CN115988754A

CN115988754A - Printed circuit board circuit manufacturing method based on semi-additive method

Info

Publication number: CN115988754A
Application number: CN202310275560.7A
Authority: CN
Inventors: 李建辉; 方映; 夏东
Original assignee: Suining Ruijiexing Technology Co ltd
Current assignee: Suining Ruijiexing Technology Co ltd
Priority date: 2023-03-21
Filing date: 2023-03-21
Publication date: 2023-04-18
Anticipated expiration: 2043-03-21
Also published as: CN115988754B

Abstract

The invention discloses a printed circuit board circuit manufacturing method based on a semi-additive method, which relates to the technical field of printed circuit boards and comprises the following steps: s1, cutting: cutting the substrate into a preset size; s2, chemical nickel plating: coarsening the substrate; then, automatically placing a plurality of substrates with suckers in the transfer frame by using a stacking device; then, automatically taking out all the suckers in the transfer frame by using a dismounting device; s24, chemical reaction: sequentially moving the transfer frame into a plurality of tanks, and respectively performing presoaking, activating, post-dipping, nickel plating and cleaning; s25, drying: after drying, taking out all the substrates in the transfer frame; s3, circuit: sticking a film, exposing and developing; s4, pattern electroplating: electroplating and depositing a copper layer to form a lead; s5, removing the film; s6, fast etching: and etching and removing the exposed nickel layer by using a rapid etching solution to obtain the lead. The scheme forms a nickel layer between the copper layer and the substrate, and avoids the copper layer from being stripped from the substrate.

Description

Printed circuit board circuit manufacturing method based on semi-additive method

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board circuit manufacturing method based on a semi-additive method.

Background

With the development of society and science and technology, electronic products are increasingly miniaturized, and the development trend also leads to the development of printed circuit boards for realizing the connection of different devices and substrates for packaging semiconductor chips towards light, thin, short and small directions on the premise of ensuring good electrical and thermal properties. In order to meet the above requirements, fine lines with smaller dimensions and thinner insulating layers are technical conditions that must be met. The method is classified according to the forming method of the circuit, and there are three main methods for manufacturing the circuit, which are a subtractive method, a semi-additive method and a full-additive method.

In the semi-additive method, a metal layer called a seed layer is formed on an insulating layer using an insulating substrate, a plating resist layer is formed on the surface of the metal layer, and then exposure and development are performed to form a plating resist pattern. And then electroplating copper on the part which is not covered by the plating resist, stripping the plating resist, and etching to remove the seed layer to form the circuit. The method generally deposits the seed layer by electroless copper plating, and the copper layer obtained by electroless copper plating is thin and easy to etch, so that the side etching of the circuit is reduced to a certain extent relatively, and the method can be used for manufacturing a printed circuit board with fine circuits. However, if electroless copper is deposited on the insulating substrate, insufficient adhesion between the electroless copper plating layer and the substrate is likely to occur, and delamination and blistering tend to occur.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention provides a printed circuit board circuit manufacturing method based on a semi-additive method, wherein a nickel layer is formed between a copper layer and a substrate, and the copper layer is prevented from being stripped from the substrate.

In order to realize the purpose of the invention, the following scheme is adopted:

a printed circuit board circuit manufacturing method based on a semi-additive method comprises the following steps:

s1, cutting: cutting a substrate into a preset size, wherein the substrate is made of glass fiber cloth impregnated with epoxy resin;

s2, chemical nickel plating:

s21, coarsening: coarsening the substrate;

s22, stacking: placing a substrate on the top of a sucker for adsorption, and automatically placing a plurality of substrates with the suckers in a transfer frame by using a stacking device;

s23, disassembling: automatically taking out all the suckers in the transfer frame by using a dismounting device so as to enable a preset gap to be reserved between every two adjacent substrates;

s24, chemical reaction: sequentially moving the transfer frame into a plurality of tanks by using a clamping transfer device, and respectively performing presoaking, activation, post-dipping, nickel plating and cleaning;

s25, drying: after drying, taking out all the substrates in the transfer frame;

s3, circuit: laminating, exposing and developing, wherein the laminating is to thermally press a layer of photosensitive dry film on the surface of the nickel layer of the substrate, the exposing is to expose partial area of the photosensitive dry film, and the developing is to remove the unexposed area;

s4, pattern electroplating: electroplating and depositing a copper layer on the exposed area of the photosensitive dry film to form a lead;

s5, removing the film: removing the photosensitive dry film by using a strong alkaline solution;

s6, fast etching: and after removing the photosensitive dry film, etching and removing the exposed nickel layer by using a quick etching solution to obtain the lead.

Furthermore, the transfer frame comprises two symmetrical inverted U-shaped frames, two symmetrical U-shaped handles, a plurality of rotating rods and a plurality of blocking rods, each U-shaped handle is horizontally arranged, two ends of each U-shaped handle are connected with the two inverted U-shaped frames, the two ends of each rotating rod and the corresponding blocking rod are fixedly connected to the inner wall of each inverted U-shaped frame, a plurality of rotating blocks are rotatably arranged on the rotating rods, the tops of the outer ends of the rotating blocks abut against the blocking rods, steps are arranged on the tops of the inner ends of the rotating blocks, the stacking device comprises a first conveying table and a jacking assembly, the first conveying table is used for sequentially conveying a plurality of substrates with suckers to the positions under the transfer frame, and the jacking assembly is used for lifting the substrates and placing the substrates on the corresponding steps; the stacking method of step S22 specifically includes: placing the transfer frame on the top of the first conveying table in advance and fixing; placing the substrate on the top of the sucker and adsorbing, and sequentially conveying a plurality of substrates with the sucker to the position right below the transfer frame by the first conveying table; the jacking assembly sequentially lifts the substrate, and when the substrate exceeds the corresponding step, the jacking assembly descends to the original position again, and in the process, the substrate is placed on the corresponding step.

Furthermore, a vertical box is arranged on the inner wall of the inverted U-shaped frame, a vertical rod is arranged on the inner wall of the vertical box, a plurality of automatic telescopic rods are sequentially arranged in the vertical box from top to bottom, the inner wall of the vertical rod is tightly attached to the corresponding rotating block, and when the first automatic telescopic rod extends, the vertical rod is used for fixing the top of the corresponding base plate; in step S22, after the substrate is placed in the transfer frame, the first automatic telescopic rods are fully extended to fix the corresponding substrate.

Furthermore, a plurality of assembling grooves are formed in the bottom of the sucker, one end of each assembling groove horizontally penetrates through the sucker, in the step S22, all the suckers in the transfer frame face the same direction, and the opening ends of the assembling grooves face one of the U-shaped handles.

Furthermore, the dismounting device comprises a connecting frame and a plurality of second automatic telescopic rods arranged on one side of the connecting frame, vacuum adsorption holes are formed in the front ends of the second automatic telescopic rods, and the positions of the plurality of second automatic telescopic rods correspond to the suckers in the transfer frame one by one; the disassembling method of the step S23 specifically includes: the second automatic telescopic rod extends to be inserted into the corresponding assembling groove and start to adsorb; the sucking disc stops adsorbing the substrate, and the second automatic telescopic rod retracts to the original position to complete the separation of the substrate and the sucking disc.

Furthermore, a variable-pitch mechanism is arranged in the connecting frame and used for adjusting the space between the plurality of second automatic telescopic rods, the dismounting device further comprises a motor, four chain wheels, a chain, a limiting frame, a sliding block, two upright posts and a second conveying table, wherein the four chain wheels are rotatably arranged on the supporting plate, the motor is connected with one of the chain wheels, the chain is sleeved on the peripheries of the four chain wheels, the two upright posts are symmetrically arranged at the top of the base, two ends of the limiting frame are in sliding fit with the upright posts, a sliding groove is arranged in the middle of the limiting frame, the other side of the connecting frame is fixedly connected with one side of the sliding block, the sliding block is slidably arranged in the sliding groove, and the other side of the sliding block is rotatably connected with the chain; the disassembling method of step S23 further includes: after the substrate is separated from the sucker, the distance between the second automatic telescopic rods is enlarged by the distance changing mechanism; the motor drives the chain wheel to enable the sliding block and the connecting frame on the sliding block to move along with the chain, and the connecting frame is kept vertical all the time under the action of the limiting frame; when the suction cup at the bottommost layer contacts the second conveying table, the second automatic telescopic rod stops adsorbing the suction cup, the second automatic telescopic rod of the suction cup penetrates through the roller of the second conveying table, and the suction cup at the bottommost layer is intercepted at the top of the roller of the second conveying table and conveyed through the roller; and after the suction cup at the topmost layer is conveyed by the roller, the connecting frame returns to the original position.

Furthermore, an avoiding groove is formed in the middle of the first conveying table along the length direction of the first conveying table, the conveying tail end of the second conveying table is in butt joint with the conveying front end of the first conveying table, in the step S22, the roughened substrate is placed on the top of a sucking disc of the second conveying table and then conveyed to the first conveying table, and the sucking disc is located in the avoiding groove.

Further, the method of taking out all the substrates in the transfer frame in step S25 includes: placing the dried transfer frame on the top of a first conveying table and fixing; the first automatic telescopic rod is completely retracted into the vertical box; lifting the jacking assembly to enable all substrates in the transfer frame to be higher than the transfer frame; all substrates are removed.

Further, the jacking assembly comprises an automatic lifting rod and a top plate arranged at the top of the automatic lifting rod, a plurality of limiting blocks are arranged at the top of the top plate, and the area surrounded by the limiting blocks is matched with the sucker.

The invention has the beneficial effects that:

1. the invention forms a nickel layer between a copper layer and a substrate, and adopts sodium m-nitrobenzenesulfonate as a nickel etchant by utilizing the difference of copper and nickel. The sodium nitrobenzenesulfonate is not corrosive to copper, and because the side corrosion of copper layer wires is avoided, a fine circuit with a regular cross section shape can be obtained. Meanwhile, the bonding force between the nickel and the epoxy resin substrate is better than that of copper, so that the problem that the semi-additive lead is easy to peel off from the substrate is solved.

2. Through the cooperation of transfer frame, first transport platform, jack-up subassembly three, can fold a plurality of base plates in the transfer frame automatically, for the follow-up base plate carries out the preparation of chemical nickel plating to this process does not need artifical the participation.

3. The sucker in the transfer frame can be taken out by utilizing the dismounting device so that two adjacent substrates have a certain gap, and the subsequent substrates can be ensured to be smoothly subjected to chemical nickel plating; the dismounting device can also sequentially place the taken-out suckers on the second conveying table so as to be used repeatedly.

Drawings

FIG. 1 is a view showing a structure of a first transfer table of the embodiment;

FIG. 2 is a block diagram of an embodiment;

FIG. 3 is a diagram of a transition block structure of an embodiment;

FIG. 4 is a top view of a transfer frame of an embodiment;

FIG. 5 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 4;

FIG. 6 is a rear view of the transfer frame of the embodiment with a substrate placed thereon;

FIG. 7 is a cross-sectional view taken along line B-B of FIG. 6;

FIG. 8 is a front view of the detachment apparatus of the embodiment just after removal of the suction cup in the transfer frame;

FIG. 9 is a right side view of the detachment apparatus of the embodiment just after removal of the suction cup in the transfer frame;

FIG. 10 is a block diagram of the detaching device of the embodiment when the suction cup is placed on the second stage;

FIG. 11 is a view showing a structure of a second carrying table of the embodiment;

FIG. 12 is a schematic view of a substrate according to an embodiment;

FIG. 13 is a schematic view of a nickel layer formed outside a substrate according to an embodiment;

FIG. 14 is a schematic view showing the formation of a dry film outside the nickel layer of the embodiment;

FIG. 15 is a schematic view of the embodiment after exposure development;

FIG. 16 is a schematic view of the embodiment after pattern plating;

FIG. 17 is a schematic view of the embodiment after film stripping;

FIG. 18 is a schematic view after rapid etching according to an embodiment;

FIG. 19 is a flowchart of a method of making an embodiment;

reference numerals: the device comprises a transfer frame-1, an inverted U-shaped frame-11, a vertical box-111, a vertical rod-112, a first automatic telescopic rod-113, a U-shaped handle-12, a rotating rod-13, a rotating block-131, a step-132, a stop lever-14, a sucker-2, an assembly groove-21, a connecting frame-51, a second automatic telescopic rod-52, a chain wheel-54, a chain-55, a limiting frame-56, a sliding groove-561, an upright post-58, a second conveying table-59, a first conveying table-3, an extension plate-32, a groove-321, a clamping plate-33, a jacking assembly-4, an automatic lifting rod-41, a top plate-42 and a limiting block-43.

Detailed description of the preferred embodiments

Example 1

As shown in fig. 2 and 6, the present embodiment provides a stacking apparatus for automatically placing a plurality of substrates with suction cups 2 in sequence in a transfer frame 1.

Specifically, as shown in fig. 3 to 5, the transfer frame 1 includes two inverted U-shaped frames 11, two U-shaped handles 12, ten rotating rods 13, twelve blocking rods 14, the two inverted U-shaped frames 11 are symmetrically disposed, and the internal structures are the same, the two U-shaped handles 12 are all horizontally disposed, and the opening directions are opposite, the two inverted U-shaped frames 11 are connected to two ends of each U-shaped handle 12, it is noted that the positions of the handles 12 are not randomly disposed, but are not shielded in the upper and lower directions in order to ensure that the space between the two inverted U-shaped frames 11 is not shielded, so that the substrate can be taken out after the electroless nickel plating is completed on the substrate in the subsequent process. Wherein five bull sticks 13, six pin 14 are located in the U type frame 11 of falling, bull stick 13, the equal fixed connection in the 11 inner walls of U type frame in both ends of pin 14, it is equipped with two turning blocks 131 to rotate on every bull stick 13, the shape of turning block 131 is close to the triangle-shaped of falling, the point portion of turning block 131 bottom passes through the bearing and connects in turning block 13, the top of turning block 131 outer end is recessed arcwall face, make it can support on a pin 14, the top of turning block 131 inner is equipped with step 132, when the turning block 131 outer end supports on pin 14, the mesa of step 132 is the horizontality.

Specifically, 2 tops of sucking discs are equipped with a plurality of vacuum adsorption holes, and 2 tops of a sucking disc adsorb a base plate, and it is all the same to notice 2 positions of sucking disc of every base plate below, for example sucking disc 2 all is located the positive center of base plate, just so can guarantee that the base plate can be folded smoothly in transferring frame 1 in subsequent processing.

More specifically, in order to facilitate the later removal of the suction cups 2 in the transfer frame 1, the following steps are taken: firstly, as shown in fig. 6, the bottom of the suction cup 2 is provided with three assembling grooves 21, one end of each assembling groove 21 horizontally penetrates through the suction cup 2, and the assembling grooves 21 are used for matching with a dismounting device; secondly, the sucking disc 2 is made of light materials, such as light plastics; thirdly, the inside of the sucker 2 is hollowed, and only some components used for realizing vacuum adsorption are installed, so that the sucker 2 is lightened in weight no matter made of light materials or hollow inside.

Specifically, as shown in fig. 1 and 2, the stacking device includes a first conveying table 3 and a jacking assembly 4, wherein an avoiding groove is formed in the middle of the first conveying table 3 along the length direction of the first conveying table, and the width of the avoiding groove is greater than that of the suction cup 2 in the direction perpendicular to the length direction of the first conveying table 3. When the first transfer table 3 transfers the substrate, both ends of the substrate move against the transfer surface of the first transfer table 3, and the suction cup 2 below the substrate moves in the escape groove.

Specifically, as shown in fig. 1, two sides of one end of the first conveying table 3 are symmetrically provided with extending plates 32, where the extending plates are point positions for stacking, the inner walls of the extending plates 32 are provided with grooves 321, two ends of the grooves 321 are provided with clamping plates 33, the transferring frame 1, more precisely, the inverted U-shaped frame 11 is placed in the grooves 321, and the clamping plates 33 are used for fixing the inverted U-shaped frame 11 under the action of the telescopic cylinders.

Specifically, the jacking assembly 4 is arranged below the transfer frame 1 and comprises an automatic lifting rod 41 and a top plate 42 arranged at the top of the automatic lifting rod, the power source of the automatic lifting rod 41 can be a cylinder, an oil cylinder and the like, five limiting blocks 43 are arranged at the top of the top plate 42, the positions of the five limiting blocks 43 are distributed as shown in fig. 1, and the area enclosed by the five limiting blocks 43 is matched with the sucker 2. When the substrate stacking device is used, the first conveying table 3 conveys a first substrate to a stacking position, namely right below the transfer frame 1; then the automatic lifting rod 41 lifts the top plate 42, when the suction cup 2 is positioned between the five limit blocks 43, the top plate 42 continues to support the suction cup 2 to lift, when the first substrate crosses the four rotating blocks 131 at the bottom layer, the top plate 42 stops lifting and starts to descend to the original position, and in the process that the top plate 42 descends, the first substrate smoothly falls onto the steps 132 of the four rotating blocks 131 at the bottom layer; the first transporting table 3 transports the second substrate to the stacking position, the second substrate contacts the suction cup 2 of the first substrate during the ascending process, so the two substrates will ascend simultaneously, after the second substrate crosses the four rotating blocks 131 at the bottom layer, the top plate 42 stops ascending and starts descending to the original position, during the descending process of the top plate 42, the second substrate will drop on the steps 132 of the four rotating blocks 131 at the bottom layer smoothly, the first substrate will move one layer above the original position, and the process will be repeated, and when one substrate is added in the transferring frame 1, all the original substrates will move one layer upwards until the stacking of five substrates is completed.

Regarding the process of stacking substrates, three points are described here: firstly, the inner walls of the five limiting blocks 43 are inclined planes, so that the substrate can be finely adjusted; second, for one turning block 131, the outer end of the turning block 131 needs to be restricted between two stop levers 14, so that there is one more turning lever 13 than stop lever 14 in each transfer frame 1, for more specific reasons as follows: when the substrates are not stacked, the top of the outer end of the rotating block 131 abuts against one stop lever 14, and in the process of stacking the substrates, the substrates need to be shifted upwards to shift the inner end of the rotating block 131, so that the substrates can be shifted one layer upwards, and therefore, in order to prevent the shifting amplitude of the rotating block 131 from being too large, the outer end of the rotating block 131 is limited between the two stop levers 14; third, the assembly grooves 21 of all the suckers 2 in the transfer frame 1 face the same direction and face the conveying direction of the first conveying table 3, so that the assembly grooves 21 are matched for the later-stage disassembling device, and then the suckers 2 are taken out.

More specifically, as shown in fig. 7, in order to improve the stability of the substrate in the transfer frame 1, a vertical box 111 is disposed on the inner wall of the inverted U-shaped frame 11, a vertical rod 112 is disposed on the inner wall of the vertical box 111, five automatic retractable rods 113 are sequentially disposed inside the vertical box 111 from top to bottom, the inner wall of the vertical rod 112 is closely attached to the corresponding rotating block 131, and the vertical rod 112 plays a role in stabilizing the rotating block 131. The power source of the first automatic expansion link 113 may be an air cylinder or an oil cylinder, and when the first automatic expansion link 113 is expanded, it may be used to fix the top of the corresponding substrate.

In summary, with the stacking apparatus of the present embodiment, by matching the transfer frame 1, the first conveying table 3, and the jacking assembly 4, a plurality of substrates can be automatically stacked in the transfer frame 1 to prepare for electroless nickel plating of subsequent substrates, and this process does not require human intervention.

Example 2

In order to provide a predetermined gap between two adjacent substrates, as shown in fig. 8 and 9, the present embodiment provides a detaching device for removing all the suction cups 2 in the transfer frame 1 of embodiment 1.

Specifically, the dismounting device comprises a connecting frame 51 and five second automatic telescopic rods 52 arranged on one side of the connecting frame 51, the power source of each second automatic telescopic rod 52 can be an air cylinder or an oil cylinder, each second automatic telescopic rod 52 is similar to a trident shape, the front end of each second automatic telescopic rod 52 is provided with a vacuum adsorption hole, and the positions of the five second automatic telescopic rods 52 correspond to the suction cups 2 in the transfer frame 1 one by one. When in use, after the transfer frame 1 finishes the stacking of the substrates, the second automatic telescopic rod 52 extends to enable the second automatic telescopic rod to be inserted into the corresponding assembling groove 21 and start to adsorb; the suction cup 2 stops sucking the substrate, and the second automatic telescopic rod 52 retracts to the original position, thereby completing the separation of the substrate from the suction cup 2.

More specifically, after the substrate is separated from the suction cup 2 by the detaching device, in order to recycle the taken-out suction cup 2, on one hand, a pitch varying mechanism is arranged in the connecting frame 51 for adjusting the vertical distance between the five second automatic telescopic rods 52, the pitch varying mechanism is a conventional mechanism, and the specific structure of the pitch varying mechanism is not shown in this embodiment. On the other hand, the dismounting device of this embodiment further includes a motor, four chain wheels 54, a chain 55, a limit frame 56, a slider 57, two upright posts 58, and a second conveying table 59, and the dismounting device is used for placing five suction cups 2 taken out by the second automatic telescopic rod 52 on the second conveying table 59 in sequence, and the specific implementation manner is as follows: four sprockets 54 enclose into the rectangle and rotate and locate the backup pad, and one of them sprocket 54 is connected to the motor, and chain 55 overlaps in four sprocket 54 peripheries, and the base top is located to two stand 58 symmetries, and is located the backup pad both sides, and sliding fit is respectively in corresponding stand 58 at spacing frame 56 both ends, is equipped with horizontally spout 561 in the middle of spacing frame 56, and one side fixed connection slider 57 one side of second automatic telescopic link 52 is kept away from to the link frame 51, and slider 57 slides and locates in spout 561, and slider 57 opposite side rotates to be connected in chain 55.

When in use, as shown in fig. 8, as a state diagram of the dismounting device just taking out the suction cup 2, at this time, the sliding block 57 is located at the chain wheel 54 at the upper right corner, the motor drives one chain wheel 54 to make the whole chain 57 rotate counterclockwise, the sliding block 57 will rise first and then move horizontally leftward, because the sliding block 57 is limited and slides in the sliding groove 561, and the sliding block 57 is rotatably connected to the chain 55, the top surface of the sliding block 57 is always upward, that is, in the moving process of the connecting frame 51 and the five suction cups 2 thereon, the state of the connecting frame 57 is kept unchanged and the connecting frame cannot rotate randomly; when the slide 57 is moved to the position shown in fig. 10, i.e. in the middle of the two sprockets 54 on the left, five suction cups 2 are about to contact the second transfer table 59; as shown in fig. 11, the structure of the second conveying table 59 is that the second conveying table 59 is in roller type conveying, and the end part of the second conveying table 59 facing to the detaching device is lack of side wall, and this structure is to ensure that the second conveying table 59 does not obstruct the downward movement of the second automatic telescopic rod 52 when the suction cup 2 is placed on the second conveying table 59; note that the pitch of the five suction cups 2 needs to be enlarged by the pitch changing mechanism before the suction cups 2 contact the second conveying table 59 to ensure that the suction cups 2 are sequentially placed on the second conveying table 59; when the suction cup 2 at the bottommost layer contacts the second conveying platform 59, the second automatic telescopic rod 52 stops adsorbing the suction cup 2, the second automatic telescopic rod 52 of the suction cup 2 downwards passes through the roller of the second conveying platform 59, and the suction cup 2 at the bottommost layer is intercepted at the top of the roller of the second conveying platform 59 and conveyed by the roller; similarly, after the middle three suckers 2 and the topmost sucker 2 are intercepted by the roller and conveyed away, the sliding block 57 and the connecting frame 51 return to the original position for the next recycling.

Preferably, the second transfer table 59 butt-joints the transfer trailing end with the transfer leading end of the first transfer table 3.

In conclusion, the sucker 2 in the transfer frame 1 can be taken out by utilizing the dismounting device, so that a certain gap is reserved between two adjacent substrates, and the subsequent substrates can be ensured to be smoothly subjected to chemical nickel plating; the dismounting device also allows the suction cups 2 taken out to be placed in sequence on the second delivery table 59 for reuse.

Example 3

As shown in fig. 19, the present embodiment provides a method for manufacturing a printed circuit board circuit based on a semi-additive method, where the semi-additive method includes the following steps:

s1, cutting: cutting the substrate into a predetermined size, wherein the substrate is made of glass fiber cloth impregnated with epoxy resin, and the schematic diagram of the substrate is shown in fig. 12.

S2, chemically plating nickel, and specifically comprising the following 5 steps:

s21, coarsening: coarsening the substrate, wherein the coarsening is to coarsen the surface of the substrate;

s22, stacking: the stacking device of embodiment 1 is used for automatically placing a plurality of substrates with suckers 2 in a transfer frame 1, and the method specifically comprises the following steps: the transfer frame 1 is placed in the groove 321 in advance and is fixed by the clamping plate 33; placing the substrate on the top of the sucker 2 and adsorbing, and sequentially conveying a plurality of substrates with the sucker 2 to the position right below the transfer frame 1 by the first conveying table 3; the jacking assembly 4 in turn raises the substrates, which are placed on the corresponding steps 132; after the substrates are placed in the transfer frame 1, the first automatic expansion rods 113 are fully extended to fix the corresponding substrates;

s23, disassembling: the dismounting device of the embodiment 2 is utilized to automatically take out all the suckers 2 in the transfer frame 1 so as to enable a preset gap to be reserved between two adjacent substrates, and the method specifically comprises the following steps: the second automatic expansion link 52 extends and is inserted into the corresponding assembly groove 21 to start adsorption; the suction cup 2 stops adsorbing the substrate, and the second automatic telescopic rod 52 retracts to the original position, so that the substrate is separated from the suction cup 2; after the separation of the substrate from the suction cup 2 is completed, the distance changing mechanism expands the distance between the five second automatic telescopic rods 52; the motor drives the chain wheel 54 to make the slide block 57 and the connecting frame 51 thereon move along with the chain 55, and the suction cups 2 are sequentially intercepted at the top of the roller of the second conveying platform 59 and conveyed by the roller; the slide block 57 and the connecting frame 51 return to the original position;

s24, chemical reaction: sequentially moving the transfer frame 1 into a plurality of tanks by using a clamping and transferring device, and respectively performing presoaking, activation, post-dipping, nickel plating and cleaning, wherein the clamping and transferring device is a conventional device which is not specifically shown in the attached drawings, the path completed by the clamping and transferring device is that the transfer frame 1 is placed in the corresponding tank, after a period of time, the transfer frame 1 is taken out and placed in the next tank, and in the chemical reaction, both the presoaking and the post-dipping are performed in an acid solution; the activation is a chemical nickel plating reaction catalyzed by a catalyst deposited on the surface of the substrate, and the catalyst component comprises colloidal palladium; the nickel plating is to deposit a nickel layer on the surface of the substrate, the thickness of the nickel layer is 1-3 μm, and the schematic diagram is shown in FIG. 13; the cleaning is clean water cleaning;

s25, drying: after drying, all the substrates in the transfer frame 1 are taken out, and the specific method for taking out all the substrates in the transfer frame 1 comprises the following steps: placing the dried transfer frame 1 in the groove 321 and fixing the transfer frame by using the clamping plate 33, and completely retracting the first automatic telescopic rod 113 into the vertical box 111; the jacking assembly 4 is lifted up to lift all the substrates in the transfer frame 1 to be higher than the transfer frame 1; all substrates are removed manually or by a robotic arm.

S3, circuit: after film pasting, exposure and development, wherein the film pasting is to thermally press a layer of photosensitive dry film on the surface of the nickel layer of the substrate, the schematic diagram is shown in fig. 14, the exposure is to expose partial areas of the photosensitive dry film, the development is to remove the unexposed areas, and the schematic diagram is shown in fig. 15;

s4, pattern electroplating: electroplating and depositing a copper layer on the exposed area of the photosensitive dry film to form a conducting wire, wherein the schematic diagram is shown in fig. 16;

s5, removing the film: removing the photosensitive dry film using a strongly alkaline solution, as shown schematically in fig. 17;

s6, fast etching: after removing the photosensitive dry film, the exposed nickel layer is etched and removed by using a fast etching solution to obtain a conductive wire, which is schematically shown in fig. 18. The components of the rapid etching solution can comprise 30-100g/L of sodium m-nitrobenzenesulfonate; 30-40g/L of sodium sulfate, 70-100ml/L of sulfuric acid and 2-5g/L of benzotriazole; the sodium m-nitrobenzenesulfonate is used as a nickel etching agent, and the benzotriazole is used as a slow release agent of copper.

The above embodiments are only for illustrating the technical ideas and features of the present invention, and are not meant to be exclusive or limiting of the present invention. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention as defined by the claims below.

Claims

1. A printed circuit board circuit manufacturing method based on a semi-additive method is characterized by comprising the following steps:

s2, chemical nickel plating:

s21, coarsening: coarsening the substrate;

s22, stacking: placing a substrate on the top of a sucking disc (2) for adsorption, and automatically placing a plurality of substrates with the sucking discs (2) in a transfer frame (1) by using a stacking device;

s23, disassembling: automatically taking out all the suckers (2) in the transfer frame (1) by using a dismounting device so as to enable a preset gap to be reserved between every two adjacent substrates;

s24, chemical reaction: sequentially moving the transfer frame (1) to a plurality of tanks by using a clamping and transferring device, and respectively carrying out presoaking, activating, post-dipping, nickel plating and cleaning;

s25, drying: after drying, taking out all the substrates in the transfer frame (1);

2. The printed circuit board circuit manufacturing method based on the semi-additive method according to claim 1, wherein the transfer frame (1) comprises two symmetrical inverted-U-shaped frames (11), two symmetrical U-shaped handles (12), a plurality of rotating rods (13) and a plurality of blocking rods (14), each U-shaped handle (12) is horizontally arranged, two ends of each U-shaped handle (12) are connected with the two inverted-U-shaped frames (11), two ends of each rotating rod (13) and one end of each blocking rod (14) are fixedly connected to the inner wall of the corresponding inverted-U-shaped frame (11), a plurality of rotating blocks (131) are rotatably arranged on each rotating rod (13), the tops of the outer ends of the rotating blocks (131) abut against the blocking rods (14), steps (132) are arranged on the tops of the inner ends of the rotating blocks, the stacking device comprises a first conveying table (3) and a jacking assembly (4), the first conveying table (3) is used for sequentially conveying a plurality of substrates with suckers (2) to be right below the transfer frame (1), and the jacking assembly (4) is used for lifting the substrates and placing the substrates on the corresponding steps (132); the stacking method of step S22 specifically includes:

the transfer frame (1) is placed on the top of the first conveying table (3) in advance and fixed;

placing the substrate on the top of the sucker (2) for adsorption, and sequentially conveying a plurality of substrates with the sucker (2) to the position right below the transfer frame (1) by the first conveying platform (3);

the jacking assembly (4) sequentially raises the substrate, and when the substrate exceeds the corresponding step (132), the jacking assembly (4) descends to the original position again, and in the process, the substrate is placed on the corresponding step (132).

3. The printed circuit board circuit manufacturing method based on the semi-additive method according to claim 2, wherein a vertical box (111) is arranged on the inner wall of the inverted U-shaped frame (11), a vertical rod (112) is arranged on the inner wall of the vertical box (111), a plurality of automatic telescopic rods (113) are sequentially arranged inside the vertical box (111) from top to bottom, the inner wall of the vertical rod (112) is tightly attached to the corresponding rotating block (131), and when the first automatic telescopic rod (113) extends, the top of the corresponding substrate is fixed; in step S22, after the substrate is placed in the transfer frame (1), the first automatic telescopic rods (113) are all extended to fix the corresponding substrate.

4. The method for manufacturing the traces on the printed circuit board based on the semi-additive method according to claim 3, wherein the bottom of the suction cup (2) is provided with a plurality of assembling grooves (21), one end of each assembling groove (21) horizontally penetrates through the suction cup (2), in the step S22, all the suction cups (2) in the transfer frame (1) are in the same orientation, and the open ends of the assembling grooves (21) are in the orientation of one U-shaped handle (12).

5. The printed circuit board circuit manufacturing method based on the semi-additive method according to claim 4, wherein the dismounting device comprises a connecting frame (51) and a plurality of second automatic telescopic rods (52) arranged on one side of the connecting frame (51), the front ends of the second automatic telescopic rods (52) are provided with vacuum adsorption holes, and the positions of the plurality of second automatic telescopic rods (52) correspond to the suckers (2) in the transfer frame (1) one by one; the disassembling method of the step S23 specifically includes:

the second automatic expansion link (52) is extended to be inserted into the corresponding assembly groove (21) and start to absorb;

the sucking disc (2) stops adsorbing the substrate, and the second automatic telescopic rod (52) retracts to the original position to complete the separation of the substrate and the sucking disc (2).

6. The printed circuit board circuit manufacturing method based on the semi-additive method according to claim 5, wherein a variable pitch mechanism is arranged in the connecting frame (51) and used for adjusting the distance between the plurality of second automatic telescopic rods (52), the dismounting device further comprises a motor, four chain wheels (54), a chain (55), a limiting frame (56), a sliding block, two upright posts (58) and a second conveying table (59), the four chain wheels (54) are rotatably arranged on the supporting plate, the motor is connected with one of the chain wheels (54), the chain (55) is sleeved on the peripheries of the four chain wheels (54), the two upright posts (58) are symmetrically arranged on the top of the base, two ends of the limiting frame (56) are in sliding fit with the upright posts (58), a sliding groove (561) is formed in the middle of the limiting frame (56), the other side of the connecting frame (51) is fixedly connected with one side of the sliding block, the sliding block is slidably arranged in the sliding groove (561), and the other side of the sliding block is rotatably connected with the chain (55); the disassembling method of the step S23 specifically further includes:

after the substrate is separated from the sucker (2), the distance between the second automatic telescopic rods (52) is enlarged by the distance changing mechanism;

the motor drives the chain wheel (54) to enable the sliding block and the connecting frame (51) on the sliding block to move along with the chain (55), and the connecting frame (51) is always kept vertical under the action of the limiting frame (56);

when the suction cup (2) at the bottommost layer contacts the second conveying platform (59), the second automatic telescopic rod (52) stops adsorbing the suction cup (2), the second automatic telescopic rod (52) of the suction cup (2) passes through the roller of the second conveying platform (59), and the suction cup (2) at the bottommost layer is intercepted at the top of the roller of the second conveying platform (59) and conveyed through the roller;

after the suction cups (2) at the topmost layer are conveyed by the rollers, the connecting frame (51) returns to the original position.

7. The method for fabricating traces on a printed circuit board according to claim 6, wherein an avoiding groove is formed in the middle of the first transfer stage (3) along the length direction thereof, the second transfer stage (59) has a transfer tail end butted against the transfer front end of the first transfer stage (3), and in step S22, the roughened substrate is placed on the top of the suction cup (2) of the second transfer stage (59) and then transferred onto the first transfer stage (3), and the suction cup (2) is located in the avoiding groove.

8. The method for fabricating a printed circuit board based on semi-additive method according to claim 3, wherein the method for taking out all the substrates in the transfer frame (1) in step S25 comprises:

placing the dried transfer frame (1) on the top of a first conveying table (3) and fixing;

the first automatic telescopic rod (113) is completely retracted into the vertical box (111);

the jacking component (4) is lifted, and all substrates in the transfer frame (1) are higher than the transfer frame (1);

all substrates are removed.

9. The method for manufacturing the printed circuit board circuit based on the semi-additive method according to claim 2, wherein the jacking assembly (4) comprises an automatic lifting rod (41) and a top plate (42) arranged at the top of the automatic lifting rod, a plurality of limiting blocks (43) are arranged at the top of the top plate (42), and the area enclosed by the limiting blocks (43) is matched with the sucking disc (2).