming a nickel layer outside a substrate according to an embodiment;

FIG. 14 is a schematic view of a dry film formed outside the nickel layer of the embodiment;

FIG. 15 is a schematic view after exposure development of the embodiment;

FIG. 16 is a schematic illustration of an embodiment after pattern plating;

FIG. 17 is a schematic diagram of an embodiment after film removal;

FIG. 18 is a schematic diagram of an embodiment after rapid etching;

FIG. 19 is a flow chart of a method of fabricating an embodiment;

reference numerals: the automatic lifting device comprises a transfer frame-1, an inverted U-shaped frame-11, a vertical box-111, a vertical rod-112, a first automatic telescopic rod-113, a U-shaped handle-12, a rotating rod-13, a rotating block-131, a step-132, a stop lever-14, a sucker-2, an assembly groove-21, a connecting frame-51, a second automatic telescopic rod-52, a chain wheel-54, a chain-55, a limiting frame-56, a sliding groove-561, a stand column-58, a second conveying table-59, a first conveying table-3, an extension plate-32, a groove-321, a clamping plate-33, a jacking component-4, an automatic lifting rod-41, a top plate-42 and a limiting block-43.

Detailed Description

Example 1

As shown in fig. 2 and 6, the present embodiment provides a stacking apparatus for automatically placing a plurality of substrates with suction cups 2 in sequence in a transfer frame 1.

Specifically, as shown in fig. 3 to 5, the transfer frame 1 includes two inverted U-shaped frames 11, two U-shaped handles 12, ten rotating rods 13, twelve stop rods 14, the two inverted U-shaped frames 11 are symmetrically arranged, and the internal structures are the same, the two U-shaped handles 12 are horizontally arranged, and the opening directions are opposite, and two ends of each U-shaped handle 12 are connected with the two inverted U-shaped frames 11, note that the positions of the handles 12 are not randomly arranged, but are used for ensuring that the space between the two inverted U-shaped frames 11 is not shielded in the upper and lower directions, so that the substrate is taken out after the chemical nickel plating of the substrate is completed later. Five bull sticks 13, six pin 14 are located in an inverted U type frame 11, bull stick 13, the both ends of pin 14 are all fixed connection in the inner wall of inverted U type frame 11, rotate on every bull stick 13 and be equipped with two rotatory pieces 131, the shape of rotatory piece 131 is close to the triangle-shaped that falls, the tip of rotatory piece 131 bottom is connected in bull stick 13 through the bearing, the top of rotatory piece 131 outer end is the arcwall face of indent, make it can support on a pin 14, the top of rotatory piece 131 inner is equipped with step 132, when rotatory piece 131 outer end supports on pin 14, the mesa of step 132 is the horizontality.

Specifically, the top of the sucker 2 is provided with a plurality of vacuum suction holes, one substrate is sucked by one sucker 2, and note that the positions of the suckers 2 below each substrate are the same, for example, the suckers 2 are all positioned at the very center of the substrate, so that the substrates can be smoothly stacked in the transfer frame 1 in the subsequent processing.

More specifically, in order to facilitate the later removal of the suction cups 2 in the transfer frame 1, the following steps are taken: firstly, as shown in fig. 3, three assembly grooves 21 are formed in the bottom of the sucker 2, one end of each assembly groove 21 horizontally penetrates through the sucker 2, and each assembly groove 21 is used for matching with a dismounting device; secondly, the sucker 2 is made of light materials, such as light plastic; thirdly, the inside of the sucker 2 is hollowed out, and only a plurality of components for realizing vacuum adsorption are installed, so that the weight of the sucker 2 is reduced no matter the sucker is made of light materials or hollow.

Specifically, as shown in fig. 1 and 2, the stacking device includes a first conveying table 3 and a jacking component 4, an avoidance groove is formed in the middle of the first conveying table 3 along the length direction of the first conveying table, and the width of the avoidance groove is larger than that of the suction cup 2 in the direction perpendicular to the length direction of the first conveying table 3. When the first conveying table 3 conveys the substrate, both ends of the substrate move against the conveying surface of the first conveying table 3, and the suction cup 2 below the substrate moves in the avoidance groove.

Specifically, as shown in fig. 1, two sides of one end of the first conveying table 3 are symmetrically provided with extension plates 32, here for stacking points, the inner wall of each extension plate 32 is provided with a groove 321, two ends of each groove 321 are provided with clamping plates 33, the grooves 321 are internally used for placing the transfer frame 1, more precisely the inverted U-shaped frame 11, and the clamping plates 33 are used for fixing the inverted U-shaped frame 11 under the action of telescopic cylinders thereof.

Specifically, the jacking component 4 is arranged below the transfer frame 1 and comprises an automatic lifting rod 41 and a top plate 42 arranged at the top of the automatic lifting rod 41, a power source of the automatic lifting rod 41 can be an air cylinder, an oil cylinder and the like, five limiting blocks 43 are arranged at the top of the top plate 42, the positions of the five limiting blocks 43 are distributed as shown in fig. 1, and an area surrounded by the five limiting blocks 43 is matched with the sucker 2. When in use, the first conveying table 3 firstly conveys the first substrate to a stacking point, namely, the position right below the transfer frame 1; then the automatic lifting rod 41 lifts the top plate 42, when the sucker 2 is positioned between the five limiting blocks 43, the top plate 42 continuously supports the sucker 2 to lift, when the first substrate passes through the four bottom-most rotating blocks 131, the top plate 42 stops lifting and starts to descend to the original position, and in the process of the top plate 42 descending, the first substrate smoothly falls onto the steps 132 of the four bottom-most rotating blocks 131; the first conveying table 3 conveys the second substrate to the stacking position, the second substrate firstly contacts the suction cup 2 of the first substrate in the ascending process, so that the two substrates can ascend simultaneously, after the second substrate passes through the four bottom-most rotating blocks 131, the top plate 42 stops ascending and starts descending to the original position, the second substrate smoothly falls onto the steps 132 of the four bottom-most rotating blocks 131 in the descending process of the top plate 42, the first substrate moves upwards by one layer compared with the original position, the first substrate continues to repeat, each time one substrate is added in the transferring frame 1, and all original substrates move upwards by one layer until stacking of five substrates is completed.

Regarding the process of stacking substrates, three points are described herein: first, the inner walls of the five limiting blocks 43 are inclined planes, so that the fine adjustment of the substrate is realized; second, for one rotating block 131, the outer end of the rotating block 131 needs to be limited between two bars 14, so the number of rotating bars 13 in each transfer frame 1 is one more than the bars 14, more specifically for the following reasons: when the substrates are not stacked, the top of the outer end of the rotating block 131 is propped against one stop lever 14, and in the process of stacking the substrates, the substrates need to dial the inner end of the rotating block 131 upwards, so that the purpose of upwards moving the substrates by one layer can be realized, and in order to prevent the dialing amplitude of the rotating block 131 from being too large, the outer end of the rotating block 131 is limited between the two stop levers 14; third, the assembling grooves 21 of all the suckers 2 in the transfer frame 1 face the same direction and all face the conveying direction of the first conveying table 3, so that the assembling grooves 21 are matched for facilitating the later disassembling device, and then the suckers 2 are taken out.

More specifically, as shown in fig. 7, in order to improve the stability of the substrate in the transfer frame 1, the inner wall of the inverted U-shaped frame 11 is provided with a vertical box 111, the inner wall of the vertical box 111 is provided with a vertical rod 112, five first automatic telescopic rods 113 are sequentially arranged inside the vertical box 111 from top to bottom, the inner wall of the vertical rod 112 is tightly attached to the corresponding rotating block 131, and the vertical rod 112 plays a role in stabilizing the rotating block 131. The power source of the first automatic expansion link 113 may be a cylinder or an oil cylinder, and may be used to fix the top of the corresponding substrate when the first automatic expansion link 113 is extended.

In summary, by using the stacking device of the embodiment, a plurality of substrates can be automatically stacked in the transfer frame 1 through the cooperation of the transfer frame 1, the first conveying table 3 and the jacking component 4, so as to prepare for chemical nickel plating of the subsequent substrates, and the process does not need to be manually participated.

Example 2

In order to provide a predetermined gap between two adjacent substrates, as shown in fig. 8 and 9, the present embodiment provides a disassembling device for taking out all the suction cups 2 in the transfer frame 1 in embodiment 1.

Specifically, the dismounting device comprises a connecting frame 51 and five second automatic telescopic rods 52 arranged on one side of the connecting frame 51, a power source of each second automatic telescopic rod 52 can be an air cylinder or an oil cylinder, each second automatic telescopic rod 52 is similar to a three-fork shape, the front end of each second automatic telescopic rod 52 is provided with a vacuum adsorption hole, and the positions of the five second automatic telescopic rods 52 are in one-to-one correspondence with the suckers 2 in the transferring frame 1. In use, after the transfer frame 1 has completed stacking of the substrates, the second automatic telescopic rod 52 is extended so as to be inserted into the corresponding assembly slot 21 and start to be adsorbed; the suction cup 2 stops sucking the substrate, and the second automatic telescopic rod 52 is retracted to the original position, so that the separation of the substrate and the suction cup 2 is completed.

More specifically, after the substrate is separated from the suction cup 2 by using the dismounting device, in order to recycle the suction cup 2 taken out, on one hand, a distance-changing mechanism is arranged in the connecting frame 51 and used for adjusting the intervals of the five second automatic telescopic rods 52 in the vertical direction, the distance-changing mechanism is a conventional mechanism, and in this embodiment, the specific structure of the distance-changing mechanism is not shown. On the other hand, the dismounting device of this embodiment further includes a motor, four sprockets 54, a chain 55, a limiting frame 56, a slider 57, two upright posts 58, and a second conveying table 59, and the dismounting device is used for sequentially placing the five suckers 2 taken out by the second automatic telescopic rod 52 on the second conveying table 59, and the specific implementation manner is as follows: four sprockets 54 enclose into the rectangle rotation and locate the backup pad, and one of them sprocket 54 is connected to the motor, and the chain 55 overlaps in four sprocket 54 periphery, and base top is located to two stand 58 symmetries, and is located the backup pad both sides, and limit frame 56 both ends respectively sliding fit in corresponding stand 58, are equipped with horizontal spout 561 in the middle of the limit frame 56, and one side fixed connection slider 57 one side of connecting frame 51 far away from second automatic telescopic link 52, slider 57 slip is located in spout 561, and slider 57 opposite side rotates to be connected in chain 55.

In use, as shown in fig. 8, in the state diagram of the dismounting device just taking out the suction cup 2, at this moment, the slide block 57 is located at the sprocket 54 at the upper right corner, the motor drives one sprocket 54 to rotate the whole chain 57 anticlockwise, the slide block 57 will rise first and then move horizontally leftwards, because the slide block 57 is limited and slides in the slide groove 561, and the slide block 57 is rotationally connected with the chain 55, the top surface of the slide block 57 is always upward, that is, the state of the connection frame 51 and the five suction cups 2 thereon will not be changed and will not rotate at will in the process of moving; when the slide 57 is moved to the position shown in fig. 10, i.e. in the middle of the two sprockets 54 on the left, five suction cups 2 are about to come into contact with the second conveying table 59; as shown in fig. 11, the second conveying table 59 is configured such that the second conveying table 59 is roller-type conveying, and the end of the second conveying table 59 facing the dismounting device lacks a sidewall, which is to ensure that the second conveying table 59 does not obstruct the downward movement of the second automatic telescopic rod 52 when the suction cup 2 is placed on the second conveying table 59; note that the pitch of five suction cups 2 needs to be enlarged by a pitch-changing mechanism before the suction cups 2 contact the second conveying table 59, so as to ensure that the suction cups 2 are placed on the second conveying table 59 in sequence; when the bottom sucker 2 contacts the second conveying table 59, the second automatic telescopic rod 52 stops sucking the sucker 2, the second automatic telescopic rod 52 of the sucker 2 passes through the roller of the second conveying table 59 downwards, and the bottom sucker 2 is trapped at the top of the roller of the second conveying table 59 and conveyed by the roller; similarly, after the middle three suckers 2 and the top sucker 2 are trapped and transported away by the roller, the sliding block 57 and the connecting frame 51 return to the original positions for the next cycle.

Preferably, the second conveying table 59 is abutted at the conveying tail end with the conveying front end of the first conveying table 3.

In summary, the sucker 2 in the transfer frame 1 can be taken out by using the dismounting device, so that two adjacent substrates have a certain gap, and the subsequent substrates can be ensured to be subjected to electroless nickel plating smoothly; the dismounting device can also place the removed suction cups 2 in sequence on the second conveyor table 59 for reuse.

Example 3

As shown in fig. 19, the present embodiment provides a method for manufacturing a circuit of a printed circuit board based on a semi-additive method, wherein the semi-additive method includes the following steps:

s1, cutting: the substrate is cut into a preset size, the substrate material is glass fiber cloth impregnated with epoxy resin, and a schematic diagram of the substrate is shown in fig. 12.

S2, chemical nickel plating, which specifically comprises the following 5 steps:

s21, coarsening: coarsening the substrate, wherein the coarsening is to coarsen the surface of the substrate;

s22, stacking: the stacking apparatus of example 1 was used to automatically place a plurality of substrates with suction cups 2 into a transfer frame 1, and the specific steps include: the transfer frame 1 is placed in the groove 321 in advance and fixed by the clamping plate 33; placing the substrate on the top of the sucker 2 and adsorbing, and sequentially conveying the plurality of substrates with the sucker 2 to the position right below the transfer frame 1 by the first conveying table 3; the jacking assemblies 4 sequentially lift the substrates, which are placed on the corresponding steps 132; after the substrate is placed in the transfer frame 1, the first automatic telescopic rods 113 are fully extended to fix the corresponding substrate;

s23, disassembly: all the suction cups 2 in the transfer frame 1 were automatically removed by the removing device of embodiment 2 so that a predetermined gap was provided between two adjacent substrates, comprising the following steps: the second automatic telescopic rod 52 is extended and inserted into the corresponding assembly groove 21 to start adsorption; the sucking disc 2 stops sucking the substrate, and the second automatic telescopic rod 52 is retracted to the original position, so that the separation of the substrate and the sucking disc 2 is completed; after the separation of the substrate and the sucker 2 is completed, the distance-changing mechanism enlarges the intervals of the five second automatic telescopic rods 52; the motor drives the chain wheel 54 to enable the sliding block 57 and the connecting frame 51 on the sliding block to move along with the chain 55, and the sucker 2 is sequentially caught on the top of the roller of the second conveying table 59 and conveyed through the roller; the slide block 57 and the connecting frame 51 return to the original positions;

s24, chemical reaction: the transfer frame 1 is sequentially moved into a plurality of tanks by using a clamping and transferring device, and the pre-soaking, activating, post-soaking, nickel plating and cleaning are respectively carried out, wherein the clamping and transferring device is a conventional device, not specifically shown in the drawing, the way of the clamping and transferring device is that the transfer frame 1 is placed in the corresponding tank, after a period of time, the transfer frame 1 is taken out and placed in the next tank, and in the chemical reaction, the pre-soaking and the post-soaking are carried out in an acid solution; the activation is an electroless nickel plating reaction catalyzed by depositing a catalyst on the surface of a substrate, wherein the catalyst component comprises colloidal palladium; nickel plating is to deposit a nickel layer on the surface of a substrate, wherein the thickness of the nickel layer is 1-3 mu m, and a schematic diagram is shown in figure 13; the cleaning is clean water cleaning;

s25, drying: after drying, taking out all the substrates in the transfer frame 1, wherein the specific method for taking out all the substrates in the transfer frame 1 comprises the following steps: the dried transfer frame 1 is placed in the groove 321 and fixed by the clamping plate 33, and the first automatic telescopic rod 113 is fully retracted into the vertical box 111; lifting the jacking component 4 to lift all the substrates in the transfer frame 1 and be higher than the transfer frame 1; all substrates are taken away manually or by a robotic arm.

S3, line: the film is formed by film pasting, exposure and development, wherein the film pasting is to thermally press a layer of photosensitive dry film on the surface of a nickel layer of a substrate, the schematic diagram is shown in fig. 14, the exposure is to expose partial areas of the photosensitive dry film, the development is to remove the unexposed areas, and the schematic diagram is shown in fig. 15;

s4, pattern electroplating: electroplating and depositing a copper layer on the exposed area of the photosensitive dry film to form a wire, wherein a schematic diagram is shown in fig. 16;

s5, film stripping: removing the photosensitive dry film by using a strong alkaline solution, wherein a schematic diagram is shown in fig. 17;

s6, rapid etching: after removing the photosensitive dry film, the exposed nickel layer is etched and removed by using a rapid etching solution, so as to obtain a wire, and a schematic diagram is shown in fig. 18. The fast etching liquid may include sodium m-nitrobenzenesulfonate 30-100g/L; 30-40g/L of sodium sulfate, 70-100ml/L of sulfuric acid and 2-5g/L of benzotriazole; wherein sodium nitrobenzenesulfonate is used as a nickel etchant, and benzotriazole is used as a slow-release agent of copper.

The above embodiments are merely for illustrating the technical ideas and features of the present invention, and are not meant to be exclusive or limiting. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.

Claims

1. The manufacturing method of the printed circuit board circuit based on the semi-additive method is characterized by comprising the following steps of:

s2, chemical nickel plating:

s21, coarsening: coarsening the substrate;

s22, stacking: placing a substrate on the top of a sucker (2) and adsorbing, and automatically placing a plurality of substrates with the suckers (2) in a transfer frame (1) by using a stacking device;

the transfer frame (1) comprises two symmetrical inverted U-shaped frames (11), two symmetrical U-shaped handles (12), a plurality of rotating rods (13) and a plurality of stop rods (14), each U-shaped handle (12) is horizontally arranged, two ends of each U-shaped handle are connected with the two inverted U-shaped frames (11), the two ends of each rotating rod (13) and each stop rod (14) are fixedly connected to the inner wall of each inverted U-shaped frame (11), a plurality of rotating blocks (131) are rotatably arranged on each rotating rod (13), the tops of the outer ends of the rotating blocks (131) are abutted against the corresponding stop rods (14), steps (132) are arranged at the tops of the inner ends of the rotating blocks, the stacking device comprises a first conveying table (3) and a jacking component (4), the first conveying table (3) is used for sequentially conveying a plurality of substrates with suckers (2) to the positions right below the transfer frame (1), and the jacking component (4) is used for lifting the substrates and placing the substrates on the corresponding steps (132). The stacking method in step S22 specifically includes:

the transfer frame (1) is placed at the top of the first conveying table (3) in advance and fixed;

placing the substrates on the tops of the suckers (2) and adsorbing the substrates, and sequentially conveying the substrates with the suckers (2) to the position right below the transfer frame (1) by the first conveying table (3);

the jacking components (4) sequentially lift the substrate, and after the substrate exceeds the corresponding steps (132), the jacking components (4) are lowered to the original position, and in the process, the substrate is placed on the corresponding steps (132);

s23, disassembly: all the suckers (2) in the transfer frame (1) are automatically taken out by using a dismounting device, so that a preset gap is reserved between two adjacent substrates;

s24, chemical reaction: sequentially moving the transfer frame (1) into a plurality of tanks by using a clamping and transferring device, and respectively performing presoaking, activating, post-dipping, nickel plating and cleaning;

s25, drying: after drying, taking out all the substrates in the transfer frame (1);

2. The method for manufacturing the printed circuit board circuit based on the semi-additive method according to claim 1, wherein a vertical box (111) is arranged on the inner wall of the inverted U-shaped frame (11), vertical rods (112) are arranged on the inner wall of the vertical box (111), a plurality of first automatic telescopic rods (113) are sequentially arranged inside the vertical box (111) from top to bottom, the inner wall of each vertical rod (112) is tightly attached to a corresponding rotating block (131), and when the first automatic telescopic rods (113) are stretched, the top of a corresponding substrate is fixed; in step S22, after the substrate is placed in the transfer frame 1, the first automatic telescopic rod 113 is fully extended to fix the corresponding substrate.

3. The method for manufacturing the circuit of the printed circuit board based on the semi-additive method according to claim 2, wherein a plurality of assembling grooves (21) are formed in the bottom of the sucker (2), one end of each assembling groove (21) horizontally penetrates through the sucker (2), and in step S22, all the suckers (2) in the transfer frame (1) face the same direction, and the open ends of the assembling grooves (21) face one of the U-shaped handles (12).

4. The printed circuit board circuit manufacturing method based on the semi-additive method according to claim 3, wherein the dismounting device comprises a connecting frame (51) and a plurality of second automatic telescopic rods (52) arranged on one side of the connecting frame (51), vacuum adsorption holes are formed in the front ends of the second automatic telescopic rods (52), and the positions of the second automatic telescopic rods (52) are in one-to-one correspondence with the suckers (2) in the transferring frame (1); the disassembling method of step S23 specifically includes:

the second automatic telescopic rod (52) is extended so as to be inserted into the corresponding assembly groove (21) and start adsorption;

the sucking disc (2) stops sucking the substrate, the second automatic telescopic rod (52) is retracted to the original position, and the separation of the substrate and the sucking disc (2) is completed.

5. The manufacturing method of the printed circuit board circuit based on the half addition method according to claim 4, wherein a distance changing mechanism is arranged in the connecting frame (51) and used for adjusting the distance between a plurality of second automatic telescopic rods (52), the dismounting device further comprises a motor, four chain wheels (54), a chain (55), a limiting frame (56), a sliding block, two stand columns (58) and a second conveying table (59), the four chain wheels (54) are rotationally arranged on the supporting plate, the motor is connected with one chain wheel (54), the chain (55) is sleeved on the peripheries of the four chain wheels (54), the two stand columns (58) are symmetrically arranged at the top of the base, two ends of the limiting frame (56) are in sliding fit with the stand columns (58), a sliding groove (561) is arranged in the middle of the limiting frame (56), one side of the connecting frame (51) is fixedly connected with one side of the sliding block, the sliding block is slidingly arranged in the sliding groove (561), and the other side of the sliding block is rotationally connected with the chain (55). The disassembling method in step S23 specifically further includes:

after the separation of the substrate and the sucker (2) is completed, the distance-changing mechanism enlarges the distance between a plurality of second automatic telescopic rods (52);

the motor drives the chain wheel (54) to enable the sliding block and the connecting frame (51) on the sliding block to move along with the chain (55), and the connecting frame (51) is always kept vertical under the action of the limiting frame (56);

after the sucker (2) at the bottommost layer contacts the second conveying table (59), the second automatic telescopic rod (52) stops adsorbing the sucker (2), the second automatic telescopic rod (52) of the sucker (2) passes through the roller of the second conveying table (59), and the sucker (2) at the bottommost layer is trapped at the top of the roller of the second conveying table (59) and conveyed through the roller;

after the topmost sucker (2) is conveyed by the roller, the connecting frame (51) returns to the original position.

6. The method for manufacturing the circuit of the printed circuit board based on the semi-additive method according to claim 5, wherein an avoidance groove is formed in the middle of the first conveying table (3) along the length direction of the first conveying table, the conveying tail end of the second conveying table (59) is in butt joint with the conveying front end of the first conveying table (3), in the step S22, the roughened substrate is placed on the top of the sucker (2) of the second conveying table (59) and then conveyed to the first conveying table (3), and the sucker (2) is located in the avoidance groove.

7. The method for manufacturing a circuit board according to claim 2, wherein the step S25 is a method for removing all the substrates in the transfer frame (1):

placing the dried transfer frame (1) on the top of a first conveying table (3) and fixing;

the first automatic telescopic rod (113) is fully retracted into the vertical box (111);

lifting the jacking component (4) to lift all the substrates in the transfer frame (1) higher than the transfer frame (1);

and taking all the substrates away.

8. The printed circuit board circuit manufacturing method based on the semi-additive method according to claim 1, wherein the jacking component (4) comprises an automatic lifting rod (41) and a top plate (42) arranged at the top of the jacking component, a plurality of limiting blocks (43) are arranged at the top of the top plate (42), and an area surrounded by the limiting blocks (43) is matched with the sucker (2).