CN115812205A - 具有集成传感器模块的弹性传感器部件 - Google Patents
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Abstract
一种弹性传感器部件(1)，其包括由弹性体材料制成的部件主体(2)和嵌入在部件主体(2)内的传感器模块(3)，该传感器模块(3)包括传感器芯片(4)、电连接到传感器芯片(4)的射频应答器芯片(5)和电连接到射频应答器芯片(5)的环形天线(6)；其中，所述弹性传感器部件(1)还包括增强天线(7)，该增强天线(7)包括增强天线环(71)，其中，所述增强天线环(71)放置在所述部件主体(2)的表面上，以便允许与所述环形天线(6)进行近场数据通信和能量传递。
Description
技术领域
本发明涉及一种弹性传感器部件，其具有嵌入在弹性体材料的部件主体内的集成传感器模块。它还涉及包括弹性传感器部件的传感器系统和用于制造弹性传感器部件的方法。
背景技术
US2018174015和EP3578395描述了一种包括射频应答器(RFID)的电子元件，该射频应答器包括电子芯片，该电子芯片配备有电连接到电子芯片的主天线和与射频阅读器通信的辐射天线。主天线电磁耦合到辐射天线，该辐射天线可以是形成电偶极子的单股螺旋弹簧。包括辐射天线的电子元件完全嵌入橡胶(例如轮胎)中。EP3632666描述了一种完全嵌入橡胶中的类似设备。该设备可以包括传感器。由于辐射天线相对较大的尺寸和精细的结构，这些已知设备的制造是复杂的，并且容易出现制造缺陷。一般来说，嵌入部分越大，越难以实现与周围弹性体材料的良好结合。
WO18226782描述了一种完全嵌入由弹性体材料制成的小物品中的电子设备。该设备可以包括能够以无线方式与相应的读取设备通信的传感器和RFID元件。然而，该电子设备没有次级辐射或辅助天线，导致仅有限的读取范围。
发明内容
本发明的一个目的是提供一种具有由弹性体材料制成的部件主体的弹性传感器部件，该弹性传感器部件主体包括嵌入在部件主体内的传感器模块，该传感器模块能够检测弹性体材料内的参数并将这些参数传送到外部设备。另一个目的是提供这样的部件，其在制造中具有成本效益，并且不容易出现制造缺陷，例如在弹性体材料中包含气泡。
本发明的至少一个目的通过根据权利要求1的弹性传感器部件和根据权利要求8的传感器系统来实现。弹性传感器部件包括由弹性体材料制成的部件主体和嵌入在部件主体内的传感器模块。传感器模块包括传感器芯片、电连接到传感器芯片的射频应答器芯片以及电连接到射频应答器芯片的环形天线。弹性传感器部件还包括增强天线，该增强天线包括增强天线环，其中增强天线环放置(例如，通过印刷)在部件主体的表面上，以便允许与环形天线的近场数据通信和能量传递。因此，要嵌入到部件主体中的部分，即传感器模块，可以设计得非常小，具有简单的形状，例如，尺寸和形状与一欧分硬币一样小或者甚至更小。这种传感器模块设计可以承受弹性体材料硫化过程中的高温和高压。硫化后，更易碎的增强天线放置在部件主体上。优选地，传感器模块完全嵌入在部件主体中。另一方面，传感器模块的一部分，例如传感器芯片的感测部分，可以露出表面，从而不被弹性体材料覆盖。
优选地，增强天线环在预定距离处与传感器模块的环形天线同心对齐。
环形天线和增强天线环的形状和尺寸被设计成实现最佳的数据和能量传输，同时尽可能小。环优选为圆形。增强天线环可以具有与环形天线相同或比环形天线更大的直径。环之间的间距可以在1mm到5mm的范围内。
在从属权利要求中阐述了本发明的其他实施例。
在一些实施例中，增强天线可以包括两个增强天线臂。增强天线臂可以是直的或曲折状的形状，和/或增强天线臂和增强天线环布置在平面内。还可能的是，增强天线臂与增强天线环的平面成一角度。
在一些实施例中，增强天线臂可以与增强天线环一起放置在部件主体的表面上。可选地，增强天线臂可以至少部分地远离弹性体突出，并且可以放置在不同于弹性体的部分上或者由不同于弹性体的部分形成。
在一些实施例中，可以通过印刷将增强天线放置在表面上，例如使用已知的印刷技术，诸如丝网印刷、苯胺印刷、凹版(gravure)印刷、凸版印刷、喷墨印刷、压电喷墨印刷、气溶胶喷射印刷、模版印刷、胶版印刷、刮刀印刷、旋转丝网印刷、凹版(intaglio)印刷、数字印刷、毛细管印刷、电流体动力印刷、印迹印刷、微接触印刷、激光印刷；涂层或层压技术。
在一些实施例中，放置在部件主体的表面上的增强天线可以覆盖有不同于部件主体的材料的介电层，例如介电箔或介电墨或漆。介电墨通常由溶剂中的有机聚合物或陶瓷组成。新型绝缘2D纳米材料如六方氮化硼进一步提供了温度和电化学稳定性。介电箔可以由有机聚合物组成，并且可以包括陶瓷粉末。使用基于填充有氧化铝的硅氧烷聚合物组合物的介电墨取得了良好的效果，产生了半透明和可拉伸的膜。
在一些实施例中，用于增强天线的材料可以从导电聚合物、碳、有机/金属化合物、金属前体和金属纳米粉末的组中选择。优选地，增强天线的材料是可拉伸的材料，例如可拉伸的银墨。该材料可选自金属墨和/或金属盐墨，例如Ag/AgCl、Cu和Ni、非金属墨，例如碳基墨(石墨烯、碳纳米管)、PEDOT：PSS及其中的组合。该材料可以与可拉伸的载体材料(例如聚硅氧烷或PU或含氟弹性体)结合。用银-硅氧烷聚合物组合物已经取得了良好的效果。
在一些实施例中，部件主体的弹性体材料可以是热固性弹性体或热塑性弹性体(TPE)。弹性体材料可以是例如合成或天然橡胶，例如丁基橡胶、异戊二烯橡胶、丁二烯橡胶、卤化丁基橡胶(例如溴化丁基橡胶)、乙烯丙烯三元共聚物、硅橡胶、氟弹性体或全氟弹性体、氯磺酸盐、聚丁二烯、丁基橡胶、氯丁橡胶、丁腈(nitrile)橡胶、聚异戊二烯橡胶、丁腈(buna-N)橡胶、共聚物橡胶，例如乙烯-丙烯(EPR)、乙烯-丙烯-二烯单体(EPDM)、丙烯腈-丁二烯(NBR或HNBR)和苯乙烯-丁二烯(SBR)、共混物，例如乙烯或丙烯-EPDM、EPR或NBR，以及其中的组合。术语“合成橡胶”还应理解为包括可替代地被广泛分类为热塑性或热固性弹性体的材料，例如聚氨酯、硅酮、氟硅酮、苯乙烯-异戊二烯-苯乙烯(SIS)和苯乙烯-丁二烯-苯乙烯(SBS)，以及表现出类似橡胶性能的其它聚合物，例如增塑尼龙、聚烯烃、聚酯、乙烯醋酸乙烯酯、含氟聚合物和聚氯乙烯。
在一些实施例中，弹性传感器部件可以包括不同于传感器模块的插入部件，该插入部件至少部分嵌入部件主体内。这种插入部件可以是泵隔膜或阀膜的杆或栓，或者注射器的柱塞。如果插入部件从部件主体突出，则增强臂可以至少部分地放置在插入部件上或由插入部件形成。
本发明还涉及一种传感器系统，该传感器系统包括如上所述的弹性传感器部件和配备有通信模块的射频(RFID)读取器设备，该通信模块用于通过增强天线向弹性传感器部件的传感器模块提供能量，并通过增强天线从传感器模块读取数据。感测的数据可以从弹性体部件的外部无线读出。
本发明还涉及一种用于制造如上所述的弹性传感器部件的方法，包括以下步骤：(a)使用模制技术，例如压缩模制(CM)、注射模制(IM)、传递模制(TM)、注射传递模制(ITM)或注射压缩模制(ICM)，将传感器模块嵌入弹性体材料的部件主体中；(b)将增强天线放置在部件主体的表面上，与传感器模块的环形天线对齐。
在该过程的一些实施例中，传感器模块可以通过将传感器模块放置在两层弹性体材料之间并利用嵌入的传感器模块压缩模制部件主体来嵌入。
传感器模块的表面可以改性以在模块和弹性体之间获得更好的结合。优选地，传感器模块在步骤a)之前用粘合剂涂覆或覆盖，或者通过等离子体或电晕处理进行改性。
可以用不同于部件主体的材料的介电层来保护增强天线。在放置增强天线之前，可以对部件主体的表面进行改性，以增加增强天线对部件主体的粘附力，优选地通过用粘合剂涂覆或者通过等离子体或电晕处理。
弹性传感器部件可应用于诸如弹性体部件的预测性维护、敏感弹性体部件的实时监控、弹性体部件的故障检测或设计迭代的表征等领域。
附图说明
下面参考附图中示出的实施例更详细地描述本发明。这些附图表明：
图1为弹性传感器部件的透视图；
图2为图1的弹性传感器部件的俯视图；
图3为图1的弹性传感器部件的侧视图，以及
图4为使用图1的部件的传感器系统的示意图。
具体实施方式
图1示出了弹性传感器部件1的透视图，该弹性传感器部件1包括弹性体材料的部件主体2、传感器模块3和增强天线7。在所示的例子中，传感器模块3完全嵌入在部件主体2中。可选地，传感器模块的一部分，例如传感器芯片的感测部分，可以露出表面，从而不被弹性体材料覆盖。部件主体2显示为透明的，以看到传感器模块3。图2示出了图1的弹性传感器部件的俯视图，图3示出了图1的弹性传感器部件的侧视图。
传感器模块3包括例如温度传感器的传感器芯片4、包括将传感器芯片4电连接到RFID芯片5的接口的射频应答器芯片5(RFID芯片)以及电连接到RFID芯片5的环形天线6。这些部件可以放置在直径几毫米的硬币形电路板上，环形天线6包围两个芯片4、5。
整个传感器模块3嵌入由弹性体材料制成的部件主体2中。弹性体材料可以选自热固性弹性体或热塑性弹性体。用三元乙丙橡胶(EPDM)已经取得了良好的效果。
包括增强天线环71和两个增强天线臂72的增强天线7以增强天线环71与传感器模块3的天线环6同心对准的方式放置在部件主体2的表面上。如图1和2所示的增强天线7具有直的形状的增强天线臂72。印刷的增强天线7具有独特的形状，其确保了传感器模块3的环形天线6和增强天线7之间的电感耦合。用可拉伸的墨或浆料(例如可拉伸的银墨)印刷增强天线7已经取得了良好的效果，以确保弹性体材料的可拉伸特性。优选地，表面通过等离子体处理以确保良好的粘附力。
RFID芯片5和环形天线6与增强天线7一起确保传感器芯片4的能量供应以及经由增强天线7将感测到的数据传送到射频读取器设备(RFID读取器)8(见图4)。
图4示出了传感器系统的示意图，该传感器系统包括弹性传感器部件1和配备有通信模块的射频(RFID)读取器设备8，该通信模块用于经由增强天线7向弹性传感器部件1的传感器模块3提供能量，并且经由增强天线7从传感器模块3读取数据。
附图标记
1弹性传感器部件
2部件主体
3传感器模块
4传感器芯片
5射频应答器芯片
6环形天线
7增强天线
71增强天线环
72增强天线臂
8射频(RFID)读取器设备
Claims (14)
1.一种弹性传感器部件(1)，其包括由弹性体材料制成的部件主体(2)和嵌入在部件主体(2)内的传感器模块(3)，所述传感器模块(3)包括传感器芯片(4)、电连接到传感器芯片(4)的射频应答器芯片(5)和电连接到射频应答器芯片(5)的环形天线(6)；其特征在于，所述弹性传感器部件(1)还包括增强天线(7)，所述增强天线包括增强天线环(71)，其中所述增强天线环(71)放置在所述部件主体(2)的表面上，以便允许与所述环形天线(6)进行近场数据通信和能量传递。
2.根据权利要求1所述的弹性传感器部件，其特征在于，所述增强天线(7)包括两个增强天线臂(72)。
3.根据前述权利要求中的一项所述的弹性传感器部件，其特征在于，所述增强天线臂(72)是直的或曲折状的形状，和/或所述增强天线臂(72)和所述增强天线环(71)布置在平面中。
4.根据前述权利要求中的一项所述的弹性传感器部件，其特征在于，所述增强天线臂(72)与所述增强天线环(71)一起放置在所述部件主体(2)的表面上。
5.根据前述权利要求中的一项所述的弹性传感器部件，其特征在于，所述增强天线(7)通过印刷、涂覆或层压技术放置。
6.根据前述权利要求中的一项所述的弹性传感器部件，其特征在于，放置在部件主体(2)表面上的增强天线(7)覆盖有不同于部件主体(2)的材料的介电层、介电箔或介电墨或漆。
7.根据前述权利要求中的一项所述的弹性传感器部件，其特征在于，所述增强天线(7)的材料是可拉伸的材料，例如可拉伸的墨或浆料。
8.根据前述权利要求中的一项所述的弹性传感器部件，其特征在于，所述部件主体(2)的弹性体材料选自热固性弹性体或热塑性弹性体。
9.一种传感器系统，其包括根据前述权利要求中任一项所述的弹性传感器部件(1)和配备有通信模块的射频(RFID)读取器设备(8)，所述通信模块用于经由增强天线(7)向弹性传感器部件(1)的传感器模块(3)提供能量，并且经由增强天线(7)从传感器模块(3)读取数据。
10.一种用于制造根据权利要求1至8中任一项所述的弹性传感器部件(1)的方法，包括以下步骤：
a.使用模制技术，例如压缩模制(CM)、注射模制(IM)、传递模制(TM)、注射传递模制(ITM)或注射压缩模制(ICM)，将传感器模块(2)嵌入弹性体材料的部件主体中，
b.将增强天线(7)放置在部件主体(2)的表面上，与传感器模块(3)的环形天线对齐。
11.根据权利要求10所述的方法，其中，通过将传感器模块(2)放置在两层弹性体材料之间并且利用嵌入的传感器模块(3)压缩模制部件主体(2)来嵌入传感器模块(2)。
12.根据权利要求10或11所述的方法，其中，在步骤a)之前，传感器模块(3)的表面被改性以在传感器模块(3)和弹性体(2)之间获得更好的结合，优选地通过用粘合剂涂覆或通过等离子体或电晕处理。
13.根据权利要求10至12中任一项所述的方法，其中，所述增强天线(7)由与所述部件主体(2)不同材料的介电层保护。
14.根据权利要求10至13中任一项所述的方法，其中，在放置所述增强天线(7)之前，所述部件主体(2)的表面被改性，优选通过用粘合剂涂覆或通过等离子体或电晕处理，以增加所述增强天线(7)的粘附力。
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