CN219829389U - Drying furnace conveyer and drying furnace - Google Patents
Drying furnace conveyer and drying furnace Download PDFInfo
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- CN219829389U CN219829389U CN202320679935.1U CN202320679935U CN219829389U CN 219829389 U CN219829389 U CN 219829389U CN 202320679935 U CN202320679935 U CN 202320679935U CN 219829389 U CN219829389 U CN 219829389U
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- 238000001035 drying Methods 0.000 title claims abstract description 152
- 238000001816 cooling Methods 0.000 claims abstract description 173
- 230000007246 mechanism Effects 0.000 claims abstract description 106
- 235000012431 wafers Nutrition 0.000 claims abstract description 87
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 75
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 75
- 239000010703 silicon Substances 0.000 claims abstract description 75
- 239000012535 impurity Substances 0.000 claims description 13
- 238000007664 blowing Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000035939 shock Effects 0.000 claims description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 230000007723 transport mechanism Effects 0.000 description 32
- 230000032258 transport Effects 0.000 description 12
- 238000010791 quenching Methods 0.000 description 10
- 230000000171 quenching effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000007774 longterm Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- -1 silver aluminum Chemical compound 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Drying Of Solid Materials (AREA)
Abstract
The utility model discloses a drying furnace conveying device and a drying furnace, comprising: the drying and transporting mechanism is arranged in the path drying section and can transport the silicon wafer so as to dry the silicon wafer in the drying section; and the cooling conveying mechanism is arranged in the way of the cooling section and can be used for receiving the dried silicon wafers conveyed by the drying conveying mechanism and continuously conveying the dried silicon wafers so as to cool the silicon wafers by the cooling section. The energy utilization efficiency can be improved, unnecessary energy loss is reduced, and the service life of the drying and transporting mechanism is prolonged. The utility model is applied to the field of drying ovens.
Description
Technical Field
The utility model relates to the field of drying ovens, in particular to a drying oven conveying device and a drying oven.
Background
In the manufacturing procedure of the photovoltaic cell, a drying furnace is required to be used for drying and cooling the silicon wafer after screen printing, and in the operation process of the existing drying equipment, a silicon wafer conveying furnace belt circularly passes through a heating furnace body and a cooling furnace body, so that the difference of the limit temperature difference of the furnace belt is large, and the energy loss is large; the temperature of the furnace belt is low, so that the drying effect is poor; long working time, aging and embrittlement of the material of the furnace belt under cold and hot impact, shortened service life and the like.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides the drying furnace conveying device which can improve the energy utilization efficiency, reduce unnecessary energy loss and prolong the service life of a drying conveying mechanism.
A drying furnace with the drying furnace conveying device is also provided.
According to an embodiment of the first aspect of the present utility model, a drying oven transportation device includes:
the drying and transporting mechanism is arranged in the path drying section and can transport the silicon wafer so as to dry the silicon wafer in the drying section;
and the cooling conveying mechanism is arranged in the way of the cooling section and can be used for receiving the dried silicon wafers conveyed by the drying conveying mechanism and continuously conveying the dried silicon wafers so as to cool the silicon wafers by the cooling section.
The drying furnace transportation device according to the embodiment of the first aspect of the utility model has at least the following beneficial effects:
1. the drying and transporting mechanism only transports in the drying section, the drying and transporting mechanism can not take out heat in the drying section to the cooling section to be cooled, the heat loss of the drying and transporting mechanism to the drying section is reduced, and the drying section does not need to use excessive heat to heat the drying and transporting mechanism;
2. the cooling transportation mechanism can independently radiate the dried silicon wafer without communicating with the cooling transportation mechanism to radiate the dried silicon wafer together, the radiating efficiency of the dried silicon wafer is higher, the cooling section can use lower radiating power consumption, the same radiating effect as before can be achieved, and the energy utilization rate is higher;
3. the use environment of the drying and transporting mechanism is kept stable, the phenomenon of shock heating and quenching is not easy to occur, the limit temperature difference range is small, and the service life of the drying and transporting mechanism can be prolonged.
According to some embodiments of the utility model, the rollers of the first and second transport mechanisms are both made of a material resistant to thermal shock.
According to some embodiments of the utility model, the drying transport mechanism, the cooling transport mechanism is one of a drum conveyor, a belt conveyor, or a slat conveyor.
According to some embodiments of the utility model, the drying conveyor is a belt conveyor.
According to some embodiments of the present utility model, the drying and transporting mechanism includes a transporting belt, a driving source and a plurality of driving members, the transporting belt is in transmission connection with the driving source and the driving members, and is driven by the driving source and the driving members to rotate, and both sides of the transporting belt along the transporting direction are provided with a tilting portion.
According to some embodiments of the utility model, the cooling transport mechanism is a thermal shock resistant transport mechanism.
A drying oven according to an embodiment of the second aspect of the present utility model includes:
a drying section provided with a drying device;
the cooling section is provided with a cooling device and is arranged adjacent to the drying section;
the conveying device is the drying furnace conveying device according to the embodiment of the first aspect of the present utility model, the drying conveying mechanism is arranged in the drying section, the cooling conveying mechanism is arranged in the cooling section, and the drying conveying mechanism can transfer the silicon wafer onto the cooling conveying mechanism.
The drying oven according to the embodiment of the second aspect of the utility model has at least the following beneficial effects: the drying and transporting mechanism and the cooling and transporting mechanism are separately arranged, the drying and transporting mechanism only transports in the drying section, heat of the drying and transporting mechanism is accumulated in the drying section, the drying and transporting mechanism cannot be cooled by the cooling section after passing through the cooling section, the heat utilization efficiency is higher, the cooling and heating variation quantity of the drying and transporting mechanism is small, the drying and transporting mechanism cannot sequentially pass through the drying section and the cooling section, quenching and quenching occur, the material requirement is lower, and the drying and transporting mechanism cannot be damaged due to the use environment of the quenching and quenching after long-term use.
According to some embodiments of the utility model, the cooling device comprises a first cooling assembly arranged towards the wafer on the cooling transport mechanism, capable of cooling the wafer.
According to some embodiments of the utility model, the first cooling assembly comprises a impurity removal blowing assembly provided with an impurity removal tuyere arranged towards the silicon wafer on the cooling and transporting mechanism, and a main air suction assembly for extracting gas.
According to some embodiments of the utility model, the cooling device comprises a second cooling assembly, wherein the second cooling assembly is arranged along the transportation direction of the cooling transportation mechanism and opposite to the first cooling assembly, and the cooling transportation mechanism is arranged between the second cooling assembly and the first cooling assembly, and is positioned in the middle of the cooling transportation mechanism.
According to some embodiments of the utility model, the second cooling assembly comprises a cool down blower assembly disposed towards the silicon wafer on the cooling transport mechanism and a secondary air extraction assembly for extracting air between the first cooling assembly and the second cooling assembly.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The utility model is further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic view showing a structure of a transporting device of a drying oven in the drying oven according to an embodiment of the present utility model;
FIG. 2 is a schematic side view of a oven conveyor in an oven according to one embodiment of the utility model;
FIG. 3 is a schematic top view of a oven conveyor in an oven according to one embodiment of the utility model;
FIG. 4 is an exploded view of a cooling section of a oven transport device according to one embodiment of the present utility model;
FIG. 5 is an exploded view of a cooling transport mechanism in a oven transport device according to one embodiment of the present utility model;
fig. 6 is a detailed schematic view of a drum of a cooling and transporting mechanism in a transporting device of a drying oven according to an embodiment of the present utility model.
Reference numerals:
a dry transport mechanism 100;
a drying section 200; a drying device 210;
cooling the transport mechanism 300; a frame 310; a drum 320; a connector 330; a gear 340;
a cooling section 400; a cooling device 410; a first cooling assembly 411; a clean-out blower assembly 4111; a main draft assembly 4112; a second cooling assembly 412; a cool down blower assembly 4121; the secondary extraction assembly 4122.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the direction or positional relationship indicated with respect to the description of the orientation, such as up, down, etc., is based on the direction or positional relationship shown in the drawings, is merely for convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, a plurality means one and more, and a plurality means two and more. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
In the related art, a drying section and a cooling section are generally arranged in a drying furnace, after silver paste on the surface of a silicon wafer is dried by the drying section and is cooled by the cooling section, the same conveying device is generally used for passing through the drying section and the cooling section, in the drying section, the conveying device is heated, the conveying device is cooled when passing through the cooling section, the conveying device is repeatedly heated and cooled, the limit temperature difference born by the conveying device is large, and when the conveying device bears cold and hot impact for a long time, the material of the conveying device is easy to age, becomes fragile, shortens the service life and is unfavorable for long-term use. Meanwhile, when the cooled conveying device enters the drying section, heat in the drying section can be absorbed again, the heating effect of the drying section is reduced, and when the heated conveying device enters the cooling section, heat dissipation can be carried out together with the silicon wafer, the cooling effect of the cooling section is reduced, and the energy utilization efficiency is low.
Referring to fig. 1, 2 and 3, a drying oven transportation device according to an embodiment of the present utility model includes:
the drying and transporting mechanism 100 is arranged in the path drying section 200 and can transport the silicon wafer so as to dry the silicon wafer in the drying section 200;
the cooling and transporting mechanism 300 is provided with a path cooling section 400, and can receive the dried silicon wafer transported by the drying and transporting mechanism 100 and continue to transport, so that the cooling section 400 cools the silicon wafer.
It should be appreciated that the drying and transporting mechanism 100 only transports in the drying section 200, the drying and transporting mechanism 100 does not carry heat in the drying section 200 to the cooling section 400 to be cooled, and the drying and transporting mechanism 100 reduces heat loss of the drying and transporting mechanism 100 to the drying section 200, and the drying section 200 does not need to use excessive heat to heat the drying and transporting mechanism 100; the cooling and transporting mechanism 300 can independently radiate the dried silicon wafer without communicating with the cooling and transporting mechanism 300 to radiate the dried silicon wafer together, so that the radiating efficiency of the silicon wafer is higher, and the cooling section 400 can use lower radiating power consumption, namely the same radiating effect as before can be achieved, and the energy utilization rate is higher; the use environment of the drying and transporting mechanism 100 is kept stable, the phenomenon of sudden heating and quenching is not easy to occur, the limit temperature difference range is small, and the service life of the drying and transporting mechanism 100 can be prolonged.
Specifically, the drying and transporting mechanism 100 and the cooling and transporting mechanism 300 may be arranged adjacently, so that the silicon wafer can be directly transferred from the drying and transporting mechanism 100 to the cooling and transporting mechanism 300, and the transfer of the silicon wafer is realized. Of course, after the delivery tact of the silicon wafer is taken out, the drying and transporting mechanism 100 and the cooling and transporting mechanism 300 may be separated by a long distance, and the drying and transporting mechanism 100 and the cooling and transporting mechanism 300 may be transported by the transporting device. The transfer device may be a manipulator.
Referring to fig. 1, 2 and 3, the drying and cooling transport mechanism 100 and 300 are one of a drum conveyor, a belt conveyor and a pallet conveyor.
It should be understood that the drying and transporting mechanism 100 and the cooling and transporting mechanism 300 may be different transporting mechanisms or the same transporting mechanism, and only the drying and transporting mechanism 100 is required to be disposed in the drying section 200, and the cooling and transporting mechanism 300 is required to be disposed in the cooling section 400.
Referring to fig. 1, 2 and 3, the drying and transporting mechanism 100 is a belt conveyor.
It should be understood that, the conveying devices in the related art are all belt conveyors for transporting silicon wafers, and in the drying oven, the length of the drying and transporting mechanism 100 is larger than that of the cooling and transporting mechanism 300, when the drying oven in the related art is improved, the belt conveyors can be directly reserved, and the cooling and transporting mechanism 300 and the corresponding structures are arranged at the tail part of the conveying direction of the belt conveyors, so that the drying oven conveying device in the related art is directly improved, the improvement cost is low, and the wide use is facilitated.
Referring to fig. 1, 2 and 3, the drying and transporting mechanism 100 includes a transporting belt, a driving source and a plurality of driving members, the transporting belt is in transmission connection with the driving source and the driving members, and is driven by the driving source and the driving members to rotate, and a tilting portion is disposed on two sides of the transporting belt along the transporting direction.
It is to be appreciated that when the silicon wafer is conveyed on the conveyor belt, the silicon wafer may slide relative to the conveyor belt to cause the silicon wafer to deviate from the position of the conveyor belt, the silicon wafer is limited by the warping parts on two sides of the conveyor belt, so that the silicon wafer is not easy to deviate from the position of the conveyor belt, when the silicon wafer is transferred onto the conveyor belt, the conveying position of the silicon wafer is fixed, the silicon wafer can be conveyed onto the cooling conveying mechanism 300 at the fixed position, and the silicon wafer transfer between the drying conveying mechanism 100 and the cooling conveying mechanism is more reliable.
Specifically, the driving source is a motor and a driving roller 320 connected with the motor in a transmission manner, the transmission member is a rotatable driving roller 320, and the driving roller 320 can tension the conveyor belt with the driving roller 320, so that the conveyor belt receives a certain tensioning force and can rotate along with the rotation of the driving roller 320.
In some embodiments of the present utility model, the cooling transport mechanism 300 is a cold thermal shock resistant transport mechanism.
Wherein, the cold and hot impact resistant material refers to: can bear the drying temperature of the drying section 200 in the drying furnace and the cooling temperature in the cooling section 400 at the same time, and is not easy to damage due to temperature difference, such as ceramics and stainless steel.
It is to be appreciated that when the cooling transport mechanism 300 receives the silicon wafer transported by the drying transport mechanism 100, the silicon wafer itself has a high temperature, and the silicon wafer and the cooling transport mechanism 300 perform heat transfer, so that the temperature of the cooling transport mechanism 300 is increased, meanwhile, the silicon wafer and the cooling transport mechanism 300 cool together, the cooling transport mechanism 300 receives a certain cold and hot impact, and the cold and hot impact resistant transport mechanism can better bear the cooling impact, is not easy to deform due to the cold and hot impact, is not easy to damage even if used for a long time, and has a longer service life.
Referring to fig. 5 and 6, the cooling transport mechanism 300 may be a cylindrical conveyor, where the contact manner between the cylindrical conveyor and the silicon wafer is a line contact, so that the contact area between the cooling transport mechanism 300 and the silicon wafer is smaller, the heat transfer efficiency is reduced, the heating rate of the cooling transport mechanism 300 is further reduced, the range of cold and hot impact is smaller, and the influence of the cold and hot impact on the cooling transport mechanism is reduced.
Specifically, referring to fig. 5 and 6, the specific structure of the cooling and conveying mechanism includes: the frame body 310 and a plurality of cylinder 320 that set up side by side along the direction of transportation, the both ends of cylinder 320 all link to each other with the frame body 310 through connecting piece 330 to cylinder 320 links to each other with connecting piece 330 rotation, and the one end of cylinder 320 is equipped with gear 340, and the axis of gear 340 and the axis collineation setting of cylinder 320, all gears 340 accessible same chain belt link to each other with the drive source transmission, and the drive source can be the motor, and the motor rotates and drives the chain belt and rotate, and the chain belt drives all gears 340 and rotates together, and all gears 340 drive all cylinders 320 and rotate together, realizes cooling conveying mechanism's transportation.
Wherein, the material of the frame 310 can be aluminum profile, which can effectively reduce the overall weight of the cooling and conveying mechanism, and is convenient for adjusting the angle between the cooling and conveying mechanism and the horizontal plane.
Referring to fig. 1, 2 and 3, a drying oven according to a second aspect of the present utility model includes:
a drying section 200 provided with a drying device 210;
a cooling section 400 provided with a cooling device 410 disposed adjacent to the drying section 200;
the transport device is a drying oven transport device according to the first aspect of the present utility model, the drying transport mechanism 100 is disposed in the drying section 200, the cooling transport mechanism 300 is disposed in the cooling section 400, and the drying transport mechanism 100 is capable of transferring silicon wafers onto the cooling transport mechanism 300.
It should be appreciated that, the drying and transporting mechanism 100 and the cooling and transporting mechanism 300 are separately arranged, the drying and transporting mechanism 100 only transports in the drying section 200, heat of the drying and transporting mechanism is accumulated in the drying section 200, the drying and transporting mechanism cannot be cooled by the cooling section 400 after passing through the cooling section 400, the heat utilization efficiency is higher, the drying and transporting mechanism 100 is subjected to small cold and heat variation, the drying and transporting mechanism cannot sequentially pass through the drying section 200 and the cooling section 400, quenching and quenching occur, the material requirement is lower, and the drying and transporting mechanism cannot be damaged due to the use environment of quenching and quenching after long-term use.
In this embodiment, the drying and transporting mechanism 100 is a drying oven transporting apparatus according to the first aspect of the present utility model.
It should be appreciated that the use of the oven transport apparatus in the drying section 200 also directly reduces the area of the wafer surface abrasion within the drying section 200 such that the lower surface of the wafer is less likely to be abraded within the drying section 200.
Referring to fig. 4, the cooling device 410 includes a first cooling assembly 411, and the first cooling assembly 411 is disposed toward the wafer on the cooling transport mechanism 300 to cool the wafer.
It should be appreciated that the wafer on the cooling transport mechanism 300 is cooled by the first cooling assembly 411 while the solidified silver aluminum paste debris on the wafer surface is removed to ensure that no debris is present on the wafer surface.
The first cooling unit 411 is usually air-cooled, and cools the silicon wafer by blowing normal-temperature or low-temperature gas toward the silicon wafer.
Referring to fig. 1, 2 and 3, the first cooling module 411 includes a impurity removal blower module 4111 and a main air draft module 4112, wherein the impurity removal blower module 4111 is provided with an impurity removal air port, the impurity removal air port is disposed towards the silicon wafer on the cooling and transporting mechanism 300, and the main air draft module 4112 is used for extracting air.
It is to be appreciated that the first cooling component 411 is configured to cool the silicon wafer by providing the impurity removal air blowing component 4111 and remove the solidified silver aluminum paste scraps on the surface of the silicon wafer at the same time, so as to ensure that scraps do not exist on the surface of the silicon wafer, the main air blowing component 4112 absorbs the air blown by the impurity removal air blowing component 4111 to form stable air flow circulation, scraps on the surface of the silicon wafer can be far away from the silicon wafer along with the air flow, scraps are prevented from being returned to the surface of the silicon wafer again due to turbulent flow, and the air flow in the first cooling component 411 is more stable.
Specifically, the impurity removal blower assembly 4111 includes two blower pipes, and the main blower assembly 4112 includes a blower and a first blower plate. The air flow in the first cooling module 411 is carried away by the blower together with the first suction plate to ensure that the air flow is stably drawn out.
Referring to fig. 4, the cooling device 410 includes a second cooling assembly 412, and the second cooling assembly 412 is disposed along a transportation direction of the cooling transportation mechanism 300 and opposite to the first cooling assembly 411 with the cooling transportation mechanism 300 therebetween and is located at a middle portion of the cooling transportation mechanism 300.
It should be appreciated that the cooling blower assembly 4121 of the second cooling assembly 412 cools the other surface of the wafer, so that the wafer cooling speed is faster. The first cooling component 411 and the second cooling component 412 cool the silicon wafer on the cooling transport mechanism 300 together, so that the temperature of the silicon wafer is reduced more uniformly, and the two sides of the silicon wafer are simultaneously cooled, so that the heat dissipation efficiency is higher.
Specifically, when the cooling and transporting mechanism 300 is a drum-type transporter, a gap is generally formed between the two rollers 320, the lower surface of the silicon wafer in the gap is suspended, the lower surface of the silicon wafer is more likely to contact with the air flow of the second cooling assembly 412, so as to realize convective heat transfer, and the whole lower surface of the silicon wafer is blown by the air flow, so that the upper surface and the lower surface of the silicon wafer dissipate heat simultaneously, and the heat dissipation efficiency is higher while the heat dissipation is more uniform.
Referring to fig. 4, the second cooling assembly 412 includes a cool down blower assembly 4121 and a sub-exhaust assembly 4122, wherein the cool down blower assembly 4121 is disposed towards the wafer on the cooling transport mechanism 300, and the sub-exhaust assembly 4122 is used for exhausting the gas between the first cooling assembly 411 and the second cooling assembly 412.
It should be appreciated that the second cooling assembly 412 cools the lower surface of the silicon wafer by the cooling blower assembly 4121, so that the temperature of the lower surface of the silicon wafer is reduced, and the secondary air draft assembly 4122 can form an air flow circulation in a corresponding area of the second cooling assembly 412 and form another air flow circulation independent of the first cooling assembly 411, and the two air flow circulation are performed simultaneously, so that the air flow circulation efficiency is improved, and the cooling efficiency is further improved.
Specifically, the cooling blower assembly 4121 may be a plurality of fans, specifically three sets of fans disposed along the conveying direction of the cooling conveying mechanism 300, and the secondary air draft assembly 4122 is a second air draft plate.
The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.
Claims (10)
1. A drying oven transportation device, comprising:
the drying and transporting mechanism is arranged in the path drying section and can transport the silicon wafer so as to dry the silicon wafer in the drying section;
and the cooling conveying mechanism is arranged in the way of the cooling section and can be used for receiving the dried silicon wafers conveyed by the drying conveying mechanism and continuously conveying the dried silicon wafers so as to cool the silicon wafers by the cooling section.
2. The oven conveyor of claim 1 wherein: the drying and conveying mechanism and the cooling and conveying mechanism are one of a cylinder conveyor, a belt conveyor or a plate conveyor.
3. The oven conveyor of claim 1 wherein: the drying and transporting mechanism is a belt conveyor.
4. The oven conveyor of claim 1 wherein: the drying and transporting mechanism comprises a transporting belt, a driving source and a plurality of driving parts, wherein the transporting belt is in transmission connection with the driving source and the driving parts, the driving source and the driving parts are driven to rotate, and a tilting part is arranged on two sides of the transporting belt along the transporting direction.
5. The oven conveyor of claim 1 wherein: the cooling transportation mechanism is a cold and hot shock resistant transportation mechanism.
6. A drying oven, comprising:
a drying section provided with a drying device;
the cooling section is provided with a cooling device and is arranged adjacent to the drying section;
a transporting device, which is the drying furnace transporting device according to any one of claims 1 to 5, wherein the drying transporting mechanism is arranged on the drying section, the cooling transporting mechanism is arranged on the cooling section, and the drying transporting mechanism can transport the silicon wafer onto the cooling transporting mechanism.
7. The drying oven according to claim 6, wherein: the cooling device comprises a first cooling component, wherein the first cooling component is arranged towards the silicon wafer on the cooling and conveying mechanism and can cool the silicon wafer.
8. The drying oven according to claim 7, wherein: the first cooling assembly comprises a impurity removal blowing assembly and a main air draft assembly, the impurity removal blowing assembly is provided with an impurity removal air port, the impurity removal air port faces to the silicon wafer on the cooling and transporting mechanism, and the main air draft assembly is used for extracting gas.
9. The drying oven according to claim 7, wherein: the cooling device comprises a second cooling assembly, the second cooling assembly is arranged along the transportation direction of the cooling transportation mechanism and is opposite to the first cooling assembly, the cooling transportation mechanism is arranged between the second cooling assembly and the first cooling assembly, and the second cooling assembly is positioned in the middle of the cooling transportation mechanism.
10. The drying oven according to claim 9, wherein: the second cooling assembly comprises a cooling blowing assembly and a secondary air draft assembly, the cooling blowing assembly faces the silicon wafer on the cooling conveying mechanism, and the secondary air draft assembly is used for extracting gas between the first cooling assembly and the second cooling assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320679935.1U CN219829389U (en) | 2023-03-30 | 2023-03-30 | Drying furnace conveyer and drying furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320679935.1U CN219829389U (en) | 2023-03-30 | 2023-03-30 | Drying furnace conveyer and drying furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219829389U true CN219829389U (en) | 2023-10-13 |
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ID=88274002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320679935.1U Active CN219829389U (en) | 2023-03-30 | 2023-03-30 | Drying furnace conveyer and drying furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219829389U (en) |
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2023
- 2023-03-30 CN CN202320679935.1U patent/CN219829389U/en active Active
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