CN115850710A - Modified bismaleimide prepolymer, resin composition and application of resin composition - Google Patents
Modified bismaleimide prepolymer, resin composition and application of resin composition Download PDFInfo
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Abstract
The invention provides a modified bismaleimide prepolymer, a resin composition and application thereof, wherein the modified bismaleimide prepolymer is obtained by reacting a bismaleimide compound with an amino organic silicon resin A and an amino organic silicon resin B, wherein the amino equivalent Ea of the amino organic silicon resin A A Amino equivalent Ea to the amino silicone resin B B In contrast, the ratio of the total mass of the aminosilicone resin A and the aminosilicone resin B to the mass of the bismaleimide compound is (5-80): 100. The invention makes the modified bismaleimideThe imide compound reacts with amino silicone resin A and amino silicone resin B with different amino equivalent weights, the quality of the amino silicone resin and the bismaleimide compound is controlled, the reactivity of the bismaleimide compound is improved, and the rheological property of the modified bismaleimide prepolymer during high-temperature lamination when the modified bismaleimide prepolymer is applied to the field of substrate materials such as packaging substrates is controlled.
Description
Technical Field
The invention relates to the technical field of electronic materials, in particular to a modified bismaleimide prepolymer, a resin composition containing the modified bismaleimide prepolymer and an application of the resin composition.
Background
In recent years, electronic devices are being miniaturized and have high performance, and the wiring density of printed wiring boards is being increased and concentrated, which makes higher demands on the heat resistance and reliability of copper-clad plates. In particular, in semiconductor package substrates, the difference in thermal expansion rate between the chip and the organic substrate at the time of package assembly causes a problem of warpage.
The bismaleimide resin condensate has excellent performances of high temperature resistance, damp and heat resistance, high modulus, low CTE, high strength and the like, and is particularly suitable for being used as a matrix resin of IC packaging carrier plates and similar carrier plates. But also has the defects of high brittleness, poor processability and the like, and limits the large-scale application of the composite material.
In order to solve the problems of the bismaleimide resin condensate in the prior art, the introduction of the silicone rubber powder into the bismaleimide resin leads to certain improvement of the water absorption rate and toughness of the bismaleimide resin condensate, but the silicone rubber powder has the problems of low density, easy agglomeration and poor dispersibility, floats on the upper layer of the bismaleimide resin glue solution, forms phase separation, leads to the delamination of the bismaleimide resin condensate and the like. In addition, in the prior art, silicone oil is directly added into the bismaleimide resin, but in the lamination process of a cured product, if the reaction is incomplete, the silicone oil is easy to seep out of a system, the production processability is influenced, and the comprehensive performance of the final cured product is seriously influenced.
Disclosure of Invention
The invention aims to provide a modified bismaleimide prepolymer, a resin composition containing the modified bismaleimide prepolymer and application of the resin composition.
In order to achieve one of the above objects, one embodiment of the present invention provides a modified bismaleimide prepolymer obtained by reacting a bismaleimide compound with an aminosilicone resin a and an aminosilicone resin B, wherein the aminosilicone resin a has an amino equivalent Ea A Amino equivalent Ea to the amino silicone resin B B On the other hand, the ratio of the total mass of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (5-80): 100.
In a further improvement of an embodiment of the present invention, a ratio of a sum of the masses of the aminosilicone resin a and the aminosilicone resin B to the mass of the bismaleimide compound is (20 to 50): 100.
In a further improvement of an embodiment of the present invention, the mass ratio of the aminosilicone resin a and the aminosilicone resin B is 1 (2-30).
In a further improvement of an embodiment of the present invention, the aminosilicone resin a and the aminosilicone resin B each have the following structure:
In a further improvement of an embodiment of the present invention, the side chain of the aminosilicone resin a and/or the aminosilicone resin B contains at least one amino group.
In a further improvement of an embodiment of the present invention, the amino silicone resin a and/or the amino silicone resin B contains at least one amino group at a terminal end thereof.
An embodiment of the present invention also provides a resin composition, comprising the following components by weight:
(a) Modified bismaleimide prepolymer: 30-100 parts;
(b) Cyanate ester resin: 3-50 parts;
(c) Elastomer: 5-60 parts;
wherein the modified bismaleimide prepolymer is the modified bismaleimide prepolymer.
As a further improvement of an embodiment of the present invention, the cyanate ester resin is one or more selected from bisphenol a cyanate ester resin, bisphenol F cyanate ester resin, bisphenol S cyanate ester resin, bisphenol E cyanate ester resin, bisphenol M cyanate ester resin, double bond-containing cyanate ester resin, phosphorus-containing cyanate ester resin, phenolic cyanate ester resin, biphenyl cyanate ester resin, naphthalene ring cyanate ester resin, and dicyclopentadiene cyanate ester resin.
As a further improvement of an embodiment of the present invention, the cyanate ester resin is a naphthalene type cyanate ester resin or/and a phenolic type cyanate ester resin as shown in the following structures:
In a further improvement of an embodiment of the present invention, the elastomer is at least one selected from the group consisting of a styrene-based elastomer, a methacrylate-based elastomer, and a silicone-based elastomer.
As a further improvement of an embodiment of the present invention, a silane coupling agent and a dispersant are further included.
As a further improvement of an embodiment of the present invention, the silane coupling agent is an epoxy silane coupling agent, the dispersant is a phosphate dispersant and/or a modified polyurethane dispersant, and the weight ratio of the silane coupling agent to the dispersant is 2:1-10.
An embodiment of the present invention further provides an application of the resin composition in prepregs, laminates, insulating films, insulating plates, copper clad plates, circuit substrates and electronic devices.
One or more technical schemes provided by the invention at least have the following technical effects or advantages:
the modified bismaleimide prepolymer provided by the invention is prepared by reacting bismaleimide compound with amino organic silicon resins with different amino equivalent weights, so that the reactivity and brittleness of the bismaleimide compound are improved; meanwhile, the quality of the amino organic silicon resin and the quality of the bismaleimide compound are controlled, the rheological reaction window of the resin composition is well adjusted, and the risk of substrate dry-out or white streak defects caused by too fast reaction of the resin composition in the pressing process is reduced.
Drawings
FIG. 1 is a graph of the rheology curves of example 2 of the invention and comparative example 2.
Detailed Description
The present invention will be described in detail with reference to specific embodiments, but these embodiments do not limit the present invention, and the changes of reaction conditions, reactants or raw materials used by those skilled in the art according to these embodiments are included in the protection scope of the present invention.
The embodiment of the invention provides a modified bismaleimide prepolymer which is obtained by reacting bismaleimide compound with amino organic silicon resin A and amino organic silicon resin B, wherein the amino equivalent Ea of the amino organic silicon resin A A Amino equivalent Ea with amino silicone resin B B In contrast, the ratio of the total mass of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (5-80): 100.
Preferably, the ratio of the total mass of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (20-50): 100.
Furthermore, the mass ratio of the amino organic silicon resin A to the amino organic silicon resin B is 1 (2-30).
The specific reaction between the bismaleimide compound, the aminosilicone resin a and the aminosilicone resin B is as follows:
firstly, the bismaleimide compound and the amino organic silicon resin A react for 0.5 to 1.5 hours at the temperature of between 60 and 90 ℃, then the temperature is increased to between 90 and 130 ℃, and the amino organic silicon resin B is added, and the reaction is continued for 0.5 to 2 hours.
Preferably, at least one of aminophenol, carboxylic acid or carboxylic anhydride is added in an amount of 0.1 to 10 parts by weight during the reaction, and phenolic hydroxyl groups, carboxyl groups and anhydride groups of the aminophenol, carboxylic acid or carboxylic anhydride can all react with the bismaleimide compound, thereby improving the reactivity.
Further, amino equivalent Ea of amino silicone resin A A Is equal to or less than 100g/mol Ea A Not more than 500g/mol, amino equivalent Ea of amino organosilicon resin B B Has an amino equivalent of 500g/mol < Ea B ≤1600g/mol。
Preferably, the absolute value of the difference between the amino equivalent weights of silicone resin A and silicone resin B is from 100g/mol to 600g/mol.
The amino organic silicon resin A and the amino organic silicon resin B both contain the following structures:
Furthermore, the side chain of the amino silicone resin A and/or the amino silicone resin B at least contains one amino group.
Furthermore, the terminal of the amino silicone resin A and/or the amino silicone resin B at least contains one amino group.
Further, the aforementioned bismaleimide compound may be selected from at least one of the following structures:
The invention also provides a resin composition which comprises the following components in parts by weight:
(a) Modified bismaleimide prepolymer: 30-100 parts;
(b) Cyanate ester resin: 3-50 parts;
(c) Elastomer: 5-60 parts;
wherein the modified bismaleimide prepolymer is the modified bismaleimide prepolymer.
Further, the cyanate ester resin is selected from one or more of bisphenol a type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol S type cyanate ester resin, bisphenol E type cyanate ester resin, bisphenol M type cyanate ester resin, double bond-containing cyanate ester resin, phosphorus-containing cyanate ester resin, phenolic aldehyde type cyanate ester resin, biphenyl type cyanate ester resin, naphthalene ring type cyanate ester resin, and dicyclopentadiene type cyanate ester resin.
Preferably, the cyanate ester resin is naphthalene ring type cyanate ester resin or/and phenolic aldehyde type cyanate ester resin shown in the following structure:
Further, the elastomer is selected from at least one of styrene elastomer, methacrylate elastomer and organic silicon elastomer.
Wherein the styrene elastomer is selected from H1041, H1043, H1051, H1052, H1053, H1221, P1500, P2000, M1911 or M1913 of Asahi Kasei; clonic 8004, 8006, 8076, 8104, V9827, 2002, 2005, 2006, 2007, 2104, 7125, 4033, 4044, 4055, 4077, or 4099.
The methacrylate is selected from M51, M52, M22 or D51N of Achima; coly LA-2330; gargarine SG-P3 series or SG-80 series.
The silicone elastomer is selected from X-40-2670, R-170S, X-40-2705, X-40-2701, KMP-600, KMP-605 and X-52-7030 in shin-Etsu chemistry; AY-42-119 of DOW, EP-2600, EP-2601, EP-2720, TMS-2670, EXL-2315, EXL-2655, etc.
Furthermore, the resin composition also comprises 0.01 to 5 weight parts of catalyst, and the catalyst is at least one of imidazole catalyst, pyridine catalyst and organic metal salt catalyst. Preferably, the catalyst is at least one of 4-dimethylaminopyridine, 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole, modified imidazole and zinc octoate.
The modified imidazole is shown in the following structure:
Further, the resin composition also comprises 20 to 200 parts by weight of a filler. The filler comprises inorganic filler, organic filler and composite filler. Wherein the inorganic filler is at least one selected from fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, alumina, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica and glass fiber powder. The organic filler is at least one selected from polytetrafluoroethylene powder, polyphenylene sulfide powder and polyether sulfone powder.
Preferably, the filler is spherical silica, alumina or aluminum hydroxide, more preferably spherical silica.
Preferably, the filler content is 30 to 150 parts by weight.
Further, the filler is subjected to surface treatment by using a silane coupling agent, wherein the silane coupling agent is at least one of an aminosilane coupling agent, a carbon-carbon double bond-containing silane coupling agent or an epoxy silane coupling agent. Preferably, the silane coupling agent is selected from one or more of KBM-573 trade name, Z-6883 Dow Corning trade name, KBM-1003 trade name and KBM-1403 trade name.
Further, the resin composition also comprises a silane coupling agent and a dispersing agent, wherein the silane coupling agent is an epoxy silane coupling agent, the dispersing agent is phosphate esters or/and modified polyurethane, and the weight ratio of the silane coupling agent to the dispersing agent is 2:1-10.
Further, the resin composition comprises a flame retardant, which is selected from a bromine flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, an organosilicon flame retardant, an organic metal salt flame retardant, and the like, in an amount of 5 to 50 parts by weight based on 100 parts by weight of the resin composition.
Preferably, the flame retardant is selected from phosphazenes manufactured by tsukamur chemicals in japan under the trade name SPB-100; modified phosphazenes with the trade marks of BP-PZ, PP-PZ, SPCN-100, SPV-100 and SPB-100L.
Furthermore, the resin composition may further contain a dye, which may be a fluorescent dye or a black dye, wherein the fluorescent dye may be a pyrazoline compound, and the black dye may be a liquid or powder carbon black, a pyridine complex, an azo complex, a quinone compound, zirconium nitride, titanium oxide, titanium nitride, black talc, cobalt chromium metal oxide, azine, phthalocyanine, or the like.
The invention also provides application of the resin composition in prepregs, laminated boards, insulating films, insulating plates, circuit substrates and electronic devices, and the specific description is as follows:
the invention also provides a prepreg, which comprises a reinforcing material and the resin composition, and the preparation method of the prepreg comprises the following steps: dissolving the resin composition with a solvent to prepare a glue solution, then soaking the reinforcing material in the glue solution, taking out the soaked reinforcing material, and baking for 1-15 min at the temperature of 100-180 ℃; and drying to obtain the prepreg.
Wherein the solvent is at least one selected from acetone, butanone, toluene, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene and cyclohexane.
The reinforcing material is at least one selected from natural fiber, organic synthetic fiber, organic fabric and inorganic fabric. Preferably, the reinforcing material adopts glass fiber cloth; the glass fiber cloth is preferably open fiber cloth or flat cloth, and the glass fiber cloth is preferably E glass fiber cloth, S glass fiber or Q glass fiber.
Further, when the reinforcing material employs a glass cloth, the glass cloth is chemically treated with a coupling agent to improve interfacial bonding between the resin composition and the glass cloth. The coupling agent is preferably an epoxy silane coupling agent or an amino silane coupling agent to provide good water resistance and heat resistance.
The embodiment of the invention also provides a laminated plate, which comprises a prepreg and a metal foil arranged on the surface of at least one side of the prepreg; or comprises a composition sheet formed by mutually laminating a plurality of prepregs and a metal foil arranged on at least one side surface of the composition sheet.
The laminate was prepared using the following method: coating metal foil on one side or two sides of a prepreg, or laminating at least two prepregs to form a sheet, coating metal foil on one side or two sides of the sheet, and hot-pressing to obtain the metal foil laminated plate. The pressing conditions of hot pressing are as follows: pressing for 2-4 hours at 150-250 ℃ under 0.2-2 MPa.
Preferably, the metal foil is selected from copper foil or aluminum foil. The metal foil has a thickness of 5 microns, 8 microns, 12 microns, 18 microns, 35 microns, or 70 microns.
The embodiment of the invention also provides an insulating plate which comprises at least one prepreg.
The embodiment of the invention also provides an insulating film, which comprises a carrier film and the resin composition coated on the carrier film, wherein the heat index of the insulating film is obviously improved.
The insulating film is prepared by the following method: and dissolving the resin composition by using a solvent to prepare a glue solution, coating the glue solution on a carrier film, and heating and drying the carrier film coated with the glue solution to obtain the insulating film.
The solvent is at least one selected from acetone, butanone, toluene, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene and cyclohexane.
The carrier film is at least one selected from PET film, PP film, PE film and PVC film.
The embodiment of the invention also provides a circuit substrate which comprises one or more of the prepreg, the laminated board, the insulating board and the insulating film.
The embodiment of the invention also provides an electronic device, which comprises the circuit substrate; since the heat resistance of the circuit board is greatly improved, the safety of the electronic device is remarkably improved.
The technical scheme of the application is further explained by combining a plurality of specific synthetic examples and comparative examples.
Synthesis example 1: modified bismaleimide prepolymer Y1
100g of bismaleimide resin (BMI-2300, dazhou chemical) and 10g of amino silicone resin A (amino equivalent of 450g/mol, DOWSIL) were added to a beaker TM BY 16-853) and a proper amount of organic solvent, reacting at 80 ℃ for 60min, heating to 100 ℃, adding 25g of amino organic silicon resin B (amino equivalent is 800g/mol, manufactured BY SIGHT CHEMICAL, X-22-161A), continuing to react for 90min, and discharging to obtain the modified bismaleimide prepolymer Y1.
Synthesis example 2: modified bismaleimide prepolymer Y2
100g of bismaleimide resin (MIR-3000, manufactured by Nippon chemical Co., ltd.), 5g of amino organic silicon resin A (KF-8010, manufactured by shin-Etsu chemical Co., ltd.) and a proper amount of organic solvent are added into a beaker, the mixture reacts for 60min at 80 ℃, 30g of amino organic silicon resin B (X-22-161A, manufactured by shin-Etsu chemical Co., ltd.) is added after the temperature is raised to 100 ℃, the reaction is continued for 90min, and the modified bismaleimide prepolymer Y2 is obtained after discharging.
Synthesis example 3: modified bismaleimide prepolymer Y3
100g of bismaleimide resin (BMI-2300, dazhou chemical) and 10g of amino silicone resin A (amino equivalent of 450g/mol, DOWSIL) were added to a beaker TM BY 16-853), 1g aminophenol andreacting organic solvent at 80 ℃ for 60min, heating to 100 ℃, adding 25g of amino organic silicon resin B (with the amino equivalent of 800g/mol, manufactured by shin-Etsu chemical Co., ltd., X-22-161A), continuing to react for 90min, and discharging to obtain the modified bismaleimide prepolymer Y3.
Synthesis example 4: modified bismaleimide prepolymer Y4
100g of bismaleimide resin (BMI-2300, manufactured by Nippon chemical Co., ltd.), 10g of amino organic silicon resin A (KF-8010, manufactured by shin-Etsu chemical Co., ltd.), 1g of amino phenol and a proper amount of organic solvent are added into a beaker, the mixture is reacted for 60min at 80 ℃, 25g of amino organic silicon resin B (X-22-161B, manufactured by shin-Etsu chemical Co., ltd.) is added after the temperature is raised to 100 ℃, the reaction is continued for 100min, and the modified bismaleimide prepolymer Y4 is prepared after discharging.
Synthesis comparative example 1: modified bismaleimide prepolymer Y5
100g of bismaleimide resin (BMI-2300, made by Dahe Kabushiki Kaisha) and 35g of amino silicone resin A (amino equivalent of 450g/mol, DOWSIL) were added to a beaker TM BY 16-853) and a proper amount of organic solvent, reacting for 120min at 100 ℃, and discharging to obtain the modified bismaleimide prepolymer Y5.
Synthesis comparative example 2: modified bismaleimide prepolymer Y6
100g of bismaleimide resin (MIR-3000, manufactured by Nippon chemical Co., ltd.), 35g of amino organic silicon resin B (X-22-161A, manufactured by Nippon chemical Co., ltd.) and 1g of aminophenol and a proper amount of organic solvent are added into a beaker, and reacted for 120min at 100 ℃, and then the modified bismaleimide prepolymer Y6 is obtained after discharging.
Weighing corresponding solid substances according to the data in the table 1, adjusting the solid content of the glue solution to 60% through a solvent for each weighed solid substance, coating the glue solution on E glass fiber cloth, placing the E glass fiber cloth in a 160 ℃ blast drying oven after soaking, and baking for 3-6 min to prepare a prepreg.
Cutting the prepreg to 300 x 300mm, placing an electrolytic copper foil on each side of the prepreg, laminating the electrolytic copper foils into a certain stack, and pressing the stack in a vacuum press to obtain a metal foil laminated board (or a copper-clad laminated board), wherein the specific performance test is shown in table 2.
TABLE 1 resin composition ingredient Table
TABLE 2 Performance Table
All of the prepregs and copper-clad laminates prepared in examples 1 to 5 and comparative examples 1 to 2 described above were subjected to performance tests.
1) The glass transition temperature adopts DMA (thermal mechanical analysis), and the heating rate is 10 ℃/min;
2) PCT 2HR water absorption determination: taking 3 samples of 10cm × 10cm, thickness of 0.40mm and metal foil removed from two sides, drying at 100 deg.C for 2 hours, weighing, and recording weight as W1, then processing at 121 deg.C under 2 atmospheric Pressure in a Pressure Cooker cooking test (Pressure Cooker test) machine for 2 hours, weighing, and recording weight as W2, and determining water absorption as (W2-W1)/W1 × 100%;
3) X/Y Coefficient of Thermal Expansion (CTE) measurement: TMA (thermal mechanical analysis) is adopted, the heating rate is 10 ℃/min, and the test temperature range is 30-100 ℃;
4) Secondary apparent defect: the standard method specified in IPC-TM-650 is adopted for testing, and whether the defects such as dry flowers, white lines and the like appear in the base material is judged by visual inspection or a slicing method.
From the above experimental data, it can be seen that examples 1 to 3 have excellent high Tg, low water absorption, low CTE values and good apparent quality, wherein example 1 has a higher Tg value and a lower CTE than comparative example 1, and example 2 has a higher Tg value and a lower CTE than comparative example 2.
In addition, as can be seen from the rheological curves of comparative example 2 and example 2 in fig. 1, the rheological window of example 2 is wider, and the lowest melt viscosity is lower, which indicates that the resin reacts more slowly, thereby being beneficial to controlling the manufacturability.
It should be understood that although the specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it will be appreciated by those skilled in the art that the specification as a whole may be appropriately combined to form other embodiments as will be apparent to those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (13)
1. A modified bismaleimide prepolymer is characterized by being obtained by reacting bismaleimide compounds with amino organic silicon resin A and amino organic silicon resin B, wherein the amino equivalent Ea of the amino organic silicon resin A A Amino equivalent Ea to the amino silicone resin B B In contrast, the ratio of the total mass of the aminosilicone resin A and the aminosilicone resin B to the mass of the bismaleimide compound is (5-80): 100.
2. The modified bismaleimide prepolymer according to claim 1 wherein the ratio of the sum of the mass of aminosilicone resin a and aminosilicone resin B to the mass of the bismaleimide compound is (20-50): 100.
3. The modified bismaleimide prepolymer according to claim 1 or 2, wherein the mass ratio of the aminosilicone resin a to the aminosilicone resin B is 1 (2-30).
4. The modified bismaleimide prepolymer of claim 1 wherein the aminosilicone resin a and the aminosilicone resin B each comprise the following structure:
5. The modified bismaleimide prepolymer of claim 1 wherein the side chain of the aminosilicone resin a and/or aminosilicone resin B comprises at least one amino group.
6. The modified bismaleimide prepolymer of claim 1 wherein the aminosilicone resin a and/or aminosilicone resin B has at least one amino group at a terminal end.
7. A resin composition is characterized by comprising the following components in parts by weight:
(a) Modified bismaleimide prepolymer: 30-100 parts;
(b) Cyanate ester resin: 3-50 parts;
(c) Elastomer: 5-60 parts;
wherein the modified bismaleimide prepolymer is the modified bismaleimide prepolymer as claimed in any one of claims 1 to 6.
8. The resin composition according to claim 7, wherein the cyanate ester resin is selected from one or more of bisphenol A type cyanate ester resin, bisphenol F type cyanate ester resin, bisphenol S type cyanate ester resin, bisphenol E type cyanate ester resin, bisphenol M type cyanate ester resin, double bond-containing cyanate ester resin, phosphorus-containing cyanate ester resin, phenolic type cyanate ester resin, biphenyl type cyanate ester resin, naphthalene ring type cyanate ester resin, and dicyclopentadiene type cyanate ester resin.
9. The resin composition according to claim 8, wherein the cyanate ester resin is naphthalene type cyanate ester resin or/and phenolic type cyanate ester resin represented by the following structure:
10. The resin composition according to claim 7, wherein the elastomer is at least one selected from the group consisting of styrene elastomers, methacrylate elastomers and silicone elastomers.
11. The resin composition according to claim 7, further comprising a silane coupling agent and a dispersant.
12. The resin composition according to claim 11, wherein the silane coupling agent is an epoxy silane coupling agent, the dispersant is a phosphate dispersant and/or a modified polyurethane dispersant, and the weight ratio of the silane coupling agent to the dispersant is 2:1-10.
13. Use of the resin composition according to any one of claims 7 to 12 in prepregs, laminates, insulating films, insulating plates, copper clad laminates, circuit substrates and electronic devices.
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| KR1020237020919A KR20240052716A (en) | 2022-10-11 | 2023-03-31 | Modified bismaleimide prepolymer, resin composition and uses of the resin composition |
| PCT/CN2023/085349 WO2024077887A1 (en) | 2022-10-11 | 2023-03-31 | Modified bismaleimide prepolymer, resin composition, and use of resin composition |
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| CN116120560A (en) * | 2022-10-11 | 2023-05-16 | 苏州生益科技有限公司 | Preparation method of modified bismaleimide prepolymer, resin composition and application of resin composition |
| WO2024077887A1 (en) * | 2022-10-11 | 2024-04-18 | 苏州生益科技有限公司 | Modified bismaleimide prepolymer, resin composition, and use of resin composition |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116120560A (en) * | 2022-10-11 | 2023-05-16 | 苏州生益科技有限公司 | Preparation method of modified bismaleimide prepolymer, resin composition and application of resin composition |
| CN116120560B (en) * | 2022-10-11 | 2024-04-12 | 苏州生益科技有限公司 | Preparation method of modified bismaleimide prepolymer, resin composition and application of resin composition |
| WO2024077887A1 (en) * | 2022-10-11 | 2024-04-18 | 苏州生益科技有限公司 | Modified bismaleimide prepolymer, resin composition, and use of resin composition |
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| CN115850710B (en) | 2023-09-15 |
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