CN115900296A - Drying furnace and silicon wafer drying method - Google Patents
Drying furnace and silicon wafer drying method Download PDFInfo
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- CN115900296A CN115900296A CN202211729550.8A CN202211729550A CN115900296A CN 115900296 A CN115900296 A CN 115900296A CN 202211729550 A CN202211729550 A CN 202211729550A CN 115900296 A CN115900296 A CN 115900296A
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- 238000001035 drying Methods 0.000 title claims abstract description 107
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 77
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 77
- 239000010703 silicon Substances 0.000 title claims abstract description 77
- 230000007246 mechanism Effects 0.000 claims abstract description 144
- 238000001816 cooling Methods 0.000 claims abstract description 91
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 238000005096 rolling process Methods 0.000 claims description 41
- 230000000903 blocking effect Effects 0.000 claims description 34
- 230000005540 biological transmission Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 11
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 50
- 239000000463 material Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The application discloses drying furnace and silicon wafer drying method, relates to the technical field of photovoltaic drying furnaces, wherein the drying furnace comprises: the heating furnace body is provided with a drying channel; the conveying device comprises a speed multiplying chain mechanism, and the speed multiplying chain mechanism penetrates through the drying channel; and the cooling device is arranged at the output end of the speed multiplying chain mechanism and is used for cooling the workpiece. The workpiece is transported by adopting the speed doubling chain mechanism, the transportation process is easy to control, and the stability of the transportation speed is favorably ensured. Simultaneously, compare in traditional net chain transportation, this application adopts doubly fast chain mechanism to transport, can make the work piece possess bigger heated area, does benefit to and improves drying efficiency. In addition, the workpiece can be conveyed to the cooling device after passing through the drying channel, so that the cooling time of the workpiece can be prolonged, and the cooling effect of the workpiece can be guaranteed.
Description
Technical Field
The application relates to the technical field of photovoltaic drying furnaces, in particular to a drying furnace and a silicon wafer drying method.
Background
The existing photovoltaic drying furnace generally adopts a net chain to transport silicon wafers, but the stability of net chain transportation is insufficient due to lack of support among the net chains; meanwhile, the transportation speed of the net chain transportation is not stable enough. In addition, when the photovoltaic piece is dried, the traditional drying furnace has the problem that the drying and cooling time of the photovoltaic piece is not enough, so that the quality of the photovoltaic piece is poor.
Disclosure of Invention
The present application is directed to solving at least one of the problems in the prior art. Therefore, the application provides a drying furnace, utilizes doubly fast chain mechanism transportation work piece, can effectively improve work piece conveying speed's stability.
The application also provides a silicon wafer drying method.
The drying oven of an aspect embodiment of this application includes: the heating furnace body is provided with a drying channel; the conveying device comprises a speed-multiplying chain mechanism and a blocking mechanism, the speed-multiplying chain mechanism penetrates through the drying channel, the blocking mechanism is arranged between the input end and the output end of the speed-multiplying chain mechanism and is relatively close to the output end of the speed-multiplying chain mechanism, and the blocking mechanism is used for being abutted against a workpiece transmitted by the speed-multiplying chain mechanism so as to enable the workpiece to be decelerated; and the cooling device is arranged at one end of the conveying device and is used for cooling the workpiece.
The application of the drying furnace at least has the following beneficial effects: the workpiece is transported by adopting the speed-multiplying chain mechanism, the transporting process is easy to control, the stability of the transporting speed is guaranteed, and the workpiece transporting efficiency is effectively improved. Meanwhile, compared with the traditional net chain transportation, the double-speed chain mechanism is adopted for transportation, so that the workpiece has a larger heating area, and the drying efficiency is improved; because the transmission speed of the speed-multiplying chain mechanism is high, the blocking mechanism is arranged at the position close to the output end of the speed-multiplying chain mechanism, so that the workpiece transmitted by the speed-multiplying chain mechanism can be decelerated, and the workpiece can be stably output to the cooling device; in addition, the workpiece can be conveyed to the cooling device for cooling after passing through the drying channel, so that the cooling time of the workpiece is prolonged, and the cooling effect of the workpiece is guaranteed.
Further, the heating furnace body comprises a first furnace body and a second furnace body located below the first furnace body, the first furnace body and the second furnace body define the drying channel, the second furnace body is provided with a groove, and the speed doubling chain mechanism is located in the groove so as to reduce the temperature loss of the heating furnace body and effectively improve the drying efficiency of the workpiece.
Furthermore, the conveying plane of the speed multiplying chain mechanism is flush with the upper end face of the second furnace body; a plurality of air holes are formed in the groove, and the air holes can be beneficial to heating and drying of the silicon wafer. The conveying plane is parallel and level to the upper end face of the second furnace body, so that the workpiece and the lower end face of the first furnace body and the upper end face of the second furnace body are kept at a short distance, and the workpiece drying is facilitated.
Further, the speed multiplying chain mechanism comprises a rotating shaft and a driven chain wheel mounted on the rotating shaft, the conveying device further comprises a tensioning mechanism, the tensioning mechanism comprises a fixing plate and an adjusting part, the fixing plate is rotatably connected with the rotating shaft, and the adjusting part changes the position of the driven chain wheel by changing the position of the fixing plate in the transmission direction of the speed multiplying chain mechanism. The tension mechanism is arranged, so that the tightness degree of the speed-multiplying chain mechanism can be adjusted, and the transmission stability of the speed-multiplying chain mechanism is improved.
Furthermore, the blocking mechanism comprises a rolling part and a first driving part, the first driving part is used for driving the rolling part to lift, and the rolling part is used for being abutted to a workpiece transmitted by the speed multiplying chain mechanism. The rolling piece is contacted with the workpiece transmitted by the speed multiplying chain mechanism and is driven by the workpiece to rotate, and the reaction force of the rolling piece on the workpiece can decelerate the workpiece, so that the workpiece is stably transmitted to the cooling device.
Furthermore, the cooling device comprises a linear slide rail, a second driving piece, a cooling fan and a roller assembly, the linear slide rail is vertically arranged, the second driving piece is used for driving the roller assembly to move along the linear slide rail, and the cooling fan is arranged above the roller assembly. The cooling device can increase the cooling time of the workpiece and improve the cooling speed of the workpiece, so that the machine table connected with the drying furnace can reduce the cooling device, the cost is reduced, and the working efficiency of the whole production line is improved.
The cooling device further comprises a sensor, wherein the sensor is arranged at the inlet end of the roller assembly to detect whether a workpiece is arranged on the roller assembly; in addition, the cooling device can control the running states of components such as the roller assembly, the cooling fan and the like according to the result of the existence of the workpiece detected by the sensor, and the reduction of the energy consumption of the cooling device is facilitated.
Further, the cooling device further comprises a buffer mechanism, the buffer mechanism is arranged below the roller assembly, and the buffer mechanism is abutted against the roller assembly to realize buffering.
Further, still include the stoving furnace body, the stoving furnace body includes a plurality of detachable receivers to conveniently clear up the internal waste product of stoving furnace.
In another aspect of the present application, a silicon wafer drying method according to an embodiment includes the following steps: feeding a silicon wafer to be dried; conveying the silicon wafer into a heating furnace body by using a conveying device, and heating and drying the silicon wafer in the heating furnace body; pre-decelerating the heated and dried silicon wafer through a blocking mechanism; transmitting the decelerated silicon wafer to a target position; controlling a lifting platform of the cooling device to stop moving, synchronously starting an electric roller in the cooling device, and conveying the silicon wafer into the cooling device by using the electric roller; the cooling device cools the silicon wafer.
The silicon wafer drying method at least has the following technical effects: the silicon chip after being heated and dried on the conveyer contacts with the blocking mechanism so as to decelerate the silicon chip, the silicon chip is decelerated in advance through the blocking mechanism, the temperature of the silicon chip is gradually reduced in the deceleration process, and then the silicon chip is transmitted to the cooling device to be cooled, so that the cooling temperature of the silicon chip can be reduced step by step, the temperature difference of the silicon chip in the drying stage and the cooling stage is reduced, the cold and hot effect control of the drying furnace can be realized, and the drying quality of the silicon chip is also favorably improved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The present application is further described with reference to the following figures and examples, in which:
FIG. 1 is a schematic view of an overall structure of a drying oven according to an embodiment of an aspect of the present application;
FIG. 2 is a schematic view of a conveyor in a drying oven according to an embodiment of an aspect of the present application;
FIG. 2a is an enlarged view of a portion A of FIG. 2;
FIG. 3 is a schematic view of a blocking mechanism in a drying oven according to an embodiment of an aspect of the present application;
FIG. 4 is a schematic view of a cooling device in a drying oven according to an embodiment of an aspect of the present application;
FIG. 5 is a schematic view of a drying hearth body in a drying oven according to an embodiment of an aspect of the present application;
FIG. 6 is a schematic flow chart illustrating a silicon wafer drying method according to another embodiment of the present application.
Reference numerals:
100. heating the furnace body; 110. a first furnace body; 120. a second furnace body; 121. air holes are formed; 130. a base frame;
210. a speed multiplying chain mechanism; 211. an input end; 212. an output end; 220. a drive mechanism; 230. a drive sprocket; 240. a guide wheel; 250. a driven sprocket; 260. a blocking mechanism; 261. a rolling member; 262. a first driving member; 263. a support; 264. a fixed seat; 270. a guide plate; 280. a tensioning mechanism; 281. a fixing plate; 282. an adjustment member;
300. a cooling device; 310. a linear slide rail; 320. a second driving member; 330. a cooling fan; 340. a roller assembly; 350. a sensor; 360. a support frame; 370. a buffer mechanism;
400. drying the hearth body; 410. a chamber body; 420. an accommodating box.
Detailed Description
Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, front, rear, left, right, etc., referred to herein are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.
In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present number, and the above, below, within, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.
In the description of the present application, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Referring to fig. 1, an embodiment of an aspect of the present application discloses a drying oven, which includes a heating oven body 100, a transportation device, and a cooling device 300.
As shown in fig. 1, the heating furnace body 100 has a drying passage. Specifically, the drying channel is provided with a heating element which can heat air in the drying channel, and the workpiece is dried in the drying channel; the drying oven further includes a base frame 130, and the heating oven body 100 is mounted on the base frame 130.
As shown in fig. 1 and 2, the transportation device includes a speed-doubling chain mechanism 210 and a blocking mechanism 260, wherein the speed-doubling chain mechanism 210 is disposed through the drying passage; the double-speed chain mechanism 210 has an input end 211 and an output end 212, the blocking mechanism 260 is disposed between the input end 211 and the output end 212 of the double-speed chain mechanism 210 and is disposed relatively close to the output end 212 of the double-speed chain mechanism 210, and the blocking mechanism 260 is used for abutting against a workpiece transmitted by the double-speed chain mechanism 210 to decelerate the workpiece. As can be seen from the figure, the double-speed chain mechanism 210 includes a driving mechanism 220 and a conveying chain arranged in parallel, the driving mechanism 220 is arranged on one side of the conveying chain, and the driving mechanism 220 drives the conveying chain to move, so as to transport the workpiece. When the workpieces are conveyed, the workpieces are placed on the conveying chains which are arranged in parallel; the workpiece is gradually dried in the process of passing through the drying channel. Since the conveying speed of the double-speed chain mechanism 210 is high, the stopper mechanism 260 is provided at a position close to the output end 212 of the double-speed chain mechanism 210, so that the workpiece conveyed by the double-speed chain mechanism 210 can be decelerated, and the workpiece can be smoothly output to the cooling device 300. It should be understood that the conveying speed of the speed chain mechanism 210 is related to the length of the drying passage, the drying time of the workpiece, and other factors. In practical applications, the transmission speed of the speed-doubling chain mechanism 210 is set according to process requirements.
As shown in fig. 1, the speed-doubling chain mechanism 210 has an input end 211 and an output end 212, a cooling device 300 is provided on one side of the output end 212 of the speed-doubling chain mechanism 210, and the cooling device 300 is used for cooling a workpiece. Specifically, the workpiece passes through the drying passage, is transferred to the cooling device 300, and is then gradually cooled in the cooling device 300. It should be understood that, in the cooling device 300, the workpiece is separated from the drying environment of the heating furnace body 100, so that the cooling speed can be increased, which is beneficial to improving the cooling effect of the workpiece.
When the drying furnace works, workpieces enter the drying channel from the input end 211 of the speed multiplying chain mechanism 210 and are gradually dried in the process of passing through the drying channel; after the workpiece flows out of the drying channel, the workpiece is transmitted from the output end 212 of the speed doubling chain mechanism 210 to the cooling device 300, and is cooled in the cooling device 300.
In the drying furnace, the speed chain mechanism 210 is adopted to transport the workpieces, so that the conveying process is easy to control, and the stability of the conveying speed is ensured. Simultaneously, compare in traditional net chain transportation, this application adopts doubly fast chain mechanism 210 transportation work piece, can make the work piece possess bigger heated area, does benefit to and improves drying efficiency. In addition, the workpiece passes through the drying channel and then is conveyed to the cooling device 300, so that the cooling time of the workpiece can be prolonged, and the cooling effect of the workpiece is guaranteed.
In this embodiment, the workpiece is specifically a silicon wafer. It should be understood that the drying oven of the embodiment of the present application can also be used for drying materials such as solar cells.
In some embodiments of the present application, as shown in fig. 1, the heating furnace body 100 includes a first furnace body 110 and a second furnace body 120 located below the first furnace body 110, a space, i.e., a drying passage, is provided between the first furnace body 110 and the second furnace body 120, the second furnace body 120 has a groove, and the speed chain mechanism 210 is located in the groove.
Further, the transportation plane of the speed-doubling chain mechanism 210 is flush with the upper end face of the second furnace body 120, so that the speed-doubling chain mechanism 210 is kept at a short distance from the first furnace body 110, and the drying effect is improved; a plurality of air holes 121 are formed in the groove, so that heating and drying of the silicon wafer are facilitated, and the drying effect can be further improved.
In some embodiments of the present application, as shown in fig. 2 and 2a, the double speed chain mechanism 210 includes a rotating shaft and a driven sprocket 250 mounted to the rotating shaft, the driven sprocket 250 being capable of rotating about an axis of the rotating shaft; the transporting device further comprises a tensioning mechanism 280, the tensioning mechanism 280 comprises a fixing plate 281 and an adjusting part 282, the fixing plate 281 is rotatably connected with the rotating shaft, and the adjusting part 282 changes the position of the driven sprocket 250 by changing the position of the fixing plate 281 in the transmission direction of the speed-doubling chain mechanism 210, so that the purpose of adjusting the tightness degree of the speed-doubling chain mechanism 210 is achieved. Specifically, the transportation device further includes a driving sprocket 230 and a driving mechanism 220, and an output end of the driving mechanism 220 is connected to the driving sprocket 230, wherein the relative positions of the driving sprocket 230 and the driven sprocket 250 determine the tightness degree of the double-speed chain mechanism 210.
In this embodiment, the position of the driving sprocket 230 is fixed, and the distance between the driven sprocket 250 and the driving sprocket 230 can be changed by adjusting the position of the driven sprocket 250 by the tensioning mechanism 280, so as to achieve the purpose of adjusting the tightness of the double-speed chain mechanism 210. In practical applications, the adjusting component 282 may be an adjusting bolt, a sliding slot is disposed on one side of the fixing plate 281, an extending direction of the sliding slot is the same as a material conveying direction of the double-speed chain mechanism 210, and the fixing plate 281 is provided with a sliding block slidably connected with the sliding slot. The position of the fixing plate 281 in the sliding groove is changed by rotating the adjusting bolt to change the positions of the rotating shaft and the driven sprocket 250, thereby achieving the purpose of adjusting the tightness degree of the speed doubling chain mechanism 210.
In some embodiments of the present application, as shown in fig. 2 and 3, the transport device further includes a blocking mechanism 260, the blocking mechanism 260 being located between the input end 211 and the output end 212 of the double speed chain mechanism 210 and being disposed relatively close to the output end 212 of the double speed chain mechanism 210; the blocking mechanism 260 comprises a rolling element 261 and a first driving element 262, the first driving element 262 is used for driving the rolling element 261 to lift, and the rolling element 261 is used for being abutted to a workpiece transmitted by the double-speed chain mechanism 210. Specifically, the blocking mechanism 260 includes a rolling element 261, a first driving element 262, a bracket 263 and a fixing seat 264, the rolling element 261 is rotatably installed on the bracket 263, an output end of the first driving element 262 is fixedly connected with the bracket 263, the first driving element 262 is installed on the second furnace body 120 through the fixing seat 264, the first driving element 262 drives the bracket 263 to move so as to drive the rolling element 261 to lift, so that the rolling element 261 can contact with a workpiece transmitted by the double-speed chain mechanism 210. It should be noted that the rolling direction of the rolling member 261 coincides with the material conveying direction of the double speed chain mechanism 210. In operation, the double-speed chain mechanism 210 drives the workpiece to move, and during the movement, the workpiece passes through the blocking mechanism 260 and contacts the rolling member 261. The rolling direction of the rolling element 261 is consistent with the moving direction of the workpiece, when the workpiece is contacted with the rolling element 261, the rolling element 261 moves along with the workpiece, and meanwhile, the resistance effect of the rolling element 261 on the workpiece can reduce the speed of the workpiece, so that the workpiece reaches the set speed when being output to a drying channel, and the workpiece is effectively prevented from directly rushing out of the speed-multiplying chain mechanism 210. In practical application, the rolling members 261 can be specifically selected as rollers, and the number of the rolling members 261 can be set to be one or more according to requirements; the first drive member 262 may specifically be selected as a cylinder.
In the foregoing embodiment, the silicon chip after being heated and dried on the transporting device contacts with the blocking mechanism 260 so as to decelerate the silicon chip, the silicon chip is decelerated in advance through the blocking mechanism 260, the temperature of the silicon chip is gradually reduced in the deceleration process, and then the silicon chip is transmitted to the cooling device 300 to be cooled, so that the cooling temperature of the silicon chip can be reduced step by step, the temperature difference of the silicon chip in the drying stage and the cooling stage is reduced, the cold and hot effect control of the drying furnace can be realized, and the drying quality of the silicon chip is improved.
In some embodiments of the present application, as shown in fig. 4, the cooling device 300 includes a linear guideway 310, a second driving member 320, a cooling fan 330 and a roller assembly 340, wherein the linear guideway 310 is disposed vertically, the second driving member 320 is configured to drive the roller assembly 340 to move along the linear guideway 310, and the cooling fan 330 is disposed above the roller assembly 340. The roller assembly 340 includes a plurality of rollers, and by rotating the rollers, the workpiece can be transferred on the roller assembly 340. The number of the cooling fans 330 is one or more, and the cooling fans 330 are disposed above the drum assembly 340, so that the cooling efficiency of the workpiece can be improved.
Specifically, in the embodiment, please refer to fig. 4, the second driving member 320 is a linear module, the roller assembly 340 is installed on the lifting platform, one side of the lifting platform is slidably connected to the linear slide rail 310, and the linear module drives the lifting platform to move along the linear slide rail 310 to achieve lifting. The cooling device 300 further includes a support frame 360, and the plurality of cooling fans 330 are mounted on the support frame 360. Wherein, the roller assembly 340 comprises a plurality of electric rollers, each of which can rotate around its own axis to realize the workpiece transmission.
In some embodiments of the present application, as shown in fig. 4, the cooling device 300 further includes a sensor 350, and the sensor 350 is disposed at the inlet end of the drum assembly 340. The sensor 350 is used to detect the presence of a workpiece. After the workpiece is transferred to the entrance end of the roller assembly 340, the sensor 350 detects the position of the workpiece and the linear module stops moving. At the same time, the roller assembly 340 is operated to move the workpiece forward. In this process, the cooling fan 330, which is located above the drum assembly 340, is operated all the time, so that the workpiece is sufficiently cooled.
In some embodiments of the present application, as shown in fig. 4, the cooling device 300 further includes a buffer mechanism 370, the buffer mechanism 370 is disposed below the roller assembly 340, and the buffer mechanism 370 is configured to buffer by abutting against the lifting platform. Specifically, the buffer mechanism 370 includes a buffer fixedly mounted to the lower end of the linear guide 310. When the second driving member 320 drives the roller assembly 340 to move downwards, the buffer can contact with the bottom of the lifting platform, so as to buffer the lifting process of the lifting platform.
In some embodiments of the present application, as shown in fig. 2, the transportation device further comprises a guide wheel 240, and the input end 211 and the output end 212 of the double speed chain mechanism 210 are each provided with a guide wheel 240. The guide wheel 240 can guide the workpiece to prevent the workpiece from colliding with the heating furnace body 100.
In some embodiments of the present application, as shown in fig. 2, the transportation device further includes guide plates 270, the guide plates 270 are disposed at both ends of the second furnace body 120, and the openings of the guide plates 270 are gradually enlarged to guide the workpiece.
In some embodiments of the present application, as shown in fig. 5, the drying oven further includes a drying hearth 400, the drying hearth 400 including a plurality of removable receiver boxes 420. Specifically, the drying hearth 400 includes a hearth body 410 and a plurality of receiving boxes 420, and the plurality of receiving boxes 420 are detachably mounted on the drying hearth 400. During the clearance, take receiver 420 out drying hearth body 400 and just can clear up the waste product in drying hearth body 400, have the characteristics of simple operation.
Referring to fig. 6, a silicon wafer drying method according to another embodiment of the present application includes the following steps: feeding a silicon wafer to be dried; conveying the silicon wafer into the heating furnace body 100 by using a conveying device, and heating and drying the silicon wafer in the heating furnace body 100; the heated and dried silicon wafer is subjected to pre-deceleration through a blocking mechanism 260; the silicon chip after speed reduction is transmitted to a target position; controlling the lifting platform of the cooling device 300 to stop moving, synchronously starting the electric roller in the cooling device 300, and conveying the silicon wafer into the cooling device 300 by using the electric roller; the cooling apparatus 300 then cools the silicon wafer.
In the silicon wafer drying method, the heated and dried silicon wafer on the conveying device is contacted with the blocking mechanism 260 to decelerate the silicon wafer, the silicon wafer is decelerated in advance through the blocking mechanism 260, the temperature of the silicon wafer is gradually reduced in the deceleration process, and then the silicon wafer is transmitted to the cooling device 300 to be cooled, so that the cooling temperature of the silicon wafer can be reduced step by step, the temperature difference of the silicon wafer in the drying stage and the cooling stage is reduced, the cold and hot effect control of the drying furnace can be realized, and the drying quality of the silicon wafer is improved.
In some embodiments, the silicon wafer drying method of the present application is applied to the aforementioned drying oven.
Specifically, the heating furnace body 100 includes a first furnace body 110 and a second furnace body 120 located below the first furnace body 110, and a certain space, i.e., a drying passage, is provided between the first furnace body 110 and the second furnace body 120.
The transportation device comprises a speed-multiplying chain mechanism 210 and a blocking mechanism 260, wherein the speed-multiplying chain mechanism 210 penetrates through the drying channel. The conveying plane of the speed doubling chain mechanism 210 is flush with the upper end face of the second furnace body 120, and the speed doubling chain mechanism 210 is used for conveying silicon wafers. The speed multiplying chain mechanism 210 has an input end 211 and an output end 212, the blocking mechanism 260 is disposed between the input end 211 and the output end 212 of the speed multiplying chain mechanism 210 and is relatively close to the output end 212 of the speed multiplying chain mechanism 210, and the blocking mechanism 260 is used for abutting against a silicon wafer transmitted by the speed multiplying chain mechanism 210 to decelerate the silicon wafer. Further, the blocking mechanism 260 includes a rolling member 261 and a first driving member 262, the first driving member 262 is used for driving the rolling member 261 to move up and down, and the rolling member 261 is used for abutting against the silicon wafer transmitted by the double speed chain mechanism 210. Specifically, the blocking mechanism 260 includes a rolling element 261, a first driving element 262, a support 263 and a fixing seat 264, the rolling element 261 is rotatably installed on the support 263, an output end of the first driving element 262 is fixedly connected with the support 263, the first driving element 262 is installed on the second furnace body 120 through the fixing seat 264, the first driving element 262 drives the rolling element 261 to move by driving the support 263 so as to lift, so that the rolling element 261 can contact with the silicon wafer transmitted by the double-speed chain mechanism 210. It should be noted that the rolling direction of the rolling member 261 coincides with the material conveying direction of the double speed chain mechanism 210. In operation, the speed-multiplying chain mechanism 210 drives the silicon wafer to move, and during the movement, the silicon wafer passes through the blocking mechanism 260 and contacts with the rolling member 261. The rolling direction of the rolling member 261 is consistent with the moving direction of the silicon wafer, when the silicon wafer is in contact with the rolling member 261, the rolling member 261 moves along with the silicon wafer, and meanwhile, the silicon wafer can be decelerated due to the resistance effect of the rolling member 261 on the silicon wafer, so that the silicon wafer reaches the set speed when the silicon wafer is output to a drying channel.
The cooling device 300 includes a linear slide rail 310, a second driving member 320, a cooling fan 330 and a roller assembly 340, wherein the linear slide rail 310 is vertically disposed, the second driving member 320 is used for driving the roller assembly 340 to move along the linear slide rail 310, and the cooling fan 330 is disposed above the roller assembly 340. The roller assembly 340 includes a plurality of rollers, and the silicon wafer can be transferred on the roller assembly 340 by rotating the rollers. The number of the cooling fans 330 is one or more. Further, the second driving member 320 is specifically a linear module, the roller assembly 340 is installed on the lifting platform, one side of the lifting platform is slidably connected to the linear slide rail 310, and the linear module drives the lifting platform to move along the linear slide rail 310 to achieve lifting. The cooling device 300 further includes a support frame 360, and the plurality of cooling fans 330 are mounted on the support frame 360. Wherein the roller assembly 340 includes a plurality of electric rollers, each of which is capable of rotating about its own axis to transfer the silicon wafer from a designated target position of the transportation device to the cooling device 300 for cooling.
The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present application. Furthermore, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Claims (10)
1. A drying oven, comprising:
the heating furnace body is provided with a drying channel;
the conveying device comprises a speed-multiplying chain mechanism and a blocking mechanism, the speed-multiplying chain mechanism penetrates through the drying channel, the blocking mechanism is arranged between the input end and the output end of the speed-multiplying chain mechanism and is relatively close to the output end of the speed-multiplying chain mechanism, and the blocking mechanism is used for being abutted against a workpiece transmitted by the speed-multiplying chain mechanism so as to enable the workpiece to be decelerated;
and the cooling device is arranged at one end of the conveying device and is used for cooling the workpiece.
2. The drying oven of claim 1 wherein the heating oven body includes a first oven body and a second oven body positioned below the first oven body, the first oven body and the second oven body defining the drying tunnel, the second oven body having a recess, the double speed chain mechanism being positioned within the recess.
3. The drying oven as claimed in claim 2, wherein the transportation plane of the speed chain mechanism is flush with the upper end surface of the second oven body, and a plurality of air holes are formed in the groove.
4. The drying oven of claim 1, wherein the double speed chain mechanism includes a rotating shaft and a driven sprocket mounted to the rotating shaft, and the conveyor further includes a tensioning mechanism, the tensioning mechanism includes a fixed plate rotatably connected to the rotating shaft and an adjusting member for changing a position of the driven sprocket by changing a position of the fixed plate in a transmission direction of the double speed chain mechanism.
5. The drying oven of any one of claims 1 to 4, wherein the blocking mechanism comprises a rolling member and a first driving member, the first driving member is used for driving the rolling member to move up and down, and the rolling member is used for abutting against the workpiece conveyed by the speed multiplying chain mechanism.
6. The drying oven according to claim 1, wherein the cooling device includes a linear slide rail, a second driving member, a cooling fan and a roller assembly, the linear slide rail is vertically disposed, the second driving member is configured to drive the roller assembly to move along the linear slide rail, and the cooling fan is disposed above the roller assembly.
7. The drying oven of claim 6, wherein the cooling device further comprises a sensor disposed at an inlet end of the drum assembly.
8. The drying oven of claim 6, wherein the cooling device further comprises a buffer mechanism, the buffer mechanism (370) is disposed below the roller assembly, and the buffer mechanism is used for abutting against the roller assembly.
9. The oven of claim 1 further comprising a drying hearth body, said drying hearth body including a plurality of removable receiver boxes.
10. A silicon wafer drying method is characterized by comprising the following steps:
feeding a silicon wafer to be dried;
conveying the silicon wafer into a heating furnace body by using a conveying device, and heating and drying the silicon wafer in the heating furnace body;
pre-decelerating the heated and dried silicon wafer through a blocking mechanism;
transmitting the decelerated silicon wafer to a target position;
controlling a lifting platform of the cooling device to stop moving, synchronously starting an electric roller in the cooling device, and conveying the silicon wafer into the cooling device by using the electric roller;
the cooling device cools the silicon wafer.
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