CN115928025A - Vacuum coating method, substrate and equipment based on granular coating material - Google Patents
Vacuum coating method, substrate and equipment based on granular coating material Download PDFInfo
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- CN115928025A CN115928025A CN202211541708.9A CN202211541708A CN115928025A CN 115928025 A CN115928025 A CN 115928025A CN 202211541708 A CN202211541708 A CN 202211541708A CN 115928025 A CN115928025 A CN 115928025A
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- 239000000463 material Substances 0.000 title claims abstract description 170
- 239000011248 coating agent Substances 0.000 title claims abstract description 49
- 238000000576 coating method Methods 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000001771 vacuum deposition Methods 0.000 title claims abstract description 26
- 238000007747 plating Methods 0.000 claims abstract description 151
- 239000002245 particle Substances 0.000 claims abstract description 74
- 239000011148 porous material Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 238000010894 electron beam technology Methods 0.000 claims abstract description 12
- 238000010884 ion-beam technique Methods 0.000 claims abstract description 12
- 239000007787 solid Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052755 nonmetal Inorganic materials 0.000 claims description 2
- 238000007738 vacuum evaporation Methods 0.000 abstract description 10
- 238000004880 explosion Methods 0.000 abstract description 6
- 238000001704 evaporation Methods 0.000 description 24
- 230000008020 evaporation Effects 0.000 description 24
- 239000010408 film Substances 0.000 description 17
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000002427 irreversible effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
The invention discloses a vacuum coating method, a substrate and equipment based on granular coating materials, wherein the method comprises a coating material placing step and a vacuum coating step positioned after the coating material placing step; the plating material placing step comprises the following substeps: placing large-particle plating materials in a container for placing the plating materials; and filling small-particle plating materials in the pores among the large-particle plating materials. The invention makes the aperture between the plating materials in the container for placing the plating materials relatively smaller, thereby reducing the situation that the plating materials are splashed out due to small explosion caused by the state change of high pressure caused by emission to the aperture when the heating light (electron beam or ion beam) is emitted to the granular plating materials for vacuum plating, greatly reducing the problem of splashing of the plating materials caused by rapid rise of heat in the heating process of the plating materials, further improving the stability of vacuum evaporation plating and improving the quality of a film layer.
Description
Technical Field
The invention relates to a vacuum coating method, a substrate and equipment based on granular coating materials.
Background
Physical Vapor Deposition (PVD) is an important and practical advanced technology for modern surface engineering, and a film prepared by the technology has the advantages of high hardness, low friction coefficient, good wear resistance, good chemical stability and the like. Vacuum evaporation is a very important film coating method in Physical Vapor Deposition (PVD).
Vacuum deposition is generally performed by evacuating a vacuum chamber containing a substrate, heating a plating material to vaporize atoms or molecules of the plating material out of the surface of the substrate, forming a vapor stream, and allowing the vapor stream to enter the surface of the substrate to condense and form a solid film. The film of the vacuum evaporation coating has high purity, high coating speed, simple equipment and easy operation. The plating material is continuously consumed in the evaporation process, and a new plating material needs to be added before evaporation to ensure that the required film thickness is reached.
In the field of PVD evaporation coating, the evaporation coating materials generally used have a granular, linear or sheet-like appearance, wherein the linear or sheet-like coating materials are generally used in the resistance heating evaporation technique. Compared with linear or sheet evaporation coating materials, granular coating materials are often used in production processes requiring preparation of evaporation coating materials with higher purity because of the advantages of easy cutting, no lamination, less impurities introduced in processing and manufacturing, and the like.
For example, the prior art (patent application No. CN 201610189702.8) discloses a vacuum evaporation coating apparatus, which comprises a coating apparatus, a vacuum apparatus and an evaporation apparatus, wherein the coating apparatus comprises a substrate heater, a substrate and a thin film, the vacuum apparatus comprises a bell jar, a vacuum chamber and an exhaust system, the evaporation apparatus comprises an evaporation source and a film material, and the evaporation source (i.e. evaporation coating material) is in a granular form as can be seen from the figure. Meanwhile, the prior art (utility model patent with application number CN 201921661706.7) discloses a coating jig for an electron beam or ion beam evaporation process of a semiconductor wafer, the jig is a lining pot filled with a granular coating material (i.e. evaporation coating material), and the lining material is used for coating the semiconductor wafer with the coating material through the excitation evaporation of the electron beam or the ion beam.
However, the process of adding the plating material is limited by the size of the plating material, certain pores are bound to exist between plating material particles, when heating light (electron beam or ion beam) is emitted to the pores between the granular plating materials, a large amount of steam may be generated in a limited space in a short time, high pressure state change is caused in the pores, small explosion occurs, the plating material splashes out, the splashed plating material seriously damages the vacuum degree of a vacuum system, the thickness of the film is uncontrollable, and irreversible serious results are caused. Therefore, the vacuum evaporation coating needs to minimize the occurrence of sputtering.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a vacuum coating method, a substrate and equipment based on granular coating materials.
The purpose of the invention is realized by the following technical scheme:
in a first aspect of the present invention, there is provided a vacuum coating method based on a granular plating material, comprising a plating material placing step and a vacuum coating step located after the plating material placing step; the plating material placing step comprises the following substeps:
placing large-particle plating materials in a container for placing the plating materials;
and filling small-particle plating materials in the pores among the large-particle plating materials.
Further, placing large-particle plating materials in a container for placing the plating materials; filling small-particle plating materials in pores among the large-particle plating materials, and specifically comprises the following steps:
in a container for placing plating materials, filling small-particle plating materials into pores among large-particle plating materials after placing a layer of large-particle plating material; or:
in the container for placing the plating material, after all the large-particle plating materials are placed, the small-particle plating materials are filled in the pores among the large-particle plating materials.
Further, the raw materials of the large-particle plating material and the small-particle plating material are metal, nonmetal, oxide, compound or alloy materials.
Further, the shapes of the large-particle plating material and the small-particle plating material are spheres, cylinders, cubes or irregular three-dimensional structures.
Further, the vacuum coating step includes the substeps of:
vacuumizing the vacuum chamber with the container and the substrate to be coated;
the granular plating material in the container is heated by the heating light to form vapor flow which is incident on the surface of the substrate to form a solid film.
Further, the heating light is an electron beam or an ion beam.
Further, the container is a crucible.
Furthermore, the substrate to be coated is arranged right above the container in parallel.
In a second aspect of the invention, a substrate is provided, which is prepared by the vacuum coating method based on the granular coating material.
In a third aspect of the invention, there is provided an apparatus comprising said substrate.
The invention has the beneficial effects that:
in an exemplary embodiment of the present invention, the large-particle plating material is placed in the container in which the plating material is placed, and then the small-particle plating material is placed to fill the pores between the large-particle plating material. By the placing method, the holes among the plating materials in the container for placing the plating materials are relatively small, so that when heating light (electron beams or ion beams) is emitted to the granular plating materials for vacuum plating, the situation that the plating materials are splashed out due to small explosion caused by the high-pressure state change caused by emission to the holes is reduced, the problem of splashing of the plating materials caused by rapid rise of heat in the heating process of the plating materials is greatly reduced, the stability of vacuum evaporation plating is further improved, and the quality of a film layer is improved.
Drawings
FIG. 1 is a schematic diagram of a plating material placement step provided in an exemplary embodiment of the invention;
FIG. 2 is a schematic view of a vacuum coating step provided in an exemplary embodiment of the present invention;
in the figure, 1-container, 2-large particle coating material, 3-small particle coating material, 4-substrate, 5-vacuum chamber, 6-heating light.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that directions or positional relationships indicated by "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are directions or positional relationships described based on the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The prior art (patent of invention with application number CN 201610189702.8) discloses a vacuum evaporation coating device, which comprises a coating device, a vacuum device and an evaporation device, wherein the coating device comprises a substrate heater, a substrate and a film, the vacuum device comprises a bell jar, a vacuum cavity and an exhaust system, the evaporation device comprises an evaporation source and a film material, and the evaporation source (i.e. evaporation coating material) is granular. Meanwhile, the prior art (utility model patent with application number CN 201921661706.7) discloses a coating jig for an electron beam or ion beam evaporation process of a semiconductor wafer, the jig is a lining pot filled with a granular coating material (i.e. evaporation coating material), and the lining material is used for coating the semiconductor wafer with the coating material through the excitation evaporation of the electron beam or the ion beam. However, the process of adding the plating material is limited by the size of the plating material, certain pores are bound to exist between plating material particles, when heating light (electron beam or ion beam) is emitted to the pores between the granular plating materials, a large amount of steam may be generated in a limited space in a short time, high pressure state change is caused in the pores, small explosion occurs, the plating material splashes out, the splashed plating material seriously damages the vacuum degree of a vacuum system, the thickness of the film is uncontrollable, and irreversible serious results are caused.
Referring to fig. 1, fig. 1 shows a schematic diagram of a method for vacuum plating based on granular plating material, including a plating material placing step and a vacuum plating step after the plating material placing step, in an exemplary embodiment of the present invention; the plating material placing step comprises the following substeps:
placing a large-particle plating material 2 in a container 1 for placing the plating material;
the pores between the large-particle plating 2 are filled with the small-particle plating 3.
Specifically, in the present exemplary embodiment, the large particle plating material 2 is placed in the container 1 in which the plating material is placed, and then the small particle plating material 3 is placed to fill the pores between the large particle plating materials 2. By the placing method, the holes among the plating materials in the container 1 for placing the plating materials are relatively small, so that when the heating light 6 (electron beams or ion beams) is emitted to the granular plating materials for vacuum plating, the situation that the plating materials are splashed out due to small explosion caused by the state change of high pressure caused by emission to the holes is reduced, the problem of splashing of the plating materials caused by rapid rise of heat in the heating process of the plating materials is greatly reduced, the stability of vacuum evaporation plating is further improved, and the quality of a film layer is improved.
More preferably, in an exemplary embodiment, the large-particle plating material 2 is placed in the container 1 where the plating material is placed; filling small-particle plating materials 3 in pores among the large-particle plating materials 2, and specifically comprises the following steps:
in a container 1 for placing the plating material, after each layer of large-particle plating material 2 is placed, small-particle plating material 3 is immediately filled in the pores among the large-particle plating materials 2; or:
in the container 1 for placing the plating material, after all the large-particle plating materials 2 are placed, the small-particle plating materials 3 are filled in the pores among the large-particle plating materials 2.
Specifically, in the exemplary embodiment, two ways are provided for filling, and in the exemplary embodiment shown in fig. 1, the large particle plating 2 has three layers, so that it is possible to fill the small particle plating 3 in the pores between the large particle plating 2 immediately after each layer of the large particle plating 2 is laid; or after all the large-particle plating materials 2 are placed, the small-particle plating materials 3 can be filled in the pores among the large-particle plating materials 2.
More preferably, in an exemplary embodiment, the raw materials of the large particle plating 2 and the small particle plating 3 are metallic, non-metallic, oxide, compound, or alloy materials. More preferably, in an exemplary embodiment, the large particle plating 2 and the small particle plating 3 are shaped as spheres, cylinders, cubes, or irregular cubic structures.
The material of the plating material is selected from different substances according to the actual film requirement for evaporation, the overall dimension of the plating material is not fixed, and the sphere in fig. 1 is only one exemplary embodiment.
In addition, the shapes of all the large particle plating materials 2 can be the same or different, and the shapes of all the small particle plating materials 3 can be the same or different, as long as the small particle plating materials 3 can be filled in the gaps among the large particle plating materials 2.
More preferably, in an exemplary embodiment, the vacuum coating step includes the substeps of:
vacuumizing a vacuum chamber 5 in which the container 1 and a substrate 4 to be coated are placed;
the granular plating material in the container 1 is heated by the heating light 6 to form vapor flow, and the vapor flow is incident on the surface of the substrate 4 to form a solid film.
Referring to fig. 2, fig. 2 shows a specific implementation of the vacuum coating step, the substrate 4 is disposed directly above the container 1 and is disposed together in the vacuum chamber 5. After the large-particle plating material 2 and the small-particle plating material 3 are placed in the container 1 and the substrate 4 are placed in the vacuum chamber 5 in the plating film placing step, the vacuum chamber 5 is vacuumized, and then the granular plating material in the container 1 is heated by the heating light 6 to form steam flow which is incident on the surface of the substrate 4 to form a solid film, so that vacuum evaporation plating is realized.
Wherein, because the small granule is plated material 3 and is filled in the gap of large granule plating material 2, this moment when heating light 6 heating, through reducing the gap size, effectively reduce because of launching to the hole and cause the situation that highly compressed state change takes place the small explosion and make the plating material splash out, thereby the plating material problem of splashing that the heat rises fast in the plating material heating process that significantly reduces rises and causes, and further improve the stability of vacuum evaporation coating film, improve the rete quality.
More preferably, in an exemplary embodiment, the heating light 6 is an electron beam or an ion beam. More preferably, in an exemplary embodiment, the container 2 is a crucible. Preferably, in an exemplary embodiment, the substrate 4 to be coated is arranged in parallel right above the container 2, so as to realize uniform coating.
Having the same inventive concept as the above exemplary embodiment, another exemplary embodiment of the present invention provides a substrate 4 prepared by the vacuum coating method based on the granular plating material.
Having the same inventive concept as the above-described exemplary embodiment, a further exemplary embodiment of the present invention provides an apparatus comprising the substrate 4.
The device can be an optical component, an LED, a flat panel display, a semiconductor separator and the like.
It is to be understood that the above-described embodiments are illustrative only and not restrictive of the broad invention, and that various other modifications and changes in light thereof will be suggested to persons skilled in the art based upon the above teachings. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.
Claims (10)
1. A vacuum coating method based on granular coating materials comprises a coating material placing step and a vacuum coating step positioned after the coating material placing step; the method is characterized in that: the plating material placing step comprises the following substeps:
placing large-particle plating materials in a container for placing the plating materials;
and filling small-particle plating materials in pores among the large-particle plating materials.
2. The vacuum coating method based on the granular coating material according to claim 1, wherein: placing large-particle plating materials in a container for placing the plating materials; filling small-particle plating materials in pores among the large-particle plating materials, and specifically comprises the following steps:
in a container for placing the plating material, after each layer of large-particle plating material is placed, filling small-particle plating materials into the pores among the large-particle plating materials; or:
in the container for placing the plating material, after all the large-particle plating materials are placed, the small-particle plating materials are filled in the pores among the large-particle plating materials.
3. The method according to claim 1, wherein the vacuum coating method comprises the following steps: the raw materials of the large-particle plating material and the small-particle plating material are metal, nonmetal, oxide, compound or alloy materials.
4. The vacuum coating method based on the granular coating material according to claim 1, wherein: the shapes of the large-particle plating material and the small-particle plating material are spheres, cylinders, cubes or irregular three-dimensional structures.
5. The vacuum coating method based on the granular coating material according to claim 1, wherein: the vacuum coating step comprises the following substeps:
vacuumizing the vacuum chamber with the container and the substrate to be coated;
the granular plating material in the container is heated by the heating light to form vapor flow which is incident on the surface of the substrate to form a solid film.
6. The vacuum coating method based on the granular coating material according to claim 5, characterized in that: the heating light is electron beam or ion beam.
7. The vacuum coating method based on the granular coating material according to claim 5, characterized in that: the container is a crucible.
8. The vacuum coating method based on the granular coating material according to claim 5, characterized in that: the substrate to be coated is arranged right above the container in parallel.
9. A substrate, characterized by: the vacuum coating method based on the granular coating material according to any one of claims 5 to 8.
10. An apparatus, characterized by: comprising the substrate of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211541708.9A CN115928025A (en) | 2022-12-02 | 2022-12-02 | Vacuum coating method, substrate and equipment based on granular coating material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211541708.9A CN115928025A (en) | 2022-12-02 | 2022-12-02 | Vacuum coating method, substrate and equipment based on granular coating material |
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| CN115928025A true CN115928025A (en) | 2023-04-07 |
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| CN202211541708.9A Pending CN115928025A (en) | 2022-12-02 | 2022-12-02 | Vacuum coating method, substrate and equipment based on granular coating material |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1389590A (en) * | 2001-06-05 | 2003-01-08 | 中国科学技术大学 | Pulsed laser deposition method and apparatus for preparing smooth film material |
| JP2004263282A (en) * | 2003-03-04 | 2004-09-24 | Shoen Kagi Kofun Yugenkoshi | Vapor deposition method |
| WO2008065845A1 (en) * | 2006-11-28 | 2008-06-05 | Osaka Titanium Technologies Co., Ltd. | METHOD FOR FABRICATING SiO SINTERED BODY |
| JP2008266728A (en) * | 2007-04-20 | 2008-11-06 | Toppan Printing Co Ltd | Vacuum deposition device and vacuum deposition method |
| JP2010031384A (en) * | 2009-11-09 | 2010-02-12 | Toshiba Corp | Optical thin film and optical component |
-
2022
- 2022-12-02 CN CN202211541708.9A patent/CN115928025A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1389590A (en) * | 2001-06-05 | 2003-01-08 | 中国科学技术大学 | Pulsed laser deposition method and apparatus for preparing smooth film material |
| JP2004263282A (en) * | 2003-03-04 | 2004-09-24 | Shoen Kagi Kofun Yugenkoshi | Vapor deposition method |
| WO2008065845A1 (en) * | 2006-11-28 | 2008-06-05 | Osaka Titanium Technologies Co., Ltd. | METHOD FOR FABRICATING SiO SINTERED BODY |
| JP2008266728A (en) * | 2007-04-20 | 2008-11-06 | Toppan Printing Co Ltd | Vacuum deposition device and vacuum deposition method |
| JP2010031384A (en) * | 2009-11-09 | 2010-02-12 | Toshiba Corp | Optical thin film and optical component |
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