CN115939049A - 半导体封装和电子装置 - Google Patents

半导体封装和电子装置 Download PDF

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CN115939049A
CN115939049A CN202210987536.1A CN202210987536A CN115939049A CN 115939049 A CN115939049 A CN 115939049A CN 202210987536 A CN202210987536 A CN 202210987536A CN 115939049 A CN115939049 A CN 115939049A
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lid
substrate
semiconductor package
annular
semiconductor die
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蔡宜霖
林仪柔
赖蔡明
张维真
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MediaTek Inc
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MediaTek Inc
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Abstract

本发明公开一种半导体封装，包括：基板，具有顶表面和底表面；半导体晶粒，安装在该基板的该顶表面上；以及两部分盖子，安装在该基板的该顶表面周边并容纳该半导体晶粒，其中该两部分盖子包括环形盖座和可拆卸地安装在该环形盖座上的盖板。当将带盖的半导体封装组装到印刷电路板上时，两部分盖子确保了良好的翘曲控制，从而提高了SMT工艺的可靠性。在SMT工艺之后，可以去除两部分盖的盖板，并可以更换为散热器或冷却模块，以提高半导体晶粒的热性能。

Description

半导体封装和电子装置
技术领域
本发明涉及半导体技术领域，尤其涉及一种半导体装置和电子装置。
背景技术
典型的半导体封装包括安装在电连接基板上的半导体晶粒。盖子或加强环安装在与晶粒同一侧的基板上。盖子完全封闭了位于其下方的半导体晶粒。诸如硅树脂(silicone)或环氧树脂(epoxy)的热界面材料可以定位在晶粒和盖子之间。热界面材料有助于半导体晶粒和盖子之间的热流动。
与带有加强环的半导体封装相比，带盖(盖子)的半导体封装提供了更好的翘曲和SMT(表面组装技术，Surface Mounted Technology)控制。另一方面，具有加强环的半导体封装具有更好的热性能和散热效率，因为可以将散热器直接粘附在裸露的晶粒上。
发明内容
有鉴于此，本发明提供一种半导体封装和电子装置，半导体封装具有良好翘曲和SMT控制以及电子装置具有增强的热性能，以解决上述问题。
根据本发明的第一方面，公开一种半导体封装，包括：
基板，具有顶表面和底表面；
半导体晶粒，安装在该基板的该顶表面上；以及
两部分盖子，安装在该基板的该顶表面周边并容纳该半导体晶粒，其中该两部分盖子包括环形盖座和可拆卸地安装在该环形盖座上的盖板。
根据本发明的第二方面，公开一种电子装置，包括：
基底；以及
如上所述的半导体封装，安装在该基底上。
本发明的半导体封装由于包括：基板，具有顶表面和底表面；半导体晶粒，安装在该基板的该顶表面上；以及两部分盖子，安装在该基板的该顶表面周边并容纳该半导体晶粒，其中该两部分盖子包括环形盖座和可拆卸地安装在该环形盖座上的盖板。当将带盖的半导体封装组装到印刷电路板上时，两部分盖子确保了良好的翘曲控制，从而提高了SMT工艺的可靠性。在SMT工艺之后，可以去除两部分盖的盖板，并可以更换为散热器或冷却模块，以提高半导体晶粒以及电子装置的热性能。
附图说明
图1为本发明一个实施例的带盖半导体封装的剖面示意图。
图2和图3是图1中两部分盖(或盖子)的侧视图。
图4是表示盖板(cover plate)沿滑动方向水平滑动的状态的图。
图5为本发明一个实施例的电子装置的剖面示意图。
具体实施方式
在下面对本发明的实施例的详细描述中，参考了附图，这些附图构成了本发明的一部分，并且在附图中通过图示的方式示出了可以实践本发明的特定的优选实施例。对这些实施例进行了足够详细的描述，以使本领域技术人员能够实践它们，并且应当理解，在不脱离本发明的精神和范围的情况下，可以利用其他实施例，并且可以进行机械，结构和程序上的改变。本发明。因此，以下详细描述不应被理解为限制性的，并且本发明的实施例的范围仅由所附权利要求限定。
将理解的是，尽管术语“第一”、“第二”、“第三”、“主要”、“次要”等在本文中可用于描述各种组件、组件、区域、层和/或部分，但是这些组件、组件、区域、这些层和/或部分不应受到这些术语的限制。这些术语仅用于区分一个组件、组件、区域、层或部分与另一区域、层或部分。因此，在不脱离本发明构思的教导的情况下，下面讨论的第一或主要组件、组件、区域、层或部分可以称为第二或次要组件、组件、区域、层或部分。
此外，为了便于描述，本文中可以使用诸如“在...下方”、“在...之下”、“在...下”、“在...上方”、“在...之上”之类的空间相对术语，以便于描述一个组件或特征与之的关系。如图所示的另一组件或特征。除了在图中描述的方位之外，空间相对术语还意图涵盖设备在使用或运行中的不同方位。该设备可以以其他方式定向(旋转90度或以其他定向)，并且在此使用的空间相对描述语可以同样地被相应地解释。另外，还将理解的是，当“层”被称为在两层“之间”时，它可以是两层之间的唯一层，或者也可以存在一个或多个中间层。
术语“大约”、“大致”和“约”通常表示规定值的±20％、或所述规定值的±10％、或所述规定值的±5％、或所述规定值的±3％、或规定值的±2％、或规定值的±1％、或规定值的±0.5％的范围内。本发明的规定值是近似值。当没有具体描述时，所述规定值包括“大约”、“大致”和“约”的含义。本文所使用的术语仅出于描述特定实施例的目的，并不旨在限制本发明。如本文所使用的，单数术语“一”，“一个”和“该”也旨在包括复数形式，除非上下文另外明确指出。本文所使用的术语仅出于描述特定实施例的目的，并不旨在限制本发明构思。如本文所使用的，单数形式“一个”、“一种”和“该”也旨在包括复数形式，除非上下文另外明确指出。
将理解的是，当将“组件”或“层”称为在另一组件或层“上”、“连接至”、“耦接至”或“邻近”时，它可以直接在其他组件或层上、与其连接、耦接或相邻、或者可以存在中间组件或层。相反，当组件称为“直接在”另一组件或层“上”、“直接连接至”、“直接耦接至”或“紧邻”另一组件或层时，则不存在中间组件或层。
注意：(i)在整个附图中相同的特征将由相同的附图标记表示，并且不一定在它们出现的每个附图中都进行详细描述，并且(ii)一系列附图可能显示单个项目的不同方面，每个方面都与各种参考标签相关联，这些参考标签可能会出现在整个序列中，或者可能只出现在序列的选定图中。
集成电路(integrated circuit，IC)芯片的封装可以涉及将IC芯片附接到基板(例如，封装基板)，其中，基板在芯片和设备(装置)的其他电子组件之间提供机械支撑和电连接。基板类型包括例如有芯基板，包括薄芯、厚芯(层压BT(bismaleimide-triazineresin，双马来酰亚胺-三嗪树脂)或FR-4型纤维板材料)和层压芯，以及无芯基板。例如，有芯封装基板可以围绕中心核心逐层构建，具有的导电材料层(通常是铜)由绝缘电介质层隔开，具有的层间连接由通孔或微通孔(通孔)形成。
热设计和材料选择仍然是电子封装所关注的问题，尤其是倒装芯片球栅数组封装(flip chip ball grid array package，FCBGA)。由于硅和层压材料之间的热膨胀系数不同，较大的晶粒尺寸会表现出较大的封装翘曲。因此，大型晶粒封装更难以焊接安装，并且可能会在晶粒和外部散热器之间的接合线厚度上产生更大的变化。
本发明涉及一种带盖半导体封装，其具有两部分盖(或盖子)(two-part lid)，包括可移除地安装到盖(或盖子)基部(lid base)上的盖板(cover plate)。将带盖的半导体封装安装到电路板上后，可以移除盖板并安装散热器或冷却模块。散热器可以与裸露的晶粒的表面直接接触，缩短散热路径，从而提高热性能。或者，随后安装的散热器可以与晶粒的表面间接接触但是间隔距离更短，从而缩短散热路径，加快散热效率。
图1是显示根据本发明实施例的示例性带盖半导体封装的示意性截面图。如图1所示，带盖半导体封装(半导体封装)1包括基板100，例如封装基板或中介层基板，但不限于此。为简单起见，未示出基板100中的迹线或互连结构。应当理解，基板100可以包括用于将半导体晶粒110电连接到诸如印刷电路板(printed circuit board，PCB)或系统板的外部电路系统的电路、迹线和/或互连结构。根据一个实施例，诸如BGA(球状矩阵排列(BallGrid Array))球的焊球102设置在基板100的底表面100b上。
根据本发明的实施例，半导体晶粒(或裸露的晶粒)110可以例如以倒装芯片方式安装在基板100的顶表面100a上。半导体晶粒110具有向下面向基板100的有源表面110a。诸如导电凸块、微凸块、柱等的连接组件(连接元件)112可以设置在有源表面110a上。连接组件112接合到设置在基板100的顶表面100a上的相应的(相应的)焊盘104。半导体晶粒110还具有与有源表面110a相对的另一表面，可称为无源表面(后表面)或上表面。
半导体晶粒110和基板100之间的间隙116可以填充有包括诸如环氧树脂的绝缘材料的底部填充层120，但不限于此。例如，具有接近连接组件112的热膨胀系数(coefficientof thermal expansion，CTE)的底部填充树脂可以在半导体晶粒110和基板100之间的间隙中沉积和固化。底部填充树脂的使用实现了芯片和基板的结构耦合，有效地降低了剪切应力，从而降低了施加在焊点上的应变。
根据一个实施例，两部分式(two-part)盖子(或盖)300通过粘合层301固定到基板100的顶表面100a的周边上。根据一个实施例，两部分式盖子(两部分盖子)300可以包括不锈钢、铝、铜、铂、镍或其合金，但不限于此。半导体晶粒110由两部分盖(两部分盖子)300容纳。两部分盖(两部分盖子)300用作半导体晶粒110的物理保护以及封装加强件以减轻组装过程中的封装翘曲。根据一个实施例，两部分式盖子(两部分盖子)300包括环形盖座(lidbase)310和盖板320，盖板320设置成与环形盖座(盖子基座或盖基座)310成可移动的(movable)关系。根据一个实施例，盖板320在半导体晶粒110上方隔开适当的距离。根据一个实施例，盖板320不与半导体晶粒110直接接触。在一个实施例中，半导体晶粒110的无源表面或上表面可以与环形盖座310的上表面基本平齐，这样在将盖板320拆卸之后，安装的散热器可以与半导体晶粒110的无源表面或上表面直接接触，从而加快散热效率。在一个实施例中，半导体晶粒110的无源表面或上表面可以高于环形盖座310的上表面，这样在将盖板320拆卸之后，安装的散热器可以与半导体晶粒110的无源表面或上表面的间隔距离更短，从而缩短散热路径，加快散热效率。
根据一个实施例，环形盖座310包括与半导体晶粒110间隔开的垂直内壁(或竖直内壁)310a和与垂直内壁(或竖直内壁)310a相对的垂直外壁(或竖直外壁)310b。滑动机构(sliding mechanism)330构造在环形盖座310和盖板320之间，使得盖板320可相对于环形盖座310移动(或滑动)。也即盖板320配置为通过滑动机构330与环状盖座310成可移动关系。例如，滑动槽(或导轨)331可以设置在垂直外壁(或竖直外壁)310b上。盖板320的滑槽(滑动槽)331和配合舌片(mating tongue)332被构造成以如下方式配合：允许滑动盖板(或盖板)320沿滑槽331相对于环形盖座310滑动。舌片(配合舌片)332与滑槽331配合以让盖板320相对于环形盖座310进行滑动。
图2和图3是图1中的两部分盖(两部分盖子)300的侧视图。如图2和图3所示，盖板320可以通过沿着滑动槽(滑槽)331滑动移动到沿着滑动方向的位置，直到盖板320的一体式止动构件(integral stopping member)340与环形盖座310直接接触。根据一个实施例，环形盖座310和盖板320均由基本上刚性的材料构成，例如金属或任何合适的材料。一体式止动构件340与盖板320为一体的结构。一体式止动构件340可以帮助盖板320准确的定位，让盖板320不会过度滑动，帮助盖板320的位置相对环形盖座310来说可以基本固定。另外，本发明实施例中一体式止动构件340仅设置在滑槽331的一侧，另一侧不设置，以便于盖板320的安装和拆卸。
根据一个实施例，盖板320的滑动是通过使用形成在环形盖座310的垂直外壁310b中的滑动槽(滑槽)331来进行的。图4为盖板沿反向滑动方向水平滑动的状态示意图。如图1和图4所示，通过使盖板320沿滑槽331连续滑动直到配合舌片332从滑槽331脱离，盖板320与环形盖座310分离(或拆卸)。盖板320可通过将舌片332与滑动槽331重新接合并将盖板320滑动到环形盖座310上方的位置而在环形盖座310上更换(盖板320可更换的在环形盖座310上)。根据一个实施例，在完成表面贴装或SMT工艺之后，可以移除盖板320，并且可以将散热器(未示出)安装到半导体晶粒110上。
使用本发明是有利的，因为当将带盖的半导体封装组装到印刷电路板(PCB)上时，两部分的盖子(两部分盖子或两部分盖)确保了良好的翘曲控制，从而提高了SMT工艺的可靠性。在SMT工艺之后，可以去除两部分盖的盖板，并可以更换为散热器或冷却模块，以提高半导体晶粒的热性能。本发明实施例中，环形盖座310和盖板320共同提高了半导体封装的机械强度，并且有效的抑制了半导体封装1或基板100的翘曲，保证了半导体封装的结构稳定性。而在将半导体封装1安装到例如PCB等结构上之后，由于工作而产生的热量成为了主要需要解决的问题，因此本发明的发明人创造性的提出了本发明实施例的方案来解决半导体封装未安装在PCB等结构上时的翘曲控制问题以及安装在PCB等结构上之后的散热问题。通过本发明实施例的上述方案，半导体封装未安装在PCB等结构上时，环形盖座310和盖板320共同提高了半导体封装的机械强度，并且有效的抑制了半导体封装1或基板100的翘曲，保证了半导体封装的结构稳定性。半导体封装安装在PCB等结构上时，由于环形盖座310和盖板320的存在而具有更好的SMT控制，易于安装；并且在半导体封装安装在PCB等结构上之后，可以将盖板320滑动取下或拆卸，就可以减少遮挡以更快散热或者使用加快散热的散热器更高效的散热。并且盖板320可以循环使用，也即取下的盖板320可以继续在下一个半导体封装上使用，因此本发明的滑槽方案的设计极大的提高了部件的利用率，大大降低了物料成本和制造成本。相对于使用粘合剂等粘结安装的盖板(拆卸时易损坏易污染，无法循环使用)来说，本发明实施例的方案具有明显的成本优势，并且易于安装和拆卸，方便操作，具有更高的生产效率。
图5为本发明一个实施例的电子装置的剖面示意图。如图5所示，电子装置DE包括基底(base)10，例如应用板或系统板(例如PCB等)，以及安装在基底10上的半导体封装1。半导体封装1包括具有顶表面(上表面)100a和底表面100b的基板100。半导体晶粒110安装在基板100的顶表面100a上。两部分盖子300安装在基板100的顶表面100a的周边上。两部分盖子300容纳半导体晶粒110。
如图2至图4所示，两部分盖子300包括环形盖座310和可拆卸地安装在环形盖座310上的盖板320。盖板320可以通过沿着滑动槽331滑动移动到沿着滑动方向的位置，直到盖板320的一体式止动构件340与环形盖座310直接接触。根据一个实施例，环形盖座310和盖板320均由基本上刚性的材料构成，例如金属或任何合适的材料。
根据一个实施例，盖板320的滑动是通过使用形成在环形盖座310的垂直外壁310b中的滑动槽331来进行的。图4为盖板沿反向滑动方向水平滑动的状态示意图。如图1和图4所示，通过使盖板320沿滑槽331连续滑动直到配合舌片(或舌片)332从滑槽331脱离，盖板320与环形盖座310分离(或拆卸)(盖板320可通过盖板320沿滑槽331连续滑动直至配合舌片(或舌片)332脱离滑槽331而从环形盖座310上拆卸)。盖板320可通过将舌片332与滑动槽331重新接合并将盖板320滑动到环形盖座310上方的位置而在环形盖座310上更换(通过将舌片332与滑动槽331重新接合并将盖板320滑动到环形盖座310上方的位置，盖板320可更换到环形盖座310上)。根据一个实施例，在完成表面贴装或SMT工艺之后，可以移除盖板320，并且可以将散热器(未示出)安装到半导体晶粒110上。
本领域的技术人员将容易地观察到，在保持本发明教导的同时，可以做出许多该设备和方法的修改和改变。因此，上述公开内容应被解释为仅由所附权利要求书的界限和范围所限制。

Claims (12)

1.一种半导体封装，其特征在于，包括：
基板，具有顶表面和底表面；
半导体晶粒，安装在该基板的该顶表面上；以及
两部分盖子，安装在该基板的该顶表面周边并容纳该半导体晶粒，其中该两部分盖子包括环形盖座和可拆卸地安装在该环形盖座上的盖板。
2.如权利要求1所述的半导体封装，其特征在于，该半导体晶粒以倒装芯片方式安装在该基板的该顶表面上。
3.如权利要求2所述的半导体封装，其特征在于，该半导体晶粒具有向下面对该基板的有源表面和设置在该有源表面上的连接组件，其中该连接组件接合到设置在该基板的该顶表面上的对应的焊盘。
4.如权利要求2所述的半导体封装，其特征在于，该半导体晶粒与该基板之间的间隙填充有底部填充层。
5.如权利要求1所述的半导体封装，其特征在于，该两部分盖子是金属盖。
6.如权利要求1所述的半导体封装，其特征在于，该盖板配置为通过滑动机构与该环状盖座成可移动关系。
7.如权利要求6所述的半导体封装，其特征在于，该滑动机构构成在该环状盖基板与该盖板之间，使得该盖板可相对于该环状盖基板移动。
8.如权利要求1所述的半导体封装，其特征在于，该环形盖座包括与该半导体晶粒间隔开的竖直内壁和与该竖直内壁相对的竖直外壁。
9.如权利要求8所述的半导体封装，其特征在于，该垂直外壁上设有滑槽，其中，该滑槽和该盖板的配合舌片相配合，使该盖板可沿该滑槽相对于该环形盖座滑动。
10.如权利要求9所述的半导体封装，其特征在于，该盖板通过沿着该滑槽滑动而移动到沿着滑动方向的位置，直到该盖板的一体式止动构件与该环形盖座直接接触。
11.如权利要求9所述的半导体封装，其特征在于，该环形盖座和该盖板由不锈钢、铝、铜、铂、镍或它们的合金构成。
12.一种电子装置，其特征在于，包括：
基底；以及
如权利要求1-11任一一项所述的半导体封装，安装在该基底上。
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