CN115830995A - Display panel - Google Patents
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- CN115830995A CN115830995A CN202211712835.0A CN202211712835A CN115830995A CN 115830995 A CN115830995 A CN 115830995A CN 202211712835 A CN202211712835 A CN 202211712835A CN 115830995 A CN115830995 A CN 115830995A
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- metal line
- metal
- insulating layer
- display panel
- sidewall
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 260
- 239000002184 metal Substances 0.000 claims abstract description 260
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 21
- 230000002093 peripheral effect Effects 0.000 description 11
- 230000009194 climbing Effects 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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Abstract
The application provides a display panel, display panel includes: a substrate; at least one first metal line disposed on the substrate; at least one insulating layer extending from one side of the first metal line to at least one sidewall of the at least one first metal line in a width direction of the first metal line and covering at least a portion of the at least one sidewall of the at least one first metal line; and at least one second metal wire, which is positioned on one side of the at least one first metal wire far away from the substrate and is overlapped with the at least one first metal wire, wherein the side wall of the second metal wire close to the insulating layer is closer to the first metal wire than the side wall of the insulating layer far away from the first metal wire.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel.
Background
In the manufacturing process of the display panel, parts of some film layers which need to be reserved are removed in the patterning process, so that the film layers after patterning treatment are absent, and the work of the display panel is influenced.
Therefore, it is necessary to provide a solution to the problem of the film layer missing after the patterning process.
Disclosure of Invention
The present application is directed to a display panel, so as to solve the problem of missing film layer after the patterning process.
In order to realize the purpose, the technical scheme is as follows:
a display panel, the display panel comprising:
a substrate;
at least one first metal line disposed on the substrate;
at least one insulating layer extending from one side of the first metal line to at least one sidewall of at least one of the first metal lines in a width direction of the first metal line and covering at least a portion of at least one of the sidewalls of at least one of the first metal lines; and
the second metal wire is positioned on one side, far away from the substrate, of the first metal wire and is overlapped with the first metal wire, and the side wall, close to the insulating layer, of the second metal wire is closer to the first metal wire relative to the side wall, far away from the first metal wire, of the insulating layer.
In the display panel of some embodiments, two adjacent first metal lines are disposed at intervals;
the plurality of insulating layers includes:
the first insulating layer extends from a region between two adjacent first metal lines to a first side wall and a second side wall of the two adjacent first metal lines, and covers at least part of the first side wall and at least part of the second side wall, the first side wall is a side face of one first metal line close to the other first metal line in the two adjacent first metal lines, and the second side wall is a side face of the other first metal line close to the one first metal line in the two adjacent first metal lines.
In the display panel of some embodiments, the plurality of insulating layers further includes:
a second insulating layer extending from one side of one of the first metal lines to a third sidewall of the one of the first metal lines and covering at least a portion of the third sidewall, wherein the third sidewall and the first sidewall are two opposite sides of the one of the first metal lines in a width direction of the one of the first metal lines, respectively; and
and a third insulating layer extending from one side of another one of the first metal lines to a fourth sidewall of the another one of the first metal lines and covering at least a portion of the fourth sidewall, wherein the fourth sidewall and the second sidewall are two opposite sides of the another one of the first metal lines in a width direction of the another one of the first metal lines, respectively.
In the display panel of some embodiments, at least one of the insulating layers further covers at least a portion of a surface of at least one of the first metal lines remote from the substrate, and a thickness of a portion of the insulating layer located on the surface of the first metal line remote from the substrate is smaller than a thickness of a portion of the insulating layer located on the substrate.
In the display panel of some embodiments, a thickness of the insulating layer is less than a sum of thicknesses of the first metal line and the second metal line, and the thickness of the insulating layer is greater than or equal to half of the thickness of the first metal line.
In the display panel of some embodiments, the material of the insulating layer includes at least one of an organic insulating material and an inorganic insulating material.
In the display panel of some embodiments, the display panel has a display region and a non-display region outside the display region, and at least one first metal line, at least one insulating layer, and at least one second metal line are disposed in at least one of the display region and the non-display region.
In the display panel of some embodiments, an orthographic projection of the first metal line on the substrate covers an orthographic projection of the second metal line on the substrate.
In the display panel of some embodiments, each of the second metal lines extends from a side of the first metal line to above a surface of the first metal line away from the substrate through a sidewall of the first metal line, the second metal line overlapping the insulating layer.
In the display panel of some embodiments, the display panel further includes an insulating film between the first metal line and the second metal line and covering at least one of the first metal line, at least one insulating layer, and at least one of the second metal line;
the second metal line is positioned on the surface of the insulating film far away from the substrate; or the like, or a combination thereof,
the display panel further includes a semiconductor layer disposed on a surface of the insulating film away from the substrate, at least a portion of the second metal line is disposed on a surface of the semiconductor layer away from the substrate, and a portion of the first metal line overlapping the second metal line overlaps the semiconductor layer.
Has the beneficial effects that: the insulating layer extends from one side of the first metal wire to at least one side wall of the first metal wire in the width direction of the first metal wire and covers at least part of the side wall of the first metal wire, the second metal wire is positioned on one side of the first metal wire, which is far away from the substrate, and is overlapped with the first metal wire, the side wall of the second metal wire, which is close to the insulating layer, is closer to the first metal wire than the side wall of the insulating layer, which is far away from the first metal wire, so that a step is formed between the insulating layer and the second metal wire, when the photoresist layer is coated, the photoresist layer climbs along the step, the step difference of the photoresist layer climbing along the step is reduced, the problem that the photoresist breaks the film and further the film layer is lost due to larger step difference is solved, and the display effect of the display panel is improved.
Drawings
Fig. 1 is a schematic plan view of a display panel according to an embodiment of the present application;
FIG. 2 isbase:Sub>A first cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is a schematic cross-sectional view of some related art display panels;
FIG. 4 isbase:Sub>A second cross-sectional view taken along line A-A of FIG. 1;
FIG. 5 isbase:Sub>A third cross-sectional view taken along line A-A of FIG. 1;
fig. 6 isbase:Sub>A fourth cross-sectional view taken along linebase:Sub>A-base:Sub>A of fig. 1.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Please refer to fig. 1, which is a schematic plan view of a display panel according to an embodiment of the present application. The display panel 100 may be any one of a liquid crystal display panel, an organic light emitting diode display panel, a micro light emitting diode display panel, a sub-millimeter light emitting diode display panel, and a quantum dot display panel. In order to describe the technical solution of the present application, the display panel 100 is taken as an example of a liquid crystal display panel for explanation, but is not limited thereto.
In the present embodiment, the display panel 100 has a display area 100a and a non-display area 100b located outside the display area 100a, the non-display area 100b being disposed around the display area 100a. The non-display area 100b includes a fan-shaped wiring area 100c, and the fan-shaped wiring area 100c is located at one side of the display area 100a.
In the present embodiment, the display panel 100 includes a plurality of display pixels (not shown) for displaying.
In the present embodiment, the display panel 100 includes a plurality of data lines 10, a plurality of peripheral wirings 11, a power line 12, and a driving unit 13, and the plurality of data lines 10, the plurality of peripheral wirings 11, and the power line 12 are insulated from each other.
In the present embodiment, the driving unit 13 is located on the side of the fan-shaped wiring area 100c away from the display area 100a, and the driving unit 13 is bound to the display panel 100.
In the present embodiment, a plurality of data lines 10 extend from the display area 100a to be connected to the driving unit 13 and pass through the fan-shaped wiring area 100c. The portions of the data lines 10 located in the fan-shaped wiring area 100c are arranged in a fan shape.
In the present embodiment, a plurality of peripheral wirings 11 are disposed around the periphery of the display area 100a, and opposite ends of each peripheral wiring 11 are connected to the driving unit 13. The peripheral wiring 11 includes, but is not limited to, a clock signal line.
In the present embodiment, the power line 12 includes a power bus 121 and a power branch line 122, the power bus 121 is disposed between the driving unit 13 and the display area 100a, and the power branch line 122 is connected to the power bus 121 and extends from the non-display area 100b to the display area 100a.
In the present embodiment, at least one of the data lines 10, the peripheral wirings 11, and the power lines 12 includes a metal, including but not limited to at least one of molybdenum, aluminum, titanium, copper, and silver.
In the present embodiment, at least one of the data lines 10, the peripheral wirings 11, and the power lines 12 includes a double-layer metal stacked to reduce a space occupied by the at least one of the data lines 10, the peripheral wirings 11, and the power lines 12 in a planar area.
The following description is given taking an example in which the peripheral wiring 11 includes stacked double-layer metals, but the present invention is not limited thereto, and the data line 10 and the power line 12 may include stacked double-layer metals. In addition, the technical scheme of the application is also suitable for the wiring comprising more than two layers of superposed metals.
Please refer to fig. 2, which isbase:Sub>A first cross-sectional view taken along linebase:Sub>A-base:Sub>A of fig. 1. The display panel 100 includes a substrate 14, and a plurality of data lines 10, a plurality of peripheral wirings 11, and a power line 12 are disposed on the substrate 14.
In the present embodiment, the plurality of peripheral wirings 11 include at least one first metal line 111 and at least one second metal line 112. The at least one first metal line 111 is disposed on the substrate 14, and the at least one second metal line 112 is disposed on a side of the at least one first metal line 111 away from the substrate 14 and overlaps the at least one first metal line 111.
Specifically, at least one first metal line 111 is disposed on the surface of the substrate 14, and at least one second metal line 112 is disposed on a side of the at least one first metal line 111 away from the substrate 14. It is understood that at least one of an insulating layer, a semiconductor layer, and a conductive layer may also be disposed between the at least one first metal line 111 and the substrate 14.
In the present embodiment, the at least one first metal line 111 and the at least one second metal line 112 are insulated from each other, that is, the at least one first metal line 111 and the at least one second metal line 112 transmit signals independently from each other.
It is understood that at least one first metal line 111 and at least one second metal line 112 may also be connected to reduce the impedance when the first metal line 111 and the second metal line 112 transmit signals.
In the present embodiment, each of the at least one first metal line 111 and the at least one second metal line 112 is linear, and an orthogonal projection of each first metal line 111 on the substrate 14 covers an orthogonal projection of one second metal line 112 on the substrate 14.
In this embodiment, the display panel 100 further includes at least one insulating layer 15, where the at least one insulating layer 15 extends from one side of the first metal line 111 to at least one sidewall 111a of the at least one first metal line 111 in the width direction of the first metal line 111 and covers at least a portion of the at least one sidewall 111a of the at least one first metal line 111, and a sidewall of the second metal line 112 close to the insulating layer 15 is closer to the first metal line 111 than a sidewall of the insulating layer 15 far from the first metal line 111, so that a step T is formed between the insulating layer 15 and the second metal line 112, when the photoresist layer is coated, the photoresist layer climbs onto the second metal line 112 along the step T, and a step difference between the photoresist layer climbing the step is reduced, thereby reducing a risk of the photoresist breaking the film, and improving a film missing problem caused by the photoresist breaking the film, thereby improving a display effect of the display panel.
In the present embodiment, the distance L between the sidewall of the second metal line 112 close to the insulating layer 15 and the sidewall of the insulating layer 15 far away from the first metal line 111 1 Greater than or equal to 0.5 micron.
In this embodiment, the number of the first metal lines 111 is two or more, two adjacent first metal lines 111 are disposed at an interval, and two adjacent first metal lines 111 are insulated from each other.
In this embodiment, the plurality of insulating layers 15 are disposed on the same layer, and the plurality of insulating layers 15 include a first insulating layer 151, where the first insulating layer 151 extends from a region between two adjacent first metal lines 111 to the first sidewall 111a1 and the second sidewall 111a2 of the two adjacent first metal lines 111, and covers at least a portion of the first sidewall 111a1 and at least a portion of the second sidewall 111a2, the first sidewall 111a1 is a side surface of one first metal line 111 of the two adjacent first metal lines 111 close to the other first metal line 111, and the second sidewall 111a2 is a side surface of the other first metal line 111 of the two adjacent first metal lines 111 close to the one first metal line 111.
In this embodiment, the plurality of insulating layers 15 further includes a second insulating layer 152 and a third insulating layer 153, and the second insulating layer 152 and the third insulating layer 153 are respectively located on two opposite sides of the first insulating layer 151.
In the present embodiment, the second insulating layer 152 extends from one side of one first metal line 111 to the third sidewall 111a3 of one first metal line 111 and covers at least a portion of the third sidewall 111a3, the third sidewall 111a3 and the first sidewall 111a1 are two opposite sides of the one first metal line 111 in the width direction of the one first metal line 111, respectively, and the third sidewall 111a3 and the first sidewall 111a1 both extend along the length direction of the one first metal line 111.
In this embodiment, the third insulating layer 153 extends from one side of the other first metal line 111 to the fourth sidewall 111a4 of the other first metal line 111 and covers at least a portion of the fourth sidewall 111a4, the fourth sidewall 111a4 and the second sidewall 111a2 are two opposite sides of the other first metal line 111 in the width direction of the other first metal line 111, and the fourth sidewall 111a4 and the second sidewall 111a2 both extend along the length direction of the other first metal line 111.
In this embodiment, the thickness of the insulating layers 15 is less than the sum of the thicknesses of the first metal line 111 and the second metal line 112, and the thickness of each insulating layer 15 is greater than or equal to half of the thickness of the first metal line 111, so as to reduce the step difference between the insulating layer 15 and the second metal line 112 and avoid the too thick thickness of the insulating layer 15, which results in a large step difference between the substrate 14 and the insulating layer 15.
The thicknesses of the first metal line 111 and the second metal line 112 are greater than or equal to 3000 angstroms and less than or equal to 8000 angstroms. The thickness of the plurality of insulating layers 15 is greater than or equal to 1500 angstroms and less than or equal to 16000 angstroms.
Specifically, the first insulating layer 151, the second insulating layer 152 and the third insulating layer 153 are disposed on the surface of the substrate 14, and the first insulating layer 151, the second insulating layer 152 and the third insulating layer 153 extend along the sidewall of the first metal line 111. The first insulating layer 151 extends from the substrate 14 between two adjacent first metal lines 111 to the first sidewall 111a1 and the second sidewall 111a2, and covers the entire lower portion of the first sidewall 111a1 near the substrate 14 and the entire lower portion of the second sidewall 111a2 near the substrate 14. The second insulating layer 152 extends from above the substrate 14 to above the third sidewall 111a3 of one of the first metal lines 111 and covers the entire lower half of the third sidewall 111a 3. The third insulating layer 153 extends from the substrate 14 to the fourth sidewall 111a4 of the other first metal line 111 and covers the entire lower half portion of the fourth sidewall 111a4.
In the present embodiment, the material of the insulating layer 15 includes at least one of an organic insulating material and an inorganic insulating material. The organic insulating material includes, but is not limited to, at least one of polyimide, polyacrylate, and polyethylene terephthalate. The inorganic insulating material includes, but is not limited to, at least one of silicon oxide, silicon nitride, and silicon oxynitride. Specifically, the material of the insulating layer 15 is an inorganic material.
The plurality of insulating layers 15 in this embodiment are obtained by patterning an insulating film layer, and the plurality of insulating layers 15 may be formed before the first metal line 111 is formed, or may be formed after the first metal line 111 is formed. In addition, when the thickness of the insulating layer 15 is greater than or equal to the thickness of the first metal line 111, the material of the insulating layer 15 includes an organic insulating material. When the thickness of the insulating layer 15 is smaller than that of the first metal line 111, the material of the insulating layer 15 includes an inorganic insulating material.
In the present embodiment, the display panel 100 further includes an insulating film 16, and the insulating film 16 is located between the first metal line 111 and the second metal line 112 and covers the at least one first metal line 111, the at least one insulating layer 15, and the at least one second metal line 112. The second metal line 112 is located on a surface of the insulating film 16 remote from the substrate 14.
It should be noted that the data line 10 may also include at least one first metal line 111, at least one insulating layer, and at least one second metal line 112, and at this time, the at least one first metal line 111, the at least one insulating layer, and the at least one second metal line 112 may also be disposed in the display area 100a.
Please refer to fig. 3, which is a cross-sectional view of some related art display panels. The display panel 200 includes a substrate 24, a first metal line 25, a second metal line 26, and an insulating layer 27. The first metal line 25 is disposed on the substrate 24, the insulating layer 27 covers the substrate 24 and the first metal line 25, the second metal line 26 is disposed on the insulating layer 27, and the second metal line 26 overlaps the first metal line 25. When coating the photoresist, the climbing height of the photoresist is H 1 ，H 1 Equal to the sum of the thicknesses of the first metal line 25 and the second metal line 26, resulting in the problem that the photoresist is prone to film missing.
In this embodiment, the insulating layer 15 extends from one side of the first metal line 111 to the sidewall of the first metal line 111, and covers a portion of the sidewall of the first metal line 111, so that a step is formed between the insulating layer 15 and the second metal line 112, the photoresist layer climbs along the step, the step difference of the photoresist climbing each step is reduced, and thus the problem of film layer loss caused by film breaking of the photoresist due to a large step difference is solved, thereby improving the display effect of the display panel.
Referring to fig. 4 and 5, fig. 4 isbase:Sub>A second cross-sectional view taken along linebase:Sub>A-base:Sub>A of fig. 1, and fig. 5 isbase:Sub>A third cross-sectional view taken along linebase:Sub>A-base:Sub>A of fig. 1. The display panel shown in fig. 4 and 5 is substantially similar to the display panel shown in fig. 2, and the same parts are not repeated, but the differences include: at least one insulating layer 15 also covers at least part of the surface of the at least one first metal line 111 far from the substrate 14, and the thickness of the part of the insulating layer 15 on the surface of the first metal line 111 far from the substrate 14 is smaller than that of the part of the insulating layer 15 on the substrate 14, so that when a step T is formed between the insulating layer 15 and the second metal line 112, when the photoresist layer climbs up the step T, the step difference of one step is smaller than the sum of the thicknesses of the first metal line 111 and the second metal line 112, and the problem of film layer missing caused by photoresist film breaking during photoresist coating is solved.
As shown in fig. 4, an insulating layer 15 covers the substrate 14, and two adjacent first metal lines 111 are formed on the first metal linesThe thickness H of the sidewall of the line 111 in the width direction and the surface of two adjacent first metal lines 111 away from the substrate 14, and the portion of the insulating layer 15 on the surface of the first metal line 111 away from the substrate 14 2 Less than the thickness H of the portion of one insulating layer 15 on the substrate 14 3 . The sidewalls of two adjacent first metal lines 111 include a first sidewall 111a1, a second sidewall 111a2, a third sidewall 111a3, and a fourth sidewall 111a4.
As shown in fig. 5, one first insulating layer 151 extends from the substrate 14 between two adjacent first metal lines 111 to the first sidewall 111a1 and the second sidewall 111a2 of the two adjacent first metal lines 111, and covers the entire first sidewall 111a1, the entire second sidewall 111a2, and a portion of the two first metal lines 111 away from the surface of the substrate 14. The second insulating layer 152 extends from the substrate 14 to the third sidewall 111a3 of one first metal line 111, and covers the entire third sidewall 111a3 and a portion of one first metal line 111 away from the surface of the substrate 14, the third sidewall 111a3 and the first sidewall 111a1 being opposite two sides of one first metal line 111 in the width direction of one first metal line 111, respectively. The third insulating layer 153 extends from the substrate 14 to the fourth sidewall 111a4 of the other first metal line 111, and covers the entire fourth sidewall 111a4 and a portion of the other first metal line 111 away from the surface of the substrate 14, and the fourth sidewall 111a4 and the second sidewall 111a2 are two opposite sides of the other first metal line 111 in the width direction of the other first metal line 111, respectively.
In addition, in fig. 5, the display panel 100 further includes a semiconductor layer 17, the semiconductor layer 17 is disposed on a surface of the insulating film 16 away from the substrate 14, at least a portion of the second metal line 112 is disposed on a surface of the semiconductor layer 17 away from the substrate 14, and a portion of the first metal line 111 overlapping with the second metal line 112 overlaps with the semiconductor layer 17, so as to increase a distance between the first metal line 111 and the second metal line 112 and prevent the insulating layer between the first metal line 111 and the second metal line 112 from being damaged to cause a short circuit therebetween. The material of the semiconductor layer 17 includes, but is not limited to, at least one of polysilicon, amorphous silicon, and metal oxide.
Please refer to fig. 6, which isbase:Sub>A fourth cross-sectional view taken along linebase:Sub>A-base:Sub>A of fig. 1. The display panel shown in fig. 6 is substantially similar to the display panel shown in fig. 5, and the same parts are not repeated, but the differences include: the display panel 100 shown in fig. 6 does not include the semiconductor layer 17, and in the display panel 100 shown in fig. 6, each second metal line 112 extends from one side of the first metal line 111 to the upper side of the surface of the first metal line 111 far from the substrate 14 through the sidewall of the first metal line 111, the second metal line 112 overlaps the insulating layer 15, and the second metal line 112 does not overlap with a portion of the first metal line 111, so that the second metal line 112 is arranged in a step manner, when a photoresist layer is coated, the number of steps climbing onto the second metal line 112 by the photoresist layer is increased, which is more beneficial to reducing the step difference of the steps, and further, the problem that the film is broken by the photoresist due to the large step difference is solved, and the problem of film layer missing is further solved, thereby improving the display effect of the display panel.
In the present embodiment, the second metal line 112 is located above the first metal line 111 and is located at a distance L between a sidewall of the second metal line 112 in the width direction and a sidewall of the first metal line 111 away from the second metal line 112 in the width direction of the first metal line 111 2 Greater than or equal to 2.5 micrometers.
The above description of the embodiments is only for assisting understanding of the technical solutions and the core ideas thereof; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display panel, comprising:
a substrate;
at least one first metal line disposed on the substrate;
at least one insulating layer extending from one side of the first metal line to at least one sidewall of at least one of the first metal lines in a width direction of the first metal line and covering at least a portion of at least one of the sidewalls of at least one of the first metal lines; and
the second metal wire is positioned on one side, far away from the substrate, of the first metal wire and overlapped with the first metal wire, and the side wall, close to the insulating layer, of the second metal wire is closer to the first metal wire relative to the side wall, far away from the first metal wire, of the insulating layer.
2. The display panel according to claim 1, wherein two adjacent first metal lines are disposed at intervals;
the plurality of insulating layers includes:
the first insulating layer extends from a region between two adjacent first metal lines to a first side wall and a second side wall of the two adjacent first metal lines, and covers at least part of the first side wall and at least part of the second side wall, the first side wall is a side face of one first metal line close to the other first metal line in the two adjacent first metal lines, and the second side wall is a side face of the other first metal line close to the one first metal line in the two adjacent first metal lines.
3. The display panel according to claim 2, wherein the plurality of insulating layers further comprises:
a second insulating layer extending from one side of one of the first metal lines to a third sidewall of the one of the first metal lines and covering at least a portion of the third sidewall, wherein the third sidewall and the first sidewall are two opposite sides of the one of the first metal lines in a width direction of the one of the first metal lines, respectively; and
and a third insulating layer extending from one side of another one of the first metal lines to a fourth sidewall of the another one of the first metal lines and covering at least a portion of the fourth sidewall, wherein the fourth sidewall and the second sidewall are two opposite sides of the another one of the first metal lines in a width direction of the another one of the first metal lines, respectively.
4. The display panel according to claim 1, wherein at least one of the insulating layers further covers at least a portion of a surface of at least one of the first metal lines remote from the substrate, and wherein a thickness of a portion of the insulating layer on the surface of the first metal line remote from the substrate is smaller than a thickness of a portion of the insulating layer on the substrate.
5. The display panel according to any one of claims 1 to 4, wherein the thickness of the insulating layer is less than the sum of the thicknesses of the first metal line and the second metal line, and the thickness of the insulating layer is greater than or equal to half the thickness of the first metal line.
6. The display panel according to any one of claims 1 to 4, wherein a material of the insulating layer comprises at least one of an organic insulating material and an inorganic insulating material.
7. The display panel according to any one of claims 1 to 4, wherein the display panel has a display region and a non-display region outside the display region, and at least one first metal line, at least one insulating layer, and at least one second metal line are provided in at least one of the display region and the non-display region.
8. The display panel according to any one of claims 1 to 4, wherein an orthographic projection of the first metal line on the substrate covers an orthographic projection of the second metal line on the substrate.
9. The display panel according to any one of claims 1 to 4, wherein each of the second metal lines extends from a side of the first metal line to above a surface of the first metal line away from the substrate through a sidewall of the first metal line, the second metal line overlapping the insulating layer.
10. The display panel according to any one of claims 1 to 4, wherein the display panel further comprises an insulating film which is located between the first metal line and the second metal line and covers at least one of the first metal line, at least one insulating layer, and at least one of the second metal line;
the second metal line is positioned on the surface of the insulating film far away from the substrate; or the like, or, alternatively,
the display panel further includes a semiconductor layer disposed on a surface of the insulating film away from the substrate, at least a portion of the second metal line is disposed on a surface of the semiconductor layer away from the substrate, and a portion of the first metal line overlapping the second metal line overlaps the semiconductor layer.
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