CN115870614A - Laser bonding apparatus and method - Google Patents
Laser bonding apparatus and method Download PDFInfo
- Publication number
- CN115870614A CN115870614A CN202111142820.0A CN202111142820A CN115870614A CN 115870614 A CN115870614 A CN 115870614A CN 202111142820 A CN202111142820 A CN 202111142820A CN 115870614 A CN115870614 A CN 115870614A
- Authority
- CN
- China
- Prior art keywords
- laser
- lead
- bonding
- wire
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application provides a laser bonding device for welding and cutting of a lead of an electronic device, the laser bonding device comprising: a laser device configured to emit a laser beam; a laser bonding head comprising a bonding head configured to press the wire and allow the laser beam to pass therethrough; and a control device configured to control the laser device to emit a laser beam such that a weld spot is formed between the lead wire and the electronic device; wherein the control device is further configured to move the laser bond head a predetermined distance along the wire in a direction away from the weld point and to control the laser device to emit a laser beam to sever the wire. The present application further provides a laser bonding method for wire bonding and cutting of electronic devices. The laser bonding device and the laser bonding method only adopt the laser beam to complete the welding and cutting of the lead, do not generate high stress on an electronic device and leave redundant lead, and can simplify the structure of the whole laser bonding device.
Description
Technical Field
The present invention relates to the field of laser processing, and more particularly, to a laser bonding apparatus and method for welding and cutting a lead of an electronic device.
Background
Electronic devices typically include many electronic components mounted on a printed circuit board, often requiring the use of separate metal lead (e.g., metal tape or wire) connections to transfer power and signals between different electronic components or between an electronic component and a conductive layer of the printed circuit board.
In the production process of the conventional electronic device, a length of lead wire unwound from a roll is first placed on a conductive layer of a printed circuit board or a lead of an electronic component, a solder joint is then formed between the conductive layer of the printed circuit board or the lead of the electronic component and the lead wire using a laser, and the lead wire is then cut off near the solder joint using a mechanical cutter. As shown in fig. 1, the electronic device 40 includes a printed circuit board 50, and a first electronic component 41 and a second electronic component 42 are mounted on the printed circuit board 50, and connection between the two electronic components is achieved by leads 30. The laser bonding apparatus 100 includes a laser device 10 and a laser bond head 20, and the laser bond head 20 includes a bonding head 21 and a mechanical cutter 22. In operation, the bonding ram 21 presses against the wire 30, the laser device 10 emits a laser beam 11, and the laser beam 11 passes through the bonding ram 21 to bond the wire 30 to the first electrical component 41 and the second electrical component 42. Subsequently, the mechanical cutter 22 moves downward to cut the wire 30.
During the cutting of the lead 30, the mechanical cutter 22 generates a pressure on the electronic parts and the printed circuit board, thereby generating an excessive stress on the electronic parts and the printed circuit board. If the pressure is too great, the electronic components and the printed circuit board may be deformed and the functions of the electronic components and the printed circuit board may be affected. In addition, the distance D between the cutting point of the mechanical cutter 22 and the second solder joint 32 is affected by the size and relative position of the mechanical cutter 22 and the bonding ram 21, and a slightly longer excess lead wire is inevitably left outside the solder joint. In addition, the cutting of the wire 30 requires a separate device (i.e., the mechanical cutter 22) to be performed, resulting in a complicated structure and a heavy weight of the entire laser bonding apparatus.
Accordingly, there is a need for improvements in existing laser bonding apparatus and methods for bonding and cutting leads for electronic devices.
Disclosure of Invention
An object of the present application is to provide an improved laser bonding apparatus and method for bonding and cutting a lead of an electronic device, to solve the problems of high stress occurring on the electronic device and excessive lead left, and to simplify the structure of the entire laser bonding apparatus.
To this end, according to an aspect of the present application, there is provided a laser bonding apparatus for welding and cutting a lead of an electronic device, the laser bonding apparatus including:
a laser device configured to emit a laser beam;
a laser bond head comprising a bonding head configured to press the wire and allow the laser beam to pass therethrough; and
a control device configured to control the laser device to emit the laser beam such that a weld spot is formed between the lead and the electronic device;
wherein the control device is further configured to enable the laser bonding head to move a predetermined distance along the lead in a direction away from the weld point and to control the laser device to emit the laser beam to cut the lead.
According to another aspect of the present application, there is provided a laser bonding method for welding and cutting a lead of an electronic device, the laser bonding method including:
providing an electronic device and a lead;
placing the leads on the electronic device;
pressing the lead by using a bonding pressure head of a laser bonding head;
causing a laser device to emit a laser beam such that a weld spot is formed between the lead and the electronic device;
causing the laser bond head to move a predetermined distance along the lead in a direction away from the weld point; and
causing the laser device to emit the laser beam to sever the wire.
The laser bonding device and the laser bonding method only adopt laser to complete welding and cutting of the lead, and a separate mechanical cutter is not needed, so that the defects caused by the mechanical cutter, such as pressure generation on an electronic device, redundant lead remaining and structural complexity and weight increase, are avoided.
Drawings
Exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings, it being understood that the following description is intended to be illustrative of the application only and is not intended to limit the scope of the application, which is to be given the full breadth of the appended claims
In the figure:
FIG. 1 is a schematic cross-sectional view showing a prior art laser bonding apparatus;
FIG. 2 is a schematic partial cross-sectional view illustrating a laser bonding apparatus according to an embodiment of the present application;
FIG. 3 is a schematic cross-sectional view illustrating a bonding ram according to an embodiment of the present application;
fig. 4 is a schematic flow chart illustrating a laser bonding method according to an embodiment of the present application.
Detailed Description
Preferred embodiments of the present application will be described in detail below with reference to examples, however, it will be understood by those skilled in the art that these preferred embodiments are not meant to limit the present application in any way. Furthermore, the features in the embodiments of the present application may be combined with each other without conflict. In the different drawings, the same components are denoted by the same reference numerals, and other components and steps are omitted for the sake of brevity, but this does not indicate that the laser bonding apparatus of the present application may not include other components, nor that the laser bonding method of the present application may not include other steps. It should be understood that the sizes, proportional relationships and numbers of the components in the drawings are not intended to limit the application.
A laser bonding apparatus according to an embodiment of the present application is described in detail below with reference to fig. 2. The laser bonding apparatus 100 of the present application is used for soldering and cutting of the lead 30 of the electronic apparatus 40, wherein the electronic apparatus 40 mentioned herein includes the printed circuit board 50 and the electronic components mounted thereon, however, the present application is not limited thereto. As shown in fig. 2, the laser bonding apparatus 100 includes a laser apparatus 10, a laser bonding head 20, and a control apparatus 70. It should be noted that the laser device 10, the laser bond head 20 and the control device 70 are schematically illustrated as blocks, but do not affect the understanding of the present application by those skilled in the art. The laser device 10 is configured to emit a laser beam 11. The laser bonding head 20 includes a bonding ram 21 but does not include a mechanical cutter. The bonding ram 21 is configured to press against the wire 30 and allow the laser beam 11 to pass therethrough. The control device 70 is configured to control the laser device 10 to emit the laser beam 11 such that a weld spot (e.g., the first weld spot 31 and the second weld spot 32) is formed between the lead 30 and the electronic device (e.g., the first part 41 or the second part 42). Specifically, the laser bonding apparatus 100 first forms a first solder joint 31 at the first electronic component 41 (the laser bonding apparatus 100 is shown in dashed lines here in fig. 2), and then moves to the second electronic component 42 to form a second solder joint 32, thus achieving connection between the first electronic component 41 and the second electronic component 42. Since the lead wire 30 is a portion that is unwound from a coiled wire or tape, it needs to be cut to separate the lead wire 30 from the coil. After the second weld 32 is formed, the control device 70 is also capable of moving the laser bond head 20 a predetermined distance D1 along the wire 30 in a direction away from the second weld 32 and controlling the laser device 10 to emit the laser beam 11 to sever the wire 30. Accordingly, the laser bonding apparatus 100 of the present application performs welding and cutting of the wire using only a laser beam, and thus does not require a separate mechanical cutter. No pressure is generated on the electronic device due to the omission of the mechanical cutter. In addition, the predetermined distance D1 that the laser bond head 20 moves along the wire 30 (i.e., the distance between the second bond 32 and the severing location) may be flexibly adjusted without being limited by the size and location of the mechanical cutter and the bonding ram 21, e.g., the predetermined distance D1 may even be set to 0, i.e., the wire 30 is severed against the second bond 32, so no excess wire remains. Meanwhile, the whole laser bonding device is simplified in structure, light in weight, convenient to maintain and reduced in cost.
In fig. 2, the laser bond head 20 is shown fixedly coupled to the laser device 10, and thus, as the laser bond head 20 moves, the laser device 10 also moves. However, the present application is not limited thereto. The laser bond head 20 may be movably coupled with the laser apparatus 10 such that cutting may be accomplished with only a small laser bond head 20 movement without moving the laser apparatus 10.
The lead 30 is typically a wire or sheet of metal and is formed into a coil so that any length of lead can be released from the coil. The web is typically carried on the laser bond head 20 and moves with the movement of the laser bond head 20. Where the lead 30 is a sheet, if the focal spot 33 of the laser beam 11 is smaller than the width of the sheet, the laser beam 11 may be scanned along the width of the lead 30 (e.g., by moving the laser bond head 20 or changing optics within the laser apparatus 10) to complete the welding and cutting of the lead.
In order to avoid that the laser beam 11 may cause damage to electronic components or printed circuit boards below the lead 30 when cutting the lead 30, the control device 70 is further configured to be able to move the focal spot 33 of the laser beam 11 upwards by a predetermined height at the same time as or after the laser bond head 20 is moved along the lead 30 in a direction away from the second weld point 32. Thus, the focal spot 33 of the laser beam 11 will be mainly concentrated within the wire 30, so that only the wire 30 can be cut without ablating parts below it. To achieve the upward movement of the focal spot 33 of the laser beam 11, the laser device 10 may be lifted upward by a predetermined height, or the focal spot 33 may be moved upward without lifting the laser device 10 itself by adjusting the parameters of the laser beam 11, however, the present application is not limited thereto.
According to an embodiment of the present application, the aforementioned predetermined distance may be in a range of 2mm to 10mm, and the aforementioned predetermined height may be in a range of 0.5mm to 2mm, however, the predetermined distance and the predetermined height may be other numerical ranges according to the size of the electronic component and the lead wire itself, the interval between the electronic components, the power of the laser beam, and the like.
Although the focal spot 33 is moved upward during the cutting of the lead 30 by the laser beam 11, there is a possibility that the laser beam 11 penetrates the lead 30 and irradiates a component below the lead 30. To further avoid damage of the laser beam 11 to components below the lead 30, the laser bonding apparatus 100 of the present application may further include a laser absorbing member or a laser reflecting member 60, and the laser absorbing member or the laser reflecting member 60 is configured to be capable of being placed below the lead 30 so as to absorb or reflect the laser beam 11 penetrating the lead 30.
During the soldering of the wire 30, the wire 30 is pressed against the electronic device by the bonding ram 21. As shown in fig. 3, the bonding ram 21 is a generally tubular member having a central through-hole 23 and an outer wall 24 (e.g., conical or pyramidal) that surrounds the central through-hole 23, the outer wall 24 allowing the laser beam 11 to pass through the central through-hole 23. However, since the inner diameter of the central through hole 23 is generally small, welding spatter generated during melting of the lead wire 30 by the laser beam 11 is easily accumulated in the central through hole 23, blocks the laser beam, and is not easily cleaned. To this end, according to an embodiment of the present application, the outer wall 24 of the bonding ram 21 may be configured as a hollowed-out structure (not shown), for example, a plurality of lateral holes 25 communicating with the central through hole 23 are formed in the outer wall 24 of the bonding ram 21 (especially, at positions close to the end opening of the central through hole 23) to reduce the accumulation of welding spatter at the bonding ram 21 and facilitate cleaning, thereby ensuring smooth performance of the laser bonding process.
It should be noted that since it is not necessary to cut the lead 30 after the first welding point 31 is formed, only the welding operation is involved, and the cutting operation is not involved. Therefore, the process of forming the first welding points 31 is not described in detail herein, however, it does not affect the understanding of the technical idea of the present application by those skilled in the art.
Having described the structure and configuration of the laser bonding apparatus 100 of the present application, the laser bonding method for welding and cutting of the lead 30 of the electronic device 40 of the present application is further described below with reference to fig. 4. As shown in fig. 4, the laser bonding method of the present application includes the steps of:
step S10: providing an electronic device 40 (including a printed circuit board 50, a first electronic component 41, a second electronic component 42, etc.) and a lead 30;
step S20: placing the lead 30 on the electronic device;
step S30: pressing the wire 30 with the bonding head 21 of the laser bonding head 20;
step S40: causing the laser device 10 to emit a laser beam 11 such that a weld spot (including a first weld spot 31 and a second weld spot 32) is formed between the lead 30 and the electronic device;
step S50: causing the laser bond head 20 to move a predetermined distance along the wire 30 in a direction away from the weld point (as shown in fig. 2, the laser bond head 20 moves to the right away from the second weld point 32); and
step S80: causing the laser device 10 to emit a laser beam 11 to sever the wire 30.
As described above, since the laser bonding method of the present application performs welding and cutting of the lead only using the laser beam, a separate mechanical cutter is not required, accordingly solving the problems of high stress that may be generated on the electronic device and the remaining of the redundant lead, and improving the processing accuracy and the production efficiency.
As shown in fig. 4, the laser bonding method of the present application may further include step S60: the focal spot 33 of the laser beam 11 is moved upward by a predetermined height while or after the laser bond head 20 is moved along the wire 30 in a direction away from the weld point (i.e., the second weld point 32). This can prevent the laser beam 11 from possibly damaging the electronic parts or the printed circuit board under the lead 30 when cutting the lead 30.
To further avoid damage to the component below the lead 30 by the laser beam 11, the laser bonding method of the present application may further include step S70: a laser light absorbing member or a laser light reflecting member 60 is placed below the lead wire 30 so as to absorb or reflect the laser beam 11 penetrating the lead wire 30.
Because the laser bonding device and the laser bonding method only adopt the laser beam to complete the welding and cutting of the lead, no mechanical cutting tool is needed, high stress is not generated on the electronic device and redundant lead is not left, the structure of the whole laser bonding device is simplified, the weight is light, the maintenance is convenient, the cost is reduced, in addition, the processing precision is improved, and the production efficiency is improved.
The present application has been described in detail with reference to specific embodiments thereof, however, the above description and the embodiments shown in the drawings should be construed as illustrative and not restrictive. It will be apparent to those skilled in the art that various changes or modifications may be made therein without departing from the spirit of the application, and these changes or modifications do not depart from the scope of the application.
Claims (10)
1. A laser bonding apparatus (100) for welding and cutting of a lead (30) of an electronic device (40), the laser bonding apparatus (100) comprising:
a laser device (10) configured to emit a laser beam (11);
a laser bonding head (20), the laser bonding head (20) comprising a bonding head (21), the bonding head (21) being configured to press the wire (30) and allow the laser beam (11) to pass therethrough; and
a control device (70) configured to control the laser device (10) to emit the laser beam (11) such that a weld spot is formed between the lead (30) and the electronic device (40);
wherein the control device (70) is further configured to enable the laser bonding head (20) to move a predetermined distance along the lead (30) in a direction away from the weld point and to control the laser device (10) to emit the laser beam (11) to cut the lead (30).
2. The laser bonding apparatus (100) according to claim 1, wherein the control apparatus (70) is further configured to move the focal spot (33) of the laser beam (11) upward by a predetermined height while or after the laser bond head (20) is moved along the wire (30) in a direction away from the weld point.
3. The laser bonding apparatus (100) according to claim 2, wherein the laser bonding apparatus (100) further comprises a laser absorbing or reflecting component (60), the laser absorbing or reflecting component (60) being configured to be placeable under the wire (30).
4. The laser bonding apparatus (100) according to claim 1, wherein the laser apparatus (10) is fixedly coupled or movably coupled with the laser bond head (20).
5. The laser bonding apparatus (100) according to claim 2, wherein the predetermined distance is in a range of 2mm to 10mm and the predetermined height is in a range of 0.5mm to 2 mm.
6. The laser bonding apparatus (100) according to claim 1, wherein the bonding ram (21) includes a central through hole (23) and an outer wall (24), the outer wall (24) surrounds the central through hole (23), the central through hole (23) is through which the laser beam (11) passes, and a plurality of lateral holes (25) communicating with the central through hole (23) are formed in the outer wall (24).
7. A laser bonding method for welding and cutting a lead (30) of an electronic device (40), the laser bonding method comprising:
providing the electronic device (40) and the leads (30);
placing the lead (30) on the electronic device (40);
pressing the wire (30) with a bonding head (21) of a laser bonding head (20);
-causing a laser device (10) to emit a laser beam (11) such that a weld spot is formed between the lead wire (30) and the electronic device (40);
-causing the laser bond head (20) to move a predetermined distance along the leads (30) in a direction away from the weld point; and
-causing the laser device (10) to emit the laser beam (11) to cut the wire (30).
8. The laser bonding method of claim 7, wherein the laser bonding method further comprises:
moving a focal spot (33) of the laser beam (11) upward by a predetermined height while or after the laser bond head (20) is moved along the wire (30) in a direction away from the weld point.
9. The laser bonding method according to claim 7 or 8, wherein the laser bonding method further comprises:
a laser light absorbing or reflecting component (60) is placed under the lead (30).
10. The laser bonding method of claim 8, wherein the predetermined distance is in a range of 2mm to 10mm and the predetermined height is in a range of 0.5mm to 2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111142820.0A CN115870614A (en) | 2021-09-28 | 2021-09-28 | Laser bonding apparatus and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111142820.0A CN115870614A (en) | 2021-09-28 | 2021-09-28 | Laser bonding apparatus and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115870614A true CN115870614A (en) | 2023-03-31 |
Family
ID=85763424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111142820.0A Pending CN115870614A (en) | 2021-09-28 | 2021-09-28 | Laser bonding apparatus and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115870614A (en) |
-
2021
- 2021-09-28 CN CN202111142820.0A patent/CN115870614A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7569840B2 (en) | Alignment method of a laser beam processing machine | |
| KR102202512B1 (en) | Method of welding laminated metal foils | |
| CN108465933A (en) | A kind of method and apparatus of laser welding foil and lug | |
| JP4275120B2 (en) | Coil parts manufacturing method and manufacturing apparatus | |
| CN106695136A (en) | Laser punching method of multilayer printed circuit board and system using same | |
| US7935910B2 (en) | Method of laser drilling vias | |
| CN115870614A (en) | Laser bonding apparatus and method | |
| JP6294084B2 (en) | Laser welding method and laser welding system | |
| WO2007142030A1 (en) | Laser welding method and laser welding apparatus | |
| JP2008183604A (en) | Laser beam welding apparatus and laser beam welding method | |
| CN101569960B (en) | Laser micro-welding process of network filter | |
| JP5040269B2 (en) | Laser welding method | |
| JP2014161868A (en) | Press device | |
| JPH07193375A (en) | Method of processing ceramic green sheet with film | |
| CN111390386B (en) | Laser stitch welding method compatible with material pressing gap | |
| KR100319967B1 (en) | Connection methods of coil for thin sheet buzzer using spot welding | |
| JP2009231559A (en) | Method of attaching resistor | |
| CN103862167A (en) | Flexible electronic material plate micro-hole high-speed manufacturing device based on ultrafast laser | |
| JP2002079384A (en) | Marking apparatus for copper-plated laminated substrate and method therefor | |
| JP4235168B2 (en) | Bonding structure and bonding method of bus bar for electronic device and connection terminal | |
| KR100853254B1 (en) | Quasi-cw diode pumped, solid-state uv laser system and method employing same | |
| CN116669323B (en) | PCBA open circuit processing method | |
| WO2018107320A1 (en) | Automatic apparatus for resistance welding underwater micro-welding, and resistance welding underwater welding method | |
| JP2012094771A (en) | Soldering method and soldering device | |
| CN117750654A (en) | Method for conducting inner layer winding for BGA wire clamping of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |