CN115802874A - Heat conduction structure, cold plate and dilution refrigerator - Google Patents
Heat conduction structure, cold plate and dilution refrigerator Download PDFInfo
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- CN115802874A CN115802874A CN202211489632.XA CN202211489632A CN115802874A CN 115802874 A CN115802874 A CN 115802874A CN 202211489632 A CN202211489632 A CN 202211489632A CN 115802874 A CN115802874 A CN 115802874A
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- 238000010790 dilution Methods 0.000 title claims abstract description 15
- 239000012895 dilution Substances 0.000 title claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000005610 quantum mechanics Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The application discloses heat-conduction structure, cold dish and dilution refrigerator, wherein, heat-conduction structure, including the heat board that sinks, the array sets up a plurality of first mounting holes on the heat board, and is a plurality of equal coaxial attenuator that sets up in the first mounting hole, microwave transmission line connects the both ends of attenuator. The heat conduction structure of this application is through setting up the heat and sinking the board for the heat is to the heat conduction of sinking the board, has reduced the heat conduction of microwave transmission line to lower one deck warm area, has avoided the heat to cause the influence to the operational environment of ultra-low temperature. The cold plate and the dilution refrigerator comprise the heat conduction structure, and therefore the same effect is achieved.
Description
Technical Field
The application relates to the technical field of quantum computers, in particular to a heat conduction structure, a cold plate and a dilution refrigerator.
Background
Quantum computers are physical devices that perform high-speed mathematical and logical operations, store and process quantum information in compliance with the laws of quantum mechanics. The quantum computer is characterized by high running speed, strong information processing capability, wide application range and the like. Among many quantum computing technology routes, superconducting technology routes have a very broad prospect, and quantum computers developed based on superconducting technology routes are of great interest to the industry. The core computational element quantum processor of a superconducting quantum computer needs to operate in an ultra-low temperature environment, such as millikelvin temperature, which is usually provided by a dilution refrigerator, while the low-temperature microwave line is an indispensable line on the dilution refrigerator.
Along with the rapid increase of the quantum bit integration number, the density of the microwave transmission line for coaxial transmission is increased, so that more heat can be generated during microwave signal transmission, the heat can be transmitted from an upper temperature zone to a lower temperature zone in the dilution refrigerator through the microwave transmission line, and the ultralow temperature working environment is influenced. Therefore, it is desirable to provide a heat conduction structure to solve the above problems.
Disclosure of Invention
The purpose of this application lies in: the heat conduction structure, the cold plate and the dilution refrigerating machine are provided, heat of the microwave transmission line is conducted to the heat sink plate in the heat conduction structure, heat conduction of the microwave transmission line to a next-layer temperature area is reduced, and influence of the heat on an ultralow-temperature working environment is avoided.
In order to achieve the above purpose, the present application provides the following technical solutions:
the utility model provides a heat conduction structure, including the heat board that sinks, the array sets up a plurality of first mounting holes on the heat board, and is a plurality of equal coaxial attenuator that sets up in the first mounting hole, microwave transmission line connection the both ends of attenuator.
According to the heat conduction structure, further, the outer wall of the attenuator is provided with an external thread, and an internal thread matched with the external thread is arranged in the first mounting hole.
In the above heat conduction structure, a heat conductive adhesive layer is further disposed between the external thread of the attenuator and the internal thread of the first mounting hole.
In the above heat conduction structure, the heat sink plate is made of oxygen-free copper.
Another aspect of this application provides a cold dish, including cold dish body and above-mentioned heat-conduction structure, wherein, the mounting groove has been seted up just to the lateral wall of cold dish body the mounting groove with the upper and lower terminal surface of cold dish body link up, install in the mounting groove heat-conduction structure.
The cold plate is characterized by further comprising a sealing plate positioned in the mounting groove, wherein the sealing plate is arranged on one side, away from the center of the cold plate body, of the heat conduction structure, and the outer side wall of the sealing plate is unified with the outer side wall of the cold plate body.
As for the cold plate, further, the heat sink plate includes a plate body, the first mounting hole is disposed on the plate body, and the lower end surface of the plate body extends to the periphery to form a mounting plate;
the mounting plate comprises a front side plate body, a rear side plate body, a left side plate body and a right side plate body;
the front side plate body, the left side plate body and the right side plate body of the mounting plate are connected with the cold plate body;
and the rear side plate body of the mounting plate is connected with the sealing plate.
According to the cold plate, the lower end surface of the cold plate body at the mounting groove is provided with the second groove; the second groove is fixedly connected with the front side plate body, the rear side plate body and the left side plate body of the mounting plate in a clamping mode through bolts.
As for the cold plate, further, a first clamping groove is formed in the lower end surface of the sealing plate, which is close to one side of the heat sinking plate, and the first clamping groove is clamped with the rear side plate body of the mounting plate and is fixedly connected with the rear side plate body through a bolt.
As above, the cold dish, further, first recess has all been seted up to the up end of the cold dish body of mounting groove both sides, the shrouding has all been seted up the second draw-in groove with the both sides face of cold dish body contact, the cold dish body first recess with the shrouding the second draw-in groove block just passes through bolt fixed connection.
Yet another aspect of the application provides a dilution refrigerator comprising a plurality of cold plates according to any one of claims 5 to 10.
The beneficial effect of this application lies in:
the heat conduction structure of this application is through setting up the heat and sinking the board for the heat is to the heat conduction of sinking the board, has reduced the heat conduction of microwave transmission line to lower one deck warm area, has avoided the heat to cause the influence to the operational environment of ultra-low temperature.
The cooling plate and the dilution refrigerator provided by the application comprise the heat conduction structure, so that the same beneficial effects are achieved, and the details are not repeated.
Drawings
FIG. 1 is a schematic view of a heat conducting structure according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a heat sink plate according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of another heat sink plate provided in an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a cold plate provided in an embodiment of the present application;
FIG. 5 is a bottom view of a cold plate body provided in an embodiment of the present application;
FIG. 6 is a schematic structural view of a closure plate according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a shielding plate according to an embodiment of the present application;
in the reference symbols:
1-a heat sinking plate, 2-an attenuator, 3-a cold plate body, 4-a mounting groove, 5-a sealing plate and 6-a shielding plate;
11-plate body, 12-mounting plate, 13-first mounting hole, 14-second mounting hole, 31-first groove, 32-second groove, 51-first card slot and 52-second card slot.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort shall fall within the protection scope of the present application. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.
As shown in fig. 1 and 2: the embodiment of the application discloses heat conduction structure, including heat sinking board 1, the heat sinks on board 1 array and sets up a plurality of first mounting holes 13, and is a plurality of equal coaxial attenuator 2 that sets up in the first mounting hole 13, the microwave transmission line is connected the both ends of attenuator 2. Through setting up heat sink plate 1 for heat is to heat sink plate 1 conduction, has reduced the heat conduction of microwave transmission line inner conductor to lower one deck warm area, has avoided the heat to cause the influence to the operational environment of ultra-low temperature. Exemplarily, 12 × 14=168 first mounting holes 13 are provided in fig. 1, forming 168 passages.
In some embodiments of the present application, the outer wall of the attenuator 2 matches the size of the inner wall of the first mounting hole 13. By matching the size of the outer wall of the attenuator 2 with the size of the inner wall of the first mounting hole 13, the attenuator 2 is completely placed in the first mounting hole 13, so that the outer wall of the attenuator 2 is completely in contact with the heat sink plate 1, and heat is conducted to the heat sink plate 1 as much as possible.
In some embodiments of the present application, the outer wall of the attenuator 2 is provided with an external thread, and the first mounting hole 13 is provided with an internal thread matching with the external thread. Through the screw thread fit, the attenuator 2 and the heat sink plate 1 are convenient to mount and dismount. In some embodiments of the present application, an external thread is provided on an outer wall of the attenuator 2 to match an internal thread in the first mounting hole 13.
In some embodiments of the present application, a layer of thermally conductive adhesive is provided between the external threads of the attenuator 2 and the internal threads of the first mounting hole 13. Through setting up the heat-conducting glue layer, be more favorable to good thermal contact between attenuator 2 and the heat sink plate 1, further guaranteed that the heat is conducted to the heat sink plate 1 on as far as possible. For example, when the attenuator 2 is mounted in the first mounting hole 13, the external thread of the attenuator 2 is coated with a heat-conducting glue, and then the attenuator 2 is screwed on and mounted on the heat sink plate 1.
In some embodiments of the present application, the material of the heat sink plate 1 is oxygen-free copper. Because the heat conduction effect of the oxygen-free copper is good, the heat sink plate 1 is made of the oxygen-free copper, and the heat conductivity is further improved.
In some embodiments of the present application, the attenuator 2 is a low temperature thermal conductive attenuator. By arranging the attenuator 2 as a low temperature attenuator it is ensured that heat is conducted as far as possible to the heat sink plate 1.
In some embodiments of the present application, the heat sink plate 1 is further provided with a second mounting hole 14, and the second mounting hole 14 is used for mounting a power strip provided with a microwave transmission line, and the microwave transmission line in the power strip is connected to the attenuator 2.
Based on the same application concept, as shown in fig. 4, the embodiment of the present application further provides a cold plate, which includes a cold plate body 3 and the above heat conduction structure, wherein an installation groove 4 is formed in an outer side wall of the cold plate body 3, the installation groove 4 is communicated with upper and lower end faces of the cold plate body 3, and the heat conduction structure is installed in the installation groove 4. Through set up heat-conduction structure on cold plate body 3, the heat that the microwave signal of coaxial transmission produced sinks board 1 conduction to the heat in the heat-conduction structure like this, has reduced the heat of microwave transmission line inner conductor and has conducted to lower one deck warm area, has avoided the heat to cause the influence to the operational environment of ultra-low temperature. Exemplarily, 4 mounting grooves 4 are formed in the cold plate body 3 in fig. 4, and only one of the mounting grooves 4 is provided with a heat conduction structure in the drawing, in practical application, the heat conduction structure is selectively mounted on several mounting grooves 4 according to the requirement of a microwave circuit, when a microwave circuit is not required on a certain mounting groove 4, and the heat conduction structure is not required to be mounted, a shielding plate 6 is mounted at the position of the reserved mounting groove 4, a schematic structural diagram of the shielding plate 6 is shown in fig. 7, and the structure of the shielding plate 6 is similar to that of the heat sink plate 1, and the difference lies in that: the shield plate 6 is not provided with the first mounting hole 13 and the second mounting hole 14. By arranging the shielding plate 6, the heat radiation from the previous temperature area to the next temperature area in the mounting groove 4 is avoided. Illustratively, the shielding plate 6 is selected to be of an oxygen-free copper material.
In some embodiments of the present application, since a multilayer temperature zone is provided in the existing dilution refrigerator, the multilayer temperature zone is divided by providing a multilayer cooling plate, the microwave transmission line for coaxial transmission is cooled by each temperature zone, and heat in the microwave transmission line is conducted to the lower temperature zone, a heat conduction structure is provided in each layer of cooling plate body 3.
In some embodiments of the present application, the cold plate further includes a sealing plate 5 located in the mounting groove 4, the sealing plate 5 is disposed on one side of the heat conduction structure away from the center of the cold plate body 3, and the outer sidewall of the sealing plate 5 is unified with the outer sidewall of the cold plate body 3. Through setting up shrouding 5, and because the lateral wall of shrouding 5 is unified with the lateral wall of the cold dish body 3 that 4 departments of mounting groove lack, sets up like this, does not have the space between the outer wall of shrouding 5 and the shells inner wall of dilution refrigerator, has avoided the heat to radiate next floor warm area through the space.
In some embodiments of the present application, in order to meet the installation requirement without affecting the integration of the heat sink plate 1, the structure of the heat sink plate 1 is designed as the structure shown in fig. 3, where the heat sink plate 1 includes a plate body 11, the first mounting hole 13 is disposed on the plate body 11, and a mounting plate 12 is disposed on the bottom surface of the plate body 11 and extends around;
the mounting plate 12 comprises a front side plate body, a rear side plate body, a left side plate body and a right side plate body;
the front side plate body, the left side plate body and the right side plate body of the mounting plate 12 are connected with the cold plate body 3;
the rear side plate of the mounting plate 12 is connected to the closing plate 5.
From the above, it can be seen that: through setting up plate body 11, plate body 11 is used for integrated microwave transmission line, and heat sinks board 1 through setting up mounting panel 12, and heat sinks board 1 and is connected with cold dish body 3 from three directions in front, left and right, and the rear of heat sinking board 1 is connected with shrouding 5, makes heat sink board 1 reliably, install closely between cold dish body 3 and shrouding 5. Illustratively, the plate body 11 may be provided as a square plate body.
In some embodiments of the present application, as shown in fig. 5, a second groove 32 is formed on the lower end surface of the cold plate body 3 at the installation groove 4; the second groove 32 is fastened with the front plate, the rear plate and the left plate of the mounting plate 12 and fixedly connected with the front plate, the rear plate and the left plate by bolts. Through setting up second recess 32, rethread bolt fastening behind second recess 32 and the front side plate body of mounting panel 12, rear side plate body and the left side plate body block makes to be connected inseparabler between heat sink plate 1 and the cold dish body 3, has avoided the heat to radiate from the lower one deck warm area of the gap of mounting panel 12 and the cold dish body 3 junction of heat sink plate 1.
In some embodiments of the present application, as shown in fig. 6, a first locking groove 51 is formed in a lower end surface of the sealing plate 5 on a side close to the heat sink plate 1, and the first locking groove 51 is engaged with the rear side plate body of the mounting plate 12 and fixedly connected thereto by a bolt. Through setting up first draw-in groove 51, first draw-in groove 51 with rethread bolt fastening behind the rear side plate body block of mounting panel 12 for it is inseparabler to connect between heat sink plate 1 and the shrouding 5, has avoided the heat to radiate from the lower warm area of one deck temperature region in the gap of mounting panel 12 and the shrouding 5 junction of heat sink plate 1.
In some embodiments of the present application, as shown in fig. 4 and fig. 6, a first groove 31 is formed in the upper end surface of the cold plate body 3 on both sides of the mounting groove 4, a second clamping groove 52 is formed in both side surfaces of the sealing plate 5 contacting the cold plate body 3, and the first groove 31 of the cold plate body 3 is engaged with the second clamping groove 52 of the sealing plate 5 and is fixedly connected by a bolt. Through setting up second draw-in groove 52 and first recess 31, rethread bolt fastening behind second draw-in groove 52 and the first recess 31 block for it is inseparabler to connect between cold plate body 3 and the shrouding 5, has avoided the heat to radiate from the lower one deck warm area in the gap of cold plate body 3 and the 5 junctions of shrouding.
In some embodiments of the present application, the sealing plate 5 is made of oxygen-free copper. Because the heat conduction effect of oxygen-free copper is good, oxygen-free copper is selected for the material of the sealing plate 5, and the heat conductivity is further improved.
Based on the same application concept, the embodiment of the application also provides a dilution refrigerator, which comprises a plurality of the cold plates.
It should be noted that fig. 4 provided in this application is only a schematic structural diagram of the cold plate, and fig. 4 only shows a structure related to the inventive point of this application.
In the description herein, references to the description of "some embodiments" or "examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. And the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application. Any person skilled in the art can make any equivalent substitutions or modifications to the technical solutions and technical contents disclosed in the present application without departing from the scope of the technical solutions of the present application, and the technical solutions and the technical contents of the present application still belong to the protection scope of the present application.
Claims (11)
1. The utility model provides a heat conduction structure, its characterized in that, includes heat sinking board (1), the array sets up a plurality of first mounting holes (13) on heat sinking board (1), and is a plurality of equal coaxial attenuator (2) that set up in first mounting hole (13), microwave transmission line connects the both ends of attenuator (2).
2. The heat conduction structure according to claim 1, wherein the outer wall of the attenuator (2) is provided with an external thread, and the first mounting hole (13) is provided with an internal thread matching the external thread.
3. The heat conduction structure according to claim 2, wherein a layer of thermally conductive adhesive is provided between the external thread of the attenuator (2) and the internal thread of the first mounting hole (13).
4. The heat conducting structure according to claim 1, wherein the heat sink plate (1) is made of oxygen-free copper.
5. A cold plate is characterized by comprising a cold plate body (3) and the heat conduction structure of any one of claims 1 to 4, wherein a mounting groove (4) is formed in the outer side wall of the cold plate body (3), the mounting groove (4) is communicated with the upper end surface and the lower end surface of the cold plate body (3), and the heat conduction structure is mounted in the mounting groove (4).
6. A cold plate according to claim 5, further comprising a sealing plate (5) located in the mounting groove (4), wherein the sealing plate (5) is arranged on a side of the heat conduction structure away from the center of the cold plate body (3) and the outer side wall of the sealing plate (5) is uniform with the outer side wall of the cold plate body (3).
7. A cold plate according to claim 6, wherein the heat sink plate (1) comprises a plate body (11), the first mounting hole (13) is arranged on the plate body (11), and the lower end of the plate body (11) is provided with a mounting plate (12) extending around;
the mounting plate (12) comprises a front side plate body, a rear side plate body, a left side plate body and a right side plate body;
the front side plate body, the left side plate body and the right side plate body of the mounting plate (12) are connected with the cold plate body (3);
the rear side plate body of the mounting plate (12) is connected with the sealing plate (5).
8. A cold plate according to claim 7, wherein a second groove (32) is formed in the lower end surface of the cold plate body (3) at the mounting groove (4); the second groove (32) is clamped with the front side plate body, the rear side plate body and the left side plate body of the mounting plate (12) and is fixedly connected with the front side plate body, the rear side plate body and the left side plate body through bolts.
9. A cold plate according to claim 7, wherein a first locking groove (51) is formed on the lower end surface of the sealing plate (5) close to the heat sinking plate (1), and the first locking groove (51) is clamped with the rear side plate body of the mounting plate (12) and is fixedly connected with the rear side plate body through a bolt.
10. The cold plate according to claim 7, wherein the upper end surfaces of the cold plate bodies (3) at two sides of the mounting groove (4) are both provided with first grooves (31), the two side surfaces of the sealing plate (5) contacting with the cold plate bodies (3) are both provided with second clamping grooves (52), and the first grooves (31) of the cold plate bodies (3) are clamped with the second clamping grooves (52) of the sealing plate (5) and fixedly connected through bolts.
11. A dilution refrigerator comprising a plurality of cold plates according to any one of claims 5 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211489632.XA CN115802874B (en) | 2022-11-25 | 2022-11-25 | Heat conduction structure, cold plate and dilution refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211489632.XA CN115802874B (en) | 2022-11-25 | 2022-11-25 | Heat conduction structure, cold plate and dilution refrigerator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115802874A true CN115802874A (en) | 2023-03-14 |
| CN115802874B CN115802874B (en) | 2024-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211489632.XA Active CN115802874B (en) | 2022-11-25 | 2022-11-25 | Heat conduction structure, cold plate and dilution refrigerator |
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| CN (1) | CN115802874B (en) |
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| JPS60210856A (en) * | 1984-04-03 | 1985-10-23 | Fujitsu Ltd | Radiative cooler |
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| CN112446494A (en) * | 2020-11-18 | 2021-03-05 | 南京乾海通信技术有限公司 | Universal type dilution refrigerator multi-channel extensible signal measuring device |
| CN216956987U (en) * | 2022-02-28 | 2022-07-12 | 合肥本源量子计算科技有限责任公司 | Quantum computer |
| CN217181555U (en) * | 2022-03-18 | 2022-08-12 | 合肥本源量子计算科技有限责任公司 | Quantum signal processing device integrated device for dilution refrigerator |
| JP2022133191A (en) * | 2021-03-01 | 2022-09-13 | 株式会社日立製作所 | Quantum information processing device |
| WO2022200761A1 (en) * | 2021-03-25 | 2022-09-29 | Oxford Instruments Nanotechnology Tools Limited | Heat exchanger for cryogenic cooling apparatus |
| CN217521564U (en) * | 2022-05-20 | 2022-09-30 | 合肥本源量子计算科技有限责任公司 | Signal line heat sink assembly, refrigeration equipment and quantum computer |
| CN217720541U (en) * | 2022-05-20 | 2022-11-01 | 本源科仪(成都)科技有限公司 | Cable fixing assembly, cable fixing tool, dilution refrigerator and quantum computer |
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2022
- 2022-11-25 CN CN202211489632.XA patent/CN115802874B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60210856A (en) * | 1984-04-03 | 1985-10-23 | Fujitsu Ltd | Radiative cooler |
| CN111191790A (en) * | 2018-10-29 | 2020-05-22 | 华为技术有限公司 | Quantum bit control device |
| CN112446494A (en) * | 2020-11-18 | 2021-03-05 | 南京乾海通信技术有限公司 | Universal type dilution refrigerator multi-channel extensible signal measuring device |
| JP2022133191A (en) * | 2021-03-01 | 2022-09-13 | 株式会社日立製作所 | Quantum information processing device |
| WO2022200761A1 (en) * | 2021-03-25 | 2022-09-29 | Oxford Instruments Nanotechnology Tools Limited | Heat exchanger for cryogenic cooling apparatus |
| CN216956987U (en) * | 2022-02-28 | 2022-07-12 | 合肥本源量子计算科技有限责任公司 | Quantum computer |
| CN217181555U (en) * | 2022-03-18 | 2022-08-12 | 合肥本源量子计算科技有限责任公司 | Quantum signal processing device integrated device for dilution refrigerator |
| CN217521564U (en) * | 2022-05-20 | 2022-09-30 | 合肥本源量子计算科技有限责任公司 | Signal line heat sink assembly, refrigeration equipment and quantum computer |
| CN217720541U (en) * | 2022-05-20 | 2022-11-01 | 本源科仪(成都)科技有限公司 | Cable fixing assembly, cable fixing tool, dilution refrigerator and quantum computer |
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| CN115802874B (en) | 2024-08-13 |
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Address after: 230088 6th floor, E2 building, phase II, innovation industrial park, 2800 innovation Avenue, high tech Zone, Hefei City, Anhui Province Applicant after: Benyuan Quantum Computing Technology (Hefei) Co.,Ltd. Address before: 230088 6th floor, E2 building, phase II, innovation industrial park, 2800 innovation Avenue, high tech Zone, Hefei City, Anhui Province Applicant before: ORIGIN QUANTUM COMPUTING COMPANY, LIMITED, HEFEI |
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