CN115943447A - 纹路识别装置以及显示装置 - Google Patents

纹路识别装置以及显示装置 Download PDF

Info

Publication number
CN115943447A
CN115943447A CN202180001579.1A CN202180001579A CN115943447A CN 115943447 A CN115943447 A CN 115943447A CN 202180001579 A CN202180001579 A CN 202180001579A CN 115943447 A CN115943447 A CN 115943447A
Authority
CN
China
Prior art keywords
layer
substrate base
recognition device
base plate
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180001579.1A
Other languages
English (en)
Inventor
张洁
蔡寿金
程锦
孔德玺
李成
王迎姿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Sensor Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Sensor Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Beijing BOE Sensor Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN115943447A publication Critical patent/CN115943447A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14678—Contact-type imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Human Computer Interaction (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

一种纹路识别装置和显示装置，该纹路识别装置具有多个像素单元(PX)，且包括衬底基板(10)、驱动电路层(20)、第一电极层和感光元件层；驱动电路层(20)设置在衬底基板(10)上，第一电极层设置在驱动电路层(20)的远离衬底基板(10)的一侧，感光元件层设置在第一电极层的远离衬底基板(10)的一侧，多个像素单元(PX)中至少一个包括设置在驱动电路层(20)中的像素驱动电路、设置在第一电极层中的第一电极(E1)以及设置在感光元件层中的多个彼此间隔的感光元件(P)，像素驱动电路与第一电极(E1)电连接，多个感光元件(P)设置在第一电极(E1)的远离衬底基板(10)的一侧，通过第一电极(E1)电连接至像素驱动电路。该纹路识别装置具有更好的纹路识别效果。

Description

PCT国内申请，说明书已公开。

Claims (26)

  1. PCT国内申请，权利要求书已公开。
CN202180001579.1A 2021-06-22 2021-06-22 纹路识别装置以及显示装置 Pending CN115943447A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/101562 WO2022266847A1 (zh) 2021-06-22 2021-06-22 纹路识别装置以及显示装置

Publications (1)

Publication Number Publication Date
CN115943447A true CN115943447A (zh) 2023-04-07

Family

ID=84543954

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180001579.1A Pending CN115943447A (zh) 2021-06-22 2021-06-22 纹路识别装置以及显示装置

Country Status (4)

Country Link
US (1) US20240185631A1 (zh)
CN (1) CN115943447A (zh)
DE (1) DE112021005019T5 (zh)
WO (1) WO2022266847A1 (zh)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5132102B2 (ja) * 2006-08-01 2013-01-30 キヤノン株式会社 光電変換装置および光電変換装置を用いた撮像システム
KR101980234B1 (ko) * 2012-10-30 2019-05-21 삼성디스플레이 주식회사 유기 발광 표시 장치와, 이의 제조 방법
CN106654067A (zh) * 2017-01-11 2017-05-10 京东方科技集团股份有限公司 触控基板及其制备方法、显示装置
KR20210069778A (ko) * 2019-12-03 2021-06-14 삼성디스플레이 주식회사 광 센서 및 광 센서를 포함하는 표시 장치
TWI731572B (zh) * 2020-02-06 2021-06-21 友達光電股份有限公司 感光裝置以及感測指紋的方法
CN111653599B (zh) * 2020-06-17 2023-04-07 京东方科技集团股份有限公司 指纹识别显示面板和显示装置
CN112001337B (zh) * 2020-08-27 2024-07-12 京东方科技集团股份有限公司 一种指纹识别基板及显示装置

Also Published As

Publication number Publication date
DE112021005019T5 (de) 2023-07-27
US20240185631A1 (en) 2024-06-06
WO2022266847A1 (zh) 2022-12-29

Similar Documents

Publication Publication Date Title
US11455823B2 (en) Under-screen fingerprint identification apparatus and electronic device
CN109935599B (zh) 显示面板、显示装置和显示面板的制作方法
CN112861763B (zh) 显示基板及显示装置
CN108288681B (zh) 显示面板及其制造方法、显示装置
WO2020151159A1 (zh) 指纹识别的装置和电子设备
CN110720106B (zh) 指纹识别的装置和电子设备
KR102611843B1 (ko) 지문 인식 장치 및 전자 장치
CN111291710B (zh) 指纹识别模组及显示装置
CN212433783U (zh) 光学指纹装置和电子设备
CN112236774B (zh) 纹路识别装置以及纹路识别装置的驱动方法
CN211349383U (zh) 指纹识别的装置和电子设备
JP7262600B2 (ja) スクリーンアセンブリ及び電子装置
US11783619B2 (en) Fingerprint identification apparatus and electronic device
US12062248B2 (en) Display panel and display device
US20220163812A1 (en) Optical identification module and display panel
CN115552488A (zh) 纹路识别装置及其制造方法、彩膜基板及其制造方法
CN114019707B (zh) 一种显示基板、显示面板及显示装置
CN111507273A (zh) 显示面板、显示装置和显示面板的制作方法
CN114695495B (zh) 显示面板及显示装置
CN115943447A (zh) 纹路识别装置以及显示装置
WO2021258941A1 (zh) 纹路识别装置以及电子装置
CN112703503A (zh) 光学指纹识别装置、阵列基板及显示装置
CN115735236A (zh) 纹路识别装置以及显示装置
CN210864753U (zh) 指纹识别装置和电子设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination