CN115835541A - High-order rigid-flex PCB manufacturing method - Google Patents
High-order rigid-flex PCB manufacturing method Download PDFInfo
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- CN115835541A CN115835541A CN202211688271.1A CN202211688271A CN115835541A CN 115835541 A CN115835541 A CN 115835541A CN 202211688271 A CN202211688271 A CN 202211688271A CN 115835541 A CN115835541 A CN 115835541A
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Abstract
The invention discloses a manufacturing method of a high-order rigid-flex PCB, which comprises the following steps: sequentially stacking the first rigid plate group, the first connecting layer, the rigid-flex plate group, the second connecting layer and the second rigid plate group from top to bottom and then performing pressing treatment to obtain a multilayer plate; performing windowing processing on the multilayer board to obtain a first windowing part and a second windowing part; dispensing the adhesive at the joint of the lower edge of the first windowing part and the flexible region of the rigid-flexible core board positioned at the uppermost layer in the rigid-flexible core board, and dispensing the adhesive at the joint of the upper edge of the second windowing part and the flexible region of the rigid-flexible core board positioned at the lowermost layer in the rigid-flexible core board; the joint of the flexible area and the rigid plate is reinforced by dispensing, so that the structural stability of the joint of the flexible area and the rigid plate is effectively improved, and the phenomenon that the flexible area is separated from the rigid plate when the PCB is excessively bent by external force due to high-order rigid-flex is effectively relieved.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a manufacturing method of a high-order rigid-flex PCB.
Background
From the development trend of the current electronic products, space saving, 3D assembling and product reliability become the development trend of new electronic products. The expansion of the electronic market has led to a continuous upgrade of the global PCB scale and technology, and PCB manufacturers have subsequently explored a variety of new technologies that are amenable to development. Due to environmental and usage constraints, flexible PCB designs have emerged; in order to further ensure the weldability and 3D assembly of the product, the rigid-flexible PCB is produced.
Rigid-flex PCBs are a class of PCBs that have grown very rapidly in recent years. According to statistics, the global annual average growth rate from 2005 to 2010 is more than 20% by yield value, more than 37% by area, and obviously exceeds the growth rate of the common PCB. From market analysis at home and abroad, circuit board enterprises of independent brands in China need to develop a key manufacturing technology of the rigid-flex PCB as early as possible so as to promote transformation development of the circuit board industry in China.
At present, many scientific research institutions are researching higher-end technologies of the rigid-flex PCB manufacturing technology in the world, particularly to a type of rigid-flex PCB with a flexible plate positioned on a surface layer and a high-order, and the two types of PCBs not only have the advantages of a common rigid-flex PCB, but also have specific information transmission and low interference characteristics. Based on various advantages, the high-order rigid-flex PCB and the high-rise surface rigid-flex PCB are widely applied to various fields such as medical instruments, automobile electronics, aerospace, military products and the like.
However, in the high-order rigid-flex PCB and the high-rise surface rigid-flex PCB manufactured and obtained in the prior art, because a certain height difference exists between the flexible board and the hard board, the flexible board is easily separated from the hard board when the flexible board is excessively bent by an external force, that is, the flexible board is torn outwards, and the quality and the structural stability of the high-order rigid-flex PCB and the high-rise surface rigid-flex PCB are seriously influenced.
Disclosure of Invention
The invention aims to provide a high-order rigid-flexible combined PCB manufacturing method, wherein the joint of a flexible area and a rigid plate is reinforced through dispensing, the structural stability of the joint of the flexible area and the rigid plate is effectively improved, the phenomenon that the flexible area is separated from the rigid plate when the high-order rigid-flexible combined PCB is excessively bent by external force is effectively relieved, the quality damage of the high-order rigid-flexible combined PCB caused by tearing of the flexible area is effectively reduced, and the high-order rigid-flexible combined PCB is suitable for being manufactured into the high-order rigid-flexible combined PCB with eighteen layers.
In order to achieve the purpose, the invention discloses a method for manufacturing a high-order rigid-flex PCB, which comprises the following steps:
the method comprises the following steps of S1, providing a first rigid plate group, a first connecting layer, a rigid-flexible combined plate group, a second connecting layer and a second rigid plate group, wherein the first rigid plate group is formed by stacking a plurality of first rigid core plates and a plurality of first semi-solidified sheets at intervals according to a preset plate stacking sequence, the rigid-flexible combined plate group is formed by stacking a plurality of rigid-flexible combined core plates and a plurality of second semi-solidified sheets at intervals according to a preset plate stacking sequence, the rigid-flexible combined core plates are provided with flexible regions, and the second rigid plate group is formed by stacking a plurality of second rigid core plates and a plurality of first semi-solidified sheets at intervals according to a preset plate stacking sequence;
s2, laminating the first rigid plate group, the first connecting layer, the rigid-flexible combined plate group, the second connecting layer and the second rigid plate group after sequentially stacking from top to bottom to obtain a multilayer plate;
s3, performing windowing treatment on the multilayer board to obtain a first windowing part and a second windowing part, wherein the first windowing part penetrates through the first rigid board group and the first connecting layer to expose a flexible area of the rigid-flex core board positioned at the uppermost layer in the rigid-flex core board, and the second windowing part penetrates through the second rigid board group and the second connecting layer to expose a flexible area of the rigid-flex core board positioned at the lowermost layer in the rigid-flex core board;
and S4, carrying out glue dispensing treatment on the junction between the lower edge of the first windowing portion and the flexible region of the rigid-flexible core board positioned at the uppermost layer in the rigid-flexible core board, and carrying out glue dispensing treatment on the junction between the upper edge of the second windowing portion and the flexible region of the rigid-flexible core board positioned at the lowermost layer in the rigid-flexible core board.
Preferably, in step S4, the dispensing process is performed on a junction between the lower edge of the first window portion and a flexible region of the rigid-flexible core board located at the uppermost layer in the rigid-flexible core board, and specifically includes:
extending a dispensing head of a dispensing machine into the first windowing part;
continuously dispensing glue at the joint of the lower edge of the first windowing part and a flexible area of the rigid-flex core plate positioned at the topmost layer in the rigid-flex core plate along the lower edge of the first windowing part in a preset direction, so as to form adhesive at the joint of the lower edge of the first windowing part and the flexible area of the rigid-flex core plate positioned at the topmost layer in the rigid-flex core plate;
and the viscose is solidified after standing for a preset time so as to reinforce the junction between the lower edge of the first windowing part and the flexible area of the rigid-flex core plate positioned at the uppermost layer in the rigid-flex core plate.
Preferably, in step S4, the dispensing process is performed on a joint between the upper edge of the second windowing portion and a flexible region of the rigid-flex core board located at the lowermost layer in the rigid-flex core board, and specifically includes:
extending a dispensing head of a dispensing machine into the second windowing part;
continuously dispensing the adhesive at the joint of the upper edge of the second windowing part and the flexible area of the rigid-flexible core board positioned at the lowest layer in the rigid-flexible core board along the upper edge of the second windowing part in a preset direction so as to form adhesive at the joint of the upper edge of the second windowing part and the flexible area of the rigid-flexible core board positioned at the lowest layer in the rigid-flexible core board;
and the viscose is solidified after standing for a preset time so as to reinforce the junction between the upper edge of the second windowing part and the flexible area of the rigid-flex core plate positioned at the lowest layer.
Preferably, the rigid-flex core board is prepared by the following steps:
providing a third rigid core plate and a flexible core plate;
windowing a designated position of the third rigid core plate to obtain a third window opening part, wherein the designated position corresponds to the flexible region, the size of the third window opening part is larger than that of the flexible core plate, and the shape of the third window opening part is the same as that of the flexible core plate;
embedding the flexible core panel within the third fenestration;
and covering the flexible area with an adhesive tape and a protective film in sequence, and then performing pressing treatment to form the rigid-flex core board.
Preferably, the projection of the flexible core plate along the vertical direction falls into the projection of the third opening part along the vertical direction, and the adhesive tape is pressed to fill the gap between the third opening part and the flexible core plate.
Preferably, the first connection layer includes a third prepreg and a fourth prepreg that are stacked in sequence from top to bottom, the third prepreg corresponds to the flexible region and has a fourth windowing portion, the fourth prepreg corresponds to the flexible region and has a fifth windowing portion, a projection of the fifth windowing portion in the vertical direction falls into a projection of the fourth windowing portion in the vertical direction, and a projection of the third windowing portion in the vertical direction falls into a projection of the fifth windowing portion in the vertical direction.
Preferably, the second connection layer includes a fifth prepreg and a sixth prepreg that are stacked in sequence from top to bottom, the fifth prepreg corresponds to the flexible region and has a sixth windowing portion, the sixth prepreg corresponds to the flexible region and has a seventh windowing portion, a projection of the sixth windowing portion along the vertical direction falls into a projection of the seventh windowing portion along the vertical direction, and a projection of the third windowing portion along the vertical direction falls into a projection of the sixth windowing portion along the vertical direction.
Preferably, the centers of the flexure zones of all of the rigid-flex core panels are vertically collinear.
Preferably, the first prepreg is a glass fiber, and the second prepreg, the third prepreg, the fourth prepreg, the fifth prepreg and the sixth prepreg are glass fibers impregnated with epoxy resin.
Preferably, the step S2 further includes, before:
respectively carrying out circuit pattern manufacturing on the first rigid core board, the third rigid core board, the flexible core board and the second rigid core board;
after the step S2, the method further includes:
and sequentially drilling and metallizing the multilayer board.
Compared with the prior art, the method comprises the steps of sequentially stacking a first rigid plate group, a first connecting layer, a rigid-flex combined plate group, a second connecting layer and a second rigid plate group from top to bottom, then performing laminating treatment to obtain a multilayer plate, then performing windowing treatment on the multilayer plate to obtain a first windowing part and a second windowing part, wherein the first windowing part penetrates through the first rigid plate group and the first connecting layer to expose a flexible area of the rigid-flex combined core plate positioned at the uppermost layer in the rigid-flex combined core plate, the second windowing part penetrates through the second rigid plate group and the second connecting layer to expose a flexible area of the rigid-flex combined core plate positioned at the lowermost layer in the rigid-flex combined core plate, then performing adhesive treatment on the joint of the lower edge of the first windowing part and the flexible area of the rigid-flex combined core plate positioned at the uppermost layer, performing adhesive treatment on the joint of the upper edge of the second windowing part and the flexible area of the rigid-flex combined core plate positioned at the lowermost layer in the rigid-flex combined core plate, and performing adhesive treatment on the flexible area of the upper edge of the second windowing part and the flexible combined core plate, thereby reducing the high-grade effective rigid-flex connection area of the PCB due to high-flex effective adhesive-flex connection area, and improving the high-flex connection-flex effective high-flex connection-flex PCB tearing resistance caused by the high-flex effective adhesive-flex joint area, thereby reducing the high-flex effective high-flex joint-flex PCB.
Drawings
FIG. 1 is a flow chart diagram of a high-order rigid-flex PCB manufacturing method of the present invention;
FIG. 2 is a schematic structural view of a multilayer sheet of the present invention;
FIG. 3 is a schematic structural diagram of a high-order rigid-flex PCB of the present invention;
FIG. 4 is a schematic structural view of a rigid-flex printed circuit board of the present invention;
FIG. 5 is an exploded view of the rigid-flex printed circuit board of the present invention;
FIG. 6 is a schematic view of the rigid-flex bonded panel of the present invention in stacked relation with a first tie layer;
fig. 7 is a schematic view showing a stacking relationship of the rigid-flex bonded panel of the present invention and the second connection layer.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 7, the method for manufacturing a high-order rigid-flexible PCB according to the present embodiment is suitable for manufacturing a high-order rigid-flexible PCB with eighteen layers, where the actual board order of the high-order rigid-flexible PCB may be flexibly set according to actual requirements, and the actual board order of the high-order rigid-flexible PCB is not limited herein. The manufacturing method of the high-order rigid-flex PCB comprises the following steps:
the method comprises the following steps of S1, providing a first rigid plate group, a first connecting layer 30, a rigid-flexible combined plate group, a second connecting layer 50 and a second rigid plate group, wherein the first rigid plate group is formed by stacking a plurality of first rigid core plates 10 and a plurality of first semi-cured sheets 20 at intervals according to a preset stacking sequence, the rigid-flexible combined plate group is formed by stacking a plurality of rigid-flexible combined core plates 41 and a plurality of second semi-cured sheets 42 at intervals according to the preset stacking sequence, the rigid-flexible combined core plates 41 are provided with flexible areas, and the second rigid plate group is formed by stacking a plurality of second rigid core plates 60 and a plurality of first semi-cured sheets 20 at intervals according to the preset stacking sequence;
s2, sequentially stacking the first rigid plate group, the first connecting layer 30, the rigid-flex combined plate group, the second connecting layer 50 and the second rigid plate group from top to bottom, and then performing pressing treatment to obtain a multilayer plate;
s3, performing windowing treatment on the multilayer board to obtain a first windowing part 1 and a second windowing part 2, wherein the first windowing part 1 penetrates through the first rigid plate group and the first connecting layer 30 to expose a flexible area of the rigid-flex core board 41 positioned at the uppermost layer in the rigid-flex core board 41, and the second windowing part 2 penetrates through the second rigid plate group and the second connecting layer 50 to expose a flexible area of the rigid-flex core board 41 positioned at the lowermost layer in the rigid-flex core board 41;
and S4, carrying out glue dispensing treatment on the junction between the lower edge of the first windowing part 1 and the flexible region of the rigid-flexible core board 41 positioned at the uppermost layer in the rigid-flexible core board 41, and carrying out glue dispensing treatment on the junction between the upper edge of the second windowing part 2 and the flexible region of the rigid-flexible core board 41 positioned at the lowermost layer in the rigid-flexible core board 41.
Preferably, in the step S4, the dispensing process is performed on a junction between the lower edge of the first window opening portion 1 and the flexible region of the rigid-flexible core board 41 located at the uppermost layer of the rigid-flexible core board 41, and specifically includes:
and a dispensing head of a dispensing machine extends into the first windowing part 1.
Follow with the direction of predetermineeing the lower limb of first portion of windowing, it is right the lower limb of first portion of windowing with the place of bordering on in the flexible region of the just-flexible combined core board 41 of the superiority in the just-flexible combined core board 41 carries out continuous some glue, with the lower limb of first portion of windowing with the place of bordering on in the flexible region of the just-flexible combined core board 41 of the superiority in the just-flexible combined core board 41 forms viscose 3 promptly the lower limb of first portion of windowing with the place of bordering on in the flexible region of the just-flexible combined core board 41 of the superiority in the just-flexible combined core board 41 forms viscose 3 that can completely cover the lower limb of first portion of windowing with the place of bordering on in the flexible region of the just-flexible combined core board 41.
The viscose 3 is solidified after standing for a preset time, so that the junction between the lower edge of the first windowing part 1 and the flexible area of the rigid-flexible core plate 41 at the uppermost layer is reinforced. It is understood that for the viscose 3 which does not need time to set, it is considered to have set at the moment of dispensing, and therefore the step of standing can be omitted.
Preferably, in the step S4, the dispensing process is performed on a junction between the upper edge of the second window portion 2 and the flexible region of the rigid-flexible core board 41 located at the lowermost layer of the rigid-flexible core board 41, and specifically includes:
a dispensing head of a dispensing machine extends into the second windowing part 2;
continuously dispensing along the upper edge of the second windowing portion 2 in a preset direction at the joint between the upper edge of the second windowing portion 2 and the flexible region of the rigid-flexible core board 41 located at the lowermost layer, so as to form an adhesive 3 at the joint between the upper edge of the second windowing portion 2 and the flexible region of the rigid-flexible core board 41 located at the lowermost layer, namely, at the joint between the upper edge of the second windowing portion 2 and the flexible region of the rigid-flexible core board 41 located at the lowermost layer, the adhesive 3 capable of completely covering the joint between the upper edge of the second windowing portion 2 and the flexible region of the rigid-flexible core board 41 located at the lowermost layer;
the viscose 3 is solidified after standing for a preset time, so as to reinforce the junction between the upper edge of the second windowing part 2 and the flexible area of the rigid-flexible core plate 41 located at the lowest layer in the rigid-flexible core plate 41. It is understood that for the viscose 3 which does not need time to set, it is considered to have set at the moment of dispensing, and therefore the step of standing can be omitted.
Preferably, the rigid-flex core 41 is made by:
a third rigid core plate 411 and a flexible core plate 412 are provided.
A window opening process is performed on a designated position of the third rigid core plate 411, the designated position corresponding to the flexible region, the size of the third window opening portion 4 is larger than that of the flexible core plate 412, and the shape of the third window opening portion 4 is the same as that of the flexible core plate 412, to obtain a third window opening portion 4. It is understood that, the size of the third window opening 4 is larger than the size of the flexible core 412, and the shape of the third window opening 4 is the same as the shape of the flexible core 412, so that the flexible core 412 can be embedded in the third window opening 4 with a certain gap from the inner wall of the third window opening 4.
The flexible core 412 is embedded within the third fenestration 4.
The flexible region is sequentially covered with an adhesive tape and a protective film 413 and then subjected to a press-fitting process to form the rigid-flex core board 41.
Preferably, the projection of the flexible core plate 412 along the vertical direction falls into the projection of the third window opening 4 along the vertical direction, and the adhesive tape is pressed to fill the gap between the third window opening 4 and the flexible core plate 412, so that the flexible core plate 412 and the third rigid core plate 411 are integrally fixed by the adhesive tape flowing into the gap between the third window opening 4 and the flexible core plate 412.
Preferably, the first connection layer 30 includes a third prepreg 31 and a fourth prepreg 32 that are sequentially stacked from top to bottom, the third prepreg 31 corresponds to the flexible region and is provided with a fourth windowing portion 5, the fourth prepreg 32 corresponds to the flexible region and is provided with a fifth windowing portion 6, a projection of the fifth windowing portion 6 in the vertical direction falls into a projection of the fourth windowing portion 5 in the vertical direction, and a projection of the third windowing portion 4 in the vertical direction falls into a projection of the fifth windowing portion 6 in the vertical direction.
Preferably, the window size of the fourth window portion 5 is 0.2mm larger than the standard window size, so as to prevent the third prepreg 31 and the fourth prepreg 32 from overflowing to the flexible board area during the laminating process, and ensure the flexibility of the rigid-flex joint flexible board.
The window size of the fifth window opening part 6 is 1.2mm larger than that of the first window opening part 1 in advance, so that the height of the protective film 413 after pressing is ensured, and the flatness of the plate surface, particularly the pad, is ensured.
It can be understood that, in the arrangement mode of the first connection layer 30, the double-layer prepreg is used to replace the traditional single-layer prepreg, and the double-layer prepreg is subjected to unequal windowing to decompose the disposable height difference into two times of lower height differences for pressing, so that the problems of glue overflow, protrusion and depression caused by the equal windowing of the traditional single-layer prepreg during pressing are effectively avoided.
Preferably, the second connection layer 50 includes a fifth prepreg 51 and a sixth prepreg 52 that are sequentially stacked from top to bottom, the fifth prepreg 51 is provided with a sixth windowing portion 7 corresponding to the flexible region, the sixth prepreg 52 is provided with a seventh windowing portion 8 corresponding to the flexible region, a projection of the sixth windowing portion 7 along the vertical direction falls into a projection of the seventh windowing portion 8 along the vertical direction, and a projection of the third windowing portion 4 along the vertical direction falls into a projection of the sixth windowing portion 7 along the vertical direction.
Preferably, the window size of the seventh window 8 is 0.2mm larger than the standard window size, so as to prevent the fifth prepreg 51 and the sixth prepreg 52 from overflowing to the flexible board region during the pressing process, and ensure the flexibility of the rigid-flex joint flexible board.
The window opening size of the sixth window opening part 7 is 1.2mm larger than that of the first window opening part 1 in advance, so that the height of the protective film 413 after pressing is guaranteed, and the flatness of the plate surface, particularly the pad, is guaranteed.
It can be understood that, in the arrangement manner of the second connection layer 50, the conventional single-layer prepreg is replaced by the double-layer prepreg, and the double-layer prepreg is subjected to unequal windowing, so that the disposable height difference is decomposed into two times of lower height differences for pressing, and the problems of glue overflow, protrusion and depression caused by the equal windowing of the conventional single-layer prepreg during pressing are effectively avoided.
Preferably, centers of the flexible regions of all the rigid-flex core boards 41 are located on the same straight line in the vertical direction, and preferably, the flexible regions of all the rigid-flex core boards 41 are uniform in size, the first windowing part 1 and the second windowing part 2 are uniform in size, and the centers of the flexible regions of the first windowing part 1, the second windowing part 2 and all the rigid-flex core boards 41 are located on the same straight line in the vertical direction, so that the use state of the high-order rigid-flex PCB is adjusted by bending.
Preferably, the first semi-cured sheet 20 is glass fiber, which is suitable for use as an interlayer bonding material for hard sheets.
The second prepreg 42, the third prepreg 31, the fourth prepreg 32, the fifth prepreg 51 and the sixth prepreg 52 are glass fibers impregnated with epoxy resin, and the glass fibers impregnated with epoxy resin are suitable for being used as interlayer bonding materials of the rigid-flex rigid board and interlayer bonding of the multilayer rigid-flex core board 41.
Preferably, the step S2 further includes, before:
the first rigid core board 10, the third rigid core board 411, the flexible core board 412 and the second rigid core board 60 are respectively subjected to circuit pattern fabrication. It can be understood that the circuit pattern is made on all the core plates in advance, and the pressing, slotting and hole opening precision is only needed to be concerned in the subsequent processes, so that the quality monitoring items of the later processes are reduced.
After the step S2, the method further includes:
and sequentially drilling and metallizing the multilayer board.
Thus, a finished high-order rigid-flex PCB is obtained.
With reference to fig. 1 to 7, in the present invention, a first rigid board group, a first connecting layer 30, a rigid-flex printed board group, a second connecting layer 50, and a second rigid board group are sequentially stacked from top to bottom and then subjected to a press-fitting process to obtain a multilayer board, and then the multilayer board is subjected to a window-opening process to obtain a first window-opening portion 1 and a second window-opening portion 2, wherein the first window-opening portion 1 penetrates through the first rigid board group and the first connecting layer 30 to expose a flexible region of the rigid-flex printed board 41 located at the uppermost layer in the rigid-flex printed board 41, the second window-opening portion 2 penetrates through the second rigid board group and the second connecting layer 50 to expose a flexible region of the rigid-flex printed board 41 located at the lowermost layer in the rigid-flex printed board 41, and then a point-contact region of a flexible region of the rigid-flex printed board 41 located at the uppermost layer in the rigid-flex printed board 41 is subjected to a point-gluing process, and a high-level effective rigid-flex printed board tearing area of the rigid-flex printed board is formed by a high-flex printed board bonding-flex printed board tearing process, thereby reducing a high-level effective high-level-flex printed board tearing and improving the high-flex printed board-level effective rigid-flex printed board tearing and the high-flex printed board bonding area.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. A manufacturing method of a high-order rigid-flex PCB is characterized by comprising the following steps:
providing a first rigid plate group, a first connecting layer, a rigid-flexible combined plate group, a second connecting layer and a second rigid plate group, wherein the first rigid plate group is formed by stacking a plurality of first rigid core plates and a plurality of first semi-cured sheets at intervals according to a preset stacking sequence, the rigid-flexible combined plate group is formed by stacking a plurality of rigid-flexible combined core plates and a plurality of second semi-cured sheets at intervals according to the preset stacking sequence, the rigid-flexible combined core plates are provided with flexible regions, and the second rigid plate group is formed by stacking a plurality of second rigid core plates and a plurality of first semi-cured sheets at intervals according to the preset stacking sequence;
sequentially stacking the first rigid plate group, the first connecting layer, the rigid-flex plate group, the second connecting layer and the second rigid plate group from top to bottom and then performing pressing treatment to obtain a multilayer plate;
performing windowing treatment on the multilayer board to obtain a first windowing part and a second windowing part, wherein the first windowing part penetrates through the first rigid board group and the first connecting layer to expose a flexible area of the rigid-flex core board positioned at the uppermost layer in the rigid-flex core board, and the second windowing part penetrates through the second rigid board group and the second connecting layer to expose a flexible area of the rigid-flex core board positioned at the lowermost layer in the rigid-flex core board;
and carrying out dispensing treatment on the joint of the lower edge of the first windowing part and the flexible region of the rigid-flex core plate positioned at the uppermost layer in the rigid-flex core plate, and carrying out dispensing treatment on the joint of the upper edge of the second windowing part and the flexible region of the rigid-flex core plate positioned at the lowermost layer in the rigid-flex core plate.
2. The method for manufacturing a high-order rigid-flex PCB according to claim 1, wherein the dispensing treatment is performed on a joint between a lower edge of the first windowing portion and a flexible region of a rigid-flex core board located at the uppermost layer in the rigid-flex core board, and specifically comprises:
extending a dispensing head of a dispensing machine into the first windowing part;
continuously dispensing glue at the joint of the lower edge of the first windowing part and a flexible area of the rigid-flex core plate positioned at the topmost layer in the rigid-flex core plate along the lower edge of the first windowing part in a preset direction, so as to form adhesive at the joint of the lower edge of the first windowing part and the flexible area of the rigid-flex core plate positioned at the topmost layer in the rigid-flex core plate;
and the viscose is solidified after standing for a preset time so as to reinforce the junction between the lower edge of the first windowing part and the flexible area of the rigid-flex core plate positioned at the uppermost layer in the rigid-flex core plate.
3. The method for manufacturing a high-order rigid-flex PCB according to claim 1, wherein the dispensing treatment is performed on the border between the upper edge of the second windowing portion and the flexible region of the rigid-flex core board located at the lowermost rigid-flex core board, and specifically comprises:
extending a dispensing head of a dispensing machine into the second windowing part;
continuously dispensing the adhesive at the joint of the upper edge of the second windowing part and the flexible area of the rigid-flexible core board positioned at the lowest layer in the rigid-flexible core board along the upper edge of the second windowing part in a preset direction so as to form adhesive at the joint of the upper edge of the second windowing part and the flexible area of the rigid-flexible core board positioned at the lowest layer in the rigid-flexible core board;
and the viscose is solidified after standing for a preset time so as to reinforce the junction between the upper edge of the second windowing part and the flexible area of the rigid-flex core plate positioned at the lowest layer.
4. The method for manufacturing a high-order flex-rigid PCB according to claim 1, wherein the flex-rigid core board is manufactured by the following steps:
providing a third rigid core plate and a flexible core plate;
windowing a designated position of the third rigid core plate to obtain a third windowed portion, wherein the designated position corresponds to the flexible area, the size of the third windowed portion is larger than that of the flexible core plate, and the shape of the third windowed portion is the same as that of the flexible core plate;
embedding the flexible core panel into the third window opening part is arranged in the base;
and sequentially covering the flexible area with an adhesive tape and a protective film, and then performing pressing treatment to form the rigid-flex core plate.
5. The method for manufacturing a high-order rigid-flex PCB according to claim 4, wherein the projection of the flexible core board along the vertical direction falls into the projection of the third opening part along the vertical direction, and the adhesive tape is pressed to fill a gap between the third opening part and the flexible core board.
6. The method for manufacturing a high-order flex-rigid PCB according to claim 5, wherein the first connection layer comprises a third prepreg and a fourth prepreg which are sequentially stacked from top to bottom, the third prepreg is provided with a fourth windowing portion corresponding to the flexible region, the fourth prepreg is provided with a fifth windowing portion corresponding to the flexible region, a vertical projection of the fifth windowing portion falls into a vertical projection of the fourth windowing portion, and a vertical projection of the third windowing portion falls into a vertical projection of the fifth windowing portion.
7. The method for manufacturing a high-order rigid-flex PCB according to claim 5, wherein the second connection layer comprises a fifth prepreg and a sixth prepreg which are sequentially stacked from top to bottom, the fifth prepreg is provided with a sixth windowing portion corresponding to the flexible region, the sixth prepreg is provided with a seventh windowing portion corresponding to the flexible region, a vertical projection of the sixth windowing portion falls within a vertical projection of the seventh windowing portion, and the vertical projection of the third windowing portion falls within the vertical projection of the sixth windowing portion.
8. The method for manufacturing a high-order flex-rigid PCB according to claim 1, wherein the centers of the flexible areas of all the flex-rigid core boards are positioned on the same straight line along the vertical direction.
9. The method for manufacturing a high-order flex-rigid PCB according to claim 1, wherein the first prepreg, the third prepreg and the sixth prepreg are glass fiber materials, and the second prepreg, the fourth prepreg and the fifth prepreg are PI materials.
10. The method for manufacturing a high-order rigid-flex PCB according to claim 4, wherein the first rigid plate group, the rigid-flex PCB group and the second rigid plate group are sequentially stacked from top to bottom and then subjected to a pressing process to obtain a multilayer board, and the method further comprises the following steps:
respectively carrying out circuit pattern manufacturing on the first rigid core board, the third rigid core board, the flexible core board and the second rigid core board;
the first rigid plate group, the rigid-flexible combined plate group and the second rigid plate group are sequentially stacked from top to bottom and then subjected to pressing treatment to obtain a multilayer plate, and the method further comprises the following steps:
and sequentially drilling and metallizing the multilayer board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211688271.1A CN115835541A (en) | 2022-12-27 | 2022-12-27 | High-order rigid-flex PCB manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202211688271.1A CN115835541A (en) | 2022-12-27 | 2022-12-27 | High-order rigid-flex PCB manufacturing method |
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