CN115946911A - PCB film pasting device and film pasting method - Google Patents
PCB film pasting device and film pasting method Download PDFInfo
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- CN115946911A CN115946911A CN202211232664.1A CN202211232664A CN115946911A CN 115946911 A CN115946911 A CN 115946911A CN 202211232664 A CN202211232664 A CN 202211232664A CN 115946911 A CN115946911 A CN 115946911A
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Abstract
The invention discloses a PCB film pasting device and a film pasting method, comprising a PCB moving mechanism and a film pasting mechanism, wherein the PCB moving mechanism comprises a sucker and a driving component for driving the sucker to move and lift; the film sticking mechanism comprises a film sticking platform, a film paving assembly, a feeding roller and an auxiliary film recycling roller, the film paving assembly comprises a moving assembly, a film paving block and a film cutting sheet, and the film paving block and the film cutting sheet are arranged on the moving assembly and can move along the film sticking platform; the feeding roller and the auxiliary film recovery roller are positioned on the side face of the film sticking platform, a double-layer film is fixed on the feeding roller, and the double-layer film passes through the space between the film paving block and the film sticking platform; the double-layer film comprises a bottom film and an auxiliary film, the film pasting platform is in a negative pressure state, and the bottom film is arranged on the film pasting platform; the auxiliary film is wound on the auxiliary film recovery roller from the upper side of the film paving block. According to the invention, the film is pasted in a mode of firstly spreading the film and then placing the PCB, the PCB does not need to be turned over repeatedly during film pasting, and the film pasting efficiency is improved.
Description
Technical Field
The invention relates to the technical field of PCB film pasting, in particular to a PCB film pasting device and a film pasting method.
Background
The PCB needs to be subjected to film pasting treatment before plastic package. The existing film pasting method is that a PCB is firstly turned over, so that the back surface of the PCB faces upwards, then the PCB is fixed through a positioning column, and a protective film is pasted on the PCB. The film pasting process is complicated, and the PCB is easy to have a deviation problem in the film pasting process, so that the film pasting effect of the PCB is influenced.
Disclosure of Invention
In order to solve the problems, the invention provides a PCB film pasting device and a film pasting method, which can quickly finish film pasting work and ensure film pasting effect.
Therefore, the first technical scheme of the invention is as follows: a PCB film pasting device comprises a PCB moving mechanism and a film pasting mechanism, wherein the PCB moving mechanism comprises a sucker and a driving assembly for driving the sucker to move and lift; the film sticking mechanism comprises a film sticking platform, a film paving assembly, a feeding roller and an auxiliary film recycling roller, the film paving assembly comprises a moving assembly, a film paving block and a film cutting sheet, and the film paving block and the film cutting sheet are arranged on the moving assembly and can move along the film sticking platform; the feeding roller and the auxiliary film recovery roller are positioned on the side surface of the film sticking platform, a double-layer film is fixed on the feeding roller, and the double-layer film passes through the space between the film paving block and the film sticking platform; the double-layer film comprises a bottom film and an auxiliary film, the film pasting platform is in a negative pressure state, and the bottom film is arranged on the film pasting platform; the auxiliary film is wound on the auxiliary film recovery roller from the upper side of the film paving block.
The invention adopts the form of firstly spreading a film and then placing a PCB (printed Circuit Board) for film pasting, the film is in a double-layer form, except a bottom film for pasting the PCB, the film also comprises a layer of auxiliary film, and the double-layer film is wound into a coil and fixed on a feeding roller; the film laying block can lay the double-layer film on the film pasting platform, the bottom film faces downwards at the moment and can be adsorbed by the film pasting platform, the auxiliary film recycling roller can wind the auxiliary film, the auxiliary film is torn off from the bottom film, then the bottom film is cut off by the aid of the cutting film, and the length of the bottom film is matched with that of the PCB; the PCB moving mechanism absorbs the PCB by utilizing the sucking disc, drives the PCB to move above the film pasting platform and to be pasted with the bottom film, and film pasting work is finished.
Preferably, still include rolling mechanism, rolling mechanism includes that first straight line removes module and press mold support, and first straight line removes the module and sets up with the pad pasting platform side by side, and the press mold support mounting is on first straight line removes the module, and press mold gyro wheel is installed in the rotation of press mold support top. In order to make basement membrane and PCB board laminate more, PCB board moving mechanism can remove the PCB board of having pasted the basement membrane to press mold gyro wheel top, and the press mold gyro wheel receives the drive of first linear movement module, moves along the length direction of PCB board, with the thorough pressfitting of basement membrane and PCB board.
Preferably, one side of the film paving block, which faces the film pasting platform, is of a triangular structure, the upper side surface of the film paving block is an inclined surface, and the auxiliary film bypasses the inclined surface and is wound on the auxiliary film recovery roller. The inclined plane is arranged above the film paving block, so that the auxiliary film is more conveniently wound by the auxiliary film recovery roller, and the auxiliary film is quickly torn off from the bottom film.
Preferably, the upper end face of the film sticking platform is provided with a porous ceramic sheet, the lower part of the film sticking platform is connected with a suction device, and the porous ceramic sheet is in a negative pressure state; and a cutting groove is arranged on the film sticking platform. The suction equipment sucks air to enable the ceramic wafer to be in negative pressure, so that the base membrane is adsorbed, and when the base membrane is attached to the PCB, the suction equipment stops sucking air to enable the base membrane to be conveniently separated from the ceramic wafer; the cutting groove facilitates the cutting of the membrane by the cutting sheet.
Preferably, the moving assembly comprises a second linear moving module and a mounting plate, and the mounting plate is driven by the second linear moving module; the film cutting cylinder is transversely arranged on the mounting plate, and the film cutting sheet is arranged on the film cutting cylinder; the film paving block is arranged on the mounting plate. The film spreading block moves above the film pasting platform through the mounting plate, and after the bottom film is adsorbed by the film pasting platform, the film cutting cylinder drives the film cutting sheet to transversely move so as to cut the bottom film, so that the bottom film is conveniently pasted with the PCB.
Preferably, the driving assembly comprises a supporting plate, and the supporting plate is positioned above the film sticking mechanism; an opening for the sucker to move is formed in the middle of the supporting plate, a third linear moving module is arranged on the side face of the opening, and the moving frame is arranged at the opening and is installed on the third linear moving module; the fourth linear movement module of vertical setting is installed on removing the frame, and the sucking disc is installed on the sucking disc mounting panel, and the sucking disc mounting panel is installed on fourth linear movement module. The sucking disc can be through the round trip movement between material loading level, pad pasting position, the roll extrusion position of third rectilinear movement module, and the sucking disc can be ordered about to the fourth rectilinear movement module and reciprocates, and the sucking disc utilizes the negative pressure to fix the PCB board, drives the PCB board and removes.
The second technical scheme of the invention is as follows: a PCB film pasting method comprises the following steps:
in an initial state, the PCB is arranged at a loading position, the double-layer film is fixed on the loading roller, the film paving block is positioned at an initial position, the end part of the double-layer film passes through the lower part of the film paving block, and the auxiliary film bypasses the film paving block and is fixed on the auxiliary film recovery roller;
1) The film laying block drives the double-layer film to move along the film pasting platform, so that the double-layer film is adsorbed by the film pasting platform;
2) The film spreading block moves to the initial position along the film sticking platform, the auxiliary film recovery roller rotates, and the auxiliary film is wound to separate the auxiliary film from the bottom film, and the bottom film is adsorbed on the film sticking platform;
3) The cutting film moves to the cutting groove of the film sticking platform to cut off the basement membrane;
4) The PCB moving mechanism moves the PCB at the material loading position to the upper part of the film pasting platform by utilizing the sucking disc, and the PCB moves downwards to be pasted with the bottom film on the film pasting platform, so that the film pasting work is completed.
Preferably, PCB board moving mechanism can drive the PCB board after laminating with the basement membrane, removes to rolling mechanism top, and the film pressing gyro wheel is contradicted with the PCB board, and the relative PCB board of film pressing gyro wheel removes for basement membrane and PCB board are thoroughly laminated.
Compared with the prior art, the invention has the beneficial effects that: the film is pasted in a mode of firstly spreading the film and then placing the PCB, the PCB does not need to be turned over repeatedly during film pasting, and the film pasting efficiency is improved; the bottom film is flatly paved on the film sticking platform by the film paving block and is fixed on the film sticking platform through negative pressure, so that the bottom film is smoother; and the film pressing roller is utilized to roll the bottom film and the PCB for the second time, so that bubbles are discharged, the bottom film and the PCB are more conformable, and the film is more firmly attached.
Drawings
The following detailed description is made with reference to the accompanying drawings and embodiments of the present invention
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a schematic structural view of a film sticking mechanism according to the present invention;
FIG. 4 is a top view of the film attaching mechanism according to the present invention;
FIG. 5 is a schematic view of the structure of the loading roller of the present invention;
FIG. 6 is a schematic structural view of the PCB moving mechanism of the present invention;
FIG. 7 is a schematic view of the rolling mechanism of the present invention;
FIG. 8 is a schematic view of the operation of a two-layer membrane of the present invention;
fig. 9 is a partially enlarged view of fig. 8.
Labeled as: the PCB board moving mechanism 1, the sucker 11, the supporting plate 12, the opening 13, the third guide rail 14, the third screw rod 15, the third motor 16, the moving frame 17, the fourth guide rail 18, the fourth motor 19 and the sucker mounting plate 20;
the film pasting platform 3, the porous ceramic plate 31 and the cutting groove 32;
the film spreading assembly 4, a film spreading block 41, a film cutting sheet 42, a mounting plate 43, a second guide rail 44, a second motor 45, a film cutting cylinder 46, a guide rod 47, a film cutting mounting block 48 and an inclined surface 49;
a feeding plate 5, a feeding roller 51, an auxiliary film recovery roller 52, a film blocking shaft 53, a guide shaft 54, a feeding motor 55 and a recovery motor 56;
the film laminating machine comprises a rolling mechanism 6, a film laminating support 61, a first guide rail 62, a first motor 63 and a film laminating roller 64;
a double-layer film 7, a bottom film 71 and an auxiliary film 72.
Detailed Description
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if any, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a number" or "a number" means two or more unless explicitly specified otherwise.
See the drawings. The PCB film sticking device comprises a PCB moving mechanism 1 and a film sticking mechanism, wherein the PCB moving mechanism 1 comprises a sucker 11 and a driving component for driving the sucker to move and lift; the driving assembly comprises a supporting plate 12, and the supporting plate 12 is erected above the film sticking mechanism through a section bar; an opening 13 for the sucker to move is formed in the middle of the supporting plate 12, a third linear moving module arranged along the Y-axis direction is arranged on the side face of the opening 13, the third linear moving module comprises a third guide rail 14, a third screw rod 15 and a third motor 16, a moving frame 17 is arranged at the opening, and the side face of the moving frame 17 is in sliding fit with the third guide rail 14 and is in threaded fit with the third screw rod 15; the third motor 16 drives the third lead screw 15 to rotate, thereby driving the moving frame 17 to move along the third guide rail 14.
The fourth linear moving module arranged along the Z-axis direction is mounted on the moving frame 17 and comprises a fourth guide rail 18, a fourth screw rod and a fourth motor 19, the sucker 11 is mounted on a sucker mounting plate 20, and the sucker mounting plate 20 is slidably mounted on the fourth guide rail 18 and in threaded fit with the fourth screw rod. The fourth motor 19 drives the fourth screw rod to rotate, so that the suction cup mounting plate 20 can move up and down along the fourth guide rail. The sucking disc can be through the round trip movement between material loading level, pad pasting position, the roll extrusion position of third rectilinear movement module, and the fourth rectilinear movement module can order about the sucking disc and reciprocate, and the sucking disc utilizes the negative pressure to adsorb the PCB board, drives the PCB board and removes.
Pad pasting mechanism includes pad pasting platform 3, shop's membrane subassembly 4, material loading roller 51 and supplementary membrane recovery roller 52, pad pasting platform 3 sets up along X axle direction, and the up end of pad pasting platform 3 is equipped with porous potsherd 31, and suction equipment is connected to pad pasting platform below, and porous potsherd is the negative pressure state, 3 sides of pad pasting platform are equipped with cuts cut groove 32, cuts cut groove and conveniently cuts the diaphragm cutting basement membrane. The suction equipment exhausts air to enable the ceramic wafer to be negative pressure and can adsorb the basement membrane, and after the basement membrane is attached to the PCB, the suction equipment stops exhausting air to enable the basement membrane to be separated from the ceramic wafer conveniently.
The feeding roller 51 and the auxiliary film recovery roller 52 are arranged on a feeding plate 5 on the side surface of the film sticking platform, a film blocking shaft 53, a guide shaft 54 and the like are further arranged on the feeding plate 5, and the feeding roller 51 and the auxiliary film recovery roller 52 are arranged along the Y axis; a feeding motor 55 and a recovery motor 56 are arranged on the back surface of the feeding plate 5 and respectively drive the feeding roller 51 and the auxiliary film recovery roller 52 to rotate; the initial state of the film pasted on the PCB is a double-layer film 7 which comprises a bottom film 71 and an auxiliary film 72, the double-layer film 7 is wound into a roll and then fixed on the feeding roller 51, the feeding roller is driven by the feeding motor to rotate and can release the double-layer film, the double-layer film 7 is driven by the guide shaft to pass through between the film paving block and the film pasting platform, and the bottom film 71 is arranged on the film pasting platform 3; auxiliary film 72 is from spreading the epimembranal piece 41 top and detouring, behind the fender membrane axle, twines on auxiliary film recovery roller, and auxiliary film recovery roller can twine auxiliary film under the driving of retrieving the motor, makes it and basement membrane separation.
The film laying assembly 4 comprises a moving assembly, a film laying block 41 and a film cutting sheet 42, wherein the film laying block 41 and the film cutting sheet 42 are arranged on the moving assembly and can move along the film pasting platform; the moving assembly comprises a second linear moving module and a mounting plate 43, the second linear moving module is arranged along the X direction and comprises a second guide rail 44, a second screw rod and a second motor 45, and the mounting plate 43 is in sliding fit with the second guide rail 44 and is in threaded fit with the second screw rod.
The film cutting device is characterized in that a film cutting cylinder 46 arranged along the Y-axis direction is mounted on the mounting plate 43, a plurality of guide rods 47 distributed along the Y-axis direction are arranged on the mounting plate, the film cutting sheets 42 are mounted on a film cutting mounting block 48, the film cutting mounting block 48 is slidably mounted on the guide rods 47, and the film cutting mounting block 48 is connected with a cylinder rod of the film cutting cylinder 46. When the film is cut, after the film cutting piece moves in place, the film cutting cylinder 46 works, and the cylinder rod pushes the film cutting piece 42 to move along the Y-axis direction, so that the film is cut.
The film laying block 41 is arranged on the mounting plate 43, one side of the film laying block 41 facing the film sticking platform is of a triangular structure, and the upper side face of the film laying block is an inclined face 49. The auxiliary film is wound around the auxiliary film recovery roller 52 from the inclined surface. The inclined plane is arranged above the film paving block, so that the auxiliary film is more conveniently wound by the auxiliary film recovery roller, and the auxiliary film is quickly torn off from the bottom film. The film laying block 41 moves above the film pasting platform 3 through the mounting plate 43, and after the bottom film is adsorbed by the film pasting platform 3, the film cutting cylinder 46 drives the film cutting sheet 42 to move transversely to cut the bottom film, so that the bottom film is conveniently pasted with a PCB.
Still include rolling mechanism 6, rolling mechanism 6 includes that the first linear motion module and the press mold support 61 that set up along the X axle direction, and first linear motion module sets up with the pad pasting platform side by side, and the press mold support mounting is on first linear motion module, and first linear motion module includes first guide rail 62, first lead screw and first motor 63, press mold support 61 and first guide rail 62 sliding fit, with first lead screw thread fit. The top of the film pressing bracket 61 is rotatably provided with a film pressing roller 64. In order to make basement membrane and PCB board laminate more, PCB board moving mechanism can remove the PCB board of having pasted the basement membrane to press mold gyro wheel top, and the press mold gyro wheel receives the drive of first linear movement module, moves along the length direction of PCB board, with the thorough pressfitting of basement membrane and PCB board.
In an initial state, the PCB is arranged at a loading position, the double-layer film is wound into a coil and fixed on a loading roller 51, the film spreading block is positioned at an initial position (the right side of the film sticking platform), the end part of the double-layer film passes through the lower part of the film spreading block 41, and the auxiliary film bypasses the film spreading block and is fixed on an auxiliary film recovery roller 52;
starting film pasting:
1) The film laying block 41 is driven by the second linear moving module to move towards the left side of the film pasting platform 3, meanwhile, the feeding motor 55 drives the feeding roller 51 to rotate to release the double-layer film 7, the double-layer film is driven by the film laying block 41 to move along the film pasting platform 3 and is flatly laid on the film pasting platform 3, the film pasting platform is in a negative pressure state, and the bottom film 71 of the double-layer film is adsorbed by the film pasting platform;
2) The film spreading block 41 is driven by the second linear moving module to move towards the right side of the film pasting platform 3 (to return to the initial position), at this time, the bottom film 71 is fixed by the film pasting platform, the feeding motor 55 stops rotating, the recovery motor 56 drives the auxiliary film recovery roller 52 to rotate, so that the auxiliary film 72 starts to wind, the auxiliary film 72 is torn off from the bottom film 71, and the auxiliary film 72 bypasses the inclined surface 49 above the film spreading block 41;
3) When the film laying block 41 moves to a cutting position, the film cutting sheet is positioned at the cutting groove of the film sticking platform, the recovery motor 56 stops rotating, the film cutting cylinder 46 is ventilated to drive the film cutting sheet 42 to move, the bottom film 71 is cut off, the auxiliary film 72 cannot be cut off, and the continuity is kept all the time;
4) When the bottom film is flatly laid and fixed on the film sticking platform 3, the sucker 11 is driven by the third linear moving module to move to the upper material level, then the sucker 11 is driven by the fourth linear moving module to move downwards, the sucker 11 adsorbs the PCB by using negative pressure, and then the PCB is driven to move upwards and then moves to the position above the film sticking platform 3;
5) The sucker 11 moves downwards under the driving of the fourth linear moving module, so that the PCB is attached to the bottom film on the film attaching platform 3, then the negative pressure state of the film attaching platform is stopped, and the sucker 11 drives the PCB attached with the bottom film to move upwards, so that the bottom film 71 leaves the film attaching platform 3;
6) The sucking disc 11 drives the PCB board pasted with the base film to move to the rolling position, the sucking disc moves downwards under the driving of the fourth linear moving module to be abutted against the film pressing roller 64, the film pressing roller 64 moves along the X-axis direction under the driving of the first linear moving module, namely, the film pressing roller 64 moves relative to the PCB board, so that the base film is completely attached to the PCB board.
The above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and all technical solutions that belong to the idea of the present invention belong to the scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (8)
1. The utility model provides a PCB board pad pasting device which characterized in that: the device comprises a PCB moving mechanism and a film sticking mechanism, wherein the PCB moving mechanism comprises a sucker and a driving component for driving the sucker to move and lift; the film sticking mechanism comprises a film sticking platform, a film paving assembly, a feeding roller and an auxiliary film recycling roller, the film paving assembly comprises a moving assembly, a film paving block and a film cutting sheet, and the film paving block and the film cutting sheet are arranged on the moving assembly and can move along the film sticking platform; the feeding roller and the auxiliary film recovery roller are positioned on the side surface of the film sticking platform, a double-layer film is fixed on the feeding roller, and the double-layer film passes through the space between the film paving block and the film sticking platform; the double-layer film comprises a bottom film and an auxiliary film, the film pasting platform is in a negative pressure state, and the bottom film is arranged on the film pasting platform; the auxiliary film is wound on the auxiliary film recovery roller from the upper side of the film paving block.
2. The PCB film laminating device of claim 1, wherein: still include rolling mechanism, rolling mechanism includes first linear movement module and press mold support, and first linear movement module sets up with the pad pasting platform side by side, and the press mold support mounting is on first linear movement module, and press mold gyro wheel is installed in the rotation of press mold support top.
3. The PCB film laminating device of claim 1, wherein: one side of the film paving block, which faces the film pasting platform, is of a triangular structure, the upper side face of the film paving block is an inclined face, and the auxiliary film bypasses the inclined face and is wound on the auxiliary film recovery roller.
4. The PCB board pasting device of claim 1, wherein: the upper end surface of the film sticking platform is provided with a porous ceramic plate, the lower part of the film sticking platform is connected with a suction device, and the porous ceramic plate is in a negative pressure state; and a cutting groove is formed in the film pasting platform.
5. The PCB board pasting device of claim 1, wherein: the moving assembly comprises a second linear moving module and a mounting plate, and the mounting plate is driven by the second linear moving module; the film cutting cylinder is transversely arranged on the mounting plate, and the film cutting sheet is arranged on the film cutting cylinder; the film paving block is arranged on the mounting plate.
6. The PCB board pasting device of claim 1, wherein: the driving assembly comprises a supporting plate, and the supporting plate is positioned above the film sticking mechanism; an opening for the sucker to move is formed in the middle of the supporting plate, a third linear moving module is arranged on the side face of the opening, and the moving frame is arranged at the opening and is installed on the third linear moving module; the fourth linear movement module of vertical setting is installed on removing the frame, and the sucking disc is installed on the sucking disc mounting panel, and the sucking disc mounting panel is installed on fourth linear movement module.
7. A PCB film pasting method is characterized in that: use of the film sticking device according to any one of claims 1 to 6, comprising the steps of:
in an initial state, the PCB is arranged at a loading position, the double-layer film is fixed on the loading roller, the film paving block is positioned at an initial position, the end part of the double-layer film passes through the lower part of the film paving block, and the auxiliary film bypasses the film paving block and is fixed on the auxiliary film recovery roller;
1) The film laying block drives the double-layer film to move along the film pasting platform, so that the double-layer film is adsorbed by the film pasting platform;
2) The film laying block moves to the initial position along the film pasting platform, the auxiliary film recovery roller rotates, and the auxiliary film is wound to separate the auxiliary film from the bottom film, and the bottom film is adsorbed on the film pasting platform;
3) The cutting film moves to the cutting groove of the film sticking platform to cut off the basement membrane;
4) The PCB moving mechanism moves the PCB at the material loading position to the position above the film pasting platform by using the sucking disc, and the PCB moves downwards to be pasted with a bottom film on the film pasting platform, so that the film pasting work is completed.
8. The method for laminating the PCB as recited in claim 7, wherein: the PCB moving mechanism can drive the PCB which is attached to the bottom film to move to the position above the rolling mechanism, the film pressing roller is abutted to the PCB, and the film pressing roller moves relative to the PCB, so that the bottom film is completely attached to the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211232664.1A CN115946911A (en) | 2022-10-10 | 2022-10-10 | PCB film pasting device and film pasting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211232664.1A CN115946911A (en) | 2022-10-10 | 2022-10-10 | PCB film pasting device and film pasting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115946911A true CN115946911A (en) | 2023-04-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211232664.1A Pending CN115946911A (en) | 2022-10-10 | 2022-10-10 | PCB film pasting device and film pasting method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116477114A (en) * | 2023-06-26 | 2023-07-25 | 佛山市旭豪机械设备有限公司 | Film sticking machine |
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2022
- 2022-10-10 CN CN202211232664.1A patent/CN115946911A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116477114A (en) * | 2023-06-26 | 2023-07-25 | 佛山市旭豪机械设备有限公司 | Film sticking machine |
| CN116477114B (en) * | 2023-06-26 | 2023-08-18 | 佛山市旭豪机械设备有限公司 | Film sticking machine |
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