CN116554685A - Bi-component heat-conducting gel and preparation method and application thereof - Google Patents
Bi-component heat-conducting gel and preparation method and application thereof Download PDFInfo
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- CN116554685A CN116554685A CN202310342571.2A CN202310342571A CN116554685A CN 116554685 A CN116554685 A CN 116554685A CN 202310342571 A CN202310342571 A CN 202310342571A CN 116554685 A CN116554685 A CN 116554685A
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- silicone oil
- adhesive
- gel
- molecular weight
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- 238000002360 preparation method Methods 0.000 title claims description 10
- 238000001879 gelation Methods 0.000 title description 2
- 229920002545 silicone oil Polymers 0.000 claims description 72
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 72
- 229920002554 vinyl polymer Polymers 0.000 claims description 72
- 239000000853 adhesive Substances 0.000 claims description 46
- 230000001070 adhesive effect Effects 0.000 claims description 46
- 239000000835 fiber Substances 0.000 claims description 39
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 26
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 24
- -1 polydimethylsiloxane Polymers 0.000 claims description 24
- 229910052739 hydrogen Inorganic materials 0.000 claims description 22
- 239000001257 hydrogen Substances 0.000 claims description 22
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 16
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 claims description 9
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 claims description 9
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 8
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 7
- 125000004122 cyclic group Chemical group 0.000 claims description 7
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 238000004898 kneading Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000000945 filler Substances 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 238000013329 compounding Methods 0.000 abstract description 2
- 239000000499 gel Substances 0.000 description 22
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- 239000000843 powder Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 229920002379 silicone rubber Polymers 0.000 description 7
- 241000530146 Clerodendrum buchananii Species 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 150000002431 hydrogen Chemical class 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 5
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000002657 fibrous material Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 206010003591 Ataxia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002121 nanofiber Substances 0.000 description 1
- 239000009959 nanxing Substances 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/10—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention provides a double-component heat-conducting gel, which comprises an A gel and a B gel; the filler with different shapes is selected for reasonable compounding, so that the prepared heat conduction gel has good heat conduction performance and also has a faster heat dissipation function; according to the invention, organic components with different molecular weights are prepared in the system, so that a heat conduction bridge is arranged among the components of the system, and the interface thermal resistance is reduced.
Description
Technical Field
The invention relates to the technical field of conductive materials, in particular to a bi-component heat-conducting gel and a preparation method and application thereof.
Background
In the process of rapid development of electronic devices, the total power density of the electronic devices is also continuously improved, but the size of the electronic devices is smaller and smaller, and the heat flux density is continuously increased. In such a high-temperature environment, performance indexes of the electronic components are liable to be affected, and therefore, it is necessary to enhance thermal control of the electronic components. How to solve the heat dissipation problem of electronic components is an important point at the present stage.
The problem of efficient heat dissipation of electronic components is affected by heat transfer and fluid mechanics principles. The heat dissipation of electrical equipment is to control the working temperature of electronic equipment to ensure the working temperature and safety of the electronic equipment, and mainly relates to different aspects of heat dissipation, materials and the like.
The common heat conducting material takes silicone oil silica gel as a matrix and is doped with heat conducting ceramic powder to form heat conducting colloid. Common heat conducting ceramic powder, such as alumina, magnesia, zinc oxide, etc. Wherein these powders are generally spherical or spheroid in shape. However, such spherical and spheroidal fillers would result in an inability to increase thermal conductivity. Because the heat comes out of the sphere, the heat is conducted to the next powder through the thermal resistance of the interface between the matrix and the heat conducting powder, and the heat conducting capacity is greatly reduced through the process. And the fiber type continuous heat conduction channel becomes a better choice. In recent years, heat conductive fillers mainly composed of carbon fibers are widely used in heat conductive gaskets, heat conductive gel and other products, and good heat conductive effects are obtained. However, carbon fiber is an electrically conductive material, which is a relatively large disadvantage for thermally conductive interface materials applied to chip circuit boards and the like. Therefore, how to select other insulating fiber type materials to construct the heat conductive gel or other heat conductive materials is a very significant subject.
In fact, in recent years, a batch of ceramic fiber materials with potential thermal conductivity are being created, including three types of alumina fibers, aluminum nitride fibers, and silicon nitride fibers. Among them, alumina fiber mass production is common, and aluminum nitride and silicon nitride fibers are rare novel materials. Tests show that after the fiber is formed, the heat conductivity coefficient of the materials is greatly reduced compared with that of powder, the aluminum oxide fiber is only 5W/mK, the aluminum nitride is 15W/mK, and the silicon nitride is on the order of 18W/mK. The novel fiber material of silicon nitride is selected to be used for constructing the heat conduction material.
Patent CN114106564a discloses an oriented heat conducting gel, a preparation method and application thereof, and the prepared oriented heat conducting gel has excellent heat conducting performance and keeps good extrusion performance through reasonable proportioning and dispersion of spherical filler and anisotropic heat conducting filler in liquid resin.
Patent CN114539781a discloses a heat-conducting gel and a preparation method thereof, which have low viscosity and moderate thixotropic property, are more suitable for continuous dispensing mode operation, and meanwhile, have better flexibility due to the reduced used filler.
The common heat conducting material takes silicone oil silica gel as a matrix and is doped with heat conducting ceramic powder to form heat conducting colloid. Common heat conducting ceramic powder, such as alumina, magnesia, zinc oxide, etc. Wherein these powders are generally spherical or spheroid in shape. However, such spherical and spheroidal fillers would result in an inability to increase thermal conductivity. Because the heat comes out of the sphere, the heat is conducted to the next powder through the thermal resistance of the interface between the matrix and the heat conducting powder, and the heat conducting capacity is greatly reduced through the process. And the fiber type continuous heat conduction channel becomes a better choice. In recent years, heat conductive fillers mainly composed of carbon fibers are widely used in heat conductive gaskets, heat conductive gel and other products, and good heat conductive effects are obtained. However, carbon fiber is an electrically conductive material, which is a relatively large disadvantage for thermally conductive interface materials applied to chip circuit boards and the like. Therefore, how to select other insulating fiber type materials to construct the heat conductive gel or other heat conductive materials is a very significant subject.
In fact, in recent years, a lot of ceramic fiber materials with potential thermal conductivity are produced, and there are four types of aluminum oxide fiber, aluminum nitride fiber, silicon nitride fiber and boron nitride fiber. The test shows that the heat conductivity coefficients of the alumina fiber, the aluminum nitride fiber and the silicon nitride fiber are all lower than that of the ceramic powder body, and are lower than 20W/mK after being formed into fibers, and are slightly lower in the heat conducting gel. While the bulk material of the boron nitride material has a thermal conductivity of 600W/mK, after formation of nanofibers, it is reported that the thermal conductivity is still greater than 100W/mK.
The invention provides a heat-conducting gel, which can coordinate the problems of flexibility, high heat conductivity, cohesive force and the like at the same time, and provides an efficient bi-component heat-conducting gel.
Disclosure of Invention
The invention provides a dual-component heat-conducting gel, which comprises an A adhesive and a B adhesive: the adhesive A comprises the following components in percentage by weight:
3% of double hydrogen bond methoxy polydimethylsiloxane with molecular weight of 5000
Methyl MQ silicone resin with molecular weight of 20000 9%
Vinyl silicone oil with vinyl content of 0.21-0.24%
Vinyl silicone oil 7% with density of 0.97-0.98g/cm
RH-H503 hydrogen silicone oil 0.8%
0.08% of a mixture of n-dodecyl trimethoxy silane SCA-K12M and n-hexyl triethoxy silane SCA-K06E
Ethynyl cyclic ethanol 0.7%
Silicon nitride fiber allowance with average diameter of 10-20 um;
the adhesive B comprises the following components in percentage by weight:
9% of monovinyl methoxy polydimethylsiloxane with molecular weight of 10000
Phenyl triethoxysilane 3%
Vinyl silicone oil with viscosity of 400cp 2%
8 percent of vinyl silicone oil with the viscosity of 20cp
RH-H33 hydrogen silicone oil 0.7%
Platinum catalyst 1.0%
0.1% of a mixture of gamma- (2, 3-glycidoxy) propyltrimethoxysilane and a silane coupling agent KH560
Silicon nitride fiber with average diameter of 10-20 um.
Preferably, the mass ratio of the adhesive A to the adhesive B is 1 (0.75-1.25).
Preferably, the vinyl silicone oil with the vinyl content of 0.21-0.24% has a molecular weight of 4500-8000.
Preferably, the viscosity is 1000-2000, and the viscosity of the vinyl silicone oil with the density of 0.97-0.98g/cm is 1000-2000cp.
Preferably, the molecular weight of the vinyl silicone oil with the viscosity of 400cp is 15000,
preferably, the molecular weight of the vinyl silicone oil with the viscosity of 20cp is 2000.
Preferably, the silicon nitride fibers are thermally conductive fillers.
The preparation method of the two-component heat-conducting gel in the other aspect comprises the following steps of:
the preparation method of the adhesive A comprises the following steps:
mixing and kneading double hydrogen bond methoxy polydimethylsiloxane with molecular weight of 5000, methyl MQ silicon resin with molecular weight of 20000, vinyl silicone oil with vinyl content of 0.21-0.24%, vinyl silicone oil with density of 0.97-0.98g/cm, mixture of n-dodecyl trimethoxy silane SCA-K12M and n-hexyl triethoxy silane SCA-K06E and silicon nitride fiber to obtain first mixture of adhesive A;
the rest raw materials are put into the first mixture of the A glue, and are stirred in vacuum for 15 minutes at the stirring speed of 1000rpm and the vacuum degree of 0.2MP, so that the A glue is obtained;
the preparation method of the adhesive B comprises the following steps: mixing and kneading monovinyl methoxy polydimethylsiloxane with molecular weight 10000, phenyl triethoxysilane, vinyl silicone oil with viscosity of 400cp, vinyl silicone oil with viscosity of 20cp, RH-H33 hydrogen-containing silicone oil and silicon nitride fiber according to a proportion to obtain a first mixture of the adhesive B; and (3) putting the rest raw materials into the mixture, and stirring the mixture in vacuum for 15 minutes at a stirring speed of 1000rpm and a vacuum degree of 0.2MP to obtain the adhesive B.
In addition, the two-component heat-conducting gel is applied to the fields of electronic components and electronic equipment.
By adopting the technical scheme, the invention has the following beneficial effects:
1. the filler with different shapes is selected for reasonable compounding, so that the heat dissipation function is faster;
2. according to the invention, organic components with different molecular weights are prepared in the system, so that a heat conduction bridge is arranged among the components of the system, and the interface thermal resistance is reduced.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The embodiment provides a dual-component heat-conducting gel, which comprises an A adhesive and a B adhesive:
the adhesive A comprises the following components in percentage by weight:
3% of double hydrogen bond methoxy polydimethylsiloxane with molecular weight of 5000
Methyl MQ silicone resin with molecular weight of 20000 9%
Vinyl silicone oil with vinyl content of 0.21-0.24%
Vinyl silicone oil 7% with density of 0.97-0.98g/cm
RH-H503 hydrogen silicone oil 0.8%
0.08% of a mixture of n-dodecyl trimethoxy silane SCA-K12M and n-hexyl triethoxy silane SCA-K06E (1:1)
Ethynyl cyclic ethanol 0.7%
Silicon nitride fiber allowance with average diameter of 10-20 um;
the adhesive B comprises the following components in percentage by weight:
9% of monovinyl methoxy polydimethylsiloxane with molecular weight of 10000
Phenyl triethoxysilane 3%
Vinyl silicone oil with viscosity of 400cp 2%
8 percent of vinyl silicone oil with the viscosity of 20cp
RH-H33 hydrogen silicone oil 0.7%
Platinum catalyst 1.0%
A mixture of gamma- (2, 3-glycidoxy) propyltrimethoxysilane and a silane coupling agent KH560 (1:1) 0.1%
Silicon nitride fiber allowance with average diameter of 10-20 um
The vinyl silicone oil with the molecular weight of 4500-8000 and the vinyl content of 0.21% -0.24% is purchased from Shandong Bogang Biotechnology Co., ltd, the viscosity of 1000-2000 and the density of 0.97-0.98g/cm is purchased from Dongguan blue silicon rubber technology Co., ltd.
The vinyl silicone oil with the molecular weight of 15000 and the viscosity of 400cp and the vinyl silicone oil with the molecular weight of 2000 and the viscosity of 20cp are purchased from Jinan Xingfeilong chemical industry Co.
Example 2
The embodiment provides a dual-component heat-conducting gel, which comprises an A adhesive and a B adhesive:
the adhesive A comprises the following components in percentage by weight:
the adhesive B comprises the following components in percentage by weight:
vinyl silicone oil with viscosity of 1000-2000 and density of 0.97-0.98g/cm is purchased from Dongguan blue silicone rubber technology Co.
The vinyl silicone oil with the molecular weight of 15000 and the viscosity of 400cp and the vinyl silicone oil with the molecular weight of 2000 and the viscosity of 20cp are purchased from Jinan Xingfeilong chemical industry Co.
Example 3
The embodiment provides a dual-component heat-conducting gel, which comprises an A adhesive and a B adhesive:
the adhesive A comprises the following components in percentage by weight:
the silicon nitride fibers have a diameter greater than 20 microns.
The adhesive B comprises the following components in percentage by weight:
the vinyl silicone oil with the molecular weight of 4500-8000 and the vinyl content of 0.21% -0.24% is purchased from Shandong Bogang Biotechnology Co., ltd, the viscosity of 1000-2000 and the density of 0.97-0.98g/cm is purchased from Dongguan blue silicon rubber technology Co., ltd.
The vinyl silicone oil with the molecular weight of 15000 and the viscosity of 400cp and the vinyl silicone oil with the molecular weight of 2000 and the viscosity of 20cp are purchased from Jinan Xingfeilong chemical industry Co.
Example 4
The embodiment provides a dual-component heat-conducting gel, which comprises an A adhesive and a B adhesive:
the adhesive A comprises the following components in percentage by weight:
3% of double hydrogen bond methoxy polydimethylsiloxane with molecular weight of 5000
Methyl MQ silicone resin with molecular weight of 20000 9%
Vinyl silicone oil with vinyl content of 0.21-0.24%
Vinyl silicone oil 7% with density of 0.97-0.98g/cm
RH-H503 hydrogen silicone oil 0.8%
0.08% of a mixture of n-dodecyl trimethoxy silane SCA-K12M and n-hexyl triethoxy silane SCA-K06E (1:1)
Ethynyl cyclic ethanol 0.7%
Silicon nitride fiber allowance with average diameter of 10-20 um;
the adhesive B comprises the following components in percentage by weight:
9% of monovinyl methoxy polydimethylsiloxane with molecular weight of 10000
Phenyl triethoxysilane 3%
Vinyl silicone oil with viscosity of 400cp 2%
8 percent of vinyl silicone oil with the viscosity of 20cp
RH-H33 hydrogen silicone oil 0.7%
Platinum catalyst 1.0%
A mixture of gamma- (2, 3-glycidoxy) propyltrimethoxysilane and a silane coupling agent KH560 (1:1) 0.1%
Silicon nitride fiber allowance with average diameter of 10-20 um
The vinyl silicone oil with the molecular weight of 4500-8000 and the vinyl content of 0.21% -0.24% is purchased from Shandong Bogang Biotechnology Co., ltd, the viscosity of 1000-2000 and the density of 0.97-0.98g/cm is purchased from Dongguan blue silicon rubber technology Co., ltd.
The vinyl silicone oil with the molecular weight of 15000 and the viscosity of 400cp and the vinyl silicone oil with the molecular weight of 2000 and the viscosity of 20cp are purchased from Jinan Xingfeilong chemical industry Co.
Example 5
The embodiment provides a dual-component heat-conducting gel, which comprises an A adhesive and a B adhesive:
the adhesive A comprises the following components in percentage by weight:
3% of double hydrogen bond methoxy polydimethylsiloxane with molecular weight of 5000
Methyl MQ silicone resin with molecular weight of 20000 9%
Vinyl silicone oil with vinyl content of 0.21-0.24%
Vinyl silicone oil 7% with density of 0.97-0.98g/cm
RH-H503 hydrogen silicone oil 0.8%
0.08% of a mixture of n-dodecyl trimethoxy silane SCA-K12M and n-hexyl triethoxy silane SCA-K06E (1:1)
Ethynyl cyclic ethanol 0.7%
Silicon nitride fiber allowance with average diameter of 10-20 um;
the adhesive B comprises the following components in percentage by weight:
9% of monovinyl methoxy polydimethylsiloxane with molecular weight of 10000
Phenyl triethoxysilane 3%
10 percent of vinyl silicone oil with the viscosity of 400cp
RH-H33 hydrogen silicone oil 0.7%
Platinum catalyst 1.0%
A mixture of gamma- (2, 3-glycidoxy) propyltrimethoxysilane and a silane coupling agent KH560 (1:1) 0.1%
Silicon nitride fiber allowance with average diameter of 10-20 um
The vinyl silicone oil with the molecular weight of 4500-8000 and the vinyl content of 0.21% -0.24% is purchased from Shandong Bogang Biotechnology Co., ltd, the viscosity of 1000-2000 and the density of 0.97-0.98g/cm is purchased from Dongguan blue silicon rubber technology Co., ltd.
The molecular weight is 15000, the viscosity is 400cp, and the molecular weight is 2000.
Example 6
The embodiment provides a dual-component heat-conducting gel, which comprises an A adhesive and a B adhesive:
the adhesive A comprises the following components in percentage by weight:
3% of double hydrogen bond methoxy polydimethylsiloxane with molecular weight of 5000
Methyl MQ silicone resin with molecular weight of 20000 9%
Vinyl silicone oil with vinyl content of 0.21-0.24%
Vinyl silicone oil 7% with density of 0.97-0.98g/cm
RH-H503 hydrogen silicone oil 0.8%
0.08% of a mixture of n-dodecyl trimethoxy silane SCA-K12M and n-hexyl triethoxy silane SCA-K06E (1:1)
Ethynyl cyclic ethanol 0.7%
Silicon nitride fiber allowance with average diameter of 10-20 um;
the adhesive B comprises the following components in percentage by weight:
9% of monovinyl methoxy polydimethylsiloxane with molecular weight of 10000
Phenyl triethoxysilane 3%
Vinyl silicone oil with viscosity of 400cp 2%
8 percent of vinyl silicone oil with the viscosity of 20cp
RH-H33 hydrogen silicone oil 0.7%
Platinum catalyst 1.0%
Silane coupling agent KH560 0.1%
Silicon nitride fiber allowance with average diameter of 10-20 um
The vinyl silicone oil with the molecular weight of 4500-8000 and the vinyl content of 0.21% -0.24% is purchased from Shandong Bogang Biotechnology Co., ltd, the viscosity of 1000-2000 and the density of 0.97-0.98g/cm is purchased from Dongguan blue silicon rubber technology Co., ltd.
The vinyl silicone oil with the molecular weight of 15000 and the viscosity of 400cp and the vinyl silicone oil with the molecular weight of 2000 and the viscosity of 20cp are purchased from Jinan Xingfeilong chemical industry Co.
Example 7
The embodiment provides a dual-component heat-conducting gel, which comprises an A adhesive and a B adhesive:
the adhesive A comprises the following components in percentage by weight:
3% of double hydrogen bond methoxy polydimethylsiloxane with molecular weight of 5000
Methyl MQ silicone resin with molecular weight of 20000 9%
Vinyl silicone oil with vinyl content of 0.21-0.24%
Vinyl silicone oil 7% with density of 0.97-0.98g/cm
RH-H503 hydrogen silicone oil 0.8%
0.08% of a mixture of n-dodecyl trimethoxy silane SCA-K12M and n-hexyl triethoxy silane SCA-K06E (1:1)
Ethynyl cyclic ethanol 0.7%
Silicon nitride fiber allowance with average diameter of 10-20 um;
the adhesive B comprises the following components in percentage by weight:
9% of monovinyl methoxy polydimethylsiloxane with molecular weight of 10000
Phenyl triethoxysilane 3%
10 percent of vinyl silicone oil with the viscosity of 20cp
RH-H33 hydrogen silicone oil 0.7%
Platinum catalyst 1.0%
A mixture of gamma- (2, 3-glycidoxy) propyltrimethoxysilane and a silane coupling agent KH560 (1:1) 0.1%
Silicon nitride fiber allowance with average diameter of 10-20 um
The vinyl silicone oil with the molecular weight of 4500-8000 and the vinyl content of 0.21% -0.24% is purchased from Shandong Bogang Biotechnology Co., ltd, the viscosity of 1000-2000 and the density of 0.97-0.98g/cm is purchased from Dongguan blue silicon rubber technology Co., ltd.
Vinyl silicone oils with a viscosity of 20cp were purchased from ataxia nan xing femto chemical industry limited.
The thermal conductivity and thermal resistance of the samples were tested by a steady state method using a rayleigh thermal conductivity meter (table below).
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (9)
1. A two-component thermally conductive gel, characterized in that the two-component thermally conductive gel comprises an a gel and a B gel: the adhesive A comprises the following components in percentage by weight:
0.08% of a mixture of n-dodecyl trimethoxy silane SCA-K12M and n-hexyl triethoxy silane SCA-K06E
Ethynyl cyclic ethanol 0.7%
Silicon nitride fiber allowance with average diameter of 10-20 um;
the adhesive B comprises the following components in percentage by weight:
2. the two-component heat conductive gel of claim 1, wherein the mass ratio of the A gel to the B gel is 1 (0.75-1.25).
3. The two-component heat conductive gel of claim 1, wherein the vinyl silicone oil having a vinyl content of 0.21% -0.24% has a molecular weight of 4500-8000.
4. The two-component heat conductive gel of claim 1, wherein the viscosity is 1000-2000 and the viscosity of the vinyl silicone oil having a density of 0.97-0.98g/cm is 1000-2000cp.
5. The two-component heat conductive gel according to claim 1, wherein the molecular weight of the vinyl silicone oil having a viscosity of 400cp is 15000,
6. the two-component heat conductive gel of claim 1, wherein the vinyl silicone oil having a viscosity of 20cp has a molecular weight of 2000.
7. The two-component thermally conductive gel of claim 1, wherein the silicon nitride fibers are thermally conductive fillers.
8. A method of preparing a two-component thermally conductive gel as claimed in any one of claims 1 to 7, wherein: the method comprises the following steps:
the preparation method of the adhesive A comprises the following steps:
mixing and kneading double hydrogen bond methoxy polydimethylsiloxane with molecular weight of 5000, methyl MQ silicon resin with molecular weight of 20000, vinyl silicone oil with vinyl content of 0.21-0.24%, vinyl silicone oil with density of 0.97-0.98g/cm, mixture of n-dodecyl trimethoxy silane SCA-K12M and n-hexyl triethoxy silane SCA-K06E and silicon nitride fiber to obtain first mixture of adhesive A;
the rest raw materials are put into the first mixture of the A glue, and are stirred in vacuum for 15 minutes at the stirring speed of 1000rpm and the vacuum degree of 0.2MP, so that the A glue is obtained;
the preparation method of the adhesive B comprises the following steps: mixing and kneading monovinyl methoxy polydimethylsiloxane with molecular weight 10000, phenyl triethoxysilane, vinyl silicone oil with viscosity of 400cp, vinyl silicone oil with viscosity of 20cp, RH-H33 hydrogen-containing silicone oil and silicon nitride fiber according to a proportion to obtain a first mixture of the adhesive B; and (3) putting the rest raw materials into the mixture, and stirring the mixture in vacuum for 15 minutes at a stirring speed of 1000rpm and a vacuum degree of 0.2MP to obtain the adhesive B.
9. A two-component thermally conductive gel as claimed in any one of claims 1 to 7 for use in the field of electronic components and electronic devices.
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| CN117327399A (en) * | 2023-09-27 | 2024-01-02 | 江苏至昕新材料有限公司 | Bi-component silica gel for IGBT and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117327399A (en) * | 2023-09-27 | 2024-01-02 | 江苏至昕新材料有限公司 | Bi-component silica gel for IGBT and preparation method thereof |
| CN117327399B (en) * | 2023-09-27 | 2024-03-22 | 江苏至昕新材料有限公司 | Bi-component silica gel for IGBT and preparation method thereof |
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