TWI695356B - Display device and manufacturing method thereof - Google Patents

Abstract

A display device and a method of manufacturing the display device are provided. The method of manufacturing the display device includes providing a substrate with a first surface and an opposite second surface; forming a driving element layer on the first surface of the substrate; forming a protective layer to cover the driving element layer; forming at least one pad on the second surface of the substrate with the protective layer covering the driving element layer; disposing at least one light-emitting diode (LED) element on the driving element layer to enable at least one LED element electrically connect to the driving element layer; forming at least one conductive wiring pattern on a side of the substrate, and electrically connect to the driving element layer and at least one pad, wherein the side connects the first surface with the second surface; and disposing a driving chip on the second surface of the substrate to enable the driving chip electrically connect to at least one pad.

Description

Display device and manufacturing method thereof

The present invention relates to a display device and a manufacturing method thereof, and particularly to a display device having a single substrate and having driving elements and conductive wiring patterns on both sides and a manufacturing method thereof.

With the advancement of technology, the screen-to-body ratio of the display panel is an important reference index for many consumers when purchasing display devices, thus improving the display area of the display panel to occupy a higher proportion of the display Device requirements. However, the peripheral area of the display panel is provided with peripheral lines that do not have a display function, and the arrangement of the peripheral lines makes it difficult for the display device to achieve a high screen ratio. Therefore, there is an urgent need for a design that can solve the above problems.

The present invention provides a new display device architecture and a manufacturing method thereof. The manufactured display device can solve the problem of increasing the peripheral wiring of the peripheral area without a display function, so as to improve the screen ratio of the display device.

The present invention provides a display device. In addition to improving the screen ratio of the display device, it can also carry out modularized seamless splicing technology. The small-size display device forms a large-size display device, which increases the area size of the display panel Excellent visual experience, and is not limited by the generation of panels.

A manufacturing method of a display device provided by the present invention includes: providing a substrate having opposing first and second surfaces; forming a driving element layer on the first surface of the substrate; forming a protective layer to cover the driving element layer; When the protective layer covers the driving element layer, at least one pad is formed on the second surface of the substrate; at least one light emitting diode element is disposed on the driving element to make the at least one light emitting diode element and the driving element electrically Connection; forming at least one conductive circuit pattern on the side of the substrate, and electrically connected to the driving element and at least one pad, wherein the side is connected between the first surface and the second surface; and the second driving chip is provided on the substrate On the surface, the driving chip is electrically connected to at least one pad.

A display device of the present invention includes a substrate, a driving element, a plurality of light-emitting diode elements, a plurality of pads, a driving chip, and a plurality of conductive circuit patterns. The substrate has a first surface, a second surface opposite to the first surface, and a side surface connected between the first surface and the second surface. The driving element layer is disposed on the first surface of the substrate. The light emitting diode element is disposed on the driving element layer and electrically connected to the driving element layer. The pad is disposed on the second surface of the substrate. The driving chip is disposed on the pad and electrically connected to the pad. The conductive circuit pattern is disposed on the side of the substrate, and is electrically connected between the driving element layer and the pad.

Based on the above, in the display device and the manufacturing method thereof according to an embodiment of the present invention, by forming at least one conductive circuit pattern on the side of the substrate, wherein the conductive circuit pattern is electrically connected between the driving element layer and the pad, it can be improved The problem of increasing the area of the peripheral area in the display device is to increase the screen ratio of the display device and allow modular splicing. In addition, in the manufacturing method of the display device according to an embodiment of the present invention, by covering the driving element layer with the protective layer, the driving element layer on the first surface is not easily damaged when the subsequent process of the second surface is performed on the substrate.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

Hereinafter, the present invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrical connection" or "coupling" can mean that there are other components between the two components.

In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between one element and another element, as shown. It should be understood that relative terms are intended to include different orientations of the device than those shown in the figures. For example, if the device in one drawing is turned over, the element described as being on the "lower" side of the other element will be oriented on the "upper" side of the other element. Thus, the exemplary term "lower" may include "lower" and "upper" orientations, depending on the particular orientation of the drawings. Similarly, if the device in one drawing is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" can include an orientation of above and below.

As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by those of ordinary skill in the art, taking into account the measurements and A certain amount of measurement-related errors (ie, measurement system limitations). For example, "about" may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. In addition, "about", "approximately" or "substantially" used in this article can select a more acceptable range of deviation or standard deviation according to optical properties, etching properties or other properties, instead of applying one standard deviation to all properties .

Exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, a change in the shape of the graph as a result of, for example, manufacturing techniques and/or tolerances can be expected. Therefore, the embodiments described herein should not be construed as being limited to the specific shapes of the regions as shown herein, but include deviations in shapes caused by manufacturing, for example. For example, an area shown or described as flat may generally have rough and/or non-linear characteristics. In addition, the acute angle shown may be round. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, and are not intended to limit the scope of the claims.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined as such in this article.

1A to 1F are schematic diagrams of a manufacturing process of a display device according to an embodiment of the invention. FIG. 1E is a schematic side view of a display device according to an embodiment of the invention. FIG. 1F is an enlarged schematic view of a partial area 100a of the display device of FIG. 1E. 2A is a schematic diagram of components on the first surface 112 of the display device of FIG. 1E, wherein FIG. 2A omits the insulating layer 130, the light-shielding pattern BM, and the cover layer 210 of FIG. 1E. FIG. 2B is a schematic diagram of components on the side surface 116 of the display device of FIG. 1E, wherein FIG. 2B omits the cover layer 210 of FIG. 1E. 2C is a schematic diagram of components on the second surface 114 of the display device of FIG. 1E, wherein FIG. 2C omits the cover layer 210 and the insulating layer 180 of FIG. 1E. In particular, FIG. 1E corresponds to section line A-A' of FIG. 2A.

Please refer to FIG. 1A. First, a substrate 110 is provided with a first surface 112 and a second surface 114 disposed oppositely. In this embodiment, the substrate 110 is, for example, a rigid substrate. However, the invention is not limited to this. In other embodiments, the substrate 110 may also be a flexible substrate. For example, the material of the hard substrate can be glass, quartz or other suitable materials; the material of the flexible substrate can be plastic or other suitable materials.

Please refer to FIG. 1A. Next, a driving element layer DE is formed on the first surface 112 of the substrate 110. In this embodiment, the driving element layer DE includes a circuit layer 120 and a first electrode E1 and a second electrode E2 electrically connected to the circuit layer 120. In this embodiment, the first electrode E1 and the second electrode E2 may be a composite layer structure. The first electrode E1 includes a sub-electrode E1a and a sub-electrode E1b, and the second electrode E2 includes a sub-electrode E2a and a sub-electrode E2b. For example, in this embodiment, a conductive layer (not shown) is patterned on the circuit layer 120 to form the sub-electrode E1b and the sub-electrode E2b, and then on the sub-electrode E1b and the sub-electrode E2b Patterning another conductive layer (not shown) to form sub-electrode E1a and sub-electrode E2a. For example, in this embodiment, the material of the sub-electrode E1a and the material of the sub-electrode E2a may be Indium-Tin Oxide (ITO) or other suitable materials; the sub-electrode E1b and the sub-electrode E2b may be a single layer Or a multi-layer structure, the material may include metal materials, such as Ti/Al/Ti, Mo/Al/Mo, Mo/Al, or other suitable materials, but not limited thereto.

Please refer to FIGS. 1A and 2A, the circuit layer 120 is disposed on the first surface 112 of the substrate 110. For example, in this embodiment, the circuit layer 120 includes a first signal line SL1, a second signal line SL2, a power line PL, a common line CL, and transistors T1 and T2. The first signal line SL1 and the second signal line SL2 are interleaved. The transistor T1 is electrically connected to the first signal line SL1 and the second signal line SL2. The control terminal of the transistor T2 is electrically connected to the transistor T1. The first end of the transistor T2 is electrically connected to the power line PL, and the second end of the transistor T2 is electrically connected to the first electrode E1. The common line CL is electrically connected to the second electrode E2. It should be noted that the distance between the first signal line SL1 and the power line PL in the drawing is only an example for auxiliary description, and does not limit the present invention.

Please refer to FIG. 1A. Then, an insulating layer 130 may be formed on the circuit layer 120. In this embodiment, the insulating layer 130 is disposed on the circuit layer 120 and can cover a portion of the first electrode E1. The insulating layer 130 has an opening 130a, exposing a part of the circuit layer 120. 1A and 2A, for example, the opening 130a of the insulating layer 130 may expose the ends of the first signal line SL1 and the power line PL electrically connected to the first electrode E1. For example, in this embodiment, the material of the insulating layer 130 includes inorganic materials (for example: silicon oxide, silicon nitride, silicon oxynitride, other suitable materials, or stacked layers of at least two of the above materials), organic materials ( For example: polyesters (PET), polyolefins, polypropylenes, polycarbonates, polyalkylene oxides, polystyrenes, polyethers, polyketones, polyalcohols, polyaldehydes, other Suitable materials or combinations thereof), other suitable materials or combinations thereof.

In this embodiment, the insulating layer 130 may be used to form the light-shielding pattern BM on the circuit layer 120 to block the reflection of the metal circuit in the circuit layer 120. The material of the light-shielding pattern BM may be an organic material (such as polyimide, acrylate, or other suitable resin material), graphite, or other suitable materials.

Referring to FIG. 1A, a protective layer 140 is formed to cover the driving element layer DE. In this embodiment, the protective layer 140 may be a double-layer structure, which includes a first protective sub-layer 142 and a second protective sub-layer 144, but the invention is not limited thereto. In other embodiments, the protective layer 140 may also be a single-layer structure or a stacked structure with more than two layers. Specifically, in this embodiment, the first protection sublayer 142 may be formed to cover the driving element layer DE, and then the second protection sublayer 144 may be formed on the first protection sublayer 142. In one embodiment, the protective layer 140 has a suitable hardness to facilitate the purpose of protecting the driving element layer DE in the subsequent manufacturing process. In this embodiment, the pencil hardness of the protective layer 140 is preferably greater than or equal to 2H to protect the driving element layer DE. Since the protective layer 140 covers the driving element layer DE, the driving element layer DE is less likely to be damaged when the substrate 110 is subsequently turned over for other processes. The material of the first protective sub-layer 142 and the material of the second protective sub-layer 144 may include metal oxide, inorganic material or organic material, wherein the metal oxide may be indium tin oxide, zinc tin oxide or other suitable metal oxide The inorganic material may be silicon nitride, graphene, or other suitable inorganic materials, and the organic material may be polyimide, polymethyl methacrylate, or other suitable organic materials. For example, in this embodiment, the material of the first protective sub-layer 142 and the material of the second protective sub-layer 144 may be zinc tin oxide (IZO) and silicon nitride (SiN _x ), respectively, but not as limit.

Please refer to FIG. 1B. Next, the substrate 110 is turned over so that the second surface 114 of the substrate 110 faces upward for the subsequent manufacturing process.

Please refer to FIG. 1C. Then, the connection line 154 and the pad 160 are formed on the second surface 114 of the substrate 110. In detail, in this embodiment, when the protective layer 140 covers the driving element layer DE, a plurality of pads 160 are formed on the second surface 114 of the substrate 110 and the plurality of pads 160 respectively extend toward the edge of the substrate 110 The plurality of extended connection lines 154, wherein the plurality of pads 160 are electrically connected to the plurality of connection lines 154, respectively. For example, in this embodiment, when the protective layer 140 covers the driving element layer DE, the connection line 154 may be formed on the second surface 114 of the substrate 110 first; then, an insulating layer 180 is formed to cover the connection line 154. The insulating layer 180 has a first contact window 180a and a second contact window 180b. The second contact window 180b exposes an end 154b of the connection line 154 near the edge of the substrate 110, and the first contact window 180a exposes the edge of the connection line 154 away from the substrate 110 The other end 154a. Then, a pad 160 is formed on the insulating layer 180. The pad 160 fills the first contact window 180 a of the insulating layer 180 to be electrically connected to the end 154 a of the connection wire 154. In short, in this embodiment, the pad 160 can be selectively formed using a film layer disposed on the insulating layer 180. However, the present invention is not limited to this. In other embodiments, other materials may also be used to form the pads disposed on the second surface 114. For example, the end 154a of the connecting wire 154 may be directly used as the pad. In this embodiment, the material of the insulating layer 180 may be the same as or different from the material of the insulating layer 130, and the invention is not limited thereto.

Please refer to FIG. 1D. Next, the protective layer 140 is removed to expose the driving element layer DE. For example, in this embodiment, the protective layer 140 may be composed of a first protective sub-layer 142 and a second protective sub-layer 144, wherein the material of the first protective sub-layer 142 is zinc tin oxide and the second protective The material of the sub-layer 144 is silicon nitride. In this embodiment, the first protective sub-layer 142 can serve as a dry etching barrier for the second protective sub-layer 144. When removing the protective layer 140, the second protective sub-layer 144 may be removed by dry etching first, and then the first protective sub-layer 142 may be removed by wet etching. In addition, in the step of removing the protective layer 140 to expose the driving element layer DE, it may further include protecting the pad 160 and the connecting line 154 on the second surface 114 of the substrate 110 with a strippable glue.

Please refer to FIGS. 1E and 2A, and then, the light emitting diode element LED is disposed on the driving element layer DE, so that the light emitting diode element LED and the driving element layer DE are electrically connected. In this embodiment, the light-emitting diode element LED is formed on the growth substrate, for example, and then transferred to the driving element layer DE using a mass transfer technique, but the invention is not limited thereto. The light emitting diode element LED is electrically connected to the transistor T1 through the first electrode E1, and electrically connected to the common line CL through the second electrode E2.

Please refer to FIG. 1E, FIG. 1F, and FIG. 2A to FIG. 2C. Then, in this embodiment, the substrate 110 may be selectively subjected to a corner guiding process so that the substrate 110 has the first connection surface 113 and the second connection surface 115 And the side 116. The first connection surface 113 is connected between the first surface 112 and the side surface 116. The first surface 112 and the first connection surface 113 have a boundary 112a (marked in FIG. 2A). The first connection surface 113 and the side surface 116 have a boundary 113a (marked in FIGS. 2A and 2B). The second connection surface 115 is connected between the second surface 114 and the side surface 116. The side surface 116 and the second connection surface 115 have a boundary 116a (labeled in FIGS. 2B and 2C). The second connection surface 115 and the second surface 114 have a boundary 115a (marked in FIGS. 2B and 2C).

In this embodiment, the first connection surface 113 may be inclined relative to the first surface 112 and the side surface 116, and the second connection surface 115 may be inclined relative to the second surface 114 and the side surface 116. That is to say, the tangent line tangent to the first connection surface 113 and the tangent line tangent to the first surface 112 have a first internal angle α, and the first internal angle α is an obtuse angle; the first connection surface 113 and the side surface 116 have The internal angle θ, the internal angle θ is an obtuse angle; the tangent to the second connection surface 115 and the tangent to the second surface 114 have an internal angle γ, which is an obtuse angle; the second connection surface 115 and the side surface 116 There is an internal angle δ between them, and the internal angle δ is an obtuse angle; but the invention is not limited to this. In addition, in this embodiment, the first connection surface 113, the side surface 116, and the second connection surface 115 include a plurality of planes that are not parallel. However, the present invention is not limited to this. The first connection surface 113, the side surface 116, and the second connection surface 115 also include curved surfaces, flat surfaces, or a combination thereof. For example, in another embodiment not shown, the first connection surface 113 and the second connection surface 115 may be convex, and the side surface 116 may be a flat surface, or the first connection surface 113, the side surface 116, and the second connection The surface 115 may be connected as a convex surface.

Then, a plurality of conductive circuit patterns 200 are formed on the side surface 116 of the substrate 110. The conductive circuit pattern 200 is electrically connected between the driving element layer DE and the pad 160. In detail, in this embodiment, the conductive circuit pattern 200 is formed on a portion of the first surface 112 near the boundary 112a, a first connection surface 113, a side surface 116, a second connection surface 115, and a portion of the second surface near the boundary 115a 114 on. The two ends of the conductive circuit pattern 200 are filled into the opening 130a on the first surface 112 and the second contact window 180b on the second surface 114, and the first signal line SL1 on the first surface 112 and the second The ends 154b of the connecting wires 154 on the two surfaces 114 are electrically connected. The first electrode E1 for electrically connecting with the light emitting diode LED is connected through the first signal line SL1 on the first surface 112, the power line PL, the conductive circuit pattern 200 on the side 116 and the connection on the second surface 114 The wire (or fan-out trace) 154 is electrically connected to the pad 160 on the second surface 114.

In this embodiment, the conductive circuit pattern 200 includes a first conductive portion 202 (labeled in FIGS. 1E and 1F) and a second conductive portion 204 (labeled in FIGS. 1E and 1F). The first conductive portion 202 is provided on the first connection surface 113 of the substrate 110. The second conductive portion 204 is disposed on the side 116 of the substrate 110. The first conductive portion 202 and the second conductive portion 204 have a second inner angle β, and the second inner angle β is an obtuse angle. In one embodiment, the second inner angle β is substantially equal to the inner angle θ, but not limited to this. The conductive circuit pattern 200 further includes a third conductive portion 206 disposed on the second connection surface 115 of the substrate 110. The second conductive portion 204 and the third conductive portion 206 have an internal angle ω, and the internal angle ω is an obtuse angle. In one embodiment, the internal angle ω is substantially equal to the internal angle δ, but not limited to this. In other words, the conductive circuit pattern 200 is formed on the first connection surface 113, the side surface 116, and the second connection surface 115 together. For example, the conductive circuit pattern 200 conformally covers the first connection surface 113, the side surface 116, and the second connection surface 115, as shown in FIG. 1F. In this embodiment, the conductive circuit pattern 200 may be formed by screen printing, spray coating or other suitable methods.

Please refer to FIG. 1E. Next, in this embodiment, a cover layer 210 may be formed to cover the conductive circuit pattern 200. For example, the material of the cover layer 210 is an insulating material, including inorganic materials (for example: silicon nitride, silicon oxide, silicon oxynitride, other suitable materials, or stacked layers of at least two of the above materials), organic materials (for example: Polyesters (PET), polyolefins, polypropylenes, polycarbonates, polyalkylene oxides, polystyrenes, polyethers, polyketones, polyalcohols, polyaldehydes, other suitable Materials or combinations thereof), other suitable materials or combinations thereof.

Please refer to FIGS. 1E and 2C. Next, the driving chip 192 is disposed on the second surface 114 of the substrate 110 so that the driving chip 192 and the pad 160 are electrically connected. For example, the driving chip 192 can be selectively electrically connected to the pad 160 and fixed on the second surface 114 of the substrate 110 through the anisotropic conductive adhesive 194 filled in the first contact window 180a. However, the present invention is not limited to this. In this embodiment, the driving chip 192 may also be electrically connected to the pad 160 and fixed on the second surface 114 by other methods.

Based on the above, in the display device 100 and the manufacturing method thereof according to an embodiment of the present invention, the conductive circuit pattern 200 provided on the side surface 116 of the substrate 110 can electrically connect the driving element layer DE on the first surface 112 of the substrate 110 and The pad 160 on the second surface 114. In other words, most of the conductive circuit pattern 200 is disposed on the side surface 116 and the second surface 114 of the substrate 110 without consuming too much peripheral area of the first surface 112 (ie, the display surface of the display device 100). In this way, the peripheral area of the first surface 112 that cannot be used for display can be reduced, thereby achieving an ultra-narrow bezel or even a bezel-less display device, and increasing the screen ratio. In addition, in the manufacturing method, the driving element layer DE is covered by the protective layer 140, and the driving element layer DE can be protected from damage when the substrate 110 is subsequently turned over for other processes.

3A to 3G are schematic cross-sectional views of a manufacturing process of a display device according to another embodiment of the invention. FIG. 3G is an enlarged schematic view of the local area 100a' of the display device of FIG. 3F. It must be noted here that the embodiments of FIGS. 3A to 3F continue to use the element numbers and parts of the embodiments of FIGS. 1A to 1E, wherein the same or similar reference numbers are used to indicate the same or similar elements, and the same technical content is omitted. instruction of. For the description of the omitted parts, reference may be made to the foregoing embodiments, which will not be repeated here.

The difference between the embodiments of FIGS. 3A to 3G and the embodiments of FIGS. 1A to 1F is that the protective layer used in the manufacturing process is different.

Please refer to FIG. 3A. In this embodiment, first, a substrate 110 is provided, having a first surface 112 and a second surface 114 oppositely disposed. Next, a driving element layer DE is formed on the first surface 112 of the substrate 110, wherein the driving element layer DE includes a circuit layer 120 and first and second electrodes E1 and E2 electrically connected to the circuit layer 120.

Please refer to FIG. 3B. Next, a protective layer 170 is formed to cover the driving element layer DE. In this embodiment, the material of the protective layer 170 may be glass, and the protective layer 170 may be a single layer or a composite multilayer structure, but it is not limited thereto. The protective layer 170 can be adhered to the driving element DE through the adhesive layer 172.

Please refer to FIG. 3C. Next, the substrate 110 is thinned to form a thinned substrate 110' and a thinned protective layer 170'. In detail, in the aforementioned process, such as a wet etching process, it is easy to form some water marks that are not easily observed on the second surface 114 of the substrate 110, or residual dirt is generated during the process due to the sputtering of the etching solution Contamination, which affects the reliability of the subsequent process of the second surface 114 of the substrate 110. When the material of the protective layer 170 is glass, the thinning process can be used to remove water marks or residual dirt on the second surface 114 to improve the reliability of the product, and at the same time, the thinning of the substrate 110 can also be achieved. Through this thinning process, the thickness of the substrate 110' can be adjusted to 0.7 to 0.2 mm.

Please refer to FIG. 3D, and then, turn the substrate 110' so that the second surface 114' of the substrate 110' faces upward. Then, with the protective layer 170' covering the driving element layer DE, a plurality of pads 160 and a plurality of strips extending from the plurality of pads 160 toward the edge of the substrate 110' are formed on the second surface 114' of the substrate 110' The connection line 154, wherein the plurality of pads 160 are electrically connected to the plurality of connection lines 154, respectively. Next, an insulating layer 180 is formed to cover the connection line 154. The insulating layer 180 has a first contact window 180a and a second contact window 180b. The second contact window 180b exposes an end 154b of the connection line 154 near the edge of the substrate 110', and the first contact window 180a exposes the connection line 154 away from the substrate 110 'The other end 154a of the edge. Then, a pad 160 is formed on the insulating layer 180. The pad 160 fills the first contact window 180 a of the insulating layer 180 to be electrically connected to the end 154 a of the connection wire 154.

Please refer to FIG. 3E. Next, the protective layer 170' is removed to expose the driving element layer DE.

Please refer to FIGS. 3F and 3G, and then, the light emitting diode element LED is disposed on the driving element layer DE, so that the light emitting diode element LED and the driving element layer DE are electrically connected. Next, in this embodiment, the substrate 110' may be selectively subjected to a corner guide process so that the substrate 110' has the first connection surface 113, the second connection surface 115, and the side surface 116.

Then, a plurality of conductive circuit patterns 200 are formed on the side surface 116 of the substrate 110'. The conductive circuit pattern 200 is electrically connected between the driving element layer DE and the pad 160.

Next, in this embodiment, a cover layer 210 may be formed to cover the conductive circuit pattern 200.

Then, the driving chip 192 is disposed on the second surface 114' of the substrate 110', so that the driving chip 192 and the pad 160 are electrically connected. At this point, the display device 100' is completed.

In summary, the display device and the manufacturing method thereof of the present invention, wherein the manufacturing method of the display device includes: providing a substrate having opposing first and second surfaces; forming a driving element layer on the first surface of the substrate; forming A protective layer to cover the driving element layer; when the protective layer covers the driving element layer, a pad is formed on the second surface of the substrate; a light emitting diode element is provided on the driving element layer to make the light emitting diode element Electrically connected to the driving element layer; a plurality of conductive circuit patterns are formed on the side of the substrate, one of the conductive circuit patterns is electrically connected between the driving element layer and the pad, and the side is connected between the first surface and the second surface And setting the driving chip on the second surface of the substrate, so that the driving chip and the pad are electrically connected. In particular, a plurality of conductive circuit patterns are formed on the side of the substrate, and one of the conductive circuit patterns is electrically connected between the driving element layer and the pad. In this way, the peripheral area of the first surface of the substrate that cannot be used for display can be reduced, thereby achieving an ultra-narrow bezel or even a bezel-less display device, so as to increase the screen ratio of the display device. In addition, by covering the driving element layer with a protective layer in the method of manufacturing a display device, when the substrate is subsequently turned over for other manufacturing processes, the driving element layer can be protected from damage and the reliability of the display device can be improved.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

100, 100’‧‧‧ display device 100a, 100a’‧‧‧ region 110, 110’‧‧‧ substrate 112‧‧‧First surface 112a, 113a, 115a, 116a ‧‧‧ junction 113‧‧‧First connection surface 114、114’‧‧‧Second surface 115‧‧‧Second connection surface 116‧‧‧Side 120‧‧‧ line layer 130, 180‧‧‧ Insulation 130a‧‧‧ opening 140, 170, 170’‧‧‧ protective layer 142‧‧‧The first protective sublayer 144‧‧‧Second protective sublayer 154‧‧‧ connection cable 154a, 154b ‧‧‧ end 160‧‧‧Pad 172‧‧‧ adhesive layer 180a‧‧‧First contact window 180b‧‧‧The second contact window 192‧‧‧Drive chip 194‧‧‧Anisotropic conductive adhesive 200‧‧‧ conductive line pattern 202‧‧‧First Conducting Department 204‧‧‧Second Conducting Department 206‧‧‧The third conductive part 210‧‧‧overlay A-A’‧‧‧Cut line CL‧‧‧Common Line DE‧‧‧Drive element layer E1‧‧‧First electrode E1a, E1b, E2a, E2b ‧‧‧ sub-electrode E2‧‧‧Second electrode LED‧‧‧Light-emitting diode components PL‧‧‧Power cord SL1‧‧‧First signal line SL2‧‧‧Second signal line T1, T2‧‧‧transistor α‧‧‧First internal angle β‧‧‧Second internal angle θ, γ, δ, ω ‧‧‧ internal angle

1A to 1F are schematic diagrams of a manufacturing process of a display device according to an embodiment of the invention. FIG. 2A is a schematic diagram of components on the first surface of the display device of FIG. 1E, wherein FIG. 2A omits the insulating layer, light-shielding pattern, and cover layer of FIG. 1E. 2B is a schematic diagram of components on the side of the display device of FIG. 1E, wherein FIG. 2B omits the cover layer of FIG. 1E. 2C is a schematic diagram of components on the second surface of the display device of FIG. 1E, wherein FIG. 2C omits the cover layer and the insulating layer of FIG. 1E. 3A to 3G are schematic cross-sectional views of a manufacturing process of a display device according to another embodiment of the invention.

100‧‧‧Display device

100a‧‧‧Region

110‧‧‧ substrate

112‧‧‧First surface

114‧‧‧Second surface

120‧‧‧ line layer

130, 180‧‧‧ Insulation

130a‧‧‧ opening

154‧‧‧ connection cable

154a, 154b ‧‧‧ end

160‧‧‧Pad

180a‧‧‧First contact window

180b‧‧‧The second contact window

192‧‧‧Drive chip

194‧‧‧Anisotropic conductive adhesive

200‧‧‧ conductive line pattern

202‧‧‧First Conducting Department

204‧‧‧Second Conducting Department

206‧‧‧The third conductive part

210‧‧‧overlay

BM‧‧‧shading pattern

DE‧‧‧Drive element layer

E1‧‧‧First electrode

E1a, E1b, E2a, E2b ‧‧‧ sub-electrode

E2‧‧‧Second electrode

LED‧‧‧Light-emitting diode components

Claims (13)

A manufacturing method of a display device includes: providing a substrate having a first surface and a second surface opposite to each other; forming a driving element layer on the first surface of the substrate; forming a protective layer to cover the driving Element layer; in the case where the protective layer covers the driving element layer, at least one pad is formed on the second surface of the substrate; at least one light emitting diode element is provided on the driving element layer, so that the at least A light emitting diode element is electrically connected to the driving element layer; at least one conductive circuit pattern is formed on one side surface of the substrate, and electrically connected to the driving element layer and the at least one pad, wherein the side surface is connected to Between the first surface and the second surface; and a driving chip is disposed on the second surface of the substrate to electrically connect the driving chip and the at least one pad. The method for manufacturing a display device as described in item 1 of the scope of the patent application further includes: forming the at least one connecting line on the second surface of the substrate with the protective layer covering the driving element layer A pad extending toward an edge of the substrate; and in the case where the protective layer covers the driving element layer, an insulating layer is formed on the at least one pad and the at least one connection line, wherein the insulating layer has a first Pick up The contact window and a second contact window are respectively overlapped on the at least one pad and the at least one connection line. The method for manufacturing a display device as described in item 2 of the patent application scope further includes: removing the protective layer after forming the at least one pad and before setting the at least one light emitting diode element. The method for manufacturing a display device as recited in item 3 of the patent application, wherein the step of removing the protective layer includes: protecting the at least one pad and the at least one pad on the second surface of the substrate with a peelable glue One connection line. The method for manufacturing a display device as described in item 1 of the patent application range, wherein the pencil hardness of the protective layer is greater than or equal to 2H. The method for manufacturing a display device as described in item 1 of the patent application range, wherein the material of the protective layer includes indium tin oxide, zinc tin oxide, silicon nitride, glass, polyimide, polymethyl methacrylate or the like combination. The method for manufacturing a display device as described in Item 1 of the patent application scope further includes: performing a lead angle process so that the substrate has a first connection surface connected between the first surface and the side surface, wherein the At least one conductive circuit pattern conformally covers the first connection surface and the side surface. The method for manufacturing a display device as described in item 7 of the patent application range, wherein the first connection surface and the first surface or the first connection surface and the side surface have an internal angle, and the internal angle is an obtuse angle . The method for manufacturing a display device as described in item 1 of the patent application further includes: forming a cover layer to cover the at least one conductive circuit pattern. A display device includes: a substrate having a first surface, a second surface opposite to the first surface, and a side surface connected between the first surface and the second surface; a driving element layer provided On the first surface of the substrate; a plurality of light-emitting diode elements are provided on the driving element layer and are electrically connected to the driving element layer; a plurality of pads are provided on the second surface of the substrate A driving chip, disposed on the pads, and electrically connected to the pads; and a plurality of conductive circuit patterns, disposed on the side of the substrate, electrically connected to the driving element layer and the Between pads. The display device according to item 10 of the patent application scope, wherein the substrate further has a first connection surface connected between the first surface and the side surface, wherein all lines and phases tangent to the first connection surface All lines cut on the first surface have a The first inner angle is an obtuse angle, and the conductive circuit patterns conformally cover the first connection surface and the side surface. The display device as recited in item 11 of the patent application range, wherein at least one of the conductive circuit patterns includes: a first conductive portion disposed on the first connection surface of the substrate; and a second conductive portion , Disposed on the side of the substrate, wherein the first conductive portion and the second conductive portion have a second internal angle, and the second internal angle is an obtuse angle. The display device as described in item 10 of the patent application scope further includes: a plurality of connection lines extending from the pads to an edge of the substrate; and an insulating layer disposed on the pads and the connection lines , The insulating layer has a plurality of first contact windows and a plurality of second contact windows which are respectively overlapped on the pads and the connection lines, wherein the connection lines are electrically connected to the ones through the second contact windows The conductive circuit pattern and the first contact windows are electrically connected to the pads, and the driving chip is electrically connected to the pads through the first contact windows.

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