CN115823510A - Light emitting module and electronic equipment - Google Patents

Abstract

The invention provides a light emitting module and an electronic device. The light emitting module includes: the carrier circuit board is provided with a through structure along the thickness direction; the light-emitting chips are packaged on one side of the carrier circuit board, each light-emitting chip is used for emitting light under the driving of the carrier circuit board, and the packaging positions of the light-emitting chips on the carrier circuit board and the opening positions of the through structures on the carrier circuit board are mutually staggered; the filling dielectric layer is arranged on the carrier circuit board, wraps each light-emitting chip and at least covers the through structure; the light reflecting film covers one side, far away from the carrier circuit board, of the filling medium layer, the light reflecting film is used for reflecting light rays emitted by the light emitting chip and penetrating through the filling medium layer, and the light rays reflected by the light reflecting film penetrate through the part, covered with the through structure, of the filling medium layer and are emitted out through the through structure. The light-emitting module provided by the invention has obvious bright and dark boundaries when emitting light, is easy to realize a required light-emitting shape, and is beneficial to expanding the application scene of the light-emitting module.

Description

Light emitting module and electronic equipment

Technical Field

The invention belongs to the technical field of display, and particularly relates to a light-emitting module and electronic equipment.

Background

In the related art, the LED lamp strip mainly comprises a circuit board, an LED chip packaged on the circuit board, and a fluorescent glue wrapped on the LED chip by means of mold pressing. Wherein, the LED chip sends first chromatic light (generally being the blue light) under the drive of circuit board, and the fluorescent glue converts the first chromatic light that the LED chip sent into second chromatic light (generally being white light), and this second chromatic light is the final light that one side that the circuit board was kept away from through the fluorescent glue in LED lamp area promptly, and the whole surface that circuit board one side was kept away from to the fluorescent glue also is the light emitting area in LED lamp area promptly. However, because the fluorescent glue has the effect of scattering uniform light, when the LED strip emits light through the whole surface of which the fluorescent glue is far away from one side of the circuit board, the problem that the bright and dark boundaries are not obvious exists, even if the LED chips in different areas of the LED strip are controlled to have different luminous powers, the LED strip cannot well manufacture an expected luminous shape, and the application scene of the LED strip is limited.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the light-emitting module and the electronic equipment, wherein the light-emitting module has obvious bright and dark boundaries when emitting light, is easy to realize a required light-emitting shape, and is beneficial to expanding the application scene of the light-emitting module.

In order to achieve the above object, in one aspect, the present invention provides a light emitting module, including:

the carrier circuit board is provided with a through structure along the thickness direction;

the light-emitting chips are packaged on one side of the carrier circuit board, and each light-emitting chip is used for emitting light under the driving of the carrier circuit board, wherein the packaging position of each light-emitting chip on the carrier circuit board and the opening position of the through structure on the carrier circuit board are mutually staggered;

the filling dielectric layer is arranged on the carrier circuit board, wraps each light-emitting chip and at least covers the through structure; and

the light reflecting film is used for reflecting the light rays emitted by the light emitting chip and penetrating through the filling medium layer, and the light rays reflected by the light reflecting film penetrate through the part, covering the through structure, of the filling medium layer and are emitted out through the through structure.

In one embodiment, the filling medium layer is a transparent colloidal layer, and the reflective film is a color reflective film, wherein the light emitted by the light emitting chip has a first color, the color reflective film has a second color, and the color reflective film is used for converting the color of the light emitted by the light emitting chip into a predetermined third color.

In one embodiment, the filling medium layer is a light conversion medium layer, and the reflective film is a mirror reflective film, wherein the light emitted by the light emitting chip has a first color, the light conversion medium layer has a second color, and the light conversion medium layer is configured to convert the color of the light emitted by the light emitting chip into a predetermined third color.

In one embodiment, the filling medium layer further fills the entire through structure, and a surface of one side of the filling medium layer in the through structure, which is far away from the reflective membrane, is flush with a surface of one side of the carrier circuit board, which is far away from the reflective membrane;

or, the filling medium layer also fills the part of the through structure close to the reflective membrane, and the surface of one side of the filling medium layer in the through structure, which is far away from the reflective membrane, is lower than the surface of one side of the carrier circuit board, which is far away from the reflective membrane.

In an embodiment, the filling medium layer further fills the entire through structure and protrudes from one side of the carrier circuit board away from the reflective membrane, and a surface of one side of the filling medium layer protruding from the carrier circuit board away from the reflective membrane is parallel to a surface of one side of the carrier circuit board away from the reflective membrane.

In one embodiment, the light emitting module further includes a leveling medium layer covering one side of the carrier circuit board far away from the reflective membrane, the leveling medium layer is spliced with the filling medium layer protruding out of the carrier circuit board, and one side surface of the filling medium layer protruding out of the carrier circuit board far away from the reflective membrane is flush with one side surface of the leveling medium layer far away from the reflective membrane.

In an embodiment, the light emitting module further includes a decorative film disposed on a side of the carrier circuit board away from the reflective film, and the decorative film at least covers a surface of a side of the filling medium layer exposed through the through structure, the side being away from the reflective film.

In an embodiment, the through structure includes at least one through hole and/or at least one through groove.

In one embodiment, the reflectivity of the reflective film is greater than or equal to 90%.

In another aspect, the present invention provides an electronic device, including a housing and the light emitting module according to any of the above embodiments, where the housing is provided with a transparent region, the light emitting module is disposed inside the housing, and the light emitting module is visually displayed on the housing through the transparent region.

Compared with the prior art, the invention has the beneficial effects that: in the light-emitting module provided by the invention, the through structures penetrating through the two opposite sides of the carrier circuit board are arranged on the carrier circuit board, the light rays emitted by the light-emitting chips and penetrating through the filling medium layer which wraps each light-emitting chip and at least covers the through structures are reflected by the reflecting film, and the light rays reflected by the reflecting film can penetrate through the parts, covering the through structures, of the filling medium layer and are emitted out through the through structures.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of a light emitting module according to an embodiment of the invention.

Fig. 2 is a schematic diagram of one embodiment of a carrier circuit board with a through structure.

Fig. 3 is a schematic diagram of another embodiment of a carrier circuit board with a through structure.

Fig. 4 is a schematic cross-sectional view of a light emitting module according to another embodiment of the invention.

Fig. 5 is a schematic cross-sectional view illustrating a light emitting module according to another embodiment of the invention.

Fig. 6 is a schematic cross-sectional view illustrating a light emitting module according to still another embodiment of the invention.

FIG. 7 is a schematic cross-sectional view of one embodiment of a decorative film.

Fig. 8 is a schematic perspective view of an electronic device according to an embodiment of the present invention.

Fig. 9 is a schematic perspective view of the electronic device shown in fig. 8 from another viewing angle.

Description of the main reference numbers:

1. a light emitting module; 5. a wireless charging module; 7. a camera module;

11. a carrier circuit board; 112. a through structure; 12. a light emitting chip; 13. filling the dielectric layer; 14. a light-reflecting membrane;

15. decorating the membrane; 151. a diaphragm body; 152. a translucent colored ink layer; 153. a light-equalizing ink layer; 154. a first texture layer; 155. a second texture layer; 1551. a microstructure; 1552. a brightness enhancement film; 16. leveling the dielectric layer;

100. a display panel; 300. a housing; 310. a transparent region; 1000. an electronic device.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

Referring to fig. 1, the present invention provides a light emitting module 1, which includes a carrier circuit board 11, a plurality of light emitting chips 12, a filling medium layer 13, and a reflective film 14.

Specifically, as shown in fig. 1, in the embodiment of the present invention, the carrier circuit board 11 is provided with through structures 112 penetrating through two opposite sides of the carrier circuit board in the thickness direction, the through structures 112 include, but are not limited to, one or a combination of two of through holes and through slots, and the number of the through holes and the through slots may be one or more, which is not limited thereto. The light emitting chips 12 are packaged on one side of the carrier circuit board 11 in the thickness direction, each light emitting chip 12 is used for emitting light under the driving of the carrier circuit board 11, and the packaging position of each light emitting chip 12 on the carrier circuit board 11 and the opening position of the through structure 112 are mutually staggered. The filling medium layer 13 is disposed on the carrier circuit board 11, and the filling medium layer 13 wraps each of the light emitting chips 12 and at least covers the through structure 112. The reflective film 14 covers a side of the filling medium layer 13 away from the carrier circuit board 11, the reflective film 14 is used for reflecting light (not limited to light indicated by a downward arrow shown in fig. 1) emitted by the light emitting chip 12 and passing through the filling medium layer 13, and light (not limited to light indicated by an upward arrow shown in fig. 1) reflected by the reflective film 14 passes through a portion of the filling medium layer 13 covering the through structure 112 and is emitted through the through structure 112. It is understood that the light emitted through the through structure 112 by covering the portion of the through structure 112 through the filling medium layer 13, i.e. the light emitted by the light emitting module 1. In order to improve the light reflection efficiency, in the embodiment of the present invention, the light reflection film 14 is a high-reflectivity light reflection film, and preferably, the reflectivity of the light reflection film is greater than or equal to 90%.

In the light emitting module 1 provided by the present invention, the through structures 112 penetrating through the opposite two sides of the carrier circuit board 11 are formed on the carrier circuit board 11, and the reflective membrane 14 is disposed on one side of the filling medium layer 13, which is away from the carrier circuit board 11, wrapping each light emitting chip 12 and at least covering the through structure 112, so that light emitted by the light emitting chip 12 and penetrating through the filling medium layer 13 can be reflected by the reflective membrane 14, further, light reflected by the reflective membrane 14 can penetrate through a portion of the filling medium layer 13 covering the through structure 112 and finally emitted through the through structure 112, so that a portion of the carrier circuit board 11 not provided with the through structure 112 can play a role of shielding reflected light, and the through structure 112 allows reflected light to pass through, so that bright and dark boundaries are obvious when the light emitting module 1 emits light, and the shape and arrangement of the through structure 112 are reasonably designed, so that a desired light emitting shape can be easily realized, which is favorable for expanding an application scene of the light emitting module 1.

For example, referring to fig. 2, in a possible implementation manner, the through structure 112 may be designed as a plurality of through holes (not limited to circular through holes) arranged in the carrier circuit board 11 in an array, and under the shielding effect of the carrier circuit board 11 and the light transmission effect of the through structure 112, the light emitting module 1 emits light and thus presents a plurality of light emitting points, so that the light emitting module can be applied to some application scenes requiring a plurality of light emitting points. For another example, referring to fig. 3, in another possible embodiment, the through structure 112 may also be designed as a serpentine through groove formed on the carrier circuit board 11, and under the shielding effect of the carrier circuit board 11 and the light transmission effect of the through structure 112, the light emitting module 1 emits light and is a serpentine light emitting strip, so that the light emitting module can be applied to some application scenarios requiring the serpentine light emitting strip. In other embodiments, the through structure 112 may also be designed in other shapes and arrangements according to actual needs, which is not described herein. The through structure 112 may be formed on the carrier circuit board 11 by, but not limited to, drilling, as long as the driving circuit on the carrier circuit board 11 is avoided, which is not described in detail herein.

It should be noted that, in the embodiment of the present invention, the carrier circuit board 11 may be a flexible circuit board provided with a driving circuit, or may be a printed circuit board provided with a driving circuit, and is preferably a flexible circuit board, so that the light emitting module 1 made by using the flexible circuit board as a carrier can be bent and folded as required, and is suitable for various occasions, and the application range of the light emitting module 1 is expanded.

Optionally, the light emitting chips 12 at least include one of LED, miniLED, and micro LED. As known to those skilled in the art, a light emitting chip such as an LED, a MiniLED, a micro LED, etc. can emit one of three primary colors (red light, blue light, green light) under the driving of its carrier circuit board, that is, the light emitted by the light emitting chip 12 is red light, or blue light, or green light. In the embodiment of the present invention, preferably, miniLED is adopted for each of the light emitting chips 12, and more preferably, blue MiniLED with high energy utilization rate is adopted for blue light, and the light emitted by each of the light emitting chips 12 is blue light. The light-emitting chips 12 are MiniLED light-emitting chips of the same type, so that not only can the design difficulty of the driving circuit on the carrier circuit board 11 be reduced, but also the size of the MiniLED is smaller than that of the LED and the micro LED, the thickness of the light-emitting module 1 (namely, the size perpendicular to the direction of the carrier circuit board 11) can be reduced, and the thickness of the electronic device using the light-emitting module 1 as a backlight source is reduced. One light emitting chip 12 may be disposed in the light emitting module 1, or a plurality of light emitting chips 12 may be disposed therein. Preferably, in the embodiment of the present invention, the number of the light emitting chips 12 is multiple and the light emitting chips are arranged in a uniform array of rows and columns to ensure the uniformity of the light emission of the light emitting module 1.

As described above, the light emitted from the light emitting chip 12 using the LED, the MiniLED or the micro LED is one of red light, blue light or green light, while in the related art, the light emitted from the light emitting module 1 is usually other colors (generally, white light) than the three primary colors, and therefore, in the embodiment of the present invention, the filling medium layer 13 and/or the reflective film 14 are also used for converting the color of the light emitted from the light emitting chip 12.

Specifically, in a possible embodiment, the filling medium layer 13 may be a transparent colloid layer, and the reflective film 14 is a color reflective film, wherein the light emitted from the light emitting chip 12 has a first color, the color reflective film has a second color, and the color reflective film is used for converting the color of the light emitted from the light emitting chip 12 into a predetermined third color. For example, in an embodiment, the light emitting chip 12 is a blue MiniLED, the first color of the light emitted by the light emitting chip is blue, and accordingly, the reflective film 14 may be a color reflective film with a fluorescent yellow color (i.e., the second color), so that the color of the light does not change when the blue light emitted by the light emitting chip 12 passes through the filling medium layer 13 with a transparent adhesive layer, but the blue light and the fluorescent yellow color are mixed to form a white (i.e., the third color) light when the blue light irradiates on the reflective film 14 with the fluorescent yellow color, and the white light passes through the transparent adhesive layer covering the through structure 112 under the reflection of the reflective film 14, so that the white light is emitted through the through structure 112, and the light emitting module 1 finally emits the white light. It is understood that, in other embodiments, when the light emitted by the light emitting chip 12 has a color other than blue, the reflective film 14 may adopt a color reflective film having a corresponding color, so that the color of the light emitted by the light emitting chip 12 is harmoniously converted into white light, which is not described in detail herein. Of course, when the light emitting module 1 needs to emit light of other colors than white light, that is, when the predetermined third color is other colors than white, the color of the light emitted by the light emitting chip 12 and the color of the color reflective film may also be configured reasonably so that the two are blended into the predetermined third color, for example, when the light emitted by the light emitting chip 12 is red and the reflective film 14 is a blue color reflective film, the light emitting module 1 may emit purple light.

It can be further understood that, in the above embodiment, the transparent glue layer plays a role of filling and bonding, so that the thickness of the transparent glue layer (i.e. the filling medium layer 13) does not need to be very thick, thereby reducing the overall thickness and volume of the light emitting module 1, and enabling the light emitting module 1 to be applied in some narrow spaces. In addition, the light emitting chip 12 is located between the reflective film 14 and the portion of the carrier circuit board 11 not opened with the through structure 112, and the light emitting chip 12 is shielded, so that even if the thickness of the transparent colloidal layer is small, the outline of the light emitting chip 12 will not be exposed through the transparent colloidal layer, and the appearance of the light emitting module 1 will not be affected. The transparent colloidal layer can adopt any one of the existing transparent optical glues, and the transparent colloidal layer is not limited; the color reflective film may be obtained by, but not limited to, attaching a color fluorescent film to a base sheet (not limited to PET), and is not limited thereto.

Optionally, auxiliary substances such as, but not limited to, diffusion powder may also be added to the transparent colloidal layer to achieve beneficial effects such as brightening the light emitted by the light emitting chip 12, as long as the auxiliary substances do not affect the propagation of the light emitted by the light emitting chip 12, and details are not described here.

In another possible embodiment, the filling medium layer 13 may also be a light conversion medium layer (such as a fluorescent glue layer or a QD glue layer), and the reflective film 14 is a mirror reflective film (i.e., a film capable of performing a mirror reflection function), wherein the light emitted from the light emitting chip 12 has a first color, and the light conversion medium layer has a second color, and the light conversion medium layer is used for converting the color of the light emitted from the light emitting chip 12 into a predetermined third color. For example, in an embodiment, the light emitting chip 12 is a blue MiniLED, the first color of the light emitted by the light emitting chip is blue, and accordingly, the light conversion medium layer may adopt a phosphor layer with a yellow phosphor color (i.e., the second color), so that when the blue light emitted by the light emitting chip 12 passes through the phosphor layer with the yellow phosphor color, the blue light is converted into a light close to white, the light does not change in color when the light irradiates the reflective film 14 with a mirror reflective film, and when the light passes through the phosphor layer covering the through structure 112 under the reflection of the reflective film 14, the light is converted into a light with a white color (i.e., the third color) again through the phosphor layer covering the through structure 112, and is emitted through the through structure 112, so that the light emitting module 1 finally emits a white light. The mirror surface reflective film can be, but is not limited to, a mirror surface aluminum film, a mirror surface terylene film, a mirror surface PET film or a high-brightness mirror surface reflective film plated with chrome on the surface of an ABS plastic sheet, and the mirror surface reflective film is not limited to this.

In other embodiments, when the light emitted by the light emitting chip 12 has a color other than blue, the filling medium layer 13 may adopt a light conversion medium layer having a corresponding color, so that the color of the light emitted by the light emitting chip 12 is harmoniously converted into white light, which is not described in detail herein.

It can be understood that, after the light emitted by the light emitting chip 12 passes through the light conversion medium layers with different thicknesses, the colors of the converted light are different, in other words, the color of the light emitted by the light emitting chip 12 and irradiated on the reflective membrane 14 through the light conversion medium layer (i.e., the light reflected by the reflective membrane 14) is different from the color of the light emitted by the light emitting chip 12, and is also different from the color of the light emitted by the reflective membrane 14 and emitted through the light conversion medium layer and the corresponding through structure 112 (i.e., the light emitted by the light emitting module 1), and the color of the light emitted by the light emitting module 1 can be adjusted by reasonably designing the thickness of the light conversion medium layer. Therefore, when the light emitting module 1 needs to emit light of a color other than white light, that is, when the predetermined third color is other than white, the color of the light emitted by the light emitting chip 12 and the color of the light conversion medium layer may also be configured reasonably so that the two are blended into the predetermined third color, for example, when the light emitted by the light emitting chip 12 is red and the light conversion medium layer is blue, the light emitting module 1 may emit violet light. The specific conversion principle of the light conversion medium layer for converting light color is the same as that of the existing fluorescent glue layer or QD glue layer, and is not described in detail herein.

It can also be understood that the light emitted by the light emitting chip 12 passes through the light conversion medium layer and is reflected by the reflective membrane 14, and then passes through the light conversion medium layer again to cover the part of the through structure 112 and finally passes through the through structure 112 to be emitted, i.e. the light emitted by the light emitting chip 12 is extended by the reflection action of the reflective membrane 14, so that the length of the propagation path in the light conversion medium layer is extended, the thickness of the light conversion medium layer (i.e. the filling medium layer 13) can be reduced, and the overall thickness and volume of the light emitting module 1 are reduced, so that the light emitting module 1 can be applied to some narrow spaces. Similar to the previous embodiment, the light emitting chip 12 is located between the reflective film 14 and the portion of the carrier circuit board 11 where the through structure 112 is not opened, the light emitting chip 12 is shielded, and even if the thickness of the light conversion medium layer is reduced, the outline of the light emitting chip 12 will not be exposed through the light conversion medium layer, so that the appearance of the light emitting module 1 will not be affected.

In the above two embodiments, the light emitting module 1 only emits light through the portion of the filling medium layer 13 (transparent glue layer or light conversion medium layer) covering the through structure 112, and the portion of the filling medium layer 13 covering the through structure 112 occupies a smaller area in the whole filling medium layer 13, so that the problem that the light emitting effect of the light emitting module 1 is affected by the presence of bubbles, foreign matters and other defects in the filling medium layer 13 can be greatly reduced, and the light emitting module 1 can be ensured to have a better light emitting effect.

In the embodiment of the present invention, the filling medium layer 13 may not only cover the through structure 112, but also fill the through structure 112.

Specifically, referring to fig. 1 again, in an embodiment of the present invention, the filling medium layer 13 may further fill the entire through structure 112, and a side surface of the filling medium layer 13 in the through structure 112, which is away from the reflective membrane 14, is flush with a side surface of the carrier circuit board 11, which is away from the reflective membrane 14. Referring to fig. 4, in another embodiment of the present invention, the filling medium layer 13 may also fill a portion of the through structure 112 close to the reflective film 14, and a surface of the filling medium layer 13 in the through structure 112, which is far away from the reflective film 14, is lower than a surface of the carrier circuit board 11, which is far away from the reflective film 14, and preferably, the two surfaces are parallel to each other. Referring to fig. 5 and fig. 6, in another embodiment of the present invention, the filling medium layer 13 may also fill the entire through structure 112 and protrude from the side of the carrier circuit board 11 away from the reflective film 14, and a surface of the filling medium layer 13 protruding from the carrier circuit board 11 away from the reflective film 14 is parallel to a surface of the carrier circuit board 11 away from the reflective film 14.

In the above embodiment, at least a part of the through structure 112 is filled with the filling dielectric layer 13, so that the adhesive area between the colloid filling dielectric layer 13 and the carrier circuit board 11 can be increased, and the connection strength between the filling dielectric layer 13 and the carrier circuit board 11 can be enhanced; the surface of the filling medium layer 13 exposed through the through structure 112 (i.e. the surface of the side far from the reflective membrane 14) is configured to be parallel to the surface of the side far from the reflective membrane 14 of the carrier circuit board 11, which is helpful to improve the light emitting uniformity of the light emitting module 1.

Further, in the embodiment shown in fig. 1 and 4, the light emitting module 1 further includes a decorative film 15 disposed on a side of the carrier circuit board 11 away from the reflective film 14, wherein the decorative film 15 at least covers a side surface of the through structure 112 of the filling medium layer 13 away from the reflective film 14, that is, at least covers a side surface of the filling medium layer 13 exposed through the through structure 112 away from the reflective film 14, and preferably, the decorative film 15 covers an entire surface of the carrier circuit board 11 on a side away from the reflective film 14. The decorative film 15 not only can play a decorative role, but also can protect the filling medium layer 13 in the through structure 112, so as to prevent the filling medium layer 13 from being damaged, thereby being beneficial to ensuring the light-emitting uniformity of the light-emitting module 1. Moreover, the decorative film 15 covers the whole surface of one side of the carrier circuit board 11 far away from the reflective film 14, and is also favorable for improving the overall appearance delicacy of the light emitting side of the light emitting module 1.

In the embodiment shown in fig. 5 and 6, the light emitting module 1 may also include a decorative film 15 disposed on a side of the carrier circuit board 11 away from the reflective film 14, wherein the decorative film 15 at least covers a surface of the filling medium layer 13 protruding from the carrier circuit board 11 away from the reflective film 14. It can be understood that the decorative film 15 can also play a decorative role, and can also protect the filling medium layer 13 protruding from the carrier circuit board 11, so as to prevent the filling medium layer 13 from being damaged, thereby ensuring the light-emitting uniformity of the light-emitting module 1.

As shown in fig. 5, in a possible embodiment, when the filling medium layer 13 protrudes from the carrier circuit board 11, the decorative film 15 may only cover a surface of the filling medium layer 13 protruding from the carrier circuit board 11, so that a height difference is formed between a portion of the light emitting side of the light emitting module 1 not covered by the decorative film 15 and a portion covered by the decorative film 15, and a depth of field effect with a layered sense and a stereoscopic sense may be generated, and the depth of field effect felt by a user when observing the light emitting side of the light emitting module 1 at different angles is different, so that an aesthetic appearance of the light emitting module 1 may be improved, and a better visual experience may be brought to the user.

In addition, as shown in fig. 6, in another possible embodiment, when the filling medium layer 13 protrudes from the carrier circuit board 11, the light emitting module 1 may further include a leveling medium layer 16 covering one side of the carrier circuit board 11 away from the reflective membrane 14, the leveling medium layer 16 is spliced with the filling medium layer 13 protruding from the carrier circuit board 11, and a surface of one side of the filling medium layer 13 protruding from the carrier circuit board 11 away from the reflective membrane 14 is flush with a surface of one side of the leveling medium layer 16 away from the reflective membrane 14, so that the decorative membrane 15 may cover a surface of one side of the leveling medium layer 16 away from the reflective membrane 14 and a surface of one side of the filling medium layer 13 protruding from the carrier circuit board 11 away from the reflective membrane 14, that is, the decorative membrane 15 covers the entire surface of one side of the carrier circuit board 11 away from the reflective membrane 14, which is beneficial to improve the overall appearance fineness of the light emitting side of the light emitting module 1. Alternatively, the leveling medium layer 16 may be, but is not limited to, a transparent glue layer or a white glue layer.

In the above embodiment, the decorative film 15 is disposed on the side of the carrier circuit board 11 away from the light emitting chips 12, so that the decorative film is not affected by the unevenness of the surfaces of the light emitting chips 12, thereby avoiding the deformation of the decorative film 15 and improving the flatness of the appearance of the light emitting module 1.

Referring to fig. 7, the decorative film 15 in the above embodiment may specifically include a film body 151 and a decorative layer disposed on the film body 151, where the decorative layer includes at least one of a translucent color ink layer 152, a light-equalizing ink layer 153, and a texture layer, and the texture layer is transparent or translucent.

The material of the diaphragm body 151 may be, but is not limited to, one or a combination of PET, fiberglass plate, glass, and PMMA; the translucent color ink layer 152, the light-equalizing ink layer 153, and the texture layer can transmit the light emitted from the light-emitting module 1 through the through structure 112. The translucent color ink layer 152 is used for enabling the decorative film 15 to have the same color as the translucent color ink layer 152 when the light emitting chip 12 does not emit light, the texture layer is used for enabling the decorative film 15 to have at least one appearance effect of a pattern effect, a dazzling effect, a matte effect and a color change effect when the light emitting chip 12 does not emit light, and the light-equalizing ink layer 153 is used for enabling light rays penetrating through the through structure 112 and further penetrating through the light-equalizing ink layer 153 to be uniformly dispersed when the light emitting chip 12 emits light, so that the light emitting uniformity of the light emitting module 1 is further improved.

Preferably, in the embodiment shown in fig. 7, the decorative layer includes the translucent color ink layer 152, the light-equalizing ink layer 153, the first texture layer 154, and the second texture layer 155.

The translucent color ink layer 152 allows light emitted from the through structure 112 to pass through, and enables the light emitting module 1 to be colored when the light emitting module 1 does not emit light, thereby improving the aesthetic appearance of the light emitting module 1. The light-equalizing ink layer 153 can have a light-equalizing effect, so that the light-emitting uniformity of the light-emitting module 1 is improved.

The translucent color ink layer 152 and the light-equalizing ink layer 153 are both formed on a surface of one side of the film body 151 close to the carrier circuit board 11, and the translucent color ink layer 152 is located between the film body 151 and the light-equalizing ink layer 153. Of course, the translucent color ink layer 152 may also be disposed on a side of the light-equalizing ink layer 153 away from the film body 151. In the embodiment of the present invention, the light-equalizing ink layer 153 may be one or more layers, and compared with a single layer of light-equalizing ink layer, a plurality of layers of light-equalizing ink layers are provided, so that the light-emitting uniformity of the light-emitting module 1 can be further improved.

It can be understood that the translucent color ink layer 152 may be formed by printing using a conventional translucent color ink, and similarly, any of the light-equalizing ink layers may be formed by printing using a conventional light-equalizing ink (usually white ink), which is not described herein again.

As shown in fig. 7, in an embodiment of the invention, the second texture layer 155 includes a plurality of microstructures 1551 disposed on a surface of the diaphragm body 151 away from the carrier circuit board 11, and a brightness enhancement film 1552 for covering the plurality of microstructures 1551, each of the microstructures 1551 has at least one reflection surface, an included angle between the reflection surface and the diaphragm body 151 is greater than 90 degrees, and the second texture layer 155 is configured to exhibit a glare effect. The first texture layer 154 is disposed on a side surface of the brightness enhancement film 1552 away from the film body 151, and the first texture layer 154 includes at least one of linear texture, coil texture, and wave texture, and the stripe texture may be arranged according to a predetermined pattern, such that the first texture layer 154 is configured to exhibit a pattern effect.

Through form in proper order on the diaphragm body 151 of decorating diaphragm 15 second texture layer 155 with first texture layer 154, work as light-emitting module 1 does not give out light and have the light irradiation on decorating diaphragm 15, the texture pattern of first texture layer 154 can appear clearly to make the user watch with the pattern of predetermineeing that the texture on the first texture layer 154 corresponds, can promote decorating diaphragm 15 gives the aesthetic feeling that light-emitting module 1 brought. Moreover, light can further irradiate on the second texture layer 155 through the transparent or semitransparent first texture layer 154, and the second texture layer 155 comprises a plurality of microstructures 1551 with reflecting surfaces, so that the light irradiating on the decorative film 15 can be reflected in multiple angles and the brightness of the light is improved under the action of the brightness enhancement film 1552, and thus, a glare effect can be presented, visual dead angles of the decorative film 15 can be reduced, and the brightness of the decorative film 15 is improved. In addition, a certain optical path difference exists between the reflected lights of the first texture layer 154 and the second texture layer 155, so that the brightness of the reflected lights of different texture layers is differentiated, the contrast between different texture layers of the decorative film 15 can be increased, and the appearance effects of the different texture layers are overlapped, the gradation is clearer, and the spatial stereoscopic effect is stronger. It is further understood that the color of the translucent color ink layer 152 and the glare effect of the second texture layer 155 may cause at least a portion of the decorative film 15 to exhibit a glare color, and the glare color and the area of the decorative film 15 that generates glare may change according to the viewing angle of the user.

It should be noted that the brightness enhancement film 1552 in the second texture layer 155 may be formed by using an existing film plating process, and the brightness enhancement film 1552 covers the plurality of microstructures 1551, so that the brightness of light reflected by the plurality of microstructures 1551 can be improved, and the brightness of the decorative film 15 can be further improved, and the flatness of the second texture layer 155 can be improved by covering the brightness enhancement film 1552 on the plurality of microstructures 1551, and the first texture layer 154 can be more favorably formed on the flatter second texture layer 155. It should be noted that the first texture layer 154 and the second texture layer 155 can be prepared by any one of the existing texture forming methods, including but not limited to printing, pad printing, CNC and the like. Specifically, in the embodiment of the present invention, the first texture layer 154 and the second texture layer 155 may be formed by printing UV texture glue, and by adjusting the thickness of the printed UV texture glue and controlling the printing process, etc., a texture layer having a certain thickness dimension is formed, so as to obtain a better texture effect.

Alternatively, in the embodiment of the present invention, the stripe texture on the first texture layer 154 may be, but is not limited to, one or more of a linear texture, a spiral texture, a coil texture, and a wave texture, which are not limited thereto.

Still alternatively, as shown in fig. 7, in an embodiment of the invention, each of the microstructures 1551 in the second texture layer 155 may be, but is not limited to, a pyramid structure or a frustum structure. Specifically, in the embodiment shown in fig. 7, the plurality of microstructures 1551 are rectangular pyramid structures arranged in an array, and each of the microstructures 1551 comprises four reflecting surfaces (i.e., four sides of the rectangular pyramid). Of course, in other embodiments, the microstructures 1551 may also be a plurality of triangular pyramid structures arranged in an array, or a plurality of pentagonal pyramid structures, or other pyramid structures having a plurality of reflective surfaces, which is not limited herein. In the embodiment shown in fig. 7, each of the microstructures 1551 in the second texture layer 155 has a plurality of reflective surfaces, so that multi-angle reflection of light can be realized, a user can receive light reflected by the decorative film 15 in a wide range, and the brightness and the flatness of the decorative film 15 can be improved. Certainly, in other embodiments, the plurality of microstructures 1551 may also be a plurality of frustum structures arranged in an array, each microstructure 1551 includes an annular reflecting surface (i.e., an annular conical surface of the frustum structure), so that multi-angle reflection of light can be realized, and the brightness and the flatness of the decorative film 15 are improved, which is not described herein again.

It can be understood that, in the embodiment of the present invention, an included angle exceeding 90 degrees is formed between the reflection surface of each microstructure 1551 and the film body 151, and if the included angle is too small, that is, the inclination degree of the reflection surface with respect to the film body 151 is too large, a user can only receive the light reflected by the reflection surface from a side view, so that the surface flatness of the decorative film 15 in appearance is reduced; on the contrary, if the included angle is too large, that is, the inclination degree of the reflection surface relative to the film body 151 is too small, the user can only receive the light reflected by the reflection surface from the front view angle or the near front view angle, but the user often looks at the decorative film 15, which reduces the brightness of the decorative film 15. Therefore, the included angle between the reflection surface of each microstructure 1551 and the diaphragm body 151 should be designed reasonably, and is preferably in the range of 120 degrees to 160 degrees.

It should be noted that, in the embodiment of the present invention, the filling medium layer 13, the reflective film 14, the decorative film 15, and the leveling medium layer 16 may be formed by, but not limited to, molding, which is not described in detail herein.

Further, referring to fig. 8, the present invention also provides an electronic device 1000, where the electronic device 1000 is not limited to a mobile phone, a tablet, a display, and other electronic devices. As shown in fig. 8, the electronic device 1000 includes a housing 300 and a display panel 100 disposed on a front surface of the housing 300 (i.e., a surface facing a user when the user uses the electronic device 1000).

Further, referring to fig. 9, in some embodiments of the present invention, the housing 300 is provided with a transparent area 310, the light emitting module 1 according to any one of the above embodiments is disposed on the inner side of the housing 300, and the light emitting module 1 can be visually displayed on the housing 300 through the transparent area 310. It can be understood that, since the light-emitting module 1 in the electronic device 1000 provided by the present invention includes all the technical solutions of all the embodiments, at least all the advantages brought by the technical solutions of the embodiments are provided, that is, the light-emitting module 1 has a clear bright-dark boundary when emitting light, so that a desired light-emitting shape can be displayed, which is helpful to improve the aesthetic feeling when the light-emitting module 1 is visually displayed through the transparent area 310.

It should be noted that, similar to the existing electronic device, the electronic device 1000 may further include other electronic components such as a control module, a camera module, a wireless charging module, a memory, a sensor, and the like. The carrier circuit board 11 in the light emitting module 1 may be electrically connected to a control module of the electronic device 1000, and the control module may control the light emitting chip 12 on the carrier circuit board 11 to emit light or not to emit light, so that the light emitting chip 12 is used to indicate states of charging, incoming call information, and the like of the electronic device 1000, and interaction between the states of the light emitting module 1 and the electronic device 1000 is achieved.

As shown in fig. 9, in the embodiment of the present invention, the housing 300 includes a rear cover opposite to the display panel 100, and a middle frame for fixing the display panel 100 and the rear cover. Alternatively, the rear cover and the middle frame may be made of a transparent material (not limited to glass, transparent plastic, etc.) wholly or partially, and the transparent portions of the rear cover and the middle frame constitute the transparent area 310. In the embodiment shown in fig. 9, the entire rear cover of the housing 300 is made of a transparent material, i.e., the entire rear cover is a transparent area 310. The transparent region 310 is formed by integrally forming the rear cover, which not only facilitates processing and preparation, but also enables a plurality of electronic components such as the camera module 7 and the wireless charging module 5 in the electronic device 1000 to be visually displayed on the housing 300 through the transparent rear cover (i.e., the transparent region 310), so that a user can see a variety of electronic components and arrangement thereof on the back of the electronic device 1000, and the technology sense and the overall aesthetic feeling of the electronic device 1000 are improved.

Preferably, in the embodiment of the present invention, the light emitting module 1 is disposed around a portion of the electronic component visually displayed on the housing 300. For example, in the embodiment shown in fig. 9, the camera module 7 and the wireless charging module 5 of the electronic device 1000 are both visually displayed on the housing 300 through the transparent area 310, and one of the light emitting modules 1 is respectively disposed around the camera module 7 and the wireless charging module 5. So, when the camera module 7 is used for shooing, the control module of the electronic device 1000 can control the light-emitting module 1 around the camera module 7 to supplement light, so that the shooting effect is improved, and the defects that the electronic device 1000 is excessively exposed by a flash lamp and the like are avoided. Similarly, when wireless charging module 5 is used for charging, electronic equipment 1000's control module can control wireless charging module 5 is around luminous module 1 reminds to the suggestion user electronic equipment 1000's current progress of charging, for example luminous module 1 presents a plurality of luminous points when giving out light, through showing the luminous point of different quantity in order to indicate the progress of charging.

In other embodiments, the electronic device 1000 may also be configured with a plurality of the light emitting modules 1 at different positions inside the housing 300, so that the plurality of light emitting modules 1 form a predetermined pattern together, which is not described in detail herein.

It is understood that, in the electronic device 1000, the light-emitting module 1 included therein may be the light-emitting module 1 according to any of the embodiments, so that at least all the advantages brought by the technical solutions of the embodiments are provided, and for the more detailed description, reference may be made to the relevant contents of the light-emitting module 1 according to the foregoing embodiments, and details are not repeated here.

In the description of the present invention, reference to the description of the terms "embodiment," "specific embodiment," "example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A light emitting module, comprising:

the carrier circuit board is provided with a through structure along the thickness direction;

the light-emitting chips are packaged on one side of the carrier circuit board, and each light-emitting chip is used for emitting light under the driving of the carrier circuit board, wherein the packaging positions of the light-emitting chips on the carrier circuit board and the opening positions of the through structures on the carrier circuit board are mutually staggered;

the filling dielectric layer is arranged on the carrier circuit board, wraps each light-emitting chip and at least covers the through structure; and

the light reflecting film is used for reflecting the light rays emitted by the light emitting chip and penetrating through the filling medium layer, and the light rays reflected by the light reflecting film penetrate through the part, covering the through structure, of the filling medium layer and are emitted out through the through structure.

2. The illumination module of claim 1, wherein the filling medium layer is a transparent colloidal layer, and the reflective film is a color reflective film, wherein the light emitted from the illumination chip has a first color, the color reflective film has a second color, and the color reflective film is used for converting the color of the light emitted from the illumination chip into a predetermined third color.

3. The illumination module of claim 1, wherein the filling medium layer is a light conversion medium layer, and the reflective film is a mirror reflective film, wherein the light emitted from the light emitting chip has a first color, the light conversion medium layer has a second color, and the light conversion medium layer is configured to convert the color of the light emitted from the light emitting chip into a predetermined third color.

4. The illumination module of claim 1, wherein the filling medium layer further fills the entire through structure, and a surface of the filling medium layer away from the reflective film in the through structure is flush with a surface of the carrier circuit board away from the reflective film;

or the filling medium layer also fills the part of the through structure close to the reflective membrane, and the surface of one side of the filling medium layer in the through structure, which is far away from the reflective membrane, is lower than the surface of one side of the carrier circuit board, which is far away from the reflective membrane.

5. The illumination module of claim 1, wherein the filling medium layer further fills the entire through structure and protrudes from the side of the carrier circuit board away from the reflective film, and a surface of the filling medium layer protruding from the carrier circuit board away from the reflective film is parallel to a surface of the carrier circuit board away from the reflective film.

6. The lighting module of claim 5, further comprising a leveling medium layer covering a side of the carrier circuit board away from the reflective film, wherein the leveling medium layer is connected to the filling medium layer protruding from the carrier circuit board, and a surface of the filling medium layer protruding from the carrier circuit board away from the reflective film is flush with a surface of the leveling medium layer away from the reflective film.

7. The lighting module of any one of claims 4 to 6, further comprising a decorative film disposed on a side of the carrier circuit board away from the reflective film, wherein the decorative film covers at least a surface of a side of the filling medium layer away from the reflective film exposed by the through structure.

8. The illumination module according to claim 1, wherein the through structure comprises at least one through hole and/or at least one through groove.

9. The lighting module of claim 1, wherein the reflective membrane has a reflectivity of greater than or equal to 90%.

10. An electronic device, comprising a housing and the light emitting module of any one of claims 1 to 9, wherein the housing is provided with a transparent region, the light emitting module is provided on the inner side of the housing, and the light emitting module is visually displayed on the housing through the transparent region.

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