CN115895270A - Heat-conducting gel and preparation method and application thereof - Google Patents
Heat-conducting gel and preparation method and application thereof Download PDFInfo
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- CN115895270A CN115895270A CN202211355519.2A CN202211355519A CN115895270A CN 115895270 A CN115895270 A CN 115895270A CN 202211355519 A CN202211355519 A CN 202211355519A CN 115895270 A CN115895270 A CN 115895270A
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Abstract
The invention discloses a heat-conducting gel and a preparation method and application thereof, wherein the preparation raw materials comprise a heat-conducting filler, a silicone oil matrix and epoxy resin E51; the heat conducting filler comprises modified graphene, modified diamond and modified carbon nano tubes; the surface of the modified graphene is modified with amino groups; the surface of the modified diamond is modified with amino groups; the modified carbon nanotube is modified with carboxyl on the surface. The heat-conducting gel provided by the invention has good heat-conducting property, and can realize self healing of cracks generated after long-time use.
Description
Technical Field
The invention relates to the technical field of new materials and application thereof, in particular to a heat-conducting gel and a preparation method and application thereof.
Background
With the development of high power consumption, miniaturization and integration of electronic devices, the energy density of the electronic devices is greatly increased, which brings about a severe heat dissipation problem. The failed thermal management can cause equipment blockage, circuit damage and serious potential safety hazard burying. Thermal interface materials are the best choice to help solve the heat dissipation problem. The heat-conducting gel is a heat-conducting interface material prepared from materials such as silicone oil, heat-conducting filler and the like. The heat dissipation device can be fully attached to the surface of a component, so that various gaps are filled, the thermal contact resistance between the component and a radiator is reduced, a heat dissipation channel is formed, and the heat dissipation device can play roles in insulation, shock absorption, sealing and the like.
Thermal gel is a thermal interface material with ultra-high conformability, is softer and has better surface affinity and can be compressed to very low thickness compared to thermal gaskets. The heat-conducting gel generally exists in a colloid form at normal temperature, has excellent plasticity, can adapt to various irregular, shape-variable and rugged heat-radiating interfaces, and has more flexible and variable application scenes. The heat-conducting gel on the market at present is mainly prepared by doping a heat-conducting filler in a silicone oil system. In order to obtain higher thermal conductivity, more thermal conductive filler is generally added into the resin system, and the filling ratio of the thermal conductive filler is increased to obtain better thermal conductivity. The traditional heat-conducting gel can inevitably generate the problem of internal cracking under the condition of working under a long-time high-temperature condition, and air is used as a hot poor conductor and enters gaps at the cracking position, so that the working performance is influenced, and the service life is shortened.
Therefore, it is urgent to develop a heat conductive gel that can prevent the occurrence of internal cracking in the case where the heat conductive gel is operated under a high temperature condition for a long time.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the heat-conducting gel which has good heat-conducting property and can realize self healing through cracks generated after long-time use.
According to the heat-conducting gel provided by the embodiment of the first aspect of the invention, the preparation raw materials comprise a heat-conducting filler, a silicone oil matrix and an epoxy resin E51;
the heat conducting filler comprises modified graphene, modified diamond and modified carbon nano tubes;
the surface of the modified graphene is modified with amino groups;
the surface of the modified diamond is modified with amino groups;
the modified carbon nanotube is modified with carboxyl on the surface.
The heat-conducting gel provided by the embodiment of the invention has at least the following beneficial effects:
1. the surface of the diamond is modified with amino groups; carboxyl is modified on the surface of the modified carbon nanotube, amino groups are modified on the surface of the modified graphene, and the amino groups and the carboxyl groups are interacted through hydrogen bonds, so that the heat-conducting fillers are distributed in a directional manner, the thermal resistance of a system is reduced when heat-conducting gel is formed subsequently, and the heat conductivity is improved.
2. When the heat-conducting gel works at high temperature for a long time and cracks, the heat-conducting filler has a large number of hydrogen bonds sensitive to temperature, can form reversible interaction and has stimulation responsiveness, and a cross-linked network is formed by re-crosslinking carboxyl groups and amino groups at the cracks, so that the function of self-repairing the cracks at high temperature is achieved. The epoxy resin E51 is a thermoplastic resin with a low glass transition temperature, and since graphene and the modified carbon nanotubes have excellent conductivity, eddy currents are induced in graphene sheets and the carbon nanotubes in a high-frequency alternating microwave field, and a large amount of joule heat is generated by the eddy currents and transferred to the epoxy resin E51. When the temperature of the epoxy resin E51 is higher than the glass transition temperature (44 ℃) of the epoxy resin E51, the chain segment of the epoxy resin E51 is dissolved and wound again, so that the crack of the epoxy resin E51 is self-healed.
According to some embodiments of the present invention, raw materials for preparing the thermal conductive gel comprise, by weight, 2 to 10 parts of the modified graphene, 2 to 10 parts of the modified diamond, 2 to 10 parts of the modified carbon nanotube, 20 to 40 parts of the silicone oil matrix, and 10 to 20 parts of the epoxy resin E5110.
According to some preferred embodiments of the present invention, the weight ratio of the modified graphene to the carbon nanotubes is 5.
According to some embodiments of the invention, the raw materials for preparing the thermally conductive gel further comprise a solvent.
According to some embodiments of the invention, the solvent comprises at least one of ethanol and N, N-dimethylformamide.
According to some embodiments of the invention, the silicone oil matrix comprises at least one of a vinyl-containing silicone oil and a hydrogen-containing silicone oil.
According to some embodiments of the invention, the method of preparing the modified graphene comprises: and mixing the alcohol-water solution of the aminosilane coupling agent with the graphene.
According to some embodiments of the present invention, in the preparation method of the modified graphene, the mixing time is 6 to 8 hours.
According to some embodiments of the present invention, in the preparation method of the modified graphene, the mixing temperature is 70 to 80 ℃.
According to some embodiments of the present invention, the raw material for preparing the modified graphene comprises an aminosilane coupling agent, an alcohol aqueous solution, and graphene.
According to some embodiments of the present invention, in the raw material for preparing the modified graphene, the aminosilane coupling agent includes at least one of KH-550 and KH-792.
According to some embodiments of the invention, the graphene sheets have a diameter of 2 to 5 μm in terms of the diameter of a circle of equal area.
According to some embodiments of the invention, the method of preparing the aqueous alcohol solution of an aminosilane coupling agent comprises mixing an aminosilane coupling agent with water.
According to some embodiments of the invention, the temperature of the mixing of the aminosilane coupling agent and water is in the range of 30 to 40 ℃.
According to some embodiments of the present invention, the mixing time in the preparation of the aqueous alcohol solution of the aminosilane coupling agent is 30 to 60min.
According to some embodiments of the invention, the method of making the modified diamond comprises: an aqueous alcohol solution of an aminosilane coupling agent is mixed with diamond.
According to some embodiments of the present invention, the raw material for preparing the modified diamond includes an aminosilane coupling agent, an alcohol aqueous solution, and diamond.
According to some embodiments of the present invention, the aminosilane coupling agent in the raw material for preparing the modified diamond includes at least one of KH-550 and KH-792.
According to some embodiments of the invention, the diamond has a particle size in the range of 4 μm to 10 μm.
According to some embodiments of the invention, the method of preparing the aqueous alcohol solution of an aminosilane coupling agent comprises mixing an aminosilane coupling agent with water.
According to some embodiments of the invention, the temperature of the mixing in the preparation of the aqueous alcohol solution of the aminosilane coupling agent is in the range of 30 to 40 ℃.
According to some embodiments of the invention, the mixing time in the preparation of the aqueous alcohol solution of the aminosilane coupling agent is 30 to 60min.
According to some embodiments of the invention, in the method for preparing modified diamond, the mixing time is 2 to 8 hours.
According to some embodiments of the invention, in the method of preparing the modified diamond, the mixing temperature is 60 to 80 ℃.
According to some embodiments of the invention, the method of preparing the modified carbon nanotube comprises: and (3) carrying out mixing reaction on the carbon nano tube and a nitric acid solution to obtain the modified carbon nano tube.
According to some embodiments of the present invention, in the method of preparing the modified carbon nanotube, the mixing temperature is 60 to 70 ℃.
According to some embodiments of the present invention, in the method for preparing the modified carbon nanotube, the mixing time is 2 to 5 hours.
According to some embodiments of the invention, the nitric acid solution has a mass concentration of 60 to 70%.
According to a second aspect of the invention, a method for preparing a heat conducting gel comprises the following steps: and mixing and reacting the heat-conducting filler, the epoxy resin E51 and the silicone oil matrix.
According to some embodiments of the invention, the temperature of the mixing in the preparation of the thermally conductive gel is 60 to 75 ℃.
According to some embodiments of the invention, the mixing time in the preparation of the thermally conductive gel is 2 to 5 hours.
According to some embodiments of the invention, the mixing reaction further comprises adding the solvent to the preparation of the thermally conductive gel.
According to some embodiments of the invention, in the method for preparing the thermally conductive gel, the mixing comprises stirring.
According to some embodiments of the invention, in the preparation method of the heat conducting gel, the rotation speed of stirring and mixing is 200-500 r/min.
The application of the heat-conducting gel in the electronic equipment heat dissipation field is disclosed.
The heat-conducting gel disclosed by the invention is applied to the field of heat dissipation of electronic equipment.
Comprising a thermally conductive gel as described in the embodiment of aspect 1 above. Since the application adopts all the technical solutions of the thermal gel of the above embodiments, at least all the advantages brought by the technical solutions of the above embodiments are achieved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The following is illustrative of the invention by reference to the examples, which are intended to be illustrative only and are not to be construed as limiting the invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are conventional products which are not indicated by manufacturers and are commercially available.
Example 1
The embodiment discloses a heat-conducting gel and a preparation method thereof, and the preparation method specifically comprises the following steps:
the preparation method of the modified graphene in this embodiment is as follows:
a1: according to parts by weight, 0.5 part of silane coupling agent (KH-550), 0.5 part of anhydrous ethanol and 0.1 part of distilled water are uniformly mixed and hydrolyzed in a constant-temperature water bath at 30 ℃ for 30min to obtain silane coupling agent hydrolysate; and adding 100 parts of graphene into a high-speed mixer, heating to 75 ℃, adding the silane coupling agent hydrolysate, continuously stirring for 4 hours, washing for 3 times by using acetone after the reaction is finished, and drying after vacuum filtration to obtain the modified diamond.
The preparation method of the modified diamond in the embodiment comprises the following steps:
b1: according to the parts by weight, 0.5 part of silane coupling agent (KH-550), 0.5 part of anhydrous ethanol and 0.1 part of distilled water are uniformly mixed and hydrolyzed in a constant-temperature water bath at 30 ℃ for 30min to obtain silane coupling agent hydrolysate; and adding 100 parts of diamond into a high-speed mixer, heating to 74 ℃, adding the silane coupling agent hydrolysate, continuously stirring for 4 hours, washing for 3 times by using acetone after the reaction is finished, and drying after vacuum filtration to obtain the modified diamond.
The preparation method of the modified carbon nanotube in this embodiment is as follows:
c1: adding 3 parts by weight of carbon nano tube into 60 parts by weight of 65% nitric acid solution, reacting for 3 hours at 60 ℃, filtering after the reaction is finished, collecting filter cakes, washing for 3 times by water, and drying at 70 ℃ to obtain the modified carbon nano tube.
The preparation method of the heat conducting gel of the embodiment specifically comprises the following steps:
d1, reacting 10 parts of modified graphene, 10 parts of modified diamond, 5 parts of modified carbon nano tube, 5 parts of epoxy resin E5110 parts of ethanol at 75 ℃ for 30min to obtain mixed slurry;
d2, putting the mixed slurry obtained in the step D1 and 40 parts of vinyl-containing silicone oil into a planetary stirrer, wherein the stirring speed is 200r/min, and the stirring time is 2 hours. And after stirring, taking out the mixture to obtain the heat conducting gel.
Example 2
The embodiment discloses a preparation method of a heat-conducting gel, and the difference between the embodiment and the embodiment 1 is that the addition amount of the modified diamond is 8 parts, and the rest conditions are the same.
Example 3
The embodiment discloses a preparation method of a heat-conducting gel, and the difference between the embodiment and the embodiment 1 is that the addition amount of the modified graphene is 8 parts, and the rest conditions are the same.
Example 4
This example discloses a method for preparing a thermal conductive gel, and the difference between this example and example 1 is that the addition amount of the modified carbon nanotubes is 2 parts, and the other conditions are the same.
Example 5
This example discloses a method for preparing a thermal conductive gel, and the difference between this example and example 1 is that the amount of modified carbon nanotubes added is 4 parts, and the other conditions are the same.
Comparative example 1
The present comparative example discloses a method for preparing a thermally conductive gel, and is different from example 1 in that unmodified diamond is added, and the rest conditions are the same.
Comparative example 2
The comparative example discloses a preparation method of a heat-conducting gel, and is different from the example 1 in that unmodified graphene is added, and the rest conditions are the same.
Comparative example 3
The comparative example discloses a preparation method of a heat-conducting gel, and is different from the example 1 in that unmodified carbon nanotubes are added, and the rest conditions are the same.
Comparative example 4
The comparative example discloses a method for preparing a thermal conductive gel, and is different from the example 1 in that the epoxy resin E51 is not added, and the other conditions are the same.
Comparative example 5
The comparative example discloses a preparation method of a heat-conducting gel, and is different from the example 1 in that the modified carbon nano tube is not added, and the rest conditions are the same.
Comparative example 6
The comparative example is different from the example 1 in that modified graphene is not added, and the rest conditions are the same.
Test example 1
The thermally conductive gels prepared in the above examples and comparative examples were subjected to a performance test,
testing the heat conduction performance: a standard test method for measuring heat conduction in a vertical direction by a steady state method is provided, wherein a test instrument is an LW-9389TIM resistance and conductivity measuring instrument, and the method comprises the following specific steps: the relationship between thermal resistance RTotal and thickness BLT of three thermal interface composite materials with different thicknesses is respectively tested at the temperature of 80 ℃ and the pressure of 10psi, the obtained data are subjected to linear fitting, as shown in formula (1), the slope is the thermal conductivity coefficient kappa TIM of the thermal interface material, and the intercept with the y axis is the contact thermal resistance RContact:
R Total ＝R Contact +BLT/κ TIM (1)；
the test results are shown in table 1.
Self-repairing performance test: the heat-conducting gel is connected in series in a circuit with the LED lamp, and in the test, the heat-conducting gel is firstly cut off, and the LED lamp connected into the circuit is also simultaneously turned off. The bars were then placed in a 800W microwave oven and treated at 2.45GHz for 5min. Then the LED lamp is reconnected into the circuit to observe whether the LED lamp is lightened again or not and whether the illumination intensity is consistent with that before the LED lamp is cut off or not. The prepared flexible electronic material is verified to have rapid and excellent repairing performance under microwave.
TABLE 1 thermal gel Performance test
The difference between comparative example 1 and example 1 is that: the added diamond is not modified, under the condition, the composite heat-conducting filler cannot form an effective heat-conducting channel in a system, and meanwhile, the modified graphene and the modified diamond cannot be interacted through hydrogen bonds, so that the directional distribution of the modified graphene and the modified diamond cannot be realized, and the heat-conducting property is reduced.
The difference between comparative example 2 and example 1 is that: the unmodified graphene is added, the composite heat-conducting filler cannot form an effective heat-conducting channel in a system under the condition, and the modified graphene and the modified diamond cannot interact with each other through hydrogen bonds, so that the directional distribution of the modified graphene and the modified diamond cannot be realized, and the heat-conducting property is reduced.
The difference between comparative example 3 and example 1 is that: the added carbon nano tubes are not modified, hydrogen bonds sensitive to temperature cannot be formed among the heat-conducting fillers under the condition, so that the function of self-repairing cracks at high temperature cannot be achieved, and the heat-conducting gel is internally cracked under the condition of working under the high-temperature condition for a long time.
The difference between comparative example 4 and example 1 is that: the epoxy resin E51 is not added, the dispersion performance of the system is reduced, and meanwhile, after epoxy groups are lacked, the amino groups cannot react with the chemical bonds of the epoxy groups, so that the heat conducting performance of the heat conducting gel is reduced.
The difference between comparative example 5 and example 1 is that: the modified carbon nano tube is not added, hydrogen bonds sensitive to temperature cannot be formed between the heat-conducting fillers under the condition, so that the function of self-repairing cracks at high temperature cannot be achieved, and the heat-conducting gel is internally cracked under the condition of working under the high-temperature condition for a long time.
The difference between comparative example 6 and example 1 is that: the modified graphene is not added, hydrogen bonds sensitive to temperature cannot be formed among the heat-conducting fillers under the condition, so that the function of self-repairing cracks at high temperature cannot be achieved, and the heat-conducting gel is internally cracked under the condition of working under the high-temperature condition for a long time.
Claims (10)
1. A thermally conductive gel, characterized by: the preparation raw materials comprise heat-conducting filler, a silicone oil matrix and epoxy resin E51;
the heat conducting filler comprises modified graphene, modified diamond and modified carbon nano tubes;
the surface of the modified graphene is modified with amino groups;
the surface of the modified diamond is modified with amino groups;
the modified carbon nanotube is modified with carboxyl groups on the surface.
2. The heat conducting gel of claim 1, wherein the raw materials for preparing the heat conducting gel comprise, by weight, 2 to 10 parts of the modified graphene, 2 to 10 parts of the modified diamond, 2 to 10 parts of the modified carbon nanotube, 20 to 40 parts of the silicone oil matrix, and 10 to 20 parts of the epoxy resin E51.
3. The thermally conductive gel of claim 1, wherein the silicone oil matrix comprises at least one of a vinyl silicone oil and a hydrogen-containing silicone oil.
4. The thermally conductive gel of claim 1, wherein the modified graphene is prepared by a method comprising: and mixing the alcohol-water solution of the aminosilane coupling agent with the graphene.
5. The thermally conductive gel of claim 1, wherein the modified diamond is prepared by a method comprising: an aqueous alcohol solution of an aminosilane coupling agent was mixed with diamond.
6. The thermally conductive gel of claim 1, wherein the modified carbon nanotubes are prepared by a method comprising: and (3) carrying out mixing reaction on the carbon nano tube and concentrated nitric acid to obtain the modified carbon nano tube.
7. The heat conductive gel of claim 6, wherein the temperature of the mixing reaction is 60-70 ℃ and the time is 2-5 h.
8. A method for preparing a thermally conductive gel as claimed in any one of claims 1 to 7, wherein the method comprises: mixing the heat conductive filler, the epoxy resin E51 and the silicone oil matrix.
9. The method of claim 8, wherein the mixing temperature is 60 to 75 ℃.
10. Use of a thermally conductive gel as claimed in any one of claims 1 to 7 in the field of heat dissipation in electronic devices.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117603660A (en) * | 2024-01-24 | 2024-02-27 | 北京泰派斯特电子技术有限公司 | Ultrathin breakdown voltage-resistant heat-conducting insulating gasket and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210120A (en) * | 2020-10-10 | 2021-01-12 | 吉林大学 | Heat-conducting filler and preparation method thereof, and polyarylethersulfone heat-conducting composite material and preparation method thereof |
| CN114958002A (en) * | 2022-06-27 | 2022-08-30 | 韦尔通(厦门)科技股份有限公司 | Heat-conducting silica gel and preparation method thereof |
-
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- 2022-11-01 CN CN202211355519.2A patent/CN115895270A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210120A (en) * | 2020-10-10 | 2021-01-12 | 吉林大学 | Heat-conducting filler and preparation method thereof, and polyarylethersulfone heat-conducting composite material and preparation method thereof |
| CN114958002A (en) * | 2022-06-27 | 2022-08-30 | 韦尔通(厦门)科技股份有限公司 | Heat-conducting silica gel and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117603660A (en) * | 2024-01-24 | 2024-02-27 | 北京泰派斯特电子技术有限公司 | Ultrathin breakdown voltage-resistant heat-conducting insulating gasket and preparation method thereof |
| CN117603660B (en) * | 2024-01-24 | 2024-04-26 | 北京泰派斯特电子技术有限公司 | Ultrathin breakdown voltage-resistant heat-conducting insulating gasket and preparation method thereof |
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