CN115803850A - 数据处理装置、数据处理系统、数据处理方法以及数据处理程序 - Google Patents

数据处理装置、数据处理系统、数据处理方法以及数据处理程序 Download PDF

Info

Publication number
CN115803850A
CN115803850A CN202180048888.4A CN202180048888A CN115803850A CN 115803850 A CN115803850 A CN 115803850A CN 202180048888 A CN202180048888 A CN 202180048888A CN 115803850 A CN115803850 A CN 115803850A
Authority
CN
China
Prior art keywords
data
processing
data processing
time
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180048888.4A
Other languages
English (en)
Chinese (zh)
Inventor
米道仁史
酒井永典
秋元健司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN115803850A publication Critical patent/CN115803850A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum
    • G01J3/443—Emission spectrometry
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T11/00—Two-dimensional [2D] image generation
    • G06T11/10—Texturing; Colouring; Generation of textures or colours
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0614—Marking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum
    • G01J2003/283—Investigating the spectrum computer-interfaced
    • G01J2003/2833—Investigating the spectrum computer-interfaced and memorised spectra collection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10024—Color image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Software Systems (AREA)
  • Quality & Reliability (AREA)
  • Medical Informatics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Computing Systems (AREA)
  • Evolutionary Computation (AREA)
  • Data Mining & Analysis (AREA)
  • Artificial Intelligence (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
CN202180048888.4A 2020-07-16 2021-07-05 数据处理装置、数据处理系统、数据处理方法以及数据处理程序 Pending CN115803850A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020122172 2020-07-16
JP2020-122172 2020-07-16
PCT/JP2021/025335 WO2022014392A1 (ja) 2020-07-16 2021-07-05 データ処理装置、データ処理システム、データ処理方法及びデータ処理プログラム

Publications (1)

Publication Number Publication Date
CN115803850A true CN115803850A (zh) 2023-03-14

Family

ID=79555305

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180048888.4A Pending CN115803850A (zh) 2020-07-16 2021-07-05 数据处理装置、数据处理系统、数据处理方法以及数据处理程序

Country Status (6)

Country Link
US (1) US20230118026A1 (https=)
JP (1) JP7427788B2 (https=)
KR (1) KR102870100B1 (https=)
CN (1) CN115803850A (https=)
TW (1) TW202204876A (https=)
WO (1) WO2022014392A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023124159A (ja) * 2022-02-25 2023-09-06 株式会社アンドパッド 情報処理装置、情報処理方法、情報処理プログラム

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6238937B1 (en) * 1999-09-08 2001-05-29 Advanced Micro Devices, Inc. Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding
JP2003509839A (ja) * 1999-09-08 2003-03-11 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド 発光スペクトルの主成分分析を用いてエッチ終点を決定する方法
CN102282654A (zh) * 2009-03-17 2011-12-14 株式会社日立高新技术 蚀刻装置、分析装置、蚀刻处理方法、以及蚀刻处理程序
JP2013161913A (ja) * 2012-02-03 2013-08-19 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
CN107689318A (zh) * 2016-08-03 2018-02-13 朗姆研究公司 监测等离子体处理系统和工艺与工具控制的方法和系统
CN108292613A (zh) * 2015-11-16 2018-07-17 应用材料公司 用于cmp监控的彩色成像

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4574422B2 (ja) 2001-11-29 2010-11-04 株式会社日立ハイテクノロジーズ 発光分光処理装置
JP5315025B2 (ja) 2007-11-30 2013-10-16 株式会社日立ハイテクノロジーズ スペクトル解析および表示
CN104736744B (zh) * 2012-10-17 2017-06-06 东京毅力科创株式会社 使用多变量分析的等离子体蚀刻终点检测
JP6870346B2 (ja) * 2017-01-30 2021-05-12 日本電気株式会社 データ分析システム、データ分析方法およびプログラム
JP2020065013A (ja) 2018-10-18 2020-04-23 東京エレクトロン株式会社 終点検出方法および終点検出装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6238937B1 (en) * 1999-09-08 2001-05-29 Advanced Micro Devices, Inc. Determining endpoint in etching processes using principal components analysis of optical emission spectra with thresholding
JP2003509839A (ja) * 1999-09-08 2003-03-11 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド 発光スペクトルの主成分分析を用いてエッチ終点を決定する方法
CN102282654A (zh) * 2009-03-17 2011-12-14 株式会社日立高新技术 蚀刻装置、分析装置、蚀刻处理方法、以及蚀刻处理程序
JP2013161913A (ja) * 2012-02-03 2013-08-19 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
CN108292613A (zh) * 2015-11-16 2018-07-17 应用材料公司 用于cmp监控的彩色成像
CN107689318A (zh) * 2016-08-03 2018-02-13 朗姆研究公司 监测等离子体处理系统和工艺与工具控制的方法和系统

Also Published As

Publication number Publication date
JPWO2022014392A1 (https=) 2022-01-20
US20230118026A1 (en) 2023-04-20
TW202204876A (zh) 2022-02-01
JP7427788B2 (ja) 2024-02-05
KR102870100B1 (ko) 2025-10-14
WO2022014392A1 (ja) 2022-01-20
KR20230041009A (ko) 2023-03-23

Similar Documents

Publication Publication Date Title
EP3855395B1 (en) Depth acquisition device, depth acquisition method and program
CN112884193A (zh) 预测装置、预测方法及记录介质
US20260056009A1 (en) Virtual metrology apparatus, virtual metrology method, and virtual metrology program
JP4154374B2 (ja) パターンマッチング装置及びそれを用いた走査型電子顕微鏡
US10521893B2 (en) Image processing apparatus, imaging system and image processing method
US8542917B2 (en) System and method for identifying complex tokens in an image
CN101084527A (zh) 用于处理视频数据的方法及系统
TW202136758A (zh) 異常偵測裝置及異常偵測方法
JP2020181959A (ja) 学習方法、管理装置および管理プログラム
GB2593270A (en) Computer implemented method of spectral un-mixing
US11139216B2 (en) System, method and non-transitory computer readable medium for tuning sensitivities of, and determining a process window for, a modulated wafer
CN115803850A (zh) 数据处理装置、数据处理系统、数据处理方法以及数据处理程序
JP2002230562A (ja) 画像処理方法およびその装置
KR20180110354A (ko) 뇌 자기 공명 이미지의 이진화 변환 장치, 이를 위한 방법 및 이 방법이 기록된 컴퓨터로 판독 가능한 기록 매체
CN115794471A (zh) 一种故障诊断优化方法、系统、设备及存储介质
CN118365566B (zh) 基于暗通道先验和双阈值分割的gis异物识别方法及系统
JP2010198476A (ja) 欠陥検出装置、欠陥検出方法および欠陥検出プログラム
JP2008294451A (ja) 画像形成方法、及び画像形成装置
US10372113B2 (en) Method for defocus detection
CN119317833A (zh) 用于半导体合格率相关应用的光致发光
US12450722B2 (en) Information processing apparatus, information processing method, and recording medium
JP2004340978A (ja) 色分類装置及び色分類方法並びに色むら検査装置
JP2018202044A (ja) 毛穴詰まり評価方法及び毛穴詰まり評価装置
CN119948319A (zh) 信息处理装置、判定方法以及判定程序
KR20250054708A (ko) 결함 검사 시스템 및 결함 검사 방법

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination