CN115832001A - Display module, preparation method and spliced display screen - Google Patents
Display module, preparation method and spliced display screen Download PDFInfo
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Abstract
A display module, a preparation method and a spliced display screen relate to the technical field of display and solve the problem of poor reliability of the existing display module. The display device comprises a flexible display substrate and a printed circuit driving board; the flexible display substrate comprises a PI film, and a conducting circuit layer, a black thin film layer, a metal bonding pad, a light emitting layer and a packaging layer are sequentially arranged on the PI film; one end of the PI film is provided with a driving element and is bent to be fixed below the printed driving circuit board. Coating polyimide on the surface of a glass substrate and curing to obtain a PI film; manufacturing a conductive circuit layer on the film; manufacturing a black thin film layer on the upper part, processing a through hole in the black thin film layer and manufacturing a metal bonding pad; bonding the chip electrode and the metal bonding pad to obtain a light-emitting layer; covering the packaging layer; crimping the driving element onto the PI film; peeling the glass substrate to obtain a flexible display substrate; and adhering the flexible display substrate above the printed circuit driving board, and then bending the driving element part pressed on the PI film to the lower part of the printed circuit driving board for fixing.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module, a preparation method and a spliced display screen.
Background
Micro LED display is a novel display technology based on third generation semiconductor materials, and compared with the existing LCD and OLED display, the Micro LED display has the advantages of high brightness, high definition, high contrast, fine image quality, wider color gamut and higher reliability. However, a large splicing gap exists at the splicing position of the small-size Micro LED display substrates, and the display effect at the splicing position is different from that at the non-splicing position to a certain extent, so that the overall watching display effect is influenced.
In order to solve the problem of the abutted seams between adjacent substrates, in the prior art, a Micro LED display substrate side edge wiring process is generally adopted, wherein a metal wire is manufactured at the side edge of the display substrate, so that an electric circuit on the front side of a glass substrate is LED to the back side of the substrate, the abutted seams between Micro LED display screens are small, and the uniformity of the whole large-screen display effect is good. However, the process has the disadvantages of complex technical route, high processing difficulty and low yield, the edge metal wiring is easy to break in the large-screen splicing and assembling process, the edge metal wiring falls off to cause defects, and the long-term reliability of the product is poor.
Disclosure of Invention
In order to solve the problem of poor reliability of the existing spliced display module, the invention provides a display module, a preparation method and a spliced display screen.
The technical scheme of the invention is as follows:
a display module comprises a flexible display substrate and a printed circuit driving board;
the flexible display substrate comprises a PI film, a conducting circuit layer, a black thin film layer, a light emitting layer and a packaging layer;
the PI film is provided with a driving element and a conducting circuit layer, the driving element is electrically connected with the conducting circuit layer through a circuit in the PI film, and the conducting circuit layer comprises TFT device circuits arranged in an array; the black thin film layer covers the upper part of the conductive circuit layer, through holes are processed in the positions, corresponding to the TFT device circuit, of the black thin film layer, and metal bonding pads are processed in the through holes; the light-emitting layer comprises a light-emitting chip, and a chip electrode of the light-emitting chip is bonded with the metal bonding pad through solder paste; the packaging layer covers the light-emitting layer; and the PI film on one side provided with the driving element is bent to the lower part of the printed driving circuit board and is fixed.
Preferably, the thickness of the PI film is 20-190 μm.
Preferably, the thickness of the black thin film layer is 1-20 μm.
Preferably, the thickness of the metal pad is 300-1000 μm.
Preferably, the encapsulation layer is epoxy resin, silica gel or photoresist.
Preferably, the thickness of the packaging layer is 0.2mm to 0.5mm.
Preferably, the TFT device circuit is a low-temperature polysilicon TFT circuit or an oxide TFT circuit.
Preferably, the light emitting chip is a Micro LED light emitting chip.
Preferably, a chamfer is processed at the edge of one side of the printed circuit driving board, which is coated by the PI film.
Preferably, the driving element includes a driving IC and an FPC connection line.
A preparation method of a display module comprises the following steps:
s1, coating polyimide slurry on the surface of an optical glass substrate, and curing under the protection of nitrogen to obtain a PI film;
s2, manufacturing a TFT device circuit on the PI film to obtain a conducting circuit layer;
s3, taking an organic black coating material as a raw material, sequentially adopting coating and exposure processes to manufacture a black thin film layer above the conductive circuit layer, and processing through holes in the black thin film layer at positions corresponding to the TFT device circuit;
s4, manufacturing a metal pad in the through hole;
s5, bonding the chip electrode and the metal bonding pad by adopting a solder paste reflow soldering process to obtain a light-emitting layer;
s6, covering a packaging layer on the luminous layer;
s7, connecting the driving element to the PI film in a pressing mode through a COP process;
s8, peeling the PI film from the optical glass substrate to obtain a flexible display substrate;
and S9, adhering the flexible display substrate to the upper side of the printed circuit driving board, and bending one end, which is pressed with the driving element on the PI film, of the PI film to the lower side of the printed circuit driving board and fixing the PI film.
Preferably, in the step S4, the metal pad is manufactured by magnetron sputtering, exposure and wet etching processes in sequence.
Preferably, the step S6 specifically includes:
and (3) performing vacuum hot-pressing curing on the luminous layer by adopting epoxy resin or silica gel, or performing light curing by adopting photoresist to obtain the packaging layer.
Preferably, the step S8 of peeling the PI film from the optical glass substrate is realized by a laser process.
The spliced display screen comprises a plurality of display modules.
Compared with the prior art, the invention solves the problem of poor reliability of the existing splicing display module, and has the following specific beneficial effects:
1. the invention provides a display module with a novel structure, wherein an electric circuit is integrally manufactured on a flexible PI film, the electric circuit on the front surface of a display substrate is LED to the back surface of the substrate by bending the flexible PI film, and a display screen using the display module is free of black edges and electric circuits on the periphery and can be used as a display unit for splicing a Micro LED large-size display screen.
2. The manufacturing method of the display module provided by the invention has the advantages of simple process, high yield of the manufactured product, high connection reliability, small splicing seam of the large screen after splicing and improvement of the whole display uniformity.
Drawings
FIG. 1 is a schematic cross-sectional view of a display module according to the present invention;
fig. 2 is a schematic view of a manufacturing process of the display module according to the present invention.
Description of the reference numerals:
110. a packaging layer; 120. a light emitting chip; 130. a chip electrode; 140. tin paste; 150. a metal pad; 160. a black thin film layer; 170. a TFT device line; 180. a PI film; 190. printing a circuit driving board; 200. a driver IC; 210. FPC connecting wire.
Detailed Description
In order to make the technical solutions of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the specification of the present invention, and it should be noted that the following embodiments are only used for better understanding of the technical solutions of the present invention, and should not be construed as limiting the present invention.
Example 1.
The embodiment provides a display module, which comprises a flexible display substrate and a printed circuit driving board 190;
the flexible display substrate comprises a PI film 180, a conductive circuit layer, a black thin film layer 160, a light emitting layer and an encapsulation layer 110;
the PI film 180 is provided with a driving element and the conducting circuit layer, the driving element is electrically connected with the conducting circuit layer through a circuit inside the PI film 180, and the conducting circuit layer comprises TFT device circuits 170 arranged in an array; the black thin film layer 160 covers the conductive circuit layer, through holes are processed on the positions of the black thin film layer 160 corresponding to the TFT device circuit 170, and metal bonding pads 150 are processed in the through holes; the light emitting layer comprises a light emitting chip 120, and a chip electrode 130 of the light emitting chip 120 is bonded with the metal pad 150 through a solder paste 140; the packaging layer 110 covers the light-emitting layer; the PI film 180 on the side where the driving element is disposed is bent to the lower side of the printed driving circuit board 190 and fixed.
The display module assembly of the novel structure that this embodiment provided has wholly made electric circuit on flexible PI membrane 180, relies on flexible PI membrane 180 self to buckle the realization and guides the positive electric circuit of display substrate to ferry to the base plate back, uses this kind of display module assembly's display screen, and it does not have black limit and electric circuit all around to can be used for splicing Micro LED jumbo size display screen as display element.
The contrast of the display substrate is increased by arranging the black film layer with high light-shielding property; the organic film also has good insulativity and adhesion, and can protect the TFT device circuit and the PI film below; meanwhile, the black film layer also has a flattening effect, and is beneficial to the bonding of a subsequent light-emitting chip.
Through setting up the encapsulation layer, can realize TFT device circuit and luminescence chip's encapsulation protection, accomplish waterproof anti-oxidation, promote display module assembly life.
Example 2.
In this embodiment, the thickness of the PI film 180 is 20 μm to 200 μm, which is further illustrated in embodiment 1.
Example 3.
In this embodiment, the thickness of the black thin film layer 160 is 1 μm to 20 μm, which is a further example of embodiment 1.
Example 4.
In this embodiment, as a further example of embodiment 1, the thickness of the metal pad 150 is 300 μm to 1000 μm.
Example 5.
This embodiment is a further illustration of embodiment 1, and the encapsulation layer 110 is epoxy resin, silicon gel, or photoresist.
Example 6.
This embodiment further illustrates example 1, wherein the thickness of the encapsulation layer 110 is 0.2mm to 0.5mm.
Example 7.
This embodiment is a further illustration of embodiment 1, and the TFT device circuit 170 is a low temperature polysilicon TFT circuit or an oxide TFT circuit.
Example 8.
This embodiment is a further illustration of embodiment 1, and the light emitting chip 120 is a Micro LED light emitting chip.
Example 9.
In this embodiment, as a further example of embodiment 1, a chamfer is formed on an edge of one side of the printed circuit board 190, which is covered by the PI film 180.
This embodiment printed circuit drive plate side edge processing has the chamfer, and the PI membrane of being convenient for taking electric circuit buckles for the PI membrane is inseparabler with the laminating of printed circuit drive plate, and then reduces the gap after the concatenation, promotes whole demonstration homogeneity.
Example 10.
This embodiment is a further illustration of embodiment 1, and the driving element includes a driving IC200 and an FPC connecting line 210.
Example 11.
The embodiment provides a preparation method of a display module, which comprises the following steps:
s1, coating polyimide slurry on the surface of an optical glass substrate, and curing under the protection of nitrogen to obtain a PI film 180;
s2, manufacturing a TFT device circuit 170 on the PI film 180 to obtain a conducting circuit layer;
s3, taking an organic black coating material as a raw material, sequentially adopting coating and exposure processes to manufacture a black thin film layer 160 above the conducting circuit layer, and processing a through hole in the position, corresponding to the TFT device circuit 170, on the black thin film layer 160;
s4, manufacturing a metal pad 150 in the through hole;
s5, bonding the chip electrode 130 and the metal pad 150 by adopting a solder paste reflow soldering process to obtain a light-emitting layer;
s6, covering the packaging layer 110 on the light-emitting layer;
s7, connecting the driving element to the PI film 180 in a pressing mode through a COP process;
s8, peeling the PI film 180 from the optical glass substrate to obtain a flexible display substrate;
and S9, adhering the flexible display substrate above the printed circuit driving board 190, and then bending one end, which is pressed with the driving element on the PI film 180, below the printed circuit driving board 190 and fixing.
The manufacturing method of the display module provided by the invention has the advantages of simple process, high yield of the manufactured product, high connection reliability, small splicing seam of the large screen after splicing and improvement of the whole display uniformity.
Example 12.
This embodiment is a further illustration of embodiment 11, and the metal pad 150 in step S4 is manufactured by magnetron sputtering, exposure, and wet etching processes in sequence.
Example 13.
This embodiment is a further example of embodiment 10, and the step S6 specifically includes:
and performing vacuum hot-pressing curing on the luminescent layer by using epoxy resin or silica gel, or performing light curing by using photoresist to obtain the packaging layer 110.
Example 14.
This embodiment further illustrates embodiment 11, wherein the separation of the PI film 180 from the optical glass substrate in step S8 is realized by a laser process.
Example 15.
The embodiment provides a tiled display screen, which comprises a plurality of display modules as described in any one of embodiments 1-10.
Claims (15)
1. A display module is characterized by comprising a flexible display substrate and a printed circuit driving board (190);
the flexible display substrate comprises a PI film (180), a conductive circuit layer, a black thin film layer (160), a light emitting layer and an encapsulation layer (110);
the PI film (180) is provided with a driving element and the conducting circuit layer, the driving element is electrically connected with the conducting circuit layer through a circuit in the PI film (180), and the conducting circuit layer comprises TFT device circuits (170) arranged in an array; the black thin film layer (160) covers the upper part of the conducting circuit layer, through holes are processed in the positions, corresponding to the TFT device circuit (170), of the black thin film layer (160), and metal bonding pads (150) are processed in the through holes; the light-emitting layer comprises a light-emitting chip (120), and a chip electrode (130) of the light-emitting chip (120) is bonded with the metal bonding pad (150) through solder paste (140); the packaging layer (110) covers the light-emitting layer; and the PI film (180) at one side provided with the driving element is bent to the lower part of the printed driving circuit board (190) and fixed.
2. The display module according to claim 1, wherein the thickness of the PI film (180) is 20 μm to 200 μm.
3. The display module according to claim 1, wherein the thickness of the black thin film layer (160) is 1 μm to 20 μm.
4. The display module according to claim 1, wherein the metal pad (150) has a thickness of 300 μm to 1000 μm.
5. The display module according to claim 1, wherein the encapsulation layer (110) is an epoxy, a silicone, or a photoresist.
6. The display module according to claim 1, wherein the thickness of the encapsulation layer (110) is 0.2mm to 0.5mm.
7. The display module of claim 1, wherein the TFT device lines (170) are low temperature poly-si TFT lines or oxide TFT lines.
8. The display module according to claim 1, wherein the light emitting chips (120) are Micro LED light emitting chips.
9. The display module according to claim 1, wherein a chamfer is formed on an edge of the printed circuit driving board (190) covered by the PI film (180).
10. The display module according to claim 1, wherein the driving elements comprise a driving IC (200) and FPC connection lines (210).
11. A preparation method of a display module is characterized by comprising the following steps:
s1, coating polyimide slurry on the surface of an optical glass substrate, and curing under the protection of nitrogen to obtain a PI film (180);
s2, manufacturing a TFT device circuit (170) on the PI film (180) to obtain a conductive circuit layer;
s3, taking an organic black coating material as a raw material, sequentially adopting coating and exposure processes to manufacture a black thin film layer (160) above the conducting circuit layer, and processing a through hole in the black thin film layer (160) at a position corresponding to the TFT device circuit (170);
s4, manufacturing a metal pad (150) in the through hole;
s5, bonding the chip electrode (130) and the metal bonding pad (150) by adopting a solder paste reflow soldering process to obtain a light-emitting layer;
s6, covering an encapsulation layer (110) on the light-emitting layer;
s7, adopting a COP (coefficient of performance) process to press and connect the driving element to the PI film (180);
s8, peeling the PI film (180) from the optical glass substrate to obtain a flexible display substrate;
and S9, adhering the flexible display substrate above the printed circuit driving board (190), and then bending one end, which is pressed with the driving element on the PI film (180), below the printed circuit driving board (190) and fixing.
12. The method for manufacturing a display module according to claim 11, wherein the metal pad (150) in step S4 is manufactured by magnetron sputtering, exposure and wet etching in sequence.
13. The method for manufacturing a display module according to claim 11, wherein the step S6 specifically comprises:
and (3) performing vacuum hot-pressing curing on the luminescent layer by adopting epoxy resin or silica gel, or performing light curing by adopting photoresist to obtain the packaging layer (110).
14. The method for manufacturing a display module according to claim 11, wherein the peeling of the PI film (180) from the optical glass substrate in step S8 is performed by a laser process.
15. A tiled display screen, characterized in that the tiled display screen comprises several display modules according to any of claims 1-10.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310119805.7A CN115832001B (en) | 2023-02-16 | 2023-02-16 | Display module, preparation method and spliced display screen |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310119805.7A CN115832001B (en) | 2023-02-16 | 2023-02-16 | Display module, preparation method and spliced display screen |
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| CN115832001A true CN115832001A (en) | 2023-03-21 |
| CN115832001B CN115832001B (en) | 2023-05-12 |
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| JPH1184355A (en) * | 1997-09-11 | 1999-03-26 | Hitachi Ltd | Liquid crystal display device |
| CN106783920A (en) * | 2016-12-21 | 2017-05-31 | 深圳市华星光电技术有限公司 | Display panel, seamless splicing display device based on flexible OLED and preparation method thereof |
| US20170170255A1 (en) * | 2015-12-15 | 2017-06-15 | Samsung Display Co., Ltd. | Flexible display apparatus |
| CN107003774A (en) * | 2014-12-22 | 2017-08-01 | 乐金显示有限公司 | Flexible organic LED display device |
| CN109559640A (en) * | 2018-12-05 | 2019-04-02 | 京东方科技集团股份有限公司 | A kind of display module and preparation method thereof and display device |
| CN110827683A (en) * | 2019-10-22 | 2020-02-21 | 武汉华星光电半导体显示技术有限公司 | Integrated flexible display module and manufacturing method thereof |
| CN113050331A (en) * | 2021-03-31 | 2021-06-29 | 武汉华星光电技术有限公司 | Frameless liquid crystal display panel |
| CN115424542A (en) * | 2022-11-03 | 2022-12-02 | 长春希达电子技术有限公司 | Seamless spliced Micro-LED display panel and preparation method thereof |
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2023
- 2023-02-16 CN CN202310119805.7A patent/CN115832001B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1184355A (en) * | 1997-09-11 | 1999-03-26 | Hitachi Ltd | Liquid crystal display device |
| CN107003774A (en) * | 2014-12-22 | 2017-08-01 | 乐金显示有限公司 | Flexible organic LED display device |
| US20170170255A1 (en) * | 2015-12-15 | 2017-06-15 | Samsung Display Co., Ltd. | Flexible display apparatus |
| CN106783920A (en) * | 2016-12-21 | 2017-05-31 | 深圳市华星光电技术有限公司 | Display panel, seamless splicing display device based on flexible OLED and preparation method thereof |
| CN109559640A (en) * | 2018-12-05 | 2019-04-02 | 京东方科技集团股份有限公司 | A kind of display module and preparation method thereof and display device |
| CN110827683A (en) * | 2019-10-22 | 2020-02-21 | 武汉华星光电半导体显示技术有限公司 | Integrated flexible display module and manufacturing method thereof |
| CN113050331A (en) * | 2021-03-31 | 2021-06-29 | 武汉华星光电技术有限公司 | Frameless liquid crystal display panel |
| CN115424542A (en) * | 2022-11-03 | 2022-12-02 | 长春希达电子技术有限公司 | Seamless spliced Micro-LED display panel and preparation method thereof |
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