CN115850710B - Modified bismaleimide prepolymer, resin composition and application of resin composition - Google Patents
Modified bismaleimide prepolymer, resin composition and application of resin composition Download PDFInfo
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Abstract
The application provides a modified bismaleimide prepolymer, a resin composition and application thereof, wherein the modified bismaleimide prepolymer is obtained by reacting a bismaleimide compound with amino-silicone resin A and amino-silicone resin B, and the amino equivalent Ea of the amino-silicone resin A A Amino equivalent Ea to the amino Silicone resin B B The ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (5 to 80): 100. The application makes the modified bismaleimide compound react with the amino organic silicon resin A and the amino organic silicon resin B with different amino equivalent, controls the quality of the amino organic silicon resin and the bismaleimide compound, improves the reactivity of the bismaleimide compound, and controls the rheological property of the modified bismaleimide prepolymer in high-temperature lamination when the modified bismaleimide prepolymer is applied to the field of substrate materials such as packaging substrates.
Description
Technical Field
The application relates to the technical field of electronic materials, in particular to a modified bismaleimide prepolymer, a resin composition containing the modified bismaleimide prepolymer and application of the resin composition.
Background
In recent years, electronic devices have been miniaturized and have been improved in performance, and wiring density has been increased in printed wiring boards, and there has been a demand for heat resistance and reliability of copper-clad boards. Especially in semiconductor package substrates, the difference in thermal expansion rate between the chip and the organic substrate at the time of package assembly causes warpage problems.
The bismaleimide resin condensate has excellent performances of high temperature resistance, damp heat resistance, high modulus, low CTE, high strength and the like, and is particularly suitable for being used as matrix resin of IC packaging carrier boards and carrier-like boards. However, the disadvantages of high brittleness, poor processability and the like are also present, which limits the large-scale application thereof.
In order to solve the above problems of the cured product of bismaleimide resin in the prior art, a silicone rubber powder is introduced into the bismaleimide resin, so that the water absorption and toughness of the cured product of the bismaleimide resin are improved to a certain extent by the introduction of the silicone rubber powder, but the silicone rubber powder has the problems of small density, easy agglomeration and poor dispersibility, floats on the upper layer of the bismaleimide resin glue solution, forms phase separation, and causes delamination of the cured product of the bismaleimide resin. In addition, in the prior art, silicone oil is directly added into bismaleimide resin, but in the lamination process of a cured product, if the reaction is incomplete, the silicone oil is extremely easy to exude from a system, the production processability is affected, and the comprehensive performance of the final cured product is seriously affected.
Disclosure of Invention
The application aims to provide a modified bismaleimide prepolymer, a resin composition containing the modified bismaleimide prepolymer and application of the resin composition, wherein the modified bismaleimide prepolymer is modified by reacting a bismaleimide compound with amino-silicone resins with different amino equivalent weights, and the quality of the amino-silicone resins and the bismaleimide compound is controlled, so that the problem of high brittleness of the bismaleimide resin is solved, the reactivity of the bismaleimide resin and the rheological property of the resin during high-temperature lamination are well controlled, and the processability of the resin composition is improved.
In order to achieve one of the above objects, an embodiment of the present application provides a modified bismaleimide prepolymer obtained by reacting a bismaleimide compound with an amino silicone resin A and an amino silicone resin B, wherein the amino silicone resin A has an amino equivalent Ea A Ammonia to the amino silicone resin BBase equivalent Ea B The ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (5 to 80): 100.
As a further improvement of an embodiment of the present application, the ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (20 to 50): 100.
As a further improvement of an embodiment of the present application, the mass ratio of the amino silicone resin A to the amino silicone resin B is 1 (2-30).
As a further improvement of one embodiment of the present application, the amino silicone resin a and the amino silicone resin B each have the following structure:
wherein R and R' are C1-C5 alkyl groups, and m is an integer of 1-30.
As a further improvement of an embodiment of the present application, the side chains in the amino silicone resin a and/or the amino silicone resin B contain at least one amino group.
As a further improvement of one embodiment of the present application, the amino silicone resin a and/or the amino silicone resin B contains at least one amino group at the terminal.
An embodiment of the present application also provides a resin composition comprising the following components by weight:
(a) Modified bismaleimide prepolymer: 30-100 parts;
(b) Cyanate resin: 3-50 parts;
(c) An elastomer: 5-60 parts;
wherein the modified bismaleimide prepolymer is the modified bismaleimide prepolymer.
As a further improvement of an embodiment of the present application, the cyanate resin is selected from one or more of bisphenol a cyanate resin, bisphenol F cyanate resin, bisphenol S type cyanate resin, bisphenol E type cyanate resin, bisphenol M type cyanate resin, double bond-containing cyanate resin, phosphorus-containing cyanate resin, phenolic type cyanate resin, biphenyl type cyanate resin, naphthalene ring type cyanate resin, dicyclopentadiene type cyanate resin.
As a further improvement of an embodiment of the present application, the cyanate resin is naphthalene type cyanate resin or/and phenolic type cyanate resin shown in the following structure:
r6 is hydrogen, methyl or ethyl, n 2 Is an integer of 1 to 10;
n is an integer of 1 to 10.
As a further improvement of one embodiment of the present application, the elastomer is at least one selected from the group consisting of a styrene-based elastomer, a methacrylate-based elastomer, and a silicone-based elastomer.
As a further improvement of an embodiment of the present application, a silane coupling agent and a dispersant are also included.
As a further improvement of an embodiment of the application, the silane coupling agent is an epoxy silane coupling agent, the dispersing agent is a phosphate dispersing agent and/or a modified polyurethane dispersing agent, and the weight ratio of the silane coupling agent to the dispersing agent is 2:1-10:1.
The application also provides application of the resin composition in prepregs, laminated boards, insulating films, insulating boards, copper-clad plates, circuit substrates and electronic devices.
The one or more technical schemes provided by the application have at least the following technical effects or advantages:
the modified bismaleimide prepolymer provided by the application is reacted with amino organic silicon resin with different amino equivalent through the bismaleimide compound, so that the reactivity and brittleness of the bismaleimide compound are improved; simultaneously, the quality of the amino silicone resin and the bismaleimide compound is controlled, the rheological reaction window of the resin composition is well regulated, and the risk of defects of dry flowers or white lines of a base material caused by too fast reaction of the resin composition in the lamination process is reduced.
Drawings
Fig. 1 is a rheological profile of inventive example 2 and comparative example 2.
Detailed Description
The present application will be described in detail with reference to specific embodiments, but these embodiments are not limited thereto, and variations in reaction conditions, amounts of reactants or raw materials according to these embodiments by one of ordinary skill in the art are included in the scope of the present application.
The embodiment of the application provides a modified bismaleimide prepolymer, which is obtained by reacting a bismaleimide compound with amino-silicone resin A and amino-silicone resin B, wherein the amino equivalent Ea of the amino-silicone resin A A Amino equivalent Ea to amino Silicone resin B B The ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (5-80): 100.
Preferably, the ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (20 to 50): 100.
Further, the mass ratio of the amino silicone resin A to the amino silicone resin B is 1 (2-30).
The specific reaction between the bismaleimide compound, the amino silicone resin a and the amino silicone resin B is as follows:
the bismaleimide compound and the amino-silicone resin A react for 0.5 to 1.5 hours at the temperature of between 60 and 90 ℃, the temperature is increased to between 90 and 130 ℃, and then the amino-silicone resin B is added for continuous reaction for 0.5 to 2 hours.
Preferably, at least one of aminophenol, carboxylic acid or carboxylic anhydride is added during the reaction in an amount of 0.1 to 10 parts by weight, and phenolic hydroxyl groups, carboxyl groups and anhydride groups of the aminophenol, carboxylic acid or carboxylic anhydride can react with the bismaleimide compound to thereby improve the reactivity.
Further, amino equivalent Ea of amino Silicone resin A A Ea is 100g/mol or less A Amino equivalent Ea of amino silicone resin B less than or equal to 500g/mol B Has an amino equivalent of 500g/mol < Ea B ≤1600g/mol。
Preferably, the absolute value of the amino equivalent difference between the silicone resin A and the silicone resin B is 100g/mol to 600g/mol.
The amino silicone resin A and the amino silicone resin B each contain the following structures:
wherein R and R' are C1-C5 alkyl groups, and m is an integer of 1-30.
Further, the amino silicone resin A and/or the amino silicone resin B contains at least one amino group on a side chain.
Further, the amino silicone resin A and/or the amino silicone resin B contains at least one amino group at the terminal.
Further, the aforementioned bismaleimide compound may be selected from at least one of the following structures:
R 2 is hydrogen, methyl or ethyl, R 1 Is methylene, ethylene or, n is an integer from 1 to 10;
n is an integer of 1 to 10;
n is an integer of 1 to 10;
n is an integer of 1 to 10;
r is hydrogen, methyl or ethyl, and n is an integer of 1 to 10.
The application also provides a resin composition, which comprises the following components in parts by weight:
(a) Modified bismaleimide prepolymer: 30-100 parts;
(b) Cyanate resin: 3-50 parts;
(c) An elastomer: 5-60 parts;
wherein the modified bismaleimide prepolymer is the modified bismaleimide prepolymer.
Further, the cyanate resin is selected from one or more of bisphenol A type cyanate resin, bisphenol F type cyanate resin, bisphenol S type cyanate resin, bisphenol E type cyanate resin, bisphenol M type cyanate resin, double bond-containing cyanate resin, phosphorus-containing cyanate resin, phenolic type cyanate resin, biphenyl type cyanate resin, naphthalene ring type cyanate resin and dicyclopentadiene type cyanate resin.
Preferably, the cyanate resin is naphthalene ring type cyanate resin or/and phenolic type cyanate resin shown in the following structure:
R 6 is hydrogen, methyl or ethyl, n 2 Is an integer of 1 to 10;
n is an integer of 1 to 10.
Further, the elastomer is at least one selected from the group consisting of styrene-based elastomer, methacrylate-based elastomer, and silicone-based elastomer.
Wherein the styrene elastomer is selected from H1041, H1043, H1051, H1052, H1053, H1221, P1500, P2000, M1911 or M1913 of Japan Asahi Karaoke chemical; colali 8004, 8006, 8076, 8104, V9827, 2002, 2005, 2006, 2007, 2104, 7125, 4033, 4044, 4055, 4077 or 4099.
The methacrylate is selected from M51, M52, M22 or D51N of the amax; colali LA-2330; long SG-P3 series or SG-80 series.
The organosilicon elastomer is selected from the group consisting of X-40-2670, R-170S, X-40-2705, X-40-2701, KMP-600, KMP-605, and X-52-7030 of Xinyue chemical; AY-42-119, EP-2600, EP-2601, EP-2720, TMS-2670, EXL-2315, EXL-2655 and the like of DOW.
Further, the resin composition also comprises 0.01 to 5 parts by weight of a catalyst, wherein the catalyst is at least one of imidazole catalyst, pyridine catalyst and organic metal salt catalyst. Preferably, the catalyst is at least one of 4-dimethylaminopyridine, 2-methylimidazole, 2-methyl-4-ethylimidazole, 2-phenylimidazole, modified imidazole and zinc octoate.
The modified imidazole is shown in the following structure:
wherein R3, R4, R5 and R6 are the same or different and are respectively methyl, ethyl or tert-butyl, and B is methylene, ethylene or +.>-S-or->P200F50, JER can be used.
Wherein R3, R4, R5 and R6 are the same or the same and are respectively methyl, ethyl or tert-butyl, A is methylene, ethylene or +.>Or an aromatic hydrocarbon group, G8009L, manufactured by first industry, may be used.
Further, the resin composition further comprises 20 to 200 parts by weight of a filler. The filler comprises inorganic filler, organic filler and composite filler. Wherein the inorganic filler is at least one selected from fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, aluminum oxide, talcum powder, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica and glass fiber powder. The organic filler is at least one selected from polytetrafluoroethylene powder, polyphenylene sulfide powder and polyethersulfone powder.
Preferably, the filler is spherical silica, alumina or aluminum hydroxide, more preferably spherical silica.
Preferably, the filler content is 30 to 150 parts by weight.
Further, the filler is subjected to surface treatment by using a silane coupling agent, wherein the silane coupling agent is at least one of an amino silane coupling agent, a silane coupling agent containing carbon-carbon double bonds or an epoxy silane coupling agent. Preferably, the silane coupling agent is selected from one or more of KBM-573, KBM-1003, KBA-1403.
Further, the resin composition also comprises a silane coupling agent and a dispersing agent, wherein the silane coupling agent is an epoxy silane coupling agent, the dispersing agent is phosphate esters or/and modified polyurethanes, and the weight ratio of the silane coupling agent to the dispersing agent is 2:1-10:1.
Further, the resin composition further comprises a flame retardant, which is selected from a brominated flame retardant, a phosphorus flame retardant, a nitrogen flame retardant, an organosilicon flame retardant, an organic metal salt flame retardant, and the like, in an amount of 5 to 50 parts by weight based on 100 parts by weight of the resin composition.
Preferably, the flame retardant is selected from phosphazenes under the trademark SPB-100 by Katsukamu chemical Co., ltd; modified phosphazenes with the designations BP-PZ, PP-PZ, SPCN-100, SPV-100 and SPB-100L.
Further, a dye may be added to the resin composition, and the dye may be a fluorescent dye or a black dye, wherein the fluorescent dye may be a pyrazoline compound, and the black dye may be a liquid or powder carbon black, a pyridine complex, an azo complex, a quinone compound, zirconium nitride, titanium oxide, titanium nitride, black talc, cobalt chromium metal oxide, azine or phthalocyanine, and the like.
The application also provides application of the resin composition in prepregs, laminated boards, insulating films, insulating boards, circuit substrates and electronic devices, and the application is specifically described as follows:
the application provides a prepreg which comprises a reinforcing material and the resin composition, and the preparation method of the prepreg comprises the following steps: dissolving the resin composition with a solvent to prepare a glue solution, then dipping the reinforcing material in the glue solution, taking out the dipped reinforcing material, and baking for 1-15 min at the temperature of 100-180 ℃; and drying to obtain the prepreg.
Wherein the solvent is at least one selected from acetone, butanone, toluene, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene and cyclohexane.
The reinforcing material is at least one selected from natural fiber, organic synthetic fiber, organic fabric and inorganic fabric. Preferably, the reinforcing material is glass fiber cloth; among the glass fiber cloths, a split cloth or a flat cloth is preferably used, and the glass fiber cloth is preferably an E glass fiber cloth, an S glass fiber cloth or a Q glass fiber cloth.
In addition, when the reinforcing material is a glass fiber cloth, the glass fiber cloth is chemically treated with a coupling agent to improve interface bonding between the resin composition and the glass fiber cloth. The coupling agent is preferably an epoxy silane coupling agent or an amino silane coupling agent to provide good water resistance and heat resistance.
The embodiment of the application also provides a laminated board, which comprises a piece of the prepreg and a metal foil arranged on at least one side surface of the prepreg; or comprises a composite sheet formed by mutually overlapping a plurality of prepregs, and a metal foil arranged on at least one side surface of the composite sheet.
The laminate was prepared using the following method: and coating metal foil on one side or two side surfaces of one prepreg, or laminating at least two prepregs to form a sheet, coating metal foil on one side or two side surfaces of the formed sheet, and performing hot press forming to obtain the metal foil laminated plate. The pressing conditions of the hot pressing are as follows: pressing for 2-4 hours at the temperature of 150-250 ℃ under the pressure of 0.2-2 MPa.
Preferably, the metal foil is selected from copper foil or aluminum foil. The metal foil has a thickness of 5 microns, 8 microns, 12 microns, 18 microns, 35 microns or 70 microns.
The embodiment of the application also provides an insulating board which comprises at least one piece of the prepreg.
The embodiment of the application also provides an insulating film, which comprises a carrier film and the resin composition coated on the carrier film, wherein the thermal index of the insulating film is obviously improved.
The insulating film is prepared by the following method: the resin composition is dissolved by a solvent to prepare a glue solution, the glue solution is coated on a carrier film, and the carrier film coated with the glue solution is heated and dried to obtain the insulating film.
The solvent is at least one selected from acetone, butanone, toluene, methyl isobutyl ketone, N, N-dimethylformamide, N, N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.
The carrier film is at least one selected from PET film, PP film, PE film and PVC film.
The embodiment of the application also provides a circuit substrate which comprises one or more of the prepregs, the laminated plates, the insulating plates and the insulating films.
The embodiment of the application also provides an electronic device, which comprises the circuit substrate; since the heat resistance of the circuit substrate is greatly improved, the safety of the electronic device is remarkably improved.
The technical scheme of the application is further described below by combining specific synthetic examples and comparative examples.
Synthesis example 1: modified bismaleimide prepolymer Y1
100g of bismaleimide resin (BMI-2300 manufactured by Dai and Chemie), 10g of amino silicone resin A (amino equivalent 450g/mol, DOWSIL) were added to a beaker TM BY 16-853) and an appropriate amount of organic solvent, reacting at 80 ℃ for 60min, heating to 100 ℃, adding 25g of amino silicone resin B (the amino equivalent is 800g/mol, xinyue chemical X-22-161A), continuing to react for 90min, and discharging to obtain the modified bismaleimide prepolymer Y1.
Synthesis example 2: modified bismaleimide prepolymer Y2
100g of bismaleimide resin (MIR-3000 manufactured by Nippon chemical Co., ltd.), 5g of amino silicone resin A (amino equivalent: 430g/mol, KF-8010 manufactured by Xinyue chemical Co., ltd.) and a proper amount of organic solvent were added into a beaker, reacted at 80℃for 60 minutes, heated to 100℃and 30g of amino silicone resin B (amino equivalent: 800g/mol, X-22-161A manufactured by Xinyue chemical Co., ltd.) were further added thereto, and the reaction was continued for 90 minutes, and discharged to obtain a modified bismaleimide prepolymer Y2.
Synthesis example 3: modified bismaleimide prepolymer Y3
100g of bismaleimide resin (BMI-2300 manufactured by Dai and Chemie), 10g of amino silicone resin A (amino equivalent 450g/mol, DOWSIL) were added to a beaker TM BY 16-853), 1g of aminophenol and a proper amount of organic solvent, reacting for 60min at 80 ℃, heating to 100 ℃, adding 25g of amino silicone resin B (the amino equivalent is 800g/mol, xinyue chemical X-22-161A), continuing to react for 90min, and discharging to obtain the modified bismaleimide prepolymer Y3.
Synthesis example 4: modified bismaleimide prepolymer Y4
100g of bismaleimide resin (BMI-2300 manufactured by Nippon chemical Co., ltd.), 10g of amino silicone resin A (amino equivalent: 430g/mol, KF-8010 manufactured by Xinyue chemical Co., ltd.), 1g of aminophenol and a proper amount of organic solvent were added into a beaker, reacted at 80℃for 60 minutes, and then 25g of amino silicone resin B (amino equivalent: 1500g/mol, X-22-161B manufactured by Xinyue chemical Co., ltd.) was added thereto, and the reaction was continued for 100 minutes, followed by discharging to obtain a modified bismaleimide prepolymer Y4.
Synthesis of comparative example 1: modified bismaleimide prepolymer Y5
100g of bismaleimide resin (manufactured by Daihua Co., ltd., BMI-2300), 35g of amino silicone resin A (amino equivalent 450g/mol, DOWSIL) were added to a beaker TM BY 16-853) and an appropriate amount of organic solvent, reacting for 120min at 100 ℃, and discharging to obtain the modified bismaleimide prepolymer Y5.
Synthesis of comparative example 2: modified bismaleimide prepolymer Y6
100g of bismaleimide resin (MIR-3000 manufactured by Nippon chemical Co., ltd.), 35g of amino silicone resin B (amino equivalent is 800g/mol, X-22-161A manufactured by Xinyue chemical Co., ltd.), 1g of aminophenol and a proper amount of organic solvent are added into a beaker, reacted at 100℃for 120 minutes, and discharged to prepare a modified bismaleimide prepolymer Y6.
Weighing corresponding solid substances according to the data in Table 1, regulating the glue solution of each weighed solid substance to have the solid content of 60% by using a solvent, coating the glue solution on E glass fiber cloth, soaking, placing in a 160 ℃ blast drying oven, and baking for 3-6 min to prepare the prepreg.
Cutting the prepreg to 300X 300mm, placing an electrolytic copper foil on each of two sides of the prepreg, stacking to form a certain stack structure, and sending the stack structure into a vacuum press to prepare a metal foil laminated plate (or a copper clad laminated plate), wherein the specific performance detection is shown in table 2.
TABLE 1 resin composition ingredients Table
Table 2 performance table
Performance tests were performed on all the prepregs and copper clad laminates prepared in examples 1 to 5 and comparative examples 1 to 2 described above.
1) The glass transition temperature adopts DMA (thermo-mechanical analysis), and the temperature rising rate is 10 ℃/min;
2) PCT 2HR water absorption measurement: taking 3 samples of 10cm multiplied by 10cm with the thickness of 0.40mm and with metal foils removed from both sides, drying at 100 ℃ for 2 hours, weighing, recording the weight as W1, then processing in a pressure cooker steaming test (Pressure Cooker test) machine at 121 ℃ under 2 atmospheres for 2 hours, weighing, recording the weight as W2, and measuring the water absorption as (W2-W1)/W1 multiplied by 100%;
3) Coefficient of Thermal Expansion (CTE) determination of X/Y: TMA (thermo mechanical analysis) is adopted, the heating rate is 10 ℃/min, and the test temperature is 30-100 ℃;
4) Secondary apparent defects: and (3) testing by adopting a standard method specified in IPC-TM-650, and judging whether the defects such as dry flowers, white lines and the like appear in the base material by a visual or slicing method.
From the above experimental data, examples 1-3 have excellent high Tg, low water absorption, low CTE value and better apparent mass, with example 1 having a higher Tg value and low CTE than comparative example 1 and example 2 having a higher Tg value and lower CTE than comparative example 2.
Furthermore, as can be seen from the rheological curves of comparative example 2 and example 2 in fig. 1, the rheological window of example 2 is wider, the lowest melt viscosity is lower, indicating that the resin reaction is slower, which is advantageous for controlling the manufacturability.
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above list of detailed descriptions is only specific to practical embodiments of the present application, and they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the spirit of the present application should be included in the scope of the present application.
Claims (13)
1. The modified bismaleimide prepolymer is characterized by being obtained by reacting a bismaleimide compound with amino silicone resin A and amino silicone resin B, wherein the reaction of the bismaleimide compound, the amino silicone resin A and the amino silicone resin B is as follows: firstly, the bismaleimide compound reacts with amino-silicone resin A for 0.5 to 1.5 hours at the temperature of between 60 and 90 ℃, then the temperature is increased to between 90 and 130 ℃, and the amino-silicone resin B is added for continuous reaction for 0.5 to 2 hours;
wherein the amino silicone resin A has an amino equivalent Ea A Amino equivalent Ea to the amino Silicone resin B B Different, amino equivalent Ea of amino Silicone resin A A Is 100 g/mol.ltoreq.Ea A Amino equivalent Ea of amino silicone resin B less than or equal to 500g/mol B Has an amino equivalent of 500g/mol < Ea B Not more than 1600g/mol; the absolute value of the amino equivalent difference between the amino silicone resin A and the amino silicone resin B is 100g to 600g per mol;
the ratio of the sum of the masses of the amino silicone resin A and the amino silicone resin B to the mass of the bismaleimide compound is (5-80): 100.
2. The modified bismaleimide prepolymer according to claim 1 wherein the ratio of the sum of the mass of the amino silicone resin A and the mass of the amino silicone resin B to the mass of the bismaleimide compound is (20 to 50): 100.
3. The modified bismaleimide prepolymer according to claim 1 or 2, wherein the mass ratio of the amino silicone resin A to the amino silicone resin B is 1 (2-30).
4. The modified bismaleimide prepolymer according to claim 1 wherein the amino silicone resin a and the amino silicone resin B each have the following structure:
the method comprises the steps of carrying out a first treatment on the surface of the Wherein R and R' are C1-C5 alkyl groups, and m is an integer of 1-30.
5. The modified bismaleimide prepolymer according to claim 1 wherein the side chains in the amino silicone resin a and/or the amino silicone resin B contain at least one amino group.
6. The modified bismaleimide prepolymer according to claim 1 wherein the amino silicone resin a and/or the amino silicone resin B contains at least one amino group at the end.
7. A resin composition characterized by comprising the following components by weight:
(a) Modified bismaleimide prepolymer: 30-100 parts of a lubricant;
(b) Cyanate resin: 3-50 parts of a lubricant;
(c) An elastomer: 5-60 parts of a lubricant;
wherein the modified bismaleimide prepolymer is the modified bismaleimide prepolymer according to any one of claims 1 to 6.
8. The resin composition according to claim 7, wherein the cyanate resin is one or more selected from bisphenol a type cyanate resin, bisphenol F type cyanate resin, bisphenol S type cyanate resin, bisphenol E type cyanate resin, bisphenol M type cyanate resin, phosphorus-containing cyanate resin, phenolic type cyanate resin, biphenyl type cyanate resin, naphthalene ring type cyanate resin, dicyclopentadiene type cyanate resin.
9. The resin composition according to claim 8, wherein the cyanate resin is a naphthalene ring type cyanate resin or/and a phenolic type cyanate resin represented by the following structure:
formula (1), R6 is hydrogen, methyl or ethyl, n 2 Is an integer of 1 to 10;
the structural formula (2), n is an integer of 1-10.
10. The resin composition according to claim 7, wherein the elastomer is at least one selected from the group consisting of a styrene-based elastomer, a methacrylate-based elastomer, and a silicone-based elastomer.
11. The resin composition according to claim 7, further comprising a silane coupling agent and a dispersant.
12. The resin composition according to claim 11, wherein the silane coupling agent is an epoxy silane coupling agent, the dispersing agent is a phosphate dispersing agent and/or a modified polyurethane dispersing agent, and the weight ratio of the silane coupling agent to the dispersing agent is 2:1-10:1.
13. Use of the resin composition according to any one of claims 7 to 12 in prepregs, laminates, insulating films, insulating boards, copper-clad boards, circuit substrates and electronic devices.
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| PCT/CN2023/085349 WO2024077887A1 (en) | 2022-10-11 | 2023-03-31 | Modified bismaleimide prepolymer, resin composition, and use of resin composition |
| KR1020237020919A KR20240052716A (en) | 2022-10-11 | 2023-03-31 | Modified bismaleimide prepolymer, resin composition and uses of the resin composition |
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