CN115825074A - Chip failure positioning device and method - Google Patents
Chip failure positioning device and method Download PDFInfo
- Publication number
- CN115825074A CN115825074A CN202211347878.3A CN202211347878A CN115825074A CN 115825074 A CN115825074 A CN 115825074A CN 202211347878 A CN202211347878 A CN 202211347878A CN 115825074 A CN115825074 A CN 115825074A
- Authority
- CN
- China
- Prior art keywords
- chip
- light microscope
- failure
- micro
- microscope detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention provides a chip failure positioning device and a chip failure positioning method, wherein the chip failure positioning device comprises a substrate, a first micro light microscope detector and a second micro light microscope detector, the first micro light microscope detector and the second micro light microscope detector are respectively arranged at two adjacent sides of the substrate, in the positioning process, the first micro light microscope detector and the second micro light microscope detector respectively obtain coordinates of a failure position in a first direction and a second direction from the side surface of the chip, and the second direction is vertical to the first direction, so that the failure position is obtained. According to the invention, the failure position is positioned from the side surface of the chip, so that the chip can be prevented from being damaged, and the success rate is improved; in the positioning process, the failure position is positioned by utilizing the low-power lens and the high-power lens in sequence, so that the accuracy of a measuring result can be effectively improved; in addition, the chip failure positioning device is simple in structure, and the chip failure positioning method is simple and convenient to operate, and is beneficial to reducing the operation cost and improving the production efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor chip failure positioning, in particular to a chip failure positioning device and method.
Background
The micro-Microscope (EMMI) technology is an important defect localization technology in chip failure analysis technology. For a power chip, a heavily doped layer is arranged in the back surface of the chip, and the heavily doped layer can block signals generated by excitation of defects, so that a low-light-level microscope cannot be used for positioning hot spots from the back surface of the power chip, and positioning can only be performed from the front surface. However, the front surface of the power chip is substantially covered by the aluminum layer, and infrared light generated by defects cannot penetrate through the aluminum layer, so that before the power chip is positioned by a micro-optical microscope, the passivation layer and the polyimide film on the aluminum layer are usually removed by using an ion beam etching technology, and then the metal aluminum is etched away by using hydrochloric acid. However, the method sometimes damages the structure of the chip, and for the high-voltage power chip, after the aluminum layer is removed, when a high-voltage test is performed, the chip is burned at the needle point due to the excessive current density at the needle point of the tungsten needle, so that the chip is damaged secondarily.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides a chip failure positioning device and method, wherein the chip failure positioning device includes a substrate, a first micro light microscope detector and a second micro light microscope detector, and the first micro light microscope detector and the second micro light microscope detector are respectively disposed at two adjacent sides of the substrate. In the chip failure positioning process, the chip is placed on the surface of the substrate, the first micro light microscope detector is moved along a first direction, and the coordinate of a failure position in the first direction is obtained; and moving the second micro-light microscope detector along the second direction to obtain the coordinate of the failure position in the second direction, wherein the second direction is vertical to the first direction, and the failure position is obtained by positioning. According to the chip failure positioning device and method provided by the invention, the failure position is positioned from the side surface of the chip, so that the chip can be positioned without destructively processing the chip, and the success rate of chip failure positioning is greatly improved; in the positioning process, the rough position of the failure position is obtained by using the low-power lens, and then the failure position is accurately positioned by using the high-power lens, so that the accuracy of the measurement result is effectively improved; in addition, the chip failure positioning device is simple in structure, and the chip failure positioning method is simple and convenient to operate, and is beneficial to reducing the operation cost and improving the production efficiency.
To achieve the above and other related objects, the present invention provides a chip failure locating device, including:
a substrate for placing a chip and applying a voltage to the chip;
little light microscope detector, including first little light microscope detector and second little light microscope detector, wherein, first little light microscope detector set up in the first side of base plate is used for the location the coordinate of the position of failure of chip on the first direction, second little light microscope detector set up in the second side of base plate is used for the location the coordinate of the position of failure of chip on the second direction, just the second direction with the first direction is perpendicular.
Optionally, the micro light microscope detector includes a first lens and a second lens, and the magnification of the second lens is greater than that of the first lens.
Optionally, the magnification of the first lens is between 1 and 10 times.
Optionally, the magnification of the second lens is between 20 and 100 times.
Optionally, the substrate is a PCB.
The invention also provides a chip failure positioning method, which adopts any one of the chip failure positioning devices and comprises the following steps:
s1: providing a chip, fixing the chip on the substrate, and applying voltage to the chip to generate a hot spot signal at the failure position;
s2: moving the first micro-light microscope detector along the first direction, and marking the coordinates of the failure position in the first direction for the first time after the first micro-light microscope detector detects the hot spot signal;
s3: and moving the second micro-light microscope detector along the second direction, and marking the coordinates of the failure position in the second direction for the first time after the second micro-light microscope detector detects the hot spot signal.
Optionally, in step S2 and step S3, the first lens is adopted by both the first micro-light microscope detector and the second micro-light microscope detector.
Optionally, the method further includes:
s4: moving the first micro-light microscope detector along the first direction by using the first mark in the step S2 as a reference, and marking the coordinates of the failure position in the first direction for the second time after the first micro-light microscope detector detects the hot spot signal;
s5: and moving the second micro light microscope detector along the second direction by using the first mark in the step S3 as a reference, and marking the coordinate of the failure position in the second direction for the second time after the second micro light microscope detector detects the hot spot signal.
Optionally, in step S4 and step S5, the second lens is adopted by both the first micro light microscope detector and the second micro light microscope detector.
The chip failure positioning device and method provided by the invention at least have the following technical effects:
according to the chip failure positioning device and method provided by the invention, the failure position is positioned from the side surface of the chip, so that the chip can be positioned without destructively processing the chip, and the success rate of chip failure positioning is greatly improved; in the positioning process, the rough position of the failure position is obtained by using the low-power lens, and then the failure position is accurately positioned by using the high-power lens, so that the accuracy of the measurement result is effectively improved; in addition, the chip failure positioning device is simple in structure, and the chip failure positioning method is simple and convenient to operate, and is beneficial to reducing the operation cost and improving the production efficiency.
Drawings
Fig. 1 is a top view of a chip failure positioning device according to an embodiment.
Fig. 2 is a flowchart illustrating a chip failure positioning method according to the second embodiment.
Description of the element reference
10. Substrate board
11. Metal electrode
21. First low-light microscope detector
22. Second low-light microscope detector
30. Chip and method for manufacturing the same
300. Failure location
101. First side of the substrate
102. Second side of the substrate
a coordinates of the fail position in the first direction
b coordinates of the failure position in the second direction
Detailed Description
The following embodiments of the present invention are provided by specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure of the present invention. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention in a schematic manner, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity, position relationship and proportion of each component in actual implementation can be changed freely on the premise of implementing the technical solution of the present invention, and the layout form of the components may be more complicated.
Example one
The embodiment provides a chip failure positioning device, as shown in fig. 1, which includes a substrate 10 and a micro-light microscope detector, wherein the micro-light microscope detector includes a first micro-light microscope detector 21 and a second micro-light microscope detector 22.
As an example, the substrate 10 is a Printed Circuit Board (PCB) which is used as a carrier for electrical connection of electronic components and has excellent reliability and testability. As shown in fig. 1, a substrate 10 is provided with a carrier region (not shown) for placing a chip 30; metal electrodes 11 are arranged around the bearing area, in this embodiment, the metal electrodes 11 may be copper electrodes, and the number of the metal electrodes 11 may be designed according to test requirements; bonding wires (not shown in the drawings) are also provided on the substrate 10 for electrically connecting the chip 30 with the metal electrodes 11 to apply a voltage to the chip 30.
As shown in fig. 1, the first micro-light microscope detector 21 is disposed on the first side 101 of the substrate 10 for locating a coordinate a of the failure position of the chip 30 in a first direction (X-axis direction shown in fig. 1). Specifically, the first micro light microscope detector 21 can move along a first direction (X-axis direction shown in fig. 1), in the process of positioning the failure position 300 of the chip 30, a voltage is applied to the chip 30 first to generate a hot spot signal at the failure position 300, the first micro light microscope detector 21 is moved along the first direction (X-axis direction shown in fig. 1), and after the first micro light microscope detector 21 detects the hot spot signal, a coordinate a of the hot spot signal in the first direction (X-axis direction shown in fig. 1) is marked, that is, a coordinate a of the failure position 300 in the first direction (X-axis direction shown in fig. 1) is obtained.
As shown in fig. 1, the second micro-light microscope detector 22 is disposed on the second side 102 of the substrate 10 for locating the coordinate b of the failure position of the chip 30 in the second direction (the Y-axis direction shown in fig. 1). Specifically, the second micro light microscope detector 22 can move along a second direction (Y-axis direction shown in fig. 1), when a voltage is applied to the chip 30, a hot spot signal is generated at the failure position 300, the second micro light microscope detector 22 is moved along the second direction (Y-axis direction shown in fig. 1), and after the second micro light microscope detector 22 detects the hot spot signal, a coordinate b of the hot spot signal in the second direction (Y-axis direction shown in fig. 1) is marked, that is, the coordinate b of the failure position 300 in the second direction (Y-axis direction shown in fig. 1) is obtained.
As an example, the first and second micro light microscope detectors 21 and 22 each include a first lens and a second lens, and the magnification of the second lens is larger than that of the first lens. In the process of positioning the failure position 300 of the chip 30, a first lens may be used for rough positioning, and because the magnification of the first lens is small, the full view of the chip 30 can be observed, and the approximate position of the failure position 300 in the chip 30 is obtained; the second lens is then used to obtain the exact position of the failed position 300 in the chip 30, based on the rough positioning of the first lens. In this embodiment, the magnification of the first lens is between 1 and 10 times, and the magnification of the second lens is between 20 and 100 times.
The chip failure positioning device provided by the embodiment comprises a substrate, a first micro light microscope detector and a second micro light microscope detector, wherein the first micro light microscope detector is arranged on the first side of the substrate and used for positioning the coordinate of the failure position on the first direction, the second micro light microscope detector is arranged on the second side of the substrate and used for positioning the coordinate of the failure position on the second direction, and the second direction is perpendicular to the first direction. The chip failure positioning device provided by the embodiment can position the failure position from the side surface of the chip, so that the chip is prevented from being damaged, the success rate of chip failure positioning is greatly improved, and the accuracy of a measurement result is effectively improved; in addition, the chip failure positioning device has a simple structure, and is beneficial to reducing the operation cost and improving the production efficiency.
Example two
The embodiment provides a chip failure positioning method, which is completed by using the chip failure positioning device provided in the first embodiment, as shown in fig. 2, and includes the following steps:
s1: providing a chip, fixing the chip on the substrate, and applying voltage to the chip to generate a hot spot signal at the failure position;
referring to fig. 1, a chip 30 is provided, the chip 30 has a failure location 300, the chip 30 is fixed in a carrying region (not shown in the figure) of a substrate 10, and a voltage is applied to the chip 30 through a metal electrode 11 on the substrate 10, so that a hot spot signal is generated at the failure location 300.
S2: moving the first micro-light microscope detector along the first direction, and marking the coordinates of the failure position in the first direction for the first time after the first micro-light microscope detector detects the hot spot signal;
as shown in fig. 1, the first micro-light microscope detector 21 is moved along the first direction (the X-axis direction shown in fig. 1), and after the first micro-light microscope detector 21 detects the hot spot signal, the coordinate a of the failure position 300 in the first direction (the X-axis direction shown in fig. 1) is marked for the first time. By way of example, the first micro-light microscope detector 21 now uses a first lens with a smaller magnification, and since the first lens has a smaller magnification, the entire view of the chip 30 can be observed, and the approximate position of the failure position 300 in the chip 30 is obtained. In this embodiment, the magnification of the first lens is between 1 and 10 times.
S3: moving the second micro-light microscope detector along the second direction, and marking the coordinates of the failure position in the second direction for the first time after the second micro-light microscope detector detects the hot spot signal;
as shown in fig. 1, the second micro-light microscope detector 22 is moved along the second direction (the Y-axis direction shown in fig. 1), and after the second micro-light microscope detector 22 detects the hot spot signal, the coordinate b of the failure position 300 in the second direction (the Y-axis direction shown in fig. 1) is marked for the first time. By way of example, the second micro-light microscope detector 22 now employs a first lens of smaller magnification, which, due to its smaller magnification, enables the overall view of the chip 30 to be observed, obtaining an approximate position of the failure location 300 in the chip 30. In this embodiment, the magnification of the first lens is between 1 and 10 times.
S4: moving the first micro-light microscope detector along the first direction by using the first mark in the step S2 as a reference, and marking the coordinates of the failure position in the first direction for the second time after the first micro-light microscope detector detects the hot spot signal;
referring to fig. 1, after the first-time marking in step S2 is performed as a reference, the first micro-light microscope detector 21 is moved along the first direction (the X-axis direction shown in fig. 1), and the first micro-light microscope detector 21 detects the hot spot signal, the coordinate a of the failure position 300 in the first direction (the X-axis direction shown in fig. 1) is marked for the second time. As an example, the first micro light microscope detector 21 uses a second lens with a larger magnification, and the exact position of the failure position 300 in the chip 30 can be obtained due to the larger magnification of the second lens. In this embodiment, the magnification of the second lens is between 20 times and 100 times.
S5: and moving the second micro-light microscope detector along the second direction by using the first mark in the step S3 as a reference, and marking the coordinate of the failure position in the second direction for the second time after the second micro-light microscope detector detects the hotspot signal.
Referring to fig. 1, after the second micro-light microscope detector 22 is moved in the second direction (the Y-axis direction shown in fig. 1) with the first marking in step S3 as the reference, and the second micro-light microscope detector 22 detects the hot spot signal, the coordinate b of the failure position 300 in the second direction (the Y-axis direction shown in fig. 1) is marked for the second time. As an example, the second micro-light microscope detector 22 uses a second lens with a larger magnification, and the exact position of the failure position 300 in the chip 30 can be obtained due to the larger magnification of the second lens. In this embodiment, the magnification of the second lens is between 20 times and 100 times.
The embodiment provides a chip failure positioning method, wherein a chip is placed on the surface of a substrate, a first micro light microscope detector is moved along a first direction, and coordinates of a failure position in the first direction are obtained; moving the second micro light microscope detector along the second direction to obtain the coordinate of the failure position in the second direction, wherein the second direction is vertical to the first direction, namely the failure position is obtained by positioning, and the failure position is positioned from the side surface of the chip, so that the damage to the chip can be avoided, and the success rate of the failure positioning of the chip is greatly improved; in the positioning process, the rough position of the failure position is obtained by using the low-power lens, and then the failure position is accurately positioned by using the high-power lens, so that the accuracy of the measurement result is effectively improved; in addition, the chip failure positioning method provided by the embodiment is simple and convenient to operate, and is beneficial to reducing the operation cost and improving the production efficiency.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (9)
1. A chip failure locating device, comprising:
a substrate for placing a chip and applying a voltage to the chip;
little light microscope detector, including first little light microscope detector and second little light microscope detector, wherein, first little light microscope detector set up in the first side of base plate is used for the location the coordinate of the position of failure of chip on the first direction, second little light microscope detector set up in the second side of base plate is used for the location the position of failure of chip is at the ascending coordinate of second direction, just the second direction with the first direction is perpendicular.
2. The chip fail locator device of claim 1, wherein the micro light microscope probe comprises a first lens and a second lens, the second lens having a magnification that is greater than a magnification of the first lens.
3. The chip failure locator device of claim 2, wherein the magnification of the first lens is between 1 and 10 times.
4. The device of claim 2, wherein the magnification of the second lens is between 20 and 100 times.
5. The chip failure locating device of claim 1, wherein the substrate is a PCB board.
6. A method for locating a chip failure, which comprises the steps of using the apparatus for locating a chip failure according to any one of claims 1 to 5:
s1: providing a chip, fixing the chip on the substrate, and applying voltage to the chip to generate a hot spot signal at the failure position;
s2: moving the first micro-light microscope detector along the first direction, and marking the coordinates of the failure position in the first direction for the first time after the first micro-light microscope detector detects the hot spot signal;
s3: and moving the second micro-light microscope detector along the second direction, and marking the coordinates of the failure position in the second direction for the first time after the second micro-light microscope detector detects the hot spot signal.
7. The method of claim 6, wherein the first lens is used in both the first micro-light microscope detector and the second micro-light microscope detector in steps S2 and S3.
8. The method of claim 7, further comprising:
s4: moving the first micro-light microscope detector along the first direction by using the first mark in the step S2 as a reference, and marking the coordinates of the failure position in the first direction for the second time after the first micro-light microscope detector detects the hot spot signal;
s5: and moving the second micro light microscope detector along the second direction by using the first mark in the step S3 as a reference, and marking the coordinate of the failure position in the second direction for the second time after the second micro light microscope detector detects the hot spot signal.
9. The method of claim 8, wherein the second lens is used in both the first micro-light microscope detector and the second micro-light microscope detector in steps S4 and S5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211347878.3A CN115825074A (en) | 2022-10-31 | 2022-10-31 | Chip failure positioning device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211347878.3A CN115825074A (en) | 2022-10-31 | 2022-10-31 | Chip failure positioning device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115825074A true CN115825074A (en) | 2023-03-21 |
Family
ID=85525916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211347878.3A Pending CN115825074A (en) | 2022-10-31 | 2022-10-31 | Chip failure positioning device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115825074A (en) |
-
2022
- 2022-10-31 CN CN202211347878.3A patent/CN115825074A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8822238B2 (en) | Apparatus and method for predetermined component placement to a target platform | |
| EP1637893B1 (en) | Method and apparatus for testing electrical characteristics of object under test | |
| KR20040004002A (en) | Probe needle fixing apparatus and method for semiconductor device test equipment | |
| JP2007178318A (en) | Substrate inspection device and method | |
| JP2008101944A (en) | Supporting member for inspection, inspection device and inspection method | |
| US20110012613A1 (en) | Failure Detection Method and Failure Detection Apparatus | |
| JPWO2020145073A1 (en) | Contact terminals, inspection jigs, and inspection equipment | |
| CN115825074A (en) | Chip failure positioning device and method | |
| CN108470690A (en) | Detector | |
| JP4391738B2 (en) | Method for collecting probe contact position, method for correcting probe contact position, and method for eliminating contact error between probe devices | |
| TW201627676A (en) | Substrate inspecting jig | |
| JP2018179758A (en) | Electrical connection device | |
| JP3258312B2 (en) | Manufacturing system of thick film/thin film hybrid multilayer wiring board and electron beam lithography system | |
| JP3201619B2 (en) | Semiconductor inspection method | |
| CN115032430B (en) | Probe structure and manufacturing method thereof | |
| TWI663682B (en) | Method of designing substrate inspection jig, substrate inspection jig, and substrate inspection apparatus | |
| CN117558714B (en) | Hybrid bonding packaging structure, offset testing method and chip mounter | |
| JP5540971B2 (en) | Contact, connecting jig, and method of manufacturing contact | |
| JP2876171B2 (en) | Inspection methods | |
| JP2959862B2 (en) | Positioning method | |
| JP2002043721A (en) | Method and device for inspecting printed wiring board | |
| CN103367191A (en) | Failpoint locating method | |
| CN117233574A (en) | Failure positioning method | |
| JP2024032044A (en) | Semiconductor test device and semiconductor test method | |
| JPH07287042A (en) | In-circuit inspection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |