CN115830995B - Display panel - Google Patents
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- CN115830995B CN115830995B CN202211712835.0A CN202211712835A CN115830995B CN 115830995 B CN115830995 B CN 115830995B CN 202211712835 A CN202211712835 A CN 202211712835A CN 115830995 B CN115830995 B CN 115830995B
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- metal
- metal line
- insulating layer
- substrate
- display panel
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 254
- 239000002184 metal Substances 0.000 claims abstract description 254
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000004065 semiconductor Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 description 17
- 238000000059 patterning Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 4
- 230000009194 climbing Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present application provides a display panel, the display panel comprising: a substrate; at least one first metal line arranged on the substrate; at least one insulating layer extending from one side of the first metal line to at least one sidewall of the at least one first metal line in a width direction of the first metal line and covering at least a portion of the at least one sidewall of the at least one first metal line; and at least one second metal line which is positioned on one side of the at least one first metal line far away from the substrate and is overlapped with the at least one first metal line, wherein the side wall of the second metal line close to the insulating layer is closer to the first metal line than the side wall of the insulating layer far away from the first metal line.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel.
Background
In the manufacturing process of the display panel, the part of the film layer which needs to be reserved is removed in the patterning process, so that the film layer subjected to patterning treatment is missing, and the work of the display panel is affected.
Therefore, a solution is needed to solve the problem of the film layer missing after the patterning process.
Disclosure of Invention
The application aims to provide a display panel to solve the problem of defect of a film layer after patterning treatment.
In order to achieve the above purpose, the technical scheme is as follows:
a display panel, the display panel comprising:
A substrate;
At least one first metal line arranged on the substrate;
At least one insulating layer extending from one side of the first metal line to at least one sidewall of at least one of the first metal lines in a width direction of the first metal line and covering at least a portion of at least one of the sidewalls of at least one of the first metal lines; and
And the second metal wire is positioned on one side of at least one first metal wire away from the substrate and is overlapped with at least one first metal wire, and the side wall, close to the insulating layer, of the second metal wire is closer to the first metal wire than the side wall, away from the first metal wire, of the insulating layer.
In some embodiments, the display panel includes two adjacent first metal lines spaced apart from each other;
The plurality of insulating layers include:
And the first insulating layer extends from a region between two adjacent first metal wires to a first side wall and a second side wall of the two adjacent first metal wires and covers at least part of the first side wall and at least part of the second side wall, one of the first metal wires is adjacent to the side face of the other first metal wire, and the second side wall is adjacent to the side face of the other first metal wire.
In some embodiments, the plurality of insulating layers further includes:
A second insulating layer extending from one side of one of the first metal lines to a third sidewall of one of the first metal lines and covering at least a portion of the third sidewall, the third sidewall and the first sidewall being opposite sides of one of the first metal lines in a width direction of the first metal line, respectively; and
And a third insulating layer extending from one side of the other first metal wire to a fourth side wall of the other first metal wire and covering at least part of the fourth side wall, wherein the fourth side wall and the second side wall are respectively opposite two side surfaces of the other first metal wire in the width direction of the other first metal wire.
In some embodiments, the at least one insulating layer further covers at least a portion of the surface of the at least one first metal line remote from the substrate, and a thickness of a portion of the insulating layer on the surface of the first metal line remote from the substrate is smaller than a thickness of a portion of the insulating layer on the substrate.
In some embodiments, the thickness of the insulating layer is less than the sum of the thicknesses of the first metal line and the second metal line, and the thickness of the insulating layer is greater than or equal to half the thickness of the first metal line.
In some embodiments, the material of the insulating layer includes at least one of an organic insulating material and an inorganic insulating material.
In some embodiments, the display panel has a display region and a non-display region outside the display region, and at least one first metal line, at least one insulating layer, and at least one second metal line are disposed in at least one of the display region and the non-display region.
In some embodiments, the orthographic projection of the first metal line on the substrate covers the orthographic projection of the second metal line on the substrate.
In some embodiments, each of the second metal lines extends from one side of the first metal line through a sidewall of the first metal line to above a surface of the first metal line remote from the substrate, the second metal line overlapping the insulating layer.
In some embodiments, the display panel further includes an insulating film between the first metal line and the second metal line and covering at least one of the first metal line, at least one insulating layer, and at least one of the second metal line;
The second metal line is positioned on the surface of the insulating film away from the substrate; or alternatively, the first and second heat exchangers may be,
The display panel further comprises a semiconductor layer, the semiconductor layer is arranged on the surface, far away from the substrate, of the insulating film, at least part of the second metal wire is arranged on the surface, far away from the substrate, of the semiconductor layer, and the overlapped part between the first metal wire and the second metal wire is overlapped with the semiconductor layer.
The beneficial effects are that: because the at least one insulating layer extends from one side of the first metal wire to at least one side wall of the at least one first metal wire in the width direction of the first metal wire and covers at least part of the at least one side wall of the at least one first metal wire, the at least one second metal wire is positioned at one side of the at least one first metal wire away from the substrate and overlaps with the at least one first metal wire, and the side wall of the second metal wire close to the insulating layer is closer to the first metal wire than the side wall of the insulating layer away from the first metal wire, so that a step is formed between the at least one insulating layer and the at least one second metal wire.
Drawings
Fig. 1 is a schematic plan view of a display panel according to an embodiment of the application;
FIG. 2 is a first schematic cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is a schematic cross-sectional view of a display panel according to some related art;
FIG. 4 is a second cross-sectional view taken along line A-A of FIG. 1;
FIG. 5 is a third cross-sectional view taken along line A-A of FIG. 1;
Fig. 6 is a fourth cross-sectional view taken along line A-A of fig. 1.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
Fig. 1 is a schematic plan view of a display panel according to an embodiment of the application. The display panel 100 may be any one of a liquid crystal display panel, an organic light emitting diode display panel, a micro light emitting diode display panel, a sub-millimeter light emitting diode display panel, and a quantum dot display panel. For the purpose of describing the present application, the display panel 100 is exemplified as a liquid crystal display panel, but is not limited thereto.
In the present embodiment, the display panel 100 has a display area 100a and a non-display area 100b located outside the display area 100a, the non-display area 100b being disposed around the display area 100 a. The non-display area 100b includes a sector wiring area 100c, and the sector wiring area 100c is located at one side of the display area 100 a.
In the present embodiment, the display panel 100 includes a plurality of display pixels (not illustrated) for display.
In the present embodiment, the display panel 100 includes a plurality of data lines 10, a plurality of peripheral wirings 11, a power supply line 12, and a driving unit 13, and the plurality of data lines 10, the plurality of peripheral wirings 11, and the power supply line 12 are insulated from each other.
In the present embodiment, the driving unit 13 is located at a side of the fan-shaped wiring region 100c away from the display region 100a, and the driving unit 13 is bound to the display panel 100.
In the present embodiment, a plurality of data lines 10 extend from the display area 100a to be connected to the driving unit 13 and pass through the fan-shaped wiring area 100c. The portions of the plurality of data lines 10 located in the sector wiring region 100c are arranged in a sector shape.
In the present embodiment, a plurality of peripheral wirings 11 are disposed around the periphery of the display area 100a, and opposite ends of each peripheral wiring 11 are connected to the driving unit 13. The peripheral wiring 11 includes, but is not limited to, a clock signal line.
In the present embodiment, the power line 12 includes a power bus 121 and a power branch line 122, the power bus 121 is disposed between the driving unit 13 and the display area 100a, and the power branch line 122 is connected to the power bus 121 and extends from the non-display area 100b to the display area 100a.
In the present embodiment, at least one of the plurality of data lines 10, the plurality of peripheral wirings 11, and the power supply line 12 includes a metal including, but not limited to, at least one of molybdenum, aluminum, titanium, copper, and silver.
In the present embodiment, at least one of the plurality of data lines 10, the plurality of peripheral wirings 11, and the power supply line 12 includes stacked double-layered metals to reduce the space occupied by at least one of the data lines 10, the peripheral wirings 11, and the power supply line 12 in the planar region.
The following description will take an example in which the peripheral wiring 11 includes stacked double-layered metals, but is not limited thereto, and the data line 10 and the power line 12 may include stacked double-layered metals. In addition, the technical scheme of the application is also suitable for wiring comprising more than two layers of overlapped metals.
Referring to FIG. 2, a first cross-sectional view taken along line A-A of FIG. 1 is shown. The display panel 100 includes a substrate 14, and a plurality of data lines 10, a plurality of peripheral wires 11, and a power line 12 are disposed on the substrate 14.
In the present embodiment, the plurality of peripheral wirings 11 includes at least one first metal line 111 and at least one second metal line 112. The at least one first metal line 111 is disposed on the substrate 14, and the at least one second metal line 112 is located on a side of the at least one first metal line 111 away from the substrate 14 and overlaps the at least one first metal line 111.
Specifically, at least one first metal line 111 is disposed on the surface of the substrate 14, and at least one second metal line 112 is located on a side of the at least one first metal line 111 away from the substrate 14. It is understood that at least one of an insulating layer, a semiconductor layer, and a conductive layer may be disposed between the at least one first metal line 111 and the substrate 14.
In the present embodiment, the at least one first metal line 111 and the at least one second metal line 112 are insulated from each other, i.e., the at least one first metal line 111 and the at least one second metal line 112 each independently transmit signals.
It is understood that the at least one first metal line 111 and the at least one second metal line 112 may also be connected to reduce the impedance of the first metal line 111 and the second metal line 112 when transmitting signals.
In this embodiment, at least one first metal line 111 and at least one second metal line 112 are each in a linear shape, and the front projection of each first metal line 111 on the substrate 14 covers the front projection of one second metal line 112 on the substrate 14.
In this embodiment, the display panel 100 further includes at least one insulating layer 15, the at least one insulating layer 15 extends from one side of the first metal line 111 to at least one sidewall 111a of the at least one first metal line 111 in the width direction of the first metal line 111, and covers at least a portion of the at least one sidewall 111a of the at least one first metal line 111, the sidewall of the second metal line 112 near the insulating layer 15 is closer to the first metal line 111 than the sidewall of the insulating layer 15 far from the first metal line 111, such that a step T is formed between the insulating layer 15 and the second metal line 112, when the photoresist layer is coated, the photoresist layer climbs onto the second metal line 112 along the step T, the step difference of the photoresist climbing step is reduced, the risk of photoresist rupture is reduced, and the problem of film layer defect caused by photoresist rupture is improved, thereby improving the display effect of the display panel.
In the present embodiment, a distance L 1 between a sidewall of the second metal line 112 close to the insulating layer 15 and a sidewall of the insulating layer 15 far from the first metal line 111 is greater than or equal to 0.5 μm.
In this embodiment, the number of the first metal lines 111 is two or more, and two adjacent first metal lines 111 are disposed at intervals, and two adjacent first metal lines 111 are insulated.
In this embodiment, the plurality of insulating layers 15 are disposed on the same layer, and the plurality of insulating layers 15 include a first insulating layer 151, and the first insulating layer 151 extends from a region between two adjacent first metal lines 111 to a first sidewall 111a1 and a second sidewall 111a2 of the two adjacent first metal lines 111, and covers at least a portion of the first sidewall 111a1 and at least a portion of the second sidewall 111a2, wherein the first sidewall 111a1 is a side surface of one first metal line 111 of the two adjacent first metal lines 111 close to the other first metal line 111, and the second sidewall 111a2 is a side surface of the other first metal line 111 of the two adjacent first metal lines 111 close to the one first metal line 111.
In this embodiment, the plurality of insulating layers 15 further includes a second insulating layer 152 and a third insulating layer 153, and the second insulating layer 152 and the third insulating layer 153 are respectively located on opposite sides of the first insulating layer 151.
In the present embodiment, the second insulating layer 152 extends from one side of the first metal line 111 to the third sidewall 111a3 of the first metal line 111, and covers at least a portion of the third sidewall 111a3, the third sidewall 111a3 and the first sidewall 111a1 are respectively opposite two sides of the first metal line 111 in the width direction of the first metal line 111, and the third sidewall 111a3 and the first sidewall 111a1 extend along the length direction of the first metal line 111.
In the present embodiment, the third insulating layer 153 extends from one side of the other first metal line 111 to the fourth sidewall 111a4 of the other first metal line 111, and covers at least a portion of the fourth sidewall 111a4, the fourth sidewall 111a4 and the second sidewall 111a2 are respectively opposite two side surfaces of the other first metal line 111 in the width direction of the other first metal line 111, and the fourth sidewall 111a4 and the second sidewall 111a2 each extend along the length direction of the other first metal line 111.
In the present embodiment, the thickness of the plurality of insulating layers 15 is smaller than the sum of the thicknesses of the first metal lines 111 and the second metal lines 112, and the thickness of each insulating layer 15 is greater than or equal to half the thickness of the first metal lines 111, so that the step difference between the insulating layer 15 and the second metal lines 112 is reduced, and at the same time, the thickness of the insulating layer 15 is prevented from being too thick, resulting in a large step difference between the substrate 14 and the insulating layer 15.
Wherein the thickness of the first metal line 111 and the second metal line 112 is greater than or equal to 3000 angstroms and less than or equal to 8000 angstroms. The thickness of the plurality of insulating layers 15 is greater than or equal to 1500 angstroms and less than or equal to 16000 angstroms.
Specifically, the first insulating layer 151, the second insulating layer 152, and the third insulating layer 153 are disposed on the surface of the substrate 14, and the first insulating layer 151, the second insulating layer 152, and the third insulating layer 153 extend along the sidewalls of the first metal line 111. Wherein the first insulating layer 151 extends from the substrate 14 between two adjacent first metal lines 111 to the first sidewall 111a1 and the second sidewall 111a2, and covers the entire lower half portion of the first sidewall 111a1 near the substrate 14 and the entire lower half portion of the second sidewall 111a2 near the substrate 14. The second insulating layer 152 extends from the substrate 14 onto the third sidewall 111a3 of one of the first metal lines 111, and covers the entire lower half of the third sidewall 111a 3. The third insulating layer 153 extends from the substrate 14 onto the fourth sidewall 111a4 of the other first metal line 111 and covers the entire lower half of the fourth sidewall 111a 4.
In the present embodiment, the material of the insulating layer 15 includes at least one of an organic insulating material and an inorganic insulating material. The organic insulating material includes, but is not limited to, at least one of polyimide, polyacrylate, and polyethylene terephthalate. The inorganic insulating material includes, but is not limited to, at least one of silicon oxide, silicon nitride, and silicon oxynitride. Specifically, the material of the insulating layer 15 is an inorganic material.
The plurality of insulating layers 15 in this embodiment are obtained by patterning the insulating film layer, and the plurality of insulating layers 15 may be formed before the first metal lines 111 are formed, or may be formed after the first metal lines 111 are formed. In addition, when the thickness of the insulating layer 15 is greater than or equal to the thickness of the first metal line 111, the material of the insulating layer 15 includes an organic insulating material. When the thickness of the insulating layer 15 is smaller than that of the first metal line 111, the material of the insulating layer 15 includes an inorganic insulating material.
In this embodiment, the display panel 100 further includes an insulating film 16, where the insulating film 16 is located between the first metal lines 111 and the second metal lines 112 and covers the at least one first metal line 111, the at least one insulating layer 15, and the at least one second metal line 112. The second metal line 112 is located on a surface of the insulating film 16 remote from the substrate 14.
It should be noted that the data line 10 may also include at least one first metal line 111, at least one insulating layer, and at least one second metal line 112, and at this time, the at least one first metal line 111, the at least one insulating layer, and the at least one second metal line 112 may also be disposed in the display area 100a.
Fig. 3 is a schematic cross-sectional view of a display panel according to some related art. The display panel 200 includes a substrate 24, a first metal line 25, a second metal line 26, and an insulating layer 27. The first metal line 25 is disposed on the substrate 24, the insulating layer 27 covers the substrate 24 and the first metal line 25, the second metal line 26 is disposed on the insulating layer 27, and the second metal line 26 overlaps the first metal line 25. When the photoresist is coated, the climbing height H 1,H1 of the photoresist is equal to the sum of the thicknesses of the first metal line 25 and the second metal line 26, so that the photoresist is easy to have a problem of film loss.
In this embodiment, the insulating layer 15 extends from one side of the first metal line 111 to the side wall of the first metal line 111, and covers a portion of the side wall of the first metal line 111, so that a step is formed between the insulating layer 15 and the second metal line 112, the photoresist layer climbs along the step, the step difference of each step of the photoresist climbs is reduced, and further, the problem that the step difference is large to cause photoresist rupture and further cause membrane layer defect is improved, thereby improving the display effect of the display panel.
Referring to fig. 4 and 5, fig. 4 is a second schematic cross-sectional view taken along the line A-A of fig. 1, and fig. 5 is a third schematic cross-sectional view taken along the line A-A of fig. 1. The display panels shown in fig. 4 and 5 are substantially similar to the display panel shown in fig. 2, and the differences include: the at least one insulating layer 15 also covers at least part of the surface of the at least one first metal line 111 away from the substrate 14, and the thickness of the part of the insulating layer 15 located on the surface of the first metal line 111 away from the substrate 14 is smaller than the thickness of the part of the insulating layer 15 located on the substrate 14, so that when the step T is formed between the insulating layer 15 and the second metal line 112, and the photoresist layer climbs on the step T, the step difference of one step is smaller than the sum of the thicknesses of the first metal line 111 and the second metal line 112, and the problem of film loss caused by photoresist film breakage during photoresist coating is solved.
As shown in fig. 4, one insulating layer 15 covers the substrate 14, the sidewalls of the adjacent two first metal lines 111 in the width direction of the first metal lines 111, and the surfaces of the adjacent two first metal lines 111 away from the substrate 14, and the thickness H 2 of the portion of one insulating layer 15 on the surface of the first metal line 111 away from the substrate 14 is smaller than the thickness H 3 of the portion of one insulating layer 15 on the substrate 14. The sidewalls of two adjacent first metal lines 111 include a first sidewall 111a1, a second sidewall 111a2, a third sidewall 111a3, and a fourth sidewall 111a4.
As shown in fig. 5, one first insulating layer 151 extends from the substrate 14 between two adjacent first metal lines 111 onto the first side wall 111a1 and the second side wall 111a2 of two adjacent first metal lines 111, and covers the entire first side wall 111a1, the entire second side wall 111a2, and portions of the surfaces of two first metal lines 111 away from the substrate 14. The second insulating layer 152 extends from the substrate 14 onto the third sidewall 111a3 of one first metal line 111, and covers the entire third sidewall 111a3 and a portion of the first metal line 111 away from the surface of the substrate 14, where the third sidewall 111a3 and the first sidewall 111a1 are opposite sides of the one first metal line 111 in the width direction of the one first metal line 111, respectively. The third insulating layer 153 extends from the substrate 14 onto the fourth sidewall 111a4 of the other first metal line 111 and covers the entire fourth sidewall 111a4 and a portion of the other first metal line 111 away from the surface of the substrate 14, the fourth sidewall 111a4 and the second sidewall 111a2 being opposite sides of the other first metal line 111 in the width direction of the other first metal line 111, respectively.
In addition, in fig. 5, the display panel 100 further includes a semiconductor layer 17, the semiconductor layer 17 is disposed on a surface of the insulating film 16 away from the substrate 14, at least a portion of the second metal line 112 is disposed on a surface of the semiconductor layer 17 away from the substrate 14, and a portion overlapping between the first metal line 111 and the second metal line 112 overlaps the semiconductor layer 17 to increase a space between the first metal line 111 and the second metal line 112, so as to prevent a short circuit between the first metal line 111 and the second metal line 112 caused by breakage of the insulating layer therebetween. The material of the semiconductor layer 17 includes, but is not limited to, at least one of polysilicon, amorphous silicon, and metal oxide.
Referring to FIG. 6, a fourth cross-sectional view taken along line A-A of FIG. 1 is shown. The display panel shown in fig. 6 is substantially similar to the display panel shown in fig. 5, and the differences include: in the display panel 100 shown in fig. 6, the semiconductor layer 17 is not included in the display panel 100 shown in fig. 6, each second metal line 112 extends from one side of the first metal line 111 to a position above a surface of the first metal line 111 away from the substrate 14 through a side wall of the first metal line 111, the second metal line 112 overlaps the insulating layer 15, and the second metal line 112 does not overlap a portion of the first metal line 111, so that the second metal line 112 is arranged in a step manner, and when a photoresist layer is coated, the number of steps of the photoresist layer climbing onto the second metal line 112 increases, which is more beneficial to reducing the step difference, and further, the problem that the photoresist film breaks due to the larger step difference and further the film layer is lost is solved, thereby improving the display effect of the display panel.
In the present embodiment, a distance L 2 between a sidewall of the second metal line 112 located above the first metal line 111 and in the width direction of the second metal line 112 and a sidewall of the first metal line 111 located away from the second metal line 112 and in the width direction of the first metal line 111 is greater than or equal to 2.5 micrometers.
The above description of the embodiments is only for helping to understand the technical solution of the present application and its core ideas; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Claims (9)
1. A display panel, the display panel comprising:
A substrate;
Two adjacent first metal wires arranged at intervals are arranged on the substrate;
A plurality of insulating layers, and includes:
A first insulating layer extending from a region between two adjacent first metal lines to a first side wall and a second side wall of the two adjacent first metal lines and covering at least part of the first side wall and at least part of the second side wall, wherein the first side wall is a side surface of one of the two adjacent first metal lines, which is close to the other first metal line, and the second side wall is a side surface of the other of the two adjacent first metal lines, which is close to the one first metal line;
A second insulating layer extending from one side of one of the first metal lines to a third sidewall of one of the first metal lines and covering at least a portion of the third sidewall, the third sidewall and the first sidewall being opposite sides of one of the first metal lines in a width direction of the first metal line, respectively; and
A third insulating layer extending from one side of the other first metal line to a fourth side wall of the other first metal line and covering at least a portion of the fourth side wall, the fourth side wall and the second side wall being opposite sides of the other first metal line in a width direction of the other first metal line, respectively; and
And the second metal wire is positioned on one side of the first metal wire away from the substrate and is overlapped with the first metal wire, and one side wall of the second metal wire, which is close to the insulating layer, is closer to the first metal wire than the side wall of the insulating layer, which is away from the first metal wire.
2. The display panel according to claim 1, wherein the display panel has a display region and a non-display region located outside the display region, the non-display region being disposed around the display region, the display panel including a data line located in the display region, a power line located in the display region and the non-display region, and a peripheral wiring located in the non-display region, at least one of the data line, the power line, and the peripheral wiring including the first metal line and the second metal line.
3. The display panel of claim 1, wherein at least one of the insulating layers of the plurality of insulations further covers at least a portion of a surface of at least one of the first metal lines remote from the substrate, and a thickness of a portion of the insulating layer on the surface of the first metal line remote from the substrate is smaller than a thickness of a portion of the insulating layer on the substrate.
4. A display panel according to any one of claims 1-3, wherein the thickness of the insulating layer is less than the sum of the thicknesses of the first metal lines and the second metal lines, and the thickness of the insulating layer is greater than or equal to half the thickness of the first metal lines.
5. A display panel according to any one of claims 1-3, wherein the material of the insulating layer comprises at least one of an organic insulating material and an inorganic insulating material.
6. A display panel according to any of claims 1-3, characterized in that the display panel has a display area and a non-display area outside the display area, at least one first metal line, at least one insulating layer and at least one second metal line being provided in at least one of the display area and the non-display area.
7. A display panel according to any of claims 1-3, wherein the orthographic projection of the first metal lines on the substrate covers the orthographic projection of the second metal lines on the substrate.
8. A display panel according to any one of claims 1-3, wherein each of the second metal lines extends from one side of the first metal line through a sidewall of the first metal line to above a surface of the first metal line remote from the substrate, the second metal line overlapping the insulating layer.
9. The display panel according to any one of claims 1 to 3, further comprising an insulating film which is located between the first metal line and the second metal line and covers at least one of the first metal line, at least one insulating layer, and at least one of the second metal line;
The second metal line is positioned on the surface of the insulating film away from the substrate; or alternatively, the first and second heat exchangers may be,
The display panel further comprises an insulating film and a semiconductor layer, wherein the insulating film is positioned between the first metal wire and the second metal wire, the semiconductor layer is arranged on the surface, far away from the substrate, of the insulating film, at least part of the second metal wire is arranged on the surface, far away from the substrate, of the semiconductor layer, and the overlapped part between the first metal wire and the second metal wire is overlapped with the semiconductor layer.
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