CN116133246A - Gao Jiegang flexible Printed Circuit Board (PCB) - Google Patents

Gao Jiegang flexible Printed Circuit Board (PCB) Download PDF

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Publication number
CN116133246A
CN116133246A CN202211689434.8A CN202211689434A CN116133246A CN 116133246 A CN116133246 A CN 116133246A CN 202211689434 A CN202211689434 A CN 202211689434A CN 116133246 A CN116133246 A CN 116133246A
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CN
China
Prior art keywords
rigid
board
flexible
flex
prepreg
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Pending
Application number
CN202211689434.8A
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Chinese (zh)
Inventor
孟昭光
赵南清
曾国权
蔡志浩
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Dongguan Wuzhu Technology Co ltd
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Dongguan Wuzhu Technology Co ltd
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Priority to CN202211689434.8A priority Critical patent/CN116133246A/en
Publication of CN116133246A publication Critical patent/CN116133246A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

The invention discloses a high-order rigid-flex Printed Circuit Board (PCB), which comprises a first rigid board group, a first connecting layer, a rigid-flex printed circuit board group, a second connecting layer and a second rigid board group which are sequentially overlapped from top to bottom to form a multi-layer board, wherein a first windowing part is arranged on the upper end surface of the multi-layer board, a second windowing part is arranged on the lower end surface of the multi-layer board, the first windowing part exposes a flexible region of the rigid-flex printed circuit board located at the uppermost layer in the rigid-flex printed circuit board, the second windowing part exposes a flexible region of the rigid-flex printed circuit board located at the lowermost layer in the rigid-flex printed circuit board, an adhesive is arranged at the junction of the lower edge of the first windowing part and the flexible region of the uppermost layer in the rigid-flex printed circuit board, and an adhesive is arranged at the junction of the upper edge of the second windowing part and the flexible region of the lowermost layer in the rigid-flex printed circuit board; the joint of the flexible region and the rigid plate is reinforced by dispensing, so that the structural stability of the joint of the flexible region and the rigid plate is effectively improved.

Description

Gao Jiegang flexible Printed Circuit Board (PCB)
Technical Field
The invention relates to the technical field of PCB manufacture, in particular to a high-order rigid-flex PCB.
Background
From the development trend of the current electronic products, space saving, 3D assembly and product reliability become development trends of novel electronic products. Expansion of the electronic market has prompted continuous updating of global PCB scale and technology, with which PCB manufacturers have explored various new technologies that are amenable to development. Flexible PCB designs have emerged due to environmental and usage constraints; to further ensure solderability and 3D assemblability of the product, rigid-flex PCB has been developed.
Flex-bonded PCBs are a class of PCBs that have grown very rapidly in recent years. The average annual growth rate from 2005 to 2010 is calculated to be over 20% by yield and over 37% by area, which is significantly over the growth rate of a conventional PCB. From domestic and foreign market analysis, the circuit board enterprises of independent brands in China need to develop key manufacturing technologies of rigid-flexible PCB in order to promote the transformation and development of the circuit board industry in China.
At present, many scientific research institutions worldwide are researching higher-end technologies of rigid-flex PCB manufacturing technologies, particularly rigid-flex PCB with a flexible board located on a surface layer and a high-order, and the two types of PCBs not only have the advantages of common rigid-flex PCB, but also have specific transmission performance and low interference characteristics of information. Based on various advantages, gao Jiegang flex PCBs and high-rise surface flex PCBs have been widely used in various fields of medical instruments, automotive electronics, aerospace, military products and the like.
However, the Gao Jiegang flexible PCB and the high-layer surface rigid PCB manufactured by the prior art have a certain height difference between the flexible board and the hard board, and when the flexible board and the hard board are excessively bent by external force, the flexible board and the hard board are easily separated, namely the flexible board is externally torn, so that the quality and the structural stability of the Gao Jiegang flexible PCB and the high-layer surface rigid PCB are seriously affected.
Disclosure of Invention
The invention aims to provide a high-order flex-rigid PCB, the connection part of a flexible area and a rigid board is reinforced by viscose, so that the structural stability of the connection part of the flexible area and the rigid board is effectively improved, the separation phenomenon of the flexible area and the rigid board, which occurs when the flexible area and the rigid board are excessively bent due to external force, is effectively relieved, the quality damage of the Gao Jiegang flex-rigid PCB, which is caused by tearing of the flexible area, is effectively reduced, and the Gao Jiegang flex-rigid PCB is suitable for being manufactured into a Gao Jiegang flex-rigid PCB with a height of eighteen layers.
In order to achieve the above objective, the invention discloses a high-order rigid-flex PCB, which comprises a first rigid board set, a first connecting layer, a rigid-flex board set, a second connecting layer and a second rigid board set, wherein the rigid-flex board set is formed by overlapping a plurality of rigid-flex core boards and a plurality of second prepregs at intervals according to a preset lamination sequence, the first rigid board set, the first connecting layer, the rigid-flex board set, the second connecting layer and the second rigid board set are overlapped from top to bottom in sequence to form a multi-layer board, the upper end surface of the multi-layer board is provided with a first windowing part, the lower end surface is provided with a second windowing part, the first windowing part penetrates through the first rigid board set and the first connecting layer to expose a flexible region of the uppermost rigid-flex core board in the rigid-flex core board, the second windowing part penetrates through the second rigid board set and the second connecting layer to expose a flexible region of the lowermost rigid-flex core board in the rigid-flex core board, and the border of the first flexible-flex core board is provided with a flexible region of the adhesive region of the upper border of the rigid-flex core board in the rigid-flex board, and the border joint between the first windowing part and the upper border of the rigid-flex core board.
Preferably, the first rigid board group is formed by stacking a plurality of first rigid core boards and a plurality of first prepregs at intervals according to a preset lamination sequence, and the second rigid board group is formed by stacking a plurality of second rigid core boards and a plurality of first prepregs at intervals according to the preset lamination sequence.
Preferably, the rigid-flex core board comprises a third rigid core board and a flexible core board, a third windowing part is arranged at a designated position of the third rigid core board, the designated position corresponds to the flexible region, the size of the third windowing part is larger than that of the flexible core board, the shape of the third windowing part is the same as that of the flexible core board, and the flexible core board is embedded in the third windowing part.
Preferably, the projection of the flexible core plate along the vertical direction falls into the projection of the third windowing part along the vertical direction, and the gap between the third windowing part and the flexible core plate is filled with adhesive tape.
Preferably, the first connecting layer includes a third prepreg and a fourth prepreg stacked in sequence from top to bottom, the third prepreg corresponds to the flexible area and is provided with a fourth window portion, the fourth prepreg corresponds to the flexible area and is provided with a fifth window portion, the projection of the fifth window portion along the vertical direction falls into the projection of the fourth window portion along the vertical direction, and the projection of the third window portion along the vertical direction falls into the projection of the fifth window portion along the vertical direction.
Preferably, the second connecting layer includes a fifth prepreg and a sixth prepreg stacked in sequence from top to bottom, the fifth prepreg corresponds to the flexible area and is provided with a sixth windowing portion, the sixth prepreg corresponds to the flexible area and is provided with a seventh windowing portion, the projection of the sixth windowing portion along the vertical direction falls into the projection of the seventh windowing portion along the vertical direction, and the projection of the third windowing portion along the vertical direction falls into the projection of the sixth windowing portion along the vertical direction.
Preferably, the surface of the flexible region is covered with a protective film.
Preferably, the centers of the flexible regions of all the rigid-flex core plates are located on the same straight line in the vertical direction.
Preferably, the first prepreg, the third prepreg and the sixth prepreg are glass fiber materials, and the second prepreg, the fourth prepreg and the fifth prepreg are P I materials.
Preferably, the first rigid core board, the third rigid core board, the flexible core board and the second rigid core board are respectively provided with circuit patterns, and the multilayer board is provided with metal holes.
Compared with the prior art, the joint of the flexible region and the rigid plate is reinforced by the adhesive, so that the structural stability of the joint of the flexible region and the rigid plate is effectively improved, the separation phenomenon of the flexible region and the rigid plate, which occurs when the flexible region and the rigid plate are excessively bent due to external force, of the Gao Jiegang flexible PCB is effectively relieved, the quality damage of the Gao Jiegang flexible PCB, which is caused by tearing of the flexible region, is effectively reduced, and the Gao Jiegang flexible PCB is suitable for being manufactured into the Gao Jiegang flexible PCB with the height of eighteen layers.
Drawings
Fig. 1 is a schematic diagram of a Gao Jiegang flex PCB of the present invention;
FIG. 2 is a schematic structural view of the multi-layer board of the present invention;
FIG. 3 is a schematic structural view of the rigid-flex printed circuit board according to the present invention;
FIG. 4 is an exploded view of the rigid-flex board of the present invention;
FIG. 5 is a schematic diagram illustrating a stacking relationship between a rigid-flex printed circuit board and a first connecting layer according to the present invention;
FIG. 6 is a schematic diagram illustrating a stacking relationship between a rigid-flex printed circuit board and a second connecting layer according to the present invention;
FIG. 7 is a block flow diagram of a method for fabricating a Gao Jiegang flex PCB in accordance with the present invention 。
Detailed Description
In order to describe the technical content, the constructional features, the achieved objects and effects of the present invention in detail, the following description is made in connection with the embodiments and the accompanying drawings.
Referring to fig. 1-6, the Gao Jiegang flex-bonded PCB of the present embodiment is suitable for manufacturing Gao Jiegang flex-bonded PCBs with a height of eighteen layers, and of course, the actual board orders of the Gao Jiegang flex-bonded PCBs can be flexibly set according to actual requirements, and the actual board orders of the Gao Jiegang flex-bonded PCBs are not limited herein.
The Gao Jiegang flex-bonded PCB comprises a first rigid board group, a first connecting layer 30, a flex-bonded board group, a second connecting layer 50 and a second rigid board group, wherein the flex-bonded board group is formed by stacking a plurality of flex-bonded core boards 41 and a plurality of second prepregs 42 at intervals according to a preset stacking sequence, and the first rigid board group, the first connecting layer 30, the flex-bonded board group, the second connecting layer 50 and the second rigid board group are sequentially stacked from top to bottom to form a multilayer board shown in fig. 2.
The upper end face of the multi-layer board is provided with a first windowing part 1, the lower end face is provided with a second windowing part 2, and the first windowing part 1 penetrates through the first rigid board group and the first connecting layer 30 to expose the flexible region of the rigid-flex combined core board 41 positioned at the uppermost layer of the rigid-flex combined core board 41.
The second window 2 penetrates through the second rigid board set and the second connection layer 50 to expose the flexible region of the lowest layer of the rigid-flex combined core board 41 in the rigid-flex combined core board 41, an adhesive 3 is disposed at a junction between the lower edge of the first window 1 and the flexible region of the uppermost layer of the rigid-flex combined core board 41 in the rigid-flex combined core board 41, and an adhesive 3 is disposed at a junction between the upper edge of the second window 2 and the flexible region of the lowest layer of the rigid-flex combined core board 41 in the rigid-flex combined core board 41.
Preferably, the first rigid board group is formed by stacking a plurality of first rigid core boards 10 and a plurality of first prepregs 20 at intervals according to a preset lamination sequence, and the second rigid board group is formed by stacking a plurality of second rigid core boards and a plurality of first prepregs 20 at intervals according to a preset lamination sequence.
Preferably, the rigid-flex core board 41 includes a third rigid core board 411 and a flexible core board 412, a third opening portion 4 is provided at a designated position of the third rigid core board 411, the designated position corresponds to the flexible region, a size of the third opening portion 4 is larger than a size of the flexible core board 412, a shape of the third opening portion 4 is the same as a shape of the flexible core board 412, and the flexible core board 412 is embedded in the third opening portion 4.
Preferably, the projection of the flexible core 412 in the vertical direction falls within the projection of the third window 4 in the vertical direction, and the gap between the third window 4 and the flexible core 412 is filled with adhesive tape.
Preferably, the first connection layer 30 includes a third prepreg 31 and a fourth prepreg 32 stacked in sequence from top to bottom, the third prepreg 31 corresponds to the flexible area and is provided with a fourth window portion 5, the fourth prepreg 32 corresponds to the flexible area and is provided with a fifth window portion 6, a projection of the fifth window portion 6 along the vertical direction falls into a projection of the fourth window portion 5 along the vertical direction, and a projection of the third window portion 4 along the vertical direction falls into a projection of the fifth window portion 6 along the vertical direction.
Preferably, the second connection layer 50 includes a fifth prepreg 51 and a sixth prepreg 52 stacked in sequence from top to bottom, the fifth prepreg 51 corresponds to the flexible area and is provided with a sixth windowed portion 7, the sixth prepreg 52 corresponds to the flexible area and is provided with a seventh windowed portion 8, a projection of the sixth windowed portion 7 along the vertical direction falls into a projection of the seventh windowed portion 8 along the vertical direction, and a projection of the third windowed portion 4 along the vertical direction falls into a projection of the sixth windowed portion 7 along the vertical direction.
Preferably, the surface of the flexible region is covered with a protective film 413.
Preferably, the centers of the flexible regions of all the rigid-flex core plates 41 are on the same straight line in the vertical direction.
Preferably, the first prepreg 20, the third prepreg 31 and the sixth prepreg 52 are glass fiber materials, and the second prepreg 42, the fourth prepreg 32 and the fifth prepreg 51 are P I materials.
Preferably, the first rigid core board 10, the third rigid core board 411, the flexible core board 412 and the second rigid core board are respectively provided with a circuit pattern, and the multi-layer board is provided with metal holes.
Referring to fig. 1-7, the Gao Jiegang flex-on PCB of the present embodiment is manufactured by Gao Jiegang flex-on PCB, and the following specific implementation steps of the method for manufacturing a Gao Jiegang flex-on PCB are better explained with reference to the Gao Jiegang flex-on PCB of fig. 1 of the present embodiment.
The Gao Jiegang flexible PCB manufacturing method comprises the following steps:
s1, providing a first rigid board group, a first connecting layer 30, a rigid-flex combined board group, a second connecting layer 50 and a second rigid board group, wherein the first rigid board group is formed by overlapping a plurality of first rigid core boards 10 and a plurality of first prepregs 20 according to a preset lamination sequence at intervals, the rigid-flex combined board group is formed by overlapping a plurality of rigid-flex combined core boards 41 and a plurality of second prepregs 42 according to the preset lamination sequence at intervals, the rigid-flex combined core boards 41 are provided with flexible areas, and the second rigid board group is formed by overlapping a plurality of second rigid core boards 60 and a plurality of first prepregs 20 according to the preset lamination sequence at intervals;
s2, stacking the first rigid board group, the first connecting layer 30, the rigid-flex printed circuit board group, the second connecting layer 50 and the second rigid board group from top to bottom in sequence, and then performing lamination treatment to obtain a multi-layer board;
s3, windowing the multilayer board to obtain a first windowing part 1 and a second windowing part 2, wherein the first windowing part 1 penetrates through the first rigid board group and the first connecting layer 30 to expose the flexible region of the rigid-flex combined core board 41 positioned at the uppermost layer of the rigid-flex combined core board 41, and the second windowing part 2 penetrates through the second rigid board group and the second connecting layer 50 to expose the flexible region of the rigid-flex combined core board 41 positioned at the lowermost layer of the rigid-flex combined core board 41;
s4, dispensing the lower edge of the first window opening part 1 and the junction of the flexible region of the rigid-flex combined core board 41 positioned at the uppermost layer of the rigid-flex combined core board 41, and dispensing the upper edge of the second window opening part 2 and the junction of the flexible region of the rigid-flex combined core board 41 positioned at the lowermost layer of the rigid-flex combined core board 41.
Preferably, in the step S4, the adhesive dispensing process is performed on the junction between the lower edge of the first window portion 1 and the flexible region of the rigid-flex combined core board 41 located at the uppermost layer of the rigid-flex combined core board 41, specifically including:
and extending a dispensing head of the dispensing machine into the first windowing part 1.
Continuously dispensing the junction between the lower edge of the first window 1 and the flexible region of the uppermost rigid-flex combined core board 41 in the rigid-flex combined core board 41 along the lower edge of the first window 1 in a preset direction to form an adhesive 3 at the junction between the lower edge of the first window 1 and the flexible region of the uppermost rigid-flex combined core board 41 in the rigid-flex combined core board 41, namely, forming an adhesive 3 capable of completely covering the junction between the lower edge of the first window 1 and the flexible region of the uppermost rigid-flex combined core board 41 in the rigid-flex combined core board 41 at the junction between the lower edge of the first window 1 and the flexible region of the uppermost rigid-flex combined core board 41 in the rigid-flex combined core board 41.
The adhesive 3 is solidified after being kept stand for a preset time to strengthen the junction between the lower edge of the first window portion 1 and the flexible region of the rigid-flex combined core board 41 located at the uppermost layer of the rigid-flex combined core board 41. It will be appreciated that for the adhesive 3 which does not require time to set, it is considered that it has set at the instant of dispensing, so that the step of standing can be omitted.
Preferably, in the step S4, the adhesive dispensing process is performed on the junction between the upper edge of the second window 2 and the flexible region of the rigid-flex combined core board 41 located at the lowest layer of the rigid-flex combined core board 41, specifically including:
extending a dispensing head of a dispensing machine into the second windowing part 2;
continuously dispensing glue along the upper edge of the second opening window part 2 in a preset direction at the junction of the upper edge of the second opening window part 2 and the flexible region of the rigid-flex combined core board 41 positioned at the lowest layer of the rigid-flex combined core board 41 so as to form glue 3 at the junction of the upper edge of the second opening window part 2 and the flexible region of the rigid-flex combined core board 41 positioned at the lowest layer of the rigid-flex combined core board 41, namely forming glue 3 capable of completely covering the junction of the upper edge of the second opening window part 2 and the flexible region of the rigid-flex combined core board 41 positioned at the lowest layer of the rigid-flex combined core board 41 at the junction of the upper edge of the second opening window part 2 and the flexible region of the rigid-flex combined core board 41 positioned at the lowest layer of the rigid-flex combined core board 41;
the adhesive 3 is solidified after being kept stand for a preset time to strengthen the junction between the upper edge of the second window 2 and the flexible region of the lowest rigid-flex combined core board 41 of the rigid-flex combined core board 41. It will be appreciated that for the adhesive 3 which does not require time to set, it is considered that it has set at the instant of dispensing, so that the step of standing can be omitted.
Preferably, the rigid-flex core board 41 is manufactured by the following steps:
a third rigid core plate 411 and a flexible core plate 412 are provided.
A designated position of the third rigid core plate 411 is windowed to obtain a third windowed portion 4, the designated position corresponds to the flexible region, a size of the third windowed portion 4 is larger than a size of the flexible core plate 412, and a shape of the third windowed portion 4 is the same as a shape of the flexible core plate 412. It will be appreciated that the size of the third fenestration unit 4 is larger than the size of the flexible core 412, and the shape of the third fenestration unit 4 is the same as the shape of the flexible core 412, so that the flexible core 412 may be embedded in the third fenestration unit 4 and form a certain gap with the inner wall of the third fenestration unit 4.
The flexible core 412 is embedded in the third fenestration 4.
The flexible region is covered with an adhesive tape and a protective film 413 in this order, and then subjected to a lamination process to form the rigid-flex core board 41.
Preferably, the projection of the flexible core board 412 along the vertical direction falls within the projection of the third window opening 4 along the vertical direction, and the adhesive tape is pressed to fill the gap between the third window opening 4 and the flexible core board 412, so that the integrated fixation of the flexible core board 412 and the third rigid core board 411 is realized by the adhesive tape flowing into the gap between the third window opening 4 and the flexible core board 412.
Preferably, the first connection layer 30 includes a third prepreg 31 and a fourth prepreg 32 stacked in sequence from top to bottom, the third prepreg 31 corresponds to the flexible area and is provided with a fourth window portion 5, the fourth prepreg 32 corresponds to the flexible area and is provided with a fifth window portion 6, a projection of the fifth window portion 6 along the vertical direction falls into a projection of the fourth window portion 5 along the vertical direction, and a projection of the third window portion 4 along the vertical direction falls into a projection of the fifth window portion 6 along the vertical direction.
Preferably, the window size of the fourth window portion 5 is larger than the standard window size by 0.2mm, so that glue overflow of the third prepreg 31 and the fourth prepreg 32 to the flexible board area in the pressing process is prevented, and flexibility of the flexible board at the rigid-flex joint is ensured.
The window size of the fifth window opening part 6 is larger than the window size of the first window opening part 1 by 1.2mm in advance so as to ensure the height of the protective film 413 after lamination, thereby ensuring the flatness of the board surface, particularly the bonding pad.
It can be appreciated that the first connecting layer 30 is configured in a manner that the double-layer prepreg is used to replace the conventional single-layer prepreg, and the double-layer prepreg is subjected to unequal opening to resolve the disposable height difference into two lower height differences for lamination, so that the problems of glue overflow, protrusion and depression caused by lamination of the large opening such as the conventional single-layer prepreg are effectively avoided.
Preferably, the second connection layer 50 includes a fifth prepreg 51 and a sixth prepreg 52 stacked in sequence from top to bottom, the fifth prepreg 51 corresponds to the flexible area and is provided with a sixth windowed portion 7, the sixth prepreg 52 corresponds to the flexible area and is provided with a seventh windowed portion 8, a projection of the sixth windowed portion 7 along the vertical direction falls into a projection of the seventh windowed portion 8 along the vertical direction, and a projection of the third windowed portion 4 along the vertical direction falls into a projection of the sixth windowed portion 7 along the vertical direction.
Preferably, the window size of the seventh window portion 8 is larger than the standard window size by 0.2mm, so as to prevent the fifth prepreg 51 and the sixth prepreg 52 from overflowing glue to the flexible board area in the lamination process, and ensure the flexibility of the flexible board at the rigid-flexible joint position.
The window size of the sixth window portion 7 is larger than the window size of the first window portion 1 by 1.2mm in advance to ensure the height of the protective film 413 after lamination, thereby ensuring the flatness of the board surface, particularly the bonding pad.
It can be appreciated that the second connection layer 50 is configured in a manner that the double-layer prepreg is used to replace the conventional single-layer prepreg, and the double-layer prepreg is subjected to unequal opening to resolve the disposable height difference into two lower height differences for lamination, so that the problems of glue overflow, protrusion and depression caused by lamination of the large opening such as the conventional single-layer prepreg are effectively avoided.
Preferably, the centers of the flexible areas of all the rigid-flex core plates 41 are located on the same straight line along the vertical direction, preferably, the sizes of the flexible areas of all the rigid-flex core plates 41 are identical, the sizes of the first opening window part 1 and the second opening window part 2 are identical, and the centers of the flexible areas of the first opening window part 1, the second opening window part 2 and all the rigid-flex core plates 41 are located on the same straight line along the vertical direction, so that the using state of the flexible-flex core plates 41 is adjusted Gao Jiegang by bending.
Preferably, the first prepreg 20 is glass fiber, which is suitable as an interlayer adhesive material for a hard sheet.
The second prepreg 42, the third prepreg 31, the fourth prepreg 32, the fifth prepreg 51 and the sixth prepreg 52 are glass fibers injected with epoxy resin, and the glass fibers injected with epoxy resin are suitable for being used as interlayer bonding materials of a soft and hard board and interlayer bonding of the multi-layer rigid-flex core board 41.
Preferably, before the step S2, the method further includes:
the first rigid core board 10, the third rigid core board 411, the flexible core board 412 and the second rigid core board 60 are respectively subjected to circuit pattern fabrication. It can be understood that the circuit pattern is manufactured on all the core boards in advance, and only the pressing, slotting and perforating precision is needed to be concerned in the subsequent process, so that quality monitoring items of the subsequent process are reduced.
The step S2 further includes:
and drilling and hole metallization treatment are sequentially carried out on the multilayer board.
Thus, a finished product Gao Jiegang flex-bonded PCB was obtained.
With reference to fig. 1-7, the connection part between the flexible region and the rigid board of the Gao Jiegang flexible printed circuit board is reinforced by dispensing, so that the structural stability of the connection part between the flexible region and the rigid board is effectively improved, the separation phenomenon of the flexible region and the rigid board caused by excessive bending of the Gao Jiegang flexible printed circuit board under external force is effectively relieved, the quality damage of the Gao Jiegang flexible printed circuit board caused by tearing of the flexible region is effectively reduced, and the flexible printed circuit board is suitable for manufacturing the Gao Jiegang flexible printed circuit board into Gao Jiegang flexible printed circuit boards with a height of eighteen layers.
The foregoing description of the preferred embodiments of the present invention is not intended to limit the scope of the claims, which follow, as defined in the claims.

Claims (10)

1. The utility model provides a high order rigid-flex PCB which characterized in that: the flexible adhesive tape comprises a first rigid board set, a first connecting layer, a rigid-flex board set, a second connecting layer and a second rigid board set, wherein the rigid-flex board set is formed by overlapping a plurality of rigid-flex combined core boards and a plurality of second prepregs at intervals according to a preset lamination sequence, the first rigid board set, the first connecting layer, the rigid-flex combined core boards, the second connecting layer and the second rigid board set are overlapped from top to bottom in sequence to form a multilayer board, a first windowing part is formed in the upper end face of the multilayer board, a second windowing part is formed in the lower end face of the multilayer board, the first windowing part penetrates through the first rigid board set and the first connecting layer to expose a flexible area of the uppermost rigid-flex combined core board in the rigid-flex combined core board, the second windowing part penetrates through the second rigid board set and the second connecting layer to expose a flexible area of the lowermost rigid-flex combined core board in the rigid-flex combined core board, and a flexible joint part is formed in the border of the second rigid-flex combined core board in the flexible area of the rigid-flex combined core board, and a flexible joint part is formed in the border of the second rigid-flex combined core board.
2. The Gao Jiegang flex PCB of claim 1, wherein: the first rigid plate group is formed by overlapping a plurality of first rigid core plates and a plurality of first prepregs at intervals according to a preset lamination sequence, and the second rigid plate group is formed by overlapping a plurality of second rigid core plates and a plurality of first prepregs at intervals according to the preset lamination sequence.
3. The Gao Jiegang flex PCB of claim 1, wherein: the rigid-flex combined core board comprises a third rigid core board and a flexible core board, wherein a third windowing part is arranged at a designated position of the third rigid core board, the designated position corresponds to the flexible region, the size of the third windowing part is larger than that of the flexible core board, the shape of the third windowing part is the same as that of the flexible core board, and the flexible core board is embedded in the third windowing part.
4. A Gao Jiegang flex PCB as claimed in claim 3, wherein: the projection of the flexible core plate along the vertical direction falls into the projection of the third windowing part along the vertical direction, and the gap between the third windowing part and the flexible core plate is filled with adhesive tape.
5. A Gao Jiegang flex PCB as claimed in claim 3, wherein: the first connecting layer comprises a third prepreg and a fourth prepreg which are sequentially overlapped from top to bottom, the third prepreg corresponds to the flexible area and is provided with a fourth windowing part, the fourth prepreg corresponds to the flexible area and is provided with a fifth windowing part, the projection of the fifth windowing part along the vertical direction falls into the projection of the fourth windowing part along the vertical direction, and the projection of the third windowing part along the vertical direction falls into the projection of the fifth windowing part along the vertical direction.
6. A Gao Jiegang flex PCB as claimed in claim 3, wherein: the second connecting layer comprises a fifth prepreg and a sixth prepreg which are sequentially overlapped from top to bottom, the fifth prepreg corresponds to the flexible area and is provided with a sixth windowing part, the sixth prepreg corresponds to the flexible area and is provided with a seventh windowing part, the projection of the sixth windowing part along the vertical direction falls into the projection of the seventh windowing part along the vertical direction, and the projection of the third windowing part along the vertical direction falls into the projection of the sixth windowing part along the vertical direction.
7. A Gao Jiegang flex PCB as claimed in claim 3, wherein: the surface of the flexible region is covered with a protective film.
8. The Gao Jiegang flex PCB of claim 1, wherein: the centers of the flexible regions of all the rigid-flex core plates are located on the same straight line in the vertical direction.
9. The Gao Jiegang flex PCB of claim 1, wherein: the first prepreg, the third prepreg and the sixth prepreg are made of glass fiber materials, and the second prepreg, the fourth prepreg and the fifth prepreg are made of PI materials.
10. A Gao Jiegang flex PCB as claimed in claim 3, wherein: the first rigid core board, the third rigid core board, the flexible core board and the second rigid core board are respectively provided with circuit patterns, and the multilayer board is provided with metal holes.
CN202211689434.8A 2022-12-27 2022-12-27 Gao Jiegang flexible Printed Circuit Board (PCB) Pending CN116133246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211689434.8A CN116133246A (en) 2022-12-27 2022-12-27 Gao Jiegang flexible Printed Circuit Board (PCB)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211689434.8A CN116133246A (en) 2022-12-27 2022-12-27 Gao Jiegang flexible Printed Circuit Board (PCB)

Publications (1)

Publication Number Publication Date
CN116133246A true CN116133246A (en) 2023-05-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211689434.8A Pending CN116133246A (en) 2022-12-27 2022-12-27 Gao Jiegang flexible Printed Circuit Board (PCB)

Country Status (1)

Country Link
CN (1) CN116133246A (en)

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