CN115780957A - Pin soldering tin removing device - Google Patents
Pin soldering tin removing device Download PDFInfo
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- CN115780957A CN115780957A CN202310064506.8A CN202310064506A CN115780957A CN 115780957 A CN115780957 A CN 115780957A CN 202310064506 A CN202310064506 A CN 202310064506A CN 115780957 A CN115780957 A CN 115780957A
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Abstract
The invention provides a pin soldering tin removing device, relates to the technical field of welding, and aims to solve the problem that the reject ratio of a product is increased when soldering tin on a pin is manually cleaned. This pin soldering tin remove device includes: the device comprises a base, two positioning plates and a discharge hole, wherein the two positioning plates are arranged on the base; the feeding piece is arranged between the two positioning plates, a positioning groove is formed in the feeding piece, a yielding groove is formed in the positioning groove, and a processing opening and a feeding opening are formed in each of two ends of the yielding groove; the feeding mechanism is arranged below the feeding piece and used for conveying the connector to the position above the tin removing mechanism; the tin removing mechanism is arranged on a positioning plate with a discharge hole and used for cleaning the connector; the heating mechanism is used for heating pins of the connector; the pressing mechanism is used for pressing the connector out of the feeding piece. According to the invention, the tin points of the pins on the connector are heated by the heating device, and the molten tin is removed by the tin removing mechanism after heating.
Description
Technical Field
The invention relates to the technical field of welding, in particular to a pin soldering tin removing device.
Background
Connectors, i.e. devices that connect two active devices, carry current or signals. The pins in the connector are metal materials used by the connector to complete the electrical conduction of the electrical signals. The pin and the connector body need to be connected in the production process, the joint of the pin and the connector body is subjected to welding treatment, and tin points can be remained on the outer surface of the welded pin and need to be treated.
Traditional processing mode is through artifical use air heater to heat the pin for soldering tin on the pin no longer adsorbs on the pin, uses the tin of drainage device after with the melting to siphon away afterwards, has inefficiency and probably leads to the pin to take place the slope scheduling problem in operation process, leads to the product defective rate of connector to rise.
Disclosure of Invention
The invention provides a pin soldering tin removing device, which aims to solve the problem that the reject ratio of products is increased when soldering tin on pins is manually cleaned.
The technical scheme adopted by the invention is as follows:
a pin soldering tin removing device comprises:
a base;
the two positioning plates are oppositely arranged at the top of the base, and a discharge hole for the connector to pass through is formed in one of the positioning plates;
the feeding piece is arranged between the two positioning plates, the feeding piece is provided with a positioning groove matched with the connector, the bottom of the positioning groove is provided with a abdicating groove for accommodating pins, the bottoms of the two ends of the abdicating groove are respectively provided with a feeding opening and a processing opening, and the processing opening is arranged at one end close to the discharge port;
the feeding mechanism is arranged at the top of the base, and a feeding rod of the feeding mechanism extends into the positioning groove through the feeding opening;
the tin removing mechanism is arranged on the positioning plate with the discharge hole and is positioned below the processing opening;
the heating mechanism is arranged at the top of the base, the heat conduction end of the heating mechanism faces the processing opening, and the size of one end, extending into the processing opening, of the heating mechanism is matched with the distance between two rows of pins of the connector;
the pressing mechanism is arranged above the feeding piece, a pressing plate of the pressing mechanism extends into the positioning groove, and the pressing plate is made of a magnetic material;
the feeding mechanism drives the connector to move towards one end of the pressing mechanism; after the pressure plate adsorbs the connector, the connector is driven to move towards the heating mechanism, so that pins of the connector penetrate through the processing opening to be abutted against the heating mechanism, and the tin removing mechanism is in contact with the pins of the connector.
Optionally, the feeding piece is provided with a yielding opening at the bottom of one end of the treatment opening, and part of the structure of the treatment rolling brush of the tin removing mechanism after installation is located in the yielding opening.
Optionally, the feeding mechanism comprises:
the telescopic element is arranged at the top of the base, and the feeding rod is arranged at the extending end of the telescopic element; the telescopic element drives the feeding rod to reciprocate along the feeding opening.
Optionally, the telescopic element is a cylinder, a hydraulic cylinder or an electric telescopic rod.
Optionally, the tin removing mechanism comprises:
the two processing rolling brushes are arranged on the positioning plate, and the axes of the two processing rolling brushes are positioned in the same horizontal plane;
and the driving shafts of the two driving motors are respectively connected with the rolling shafts of the two processing rolling brushes and drive the two processing rolling brushes to rotate oppositely.
Optionally, the process roller is a wire roller.
Optionally, the heating mechanism comprises:
the driving mechanism is arranged at the top of the base and is positioned at one side of the processing opening;
the heating base is connected with the power end of the driving mechanism;
the heating component is arranged on the top of the heating base, and the top of the heating component can extend into the processing opening;
the driving mechanism can drive the heating base to move towards the processing opening, so that the heating component is in contact with the connector in the processing opening.
Optionally, the heating means comprises:
the heat insulation layer is arranged on the top of the heating base, and an installation cavity is formed in the top of the heat insulation layer;
the heat conduction layer is arranged in the mounting cavity, the top of the heat conduction layer is contacted with the connector, and a mounting hole is formed in the heat conduction layer;
and the heater is arranged in the mounting hole.
Optionally, the two driving mechanisms are symmetrically arranged at two sides of the processing opening, and the heating base is arranged between the two driving mechanisms.
Optionally, the swaging mechanism includes:
the mounting seat is mounted on the positioning plate or on the top of the feeding piece;
the fixed end of the telescopic piece is arranged on the mounting seat, and the movable end of the telescopic piece faces the abdicating groove;
the connecting plate is connected with the extending end of the telescopic piece;
the pressing plate is arranged on the connecting plate, and one end of the pressing plate extends into the positioning groove;
the at least two springs are arranged at the bottom of the connecting plate and are positioned on two sides of the pressure plate;
the telescopic piece moves to drive the pressure plate to press the connector, so that the pins of the connector are exposed out of the processing opening and are contacted with the tin removing mechanism, and when the pressure plate is pressed down, the two springs are contacted with the bottom of the positioning groove.
Compared with the prior art, the invention has the beneficial effects that:
1. the soldering tin of the pin on the connecting piece is heated and removed through the device, so that the condition that the pin is inclined due to human factors and subsequent use is influenced is avoided.
2. The pins of the connector are regularly fed in the melting and removing processes through the positioning grooves, the yielding grooves, the feeding openings and the processing openings on the feeding piece.
3. The pins of the connector are driven by the material pressing mechanism arranged above the tin removing mechanism to expose the processing opening and contact with the heating mechanism, so that the soldering tin on the pins can be conveniently removed by the tin removing mechanism after being melted by the heating mechanism.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic perspective view of a pin solder removing apparatus.
Fig. 2 is a schematic structural diagram of a feeding member and a pressing mechanism of the pin solder removing device in use.
Fig. 3 is a schematic structural view of a positioning plate with a discharge hole in the pin soldering removing device.
Fig. 4 is a schematic perspective view of a feeding member of the pin solder removing apparatus.
Fig. 5 is a schematic front view of a feeding member of the pin solder removing apparatus.
Fig. 6 is a schematic diagram of a right-side view structure of a feeding member of the pin solder removing device.
Fig. 7 is a first partial structural diagram of the pin solder removing apparatus.
Fig. 8 is a schematic view of a partial structure of the pin solder removing apparatus.
Fig. 9 is a schematic structural view of a heating mechanism and a pressing mechanism of the pin solder removing device.
FIG. 10 is a schematic view of a heating mechanism of the pin solder removing apparatus.
Reference numerals:
1. a base;
2. positioning a plate; 21. a discharge port;
3. a feeding member; 31. positioning a groove; 32. a yielding groove; 33. a feeding opening; 34. processing the opening; 35. a abdicating opening;
4. a feeding mechanism; 41. a feed bar; 42. a telescopic element;
5. a tin removal mechanism; 51. processing the rolling brush; 52. a drive motor;
6. a heating mechanism; 61. a drive mechanism; 62. heating the susceptor; 63. a heating member; 631. a thermal insulation layer; 632. a mounting cavity; 633. a heat conductive layer; 634. mounting holes; 635. a heater;
7. a material pressing mechanism; 71. a mounting base; 72. a telescoping member; 73. a connecting plate; 74. a material pressing plate; 75. a spring.
Detailed description of the preferred embodiments
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention are conventionally placed in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, and are used only for the convenience of describing and simplifying the description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the present invention, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being permanently connected, detachably connected, or integral; the connection can be mechanical connection, electrical connection or communication; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. The first feature being "under," "beneath," and "under" the second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, 2, 3, 4, 5 and 6, an embodiment of the present invention provides a pin solder removing apparatus, including: the tin removing machine comprises a base 1, two positioning plates 2, a feeding piece 3, a feeding mechanism 4, a tin removing mechanism 5, a heating mechanism 6 and a pressing mechanism 7; two locating plates 2 are fixedly installed at the top of the base 1, and one of the locating plates 2 is provided with a discharge hole 21 for the connector to pass through. The pay-off 3 is installed between two locating plates 2, is provided with on the pay-off 3 with connector matched with constant head tank 31, is provided with the groove 32 of stepping down that is used for holding the pin of connector in the bottom of constant head tank 31, is provided with pay-off opening 33 and processing opening 34 respectively at the both ends in the groove 32 of stepping down, and after the installation of pay-off 3, the one end that has processing opening 34 is connected with locating plate 2 that is equipped with discharge gate 21. The feeding mechanism 4 is arranged at the top of the base 1 and is positioned under the feeding piece 3, and a feeding rod 41 of the feeding mechanism 4 extends into the positioning groove 31 through the feeding opening 33 and is in contact with the side wall of the connector placed in the positioning groove 31, so that the connector is conveniently driven to slide in the feeding piece 3, and the connector is enabled to be connected from one end of the feeding opening 33 to one end of the processing opening 34. And the tin removing mechanism 5 is arranged on the positioning plate 2 and is positioned below the processing opening 34 of the feeding piece 3, so that a connector fed to one end of the processing opening 34 can be cleaned conveniently. The heating mechanism 6 is installed on the top of the base 1 and located right below the processing opening 34, so that the connector can be conveniently heated and positioned. The pressing mechanism 7 is installed above the feeding member 3, a pressing plate 74 of the pressing mechanism 7 extends into the positioning groove 31, the pressing plate 74 is made of a magnet and used for adsorbing the connector, the pressing plate 74 presses the connector after adsorbing the connector, and the bottom of the connector is contacted with the heat conducting end of the heating mechanism 6 after pressing to a certain degree, so that the positioning of the connector is realized.
When the connector is used, the connector is sequentially placed in the positioning groove 31 of the feeding piece 3, pins of the connector are located in the abdicating groove 32, then the connector is fed towards one end of the tin removing mechanism 5 through the feeding mechanism 4 arranged at the top of the base 1, when the connector is fed above the tin removing mechanism 5, the pressing mechanism 7 arranged on the feeding piece 3 moves, the pressing plate 74 of the pressing mechanism 7 adsorbs the connector, then the connector is pressed down towards one side of the heating mechanism 6 in the moving process of the pressing mechanism 7, the pins of the connector are heated and positioned by the heating mechanism 6 after the pressing, in order to reduce the subsequent processing time length in the heating process, the tin removing mechanism 5 moves in the heating process, so that the molten tin points are taken away quickly by the tin removing mechanism 5, after the tin points are cleaned, the pressing mechanism 7 drives the connector to reset, and then a new connector is conveyed to the position below the tin removing mechanism 5 through the feeding mechanism 4, and the new connector ejects out the processed connector.
More specifically, the feeding mechanism 4 drives the connector to move towards one end of the pressing mechanism 7, the pressing plate 74 sucks the connector, then the pressing mechanism 7 drives the connector to move towards the heating mechanism 6, so that the pins of the connector penetrate through the processing openings 34 to be in contact with the tin removing mechanism 5, heat on the heating mechanism 6 is transferred to the pins in the contact process, and tin points on the pins are melted.
It should be noted that the connector in this embodiment has two rows of pins. The discharge port 21 on the positioning plate 2 is matched with the positioning groove 31 and the abdicating groove 32 on the feeding piece 3, so that the connector after tin removal can be conveniently conveyed out of the device.
In another embodiment, as shown in fig. 5, in order to facilitate the pressing mechanism 7 to press the pins of the connector out of the processing openings 34, and then to quickly clean the pins through the tin removing mechanism 5, a yield opening 35 is provided at the bottom of the end of the feeding member 3 where the processing openings 34 are provided, and after the tin removing mechanism 5 is mounted on the positioning plate 2, a part of the structure of the tin removing mechanism 5 is located in the yield opening 35. More specifically, the processing roller 51 of the tin removing mechanism 5 is positioned in the relief opening 35 after the roller is mounted, and rotates relatively in the relief opening 35 to clean the melted tin spot on the pin of the connector.
In another embodiment, as shown in fig. 1, 7 and 8, after the connector is placed in the positioning groove 31, the connector is conveyed to the side of the processing opening 34 by the feeding mechanism 4, so as to facilitate the subsequent processing. More specifically, the feeding mechanism 4 includes: the telescopic element 42 is installed at the top of the base 1, the feeding rod 41 is installed at the extending end of the telescopic element 42, the telescopic element 42 drives the feeding rod 41 to reciprocate along the feeding opening 33, and a new connector can be added into the positioning groove 31 manually or in real time through a manipulator when the reciprocating motion is carried out.
In a specific use process, the telescopic element 42 is a cylinder, a hydraulic cylinder or an electric telescopic rod. Most preferably a cylinder.
When the connector is placed, the piston rod of the air cylinder is in an extending state, after the connector is placed, the air cylinder contracts to drive the feeding rod 41 arranged on the piston rod of the air cylinder to move, and the feeding rod 41 drives the connector to move from one end of the feeding opening 33 to one end of the processing opening 34 in the moving process.
In another embodiment, as shown in fig. 1 and 7, in order to quickly remove the tin spot on the pin of the connector, the tin removing mechanism 5 includes: two processing rolling brushes 51 and two driving motors 52, wherein the two processing rolling brushes 51 are arranged on the positioning plate 2, and the axes of the two processing rolling brushes 51 are positioned in the same horizontal plane after the two processing rolling brushes 51 are arranged. The driving shafts of the two driving motors 52 are respectively connected with the rollers of the two processing roller brushes 51 and drive the two processing roller brushes 51 to move relatively.
When the pins of the connector are exposed out of the processing openings 34, the two driving motors 52 are started to drive the two processing rolling brushes 51 to move relatively, and the heating mechanism 6 is matched to heat the pins of the connector, so that the tin points on the pins are melted, and the melted tin points are cleaned in the rotating process of the processing rolling brushes 51.
In another embodiment, the process roller 51 is a wire roller in order to facilitate the rapid removal of the solder attached to the leads.
In another embodiment, as shown in fig. 9 and 10, in order to avoid unclean solder points on the pins, the heating mechanism 6 includes: a driving mechanism 61, a heating base 62 and a heating member 63, the driving mechanism 61 is installed on the top of the base 1 and disposed at one side of the processing opening 34. The heating base 62 is mounted on the driving mechanism 61, and the driving mechanism 61 drives the heating base 62 to move towards the feeding member 3. Heating member 63 installs at the top of heating base 62, and the top of heating member 63 stretches into and handles opening 34, and the diapire with the connector that comes out from handling opening 34 contacts, heats the pin of connector during the contact, and the rotation of handling round brush 51 in the heating process takes away the tin after the melting fast, realizes the tin point clearance on the pin to the connector.
When the solder pot is cleaned, the heating mechanism 6 and the swaging mechanism 7 move relatively, and the swaging mechanism 7 presses the connector downward to expose the processing opening 34; the heating mechanism 6 is moved upward so that the heating member 63 of the heating mechanism 6 is brought into contact with the connector, and heating is achieved.
The driving mechanism 61 in this embodiment may be a linear motor, a cylinder, a hydraulic cylinder, or an electric telescopic rod. The most preferred of which are cylinders.
In another embodiment, as shown in fig. 10, in order to avoid thermal deformation of other components during heating, the heating component 63 includes: insulating layer 631, heat conduction layer 633 and heater 635, insulating layer 631 installs the top at heating base 62, and the top of insulating layer 631 has mounting chamber 632. The heat conducting layer 633 is mounted in the mounting cavity 632, and the top of the heat conducting layer 633 contacts with the connector to melt the tin spot on the pin of the connector. The heat conductive layer 633 is provided with mounting holes 634, and the heater 635 is mounted in the mounting holes 634.
It should be noted that the cross section of the end of the heat conducting layer 633, which is exposed out of the mounting cavity 632, is an isosceles trapezoid, and the top edge of the isosceles trapezoid contacts with the connector, so that the heat conducting layer 633 can enter between two rows of pins of the connector.
It should be noted that the heater 635 in this embodiment is an electric heater, and the heater 635 may also be a heating copper core in other embodiments. The heat insulating layer 631 is made of asbestos and the heat conducting layer 633 is a heat conducting piece made of copper. The heat insulating layer 631 is wrapped outside the copper heat conducting member and exposes one end of the copper heat conducting layer 633.
In another embodiment, as shown in fig. 9, in order to improve the stability of the heating mechanism 6 during the movement, two driving mechanisms 61 are provided, symmetrically installed at both sides of the processing opening 34, and the heating susceptor 62 is installed between the two driving mechanisms 61.
The driving mechanism 61 in the present embodiment is an air cylinder.
In another embodiment, as shown in fig. 2 and 8, in order to expose the pins of the connector out of the processing openings 34, the swage mechanism 7 includes: a mounting seat 71, a telescopic piece 72, a connecting plate 73, a pressure plate 74 and at least two springs 75. The mount 71 is mounted on the positioning plate 2. The fixed end of the extensible member 72 is mounted on the mounting seat 71, and the extended end of the extensible member 72 is disposed toward the receding groove 32. A connecting plate 73 is mounted on the end of the projecting end of the telescopic member 72. The pressure plate 74 is installed on the connecting plate 73, and one end of the pressure plate 74 extends into the positioning groove 31, so that the connector can be conveniently adsorbed and positioned. At least two springs 75 are installed at the bottom of the connecting plate 73 and located at both sides of the nip plate 74. The telescopic piece 72 moves to drive the pressure plate 74 to press downwards, so that the pressure plate 74 adsorbs the connector at the end part, then the connector is driven to descend, the pin of the connector is exposed out of the processing opening 34 to be contacted with the tin removing mechanism 5, and when the pressure plate 74 presses downwards, the two springs 75 are contacted with the bottom of the positioning groove 31.
The extensible member 72 drives connecting plate 73 and moves towards 5 one end of detinning mechanism, make install the pressure flitch 74 on connecting plate 73 stretch into in the constant head tank 31, and contact with the connector in the constant head tank 31, then adsorb the connector to pushing down, make the spring 75 of installing in the connecting plate 73 bottom contact with the tank bottom of constant head tank 31, spring 75 is compression state gradually in the contact process, the pin of connector stretches out handles opening 34 this moment, it can to clear up it through detinning mechanism 5 that sets up in the below of handling opening 34. After cleaning, the telescopic piece 72 removes power, the pressure plate 74 is reset quickly through the spring 75, the connector is driven to rise in the resetting process, and the phenomenon that the connector is damaged due to overheating caused by the fact that the connector is in contact with the heating mechanism 6 for too long time is avoided. And pushing the lifted connector out by a new connector, and adsorbing the new connector by the pressure plate to repeat the steps to remove the tin point.
In other embodiments, the mounting seat 71 may be mounted on top of the feeder 3. The springs 75 are arranged in groups of four, two, oppositely disposed on either side of the process opening 34.
It should be noted that the telescopic member 72 in this embodiment is an air cylinder, a hydraulic cylinder or an electric telescopic rod. Most preferably a cylinder.
The specific working principle is as follows:
the feeding member 3 is used as a slide rail, and a positioning groove 31 and a yielding groove 32 are arranged on the feeding member 3. The connector is placed in the positioning groove 31 while the pins of the connector are positioned in the relief grooves 32, and the connector is moved from the feed opening 33 end toward the treatment opening 34 end by the cylinder of the feed mechanism 4. When the connector moves to the lower part of the pressing mechanism 7, the telescopic part 72 of the pressing mechanism 7 drives the pressing plate 74 to move, the pressing plate 74 adsorbs the connector in the descending process, then the pins of the connector are driven to be exposed from the processing opening 34, and at the moment, the pins are just positioned outside the processing opening 34 provided with the abdicating opening 35. When the pressing mechanism 7 moves, the heating mechanism 6 moves relatively, and the driving mechanism 61 of the heating mechanism 6 drives the heat conduction layer 633 to move towards the connector, so that the heat conduction end of the heat conduction layer 633 is in contact with pins of the connector, heat transfer is realized, and tin points on the pins are melted by heating. The two driving motors 52 are started, and the two driving motors 52 drive the two processing roller brushes 51 to rotate relatively to remove the melted tin. After the tin point is cleared, the spring 75 of the material pressing mechanism 7 is used for quickly resetting, so that the connector is prevented from being damaged, and the connector is pushed away by a newly-entered connector after resetting.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A pin soldering tin removing device is characterized by comprising:
a base;
the two positioning plates are oppositely arranged at the top of the base, and a discharge hole for the connector to pass through is formed in one of the positioning plates;
the feeding piece is arranged between the two positioning plates, a positioning groove matched with the connector is formed in the feeding piece, a yielding groove used for containing pins is formed in the bottom of the positioning groove, a feeding opening and a processing opening are respectively formed in the bottoms of the two ends of the yielding groove, and the processing opening is formed in one end close to the discharge port;
the feeding mechanism is arranged at the top of the base, and a feeding rod of the feeding mechanism extends into the positioning groove through the feeding opening;
the tin removing mechanism is arranged on the positioning plate with the discharge hole and is positioned below the processing opening;
the heating mechanism is arranged at the top of the base, the heat conducting end of the heating mechanism faces the processing opening, and the size of one end of the heating mechanism, which extends into the processing opening, is matched with the space between the two rows of pins of the connector;
the pressing mechanism is arranged above the feeding piece, a pressing plate of the pressing mechanism extends into the positioning groove, and the pressing plate is made of a magnetic material;
the feeding mechanism drives the connector to move towards one end of the pressing mechanism; after the pressure plate adsorbs the connector, the connector is driven to move towards the heating mechanism, so that pins of the connector penetrate through the processing opening to be abutted against the heating mechanism, and the tin removing mechanism is in contact with the pins of the connector.
2. The pin solder removing device according to claim 1, wherein the feeding member has a relief opening at a bottom of one end of the processing opening, and a part of the structure of the processing roller brush of the tin removing mechanism is located in the relief opening after the tin removing mechanism is installed.
3. The pin solder removing apparatus according to claim 1, wherein the feeding mechanism comprises:
the telescopic element is arranged at the top of the base, and the feeding rod is arranged at the extending end of the telescopic element; the telescopic element drives the feeding rod to reciprocate along the feeding opening.
4. The pin solder removing apparatus according to claim 3, wherein the telescopic element is a pneumatic cylinder, a hydraulic cylinder or an electric telescopic rod.
5. The pin solder removing apparatus according to claim 1, wherein the solder removing mechanism comprises:
the two processing rolling brushes are arranged on the positioning plate, and the axes of the two processing rolling brushes are positioned in the same horizontal plane;
and the driving shafts of the two driving motors are respectively connected with the rolling shafts of the two processing rolling brushes and drive the two processing rolling brushes to rotate oppositely.
6. The pin solder removing apparatus according to claim 5, wherein the process roller is a wire roller.
7. The pin solder removal apparatus according to claim 1, wherein the heating mechanism comprises:
the driving mechanism is arranged at the top of the base and is positioned at one side of the processing opening;
the heating base is connected with the power end of the driving mechanism;
the heating component is arranged on the top of the heating base, and the top of the heating component can extend into the processing opening;
the driving mechanism can drive the heating base to move towards the processing opening, so that the heating component is in contact with the connector in the processing opening.
8. The pin solder removal device of claim 7, wherein the heating element comprises:
the heat insulation layer is arranged on the top of the heating base, and an installation cavity is formed in the top of the heat insulation layer;
the heat conduction layer is arranged in the mounting cavity, the top of the heat conduction layer is contacted with the connector, and a mounting hole is formed in the heat conduction layer;
and the heater is arranged in the mounting hole.
9. The pin solder removing apparatus according to claim 7 or 8, wherein the driving mechanisms are symmetrically installed at both sides of the processing opening, and the heating base is installed between the two driving mechanisms.
10. The pin solder removing apparatus according to claim 1, wherein the swaging mechanism includes:
the mounting seat is mounted on the positioning plate or mounted at the top of the feeding piece;
the fixed end of the telescopic piece is arranged on the mounting seat, and the movable end of the telescopic piece faces the abdicating groove;
the connecting plate is connected with the extending end of the telescopic piece;
the pressing plate is arranged on the connecting plate, and one end of the pressing plate extends into the positioning groove;
the at least two springs are arranged at the bottom of the connecting plate and are positioned at two sides of the material pressing plate;
the telescopic piece moves to drive the pressure plate to press the connector, so that the pins of the connector are exposed out of the processing opening and are contacted with the tin removing mechanism, and when the pressure plate is pressed down, the two springs are contacted with the bottom of the positioning groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310064506.8A CN115780957B (en) | 2023-02-06 | 2023-02-06 | Pin soldering tin removing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310064506.8A CN115780957B (en) | 2023-02-06 | 2023-02-06 | Pin soldering tin removing device |
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| CN115780957A true CN115780957A (en) | 2023-03-14 |
| CN115780957B CN115780957B (en) | 2023-05-19 |
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| CN202310064506.8A Active CN115780957B (en) | 2023-02-06 | 2023-02-06 | Pin soldering tin removing device |
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| CN115780957B (en) | 2023-05-19 |
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