CN115776796A

CN115776796A - Heat dissipation assembly and electronic assembly

Info

Publication number: CN115776796A
Application number: CN202111039371.7A
Authority: CN
Inventors: 童凯炀; 陈虹汝
Original assignee: Inventec Pudong Technology Corp; Inventec Corp
Current assignee: Inventec Pudong Technology Corp; Inventec Corp
Priority date: 2021-09-06
Filing date: 2021-09-06
Publication date: 2023-03-10

Abstract

The invention provides a heat dissipation assembly and an electronic assembly. The heat dissipation assembly is used for a working fluid to flow and comprises a plurality of condensers and fans. The condensers each include a first tank, a second tank, and a plurality of flow tubes. In each condenser, two opposite ends of each flow pipe are respectively communicated with the first box body and the second box body, a heat dissipation gap is formed between every two adjacent flow pipes, and the working fluid is used for flowing from the first box body to the second box body through the flow pipes. The first box, the second box and the flow pipe of the condenser surround the heat dissipation channel together. The heat dissipation channel is communicated with the heat dissipation gap between the flow pipes. The fan is arranged on the condenser and communicated with the heat dissipation channel to guide heat dissipation airflow to flow between the heat dissipation channel and the heat dissipation gap between the flow pipes of the condenser, and further to cool the working fluid flowing in the flow pipes.

Description

Heat dissipation assembly and electronic assembly

Technical Field

The present invention relates to a heat dissipation assembly and an electronic assembly, and more particularly, to a heat dissipation assembly including a plurality of condensers surrounding a heat dissipation channel and an electronic assembly including the heat dissipation assembly.

Background

Generally, in the immersion cooling system or the drip cooling system, the dielectric fluid submerged or dripped to the heat source is condensed into a liquid state in the single-plate condenser provided in the rack after being evaporated into a gaseous state.

However, the conventional single-plate condenser is not enough to satisfy the heat dissipation requirement of the heat source with high heat productivity. While increasing the size of the single-piece condenser increases the heat dissipation capacity of the single-piece condenser, it compresses the space in the rack in which the servers are located. That is, the current immersion cooling system or drip cooling system has a problem in that it is difficult to effectively utilize a limited space in a rack while enhancing a heat dissipation capability of a condenser.

In addition, hot air exhausted from the single-chip condenser is exhausted from the side of the server including the service opening. Therefore, hot air may be blown to the maintenance person when the maintenance person maintains the components of the server, thereby causing difficulty in smooth maintenance by the maintenance person.

Disclosure of Invention

The present invention provides a heat dissipation assembly and an electronic assembly, which can effectively utilize the limited space in the rack while improving the heat dissipation capability of the condenser, and prevent the hot wind exhausted by the electronic device from affecting the maintenance personnel to maintain the electronic device.

The heat dissipation assembly for a working fluid according to an embodiment of the present invention includes a plurality of condensers and a fan. The condensers each include a first tank, a second tank, and a plurality of flow tubes. In each condenser, two opposite ends of each flow pipe are respectively communicated with the first box body and the second box body, a heat dissipation gap is formed between every two adjacent flow pipes, and the working fluid is used for flowing from the first box body to the second box body through the flow pipes. A heat dissipation channel is surrounded by the first box body, the second box body and the flow pipe of the condenser. The heat dissipation channel is communicated with the heat dissipation gap between the flow pipes. The fan is arranged on the condenser and communicated with the heat dissipation channel to guide a heat dissipation airflow to flow between the heat dissipation channel and a heat dissipation gap between flow pipes of the condenser, so as to cool the working fluid flowing in the flow pipes.

In another embodiment of the present invention, an electronic assembly for flowing a working fluid includes a cabinet, a frame, an electronic device, a heat dissipation assembly and a filter assembly. The frame is arranged on the cabinet. The electronic device is arranged in the rack. The heat dissipation assembly comprises a plurality of condensers and a fan. The condenser comprises a first box body, a second box body and a plurality of flow pipes. In each condenser, two opposite ends of each flow tube are respectively communicated with the first box body and the second box body, a heat dissipation gap is formed between every two adjacent flow tubes, and the working fluid is used for flowing from the first box body to the second box body through the flow tubes. The first box, the second box and the flow pipe of the condenser surround a heat dissipation channel together. The heat dissipation channel is communicated with the heat dissipation gap between the flow pipes. The fan is arranged on the condenser and communicated with the heat dissipation channel to guide a heat dissipation airflow to flow between the heat dissipation channel and the heat dissipation gap between the flow pipes of the condenser, and further to cool the working fluid flowing in the flow pipes. The heat dissipation assembly is arranged on the cabinet and located on one side of the rack. The condenser of the heat dissipation assembly is communicated with the electronic device. The filtering component is arranged on one side of the heat dissipation component far away from the rack, so that heat dissipation airflow guided by a fan of the heat dissipation component passes through the filtering component before passing through the heat dissipation channel.

According to the heat dissipation assembly and the electronic assembly disclosed in the above embodiments, the first box, the second box and the flow tubes of the condensers surround the heat dissipation channel together, and the heat dissipation channel is communicated with the heat dissipation gap between the flow tubes. Therefore, the fan communicated with the heat dissipation channel can guide the heat dissipation airflow to flow between the heat dissipation channel and the heat dissipation gap between the flow pipes, and further effectively cool the working fluid flowing in the flow pipes. Therefore, the limited space in the frame can be effectively utilized while the heat dissipation capacity of the condenser is improved.

In addition, the fan can guide the heat dissipation airflow to flow from the heat dissipation gap between the flow pipes to the heat dissipation channel. Therefore, the heat dissipation airflow guided by the fan can be discharged in a direction away from the electronic device without affecting the maintenance of the electronic device by maintenance personnel.

Moreover, the fan can guide the heat dissipation airflow to flow to the heat dissipation gap between the flow pipes from the heat dissipation channel, and the filtering component is arranged on one side of the heat dissipation component far away from the rack. Therefore, the heat dissipation airflow guided by the fan passes through the filter assembly before passing through the heat dissipation channel. Therefore, the filter assembly can prevent dust from accumulating on the fan or the condenser, and further prevent the performance of the fan or the condenser from being reduced due to the dust.

Drawings

Fig. 1 is a perspective view of a heat dissipation assembly according to a first embodiment of the present invention.

Fig. 2 is an exploded view of the heat sink assembly of fig. 1.

Fig. 3 is an exploded view of a condenser of the heat dissipation assembly of fig. 1.

Fig. 4 is a partially enlarged view of a cross-sectional view of the heat dissipation assembly in fig. 1.

Fig. 5 is a partially enlarged view of a cross-sectional view of a heat dissipation assembly according to a second embodiment of the invention.

Fig. 6 is a side view of an electronic assembly according to an embodiment of the invention.

Description of the symbols

10 heat radiation assembly

100: condenser

110 the first box body

1100 first through groove

115 first cover plate

120: second case

1200 second through groove

125 second cover plate

130: flow tube

1300 heat dissipation gap

1301: first flow pipe

1302 second flow tube

140 radiating fin group

150 first mounting plate

160: second mounting plate

170 heat dissipation channel

180 the first opening

190 second opening

200 first connecting pipe

300 second connecting pipe

400 inflow pipe

500 outflow tube

600: fan rack

610 first plate body

611, mounting port

620 support column

630 second plate body

640 bump

700 fan

800 wind shield

P1 first reference plane

P2 second reference plane

F1, F2 radiating air flow

100a condenser

130a flow tube

P1a first reference plane

1301a first flow tube

20 electronic component

21: cabinet

22: frame

23 electronic device

24 filter assembly

Detailed Description

The detailed features and advantages of the embodiments of the present invention are described in detail below, which is sufficient for one skilled in the art to understand the technical contents of the embodiments of the present invention and to implement the embodiments of the present invention, and the related objects and advantages of the present invention can be easily understood by one skilled in the art according to the disclosure, claims and drawings of the present specification. The following examples further illustrate aspects of the present invention in detail, but are not intended to limit the scope of the invention in any way.

Please refer to fig. 1 to 3. Fig. 1 is a perspective view of a heat dissipation assembly according to a first embodiment of the present invention. Fig. 2 is an exploded view of the heat sink assembly of fig. 1. Fig. 3 is an exploded view of a condenser of the heat dissipation assembly of fig. 1.

In the present embodiment, the heat dissipation assembly 10 is used for flowing a working fluid (not shown) and is, for example, connected to an immersion cooling system (not shown). The working fluid is, for example, a dielectric fluid. It should be noted that the immersion cooling system may be an immersion cooling system in which the heat source (not shown) is entirely immersed in the working fluid or a drip cooling system in which the working fluid drips onto the heat source.

In the present embodiment, the heat dissipation assembly 10 includes a plurality of condensers 100, a plurality of first connection pipes 200, a plurality of second connection pipes 300, an inflow pipe 400, an outflow pipe 500, a fan frame 600, a plurality of fans 700, and a wind shielding plate 800.

In the present embodiment, each of the condensers 100 includes a first tank 110, two first cover plates 115, a second tank 120, two second cover plates 125, a plurality of flow tubes 130, a heat sink fin assembly 140, a first mounting plate 150, and a second mounting plate 160.

The first tank 110, the second tank 120 and the flow tube 130 of the condenser 100 together surround a heat dissipation channel 170. The first tanks 110 of the condensers 100 collectively surround a first opening 180. The second tanks 120 of the condensers 100 collectively surround a second opening 190. The first opening 180 and the second opening 190 are respectively communicated with two opposite ends of the heat dissipation channel 170. The first tanks 110 of the condensers 100 communicate with each other through the first connection pipe 200. The second tanks 120 of the condensers 100 are communicated with each other through the second connection pipe 300. The inflow pipe 400 is connected to one of the first connection pipes 200 and is used for the inflow of the gaseous working fluid. The outflow pipe 500 is connected to one of the second connection pipes 300 and is used for flowing out the liquid working fluid.

In other embodiments, the heat dissipation assembly may not include the first connection pipe 200 and the second connection pipe 300, in such embodiments, the first tanks of the condensers may not be communicated with each other, the second tanks of the condensers may not be communicated with each other, and the condensers may include an outflow pipe and an inflow pipe respectively.

Since these condensers 100 are similar in structure, only the structure of a single condenser 100 will be described in detail below. The first casing 110 has a first through-groove 1100. The two first cover plates 115 are respectively fixed to opposite sides of the first case 110 to shield the first through-groove 1100, thereby preventing the working fluid from leaking out of the first through-groove 1100. The second housing 120 has a second through-slot 1200. The two second cover plates 125 are respectively fixed to two opposite sides of the second box 120 to shield the second through-groove 1200, thereby preventing the working fluid from leaking out of the second through-groove 1200. In the present embodiment, the flow tube 130 is, for example, a circular tube. Opposite ends of each flow tube 130 are respectively communicated with the first through groove 1100 of the first box 110 and the second through groove 1200 of the second box 120, and the working fluid flows from the first through groove 1100 of the first box 110 to the second through groove 1200 of the second box 120 through the flow tube 130. A heat dissipation gap 1300 is formed between two adjacent flow tubes 130 and is communicated with the heat dissipation channel 170. The flow tube 130 penetrates the heat dissipating fin set 140, and two opposite ends of the heat dissipating fin set 140 are fixed to the first box 110 and the second box 120 through the first mounting plate 150 and the second mounting plate 160, respectively. Referring to fig. 4, fig. 4 is a partially enlarged view of a cross-sectional view of the heat dissipation assembly in fig. 1. In the present embodiment, the flow pipe 130 includes a plurality of first flow pipes 1301 and a plurality of second flow pipes 1302. The first flow pipes 1301 are arranged parallel to each other on a first reference plane P1. The second flow tubes 1302 are arranged parallel to each other on a second reference plane P2. The first reference plane P1 is parallel to the second reference plane P2. The first flow tube 1301 and the second flow tube 1302 are offset from each other.

In other embodiments, the condenser may also directly weld the opposite ends of the cooling fin set to the first and second cases, respectively, without including the first and second mounting

plates

150 and 160. In other embodiments, the condenser may not include the heat sink fin set 140.

Please refer to fig. 1 to 3 again. In the present embodiment, the fan case 600 includes a first board 610, a plurality of supporting pillars 620, a second board 630 and a plurality of bumps 640. The first plate 610 is disposed in the first opening 180 and has a plurality of mounting openings 611. These mounting openings 611 communicate with the heat dissipation channel 170. Opposite ends of each supporting pillar 620 are fixed to the first board 610 and the second board 630, respectively. The protrusion 640 protrudes from the second board 630.

The fans 700 are respectively disposed at the mounting openings 611 and are communicated with the heat dissipation channel 170 to guide the heat dissipation airflows F1 and F2 to flow between the heat dissipation channel 170 and the heat dissipation gap 1300 between the flow tubes 130, so as to cool the working fluid flowing in the flow tubes 130. In the present embodiment, the fan 700 is used for guiding the heat dissipation airflow F1 to flow from the heat dissipation channel 170 to the heat dissipation gap 1300 between the flow tubes 130 of the condenser 100, or for guiding the heat dissipation airflow F2 to flow from the heat dissipation gap 1300 between the flow tubes 130 to the heat dissipation channel 170. In other embodiments, the first plate of the fan case may also be disposed in the heat dissipation channel and spaced apart from the first opening, so that the fan is located in the heat dissipation channel and spaced apart from the first opening.

In the present embodiment, the wind shielding plate 800 is disposed between the bump 640 and the second box 120 and located at the second opening 190. Accordingly, the wind shielding plate 800 prevents the heat exchange efficiency between the working fluid and the heat dissipation airflows F1 and F2 guided by the fan 700 from being reduced due to the outflow of the heat dissipation airflows F1 and F2 from the second opening 190. In other embodiments, the heat dissipation assembly does not need to include the wind shielding plate 800.

In the present embodiment, since the first flow tube 1301 and the second flow tube 1302 are offset from each other, the condenser 100 can include more flow tubes 130 and thus more working fluid flows to the flow tubes 130. Thus, the heat exchange efficiency between the working fluid and the heat dissipation airflow F1 guided by the fan 700 can be improved.

It should be noted that the present invention is not limited to the arrangement of the flow tubes. Referring to fig. 5, fig. 5 is a partially enlarged view of a cross-sectional view of a heat dissipation assembly according to a second embodiment of the invention. In the present embodiment, the flow pipe 130a of each condenser 100a includes only the plurality of first flow pipes 1301a arranged parallel to each other along the first reference plane P1a and does not include the second flow pipes arranged parallel to each other on the second reference plane.

Referring to fig. 6, fig. 6 is a side view of an electronic assembly according to an embodiment of the invention. In the present embodiment, the electronic component 20 is used for flowing a working fluid and includes a cabinet 21, a frame 22, an electronic device 23, the heat dissipation assembly 10 according to the first embodiment of the present invention as described above with reference to fig. 1 to 4, and a filtering assembly 24. The rack 22 is provided in the cabinet 21. The electronic device 23 is disposed in the rack 22 and is, for example, a server. The heat sink assembly 10 is disposed on the cabinet 21 and located at one side of the frame 22. The condenser 100 of the heat sink assembly 10 is connected to the electronic device 23 for cooling a heat source (not shown) in the electronic device 23. The filter assembly 24 is disposed on a side of the heat sink assembly 10 away from the frame 22 such that the heat dissipation airflow F1 guided by the fan 700 of the heat sink assembly 10 passes through the filter assembly 24 before passing through the heat dissipation channel 170.

In addition, the fan can guide the heat dissipation airflow to flow from the heat dissipation gap between the flow pipes to the heat dissipation channel. Therefore, the heat dissipation airflow guided by the fan can be discharged in a direction away from the electronic device without affecting the maintenance of the electronic device by a maintenance worker.

In an embodiment of the invention, the heat dissipation assembly and the electronic assembly of the invention can be applied to a server, and the server can be used for Artificial Intelligence (AI) operation and Edge Computing (Edge Computing), and can also be used as a 5G server, a cloud server or a car networking server.

Although the invention has been described with respect to one or more embodiments thereof, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.

Claims

1. A heat dissipation assembly for a working fluid, the heat dissipation assembly comprising:

the condenser comprises a plurality of condensers, each condenser comprises a first box body, a second box body and a plurality of flow pipes, two opposite ends of each flow pipe are respectively communicated with the first box body and the second box body, a heat dissipation gap is formed between every two adjacent flow pipes, the working fluid is used for flowing from the first box body to the second box body through the flow pipes, the first box bodies, the second box bodies and the flow pipes of the condensers surround a heat dissipation channel, and the heat dissipation channel is communicated with the heat dissipation gaps among the flow pipes; and

and the fan is arranged on the condensers, is communicated with the heat dissipation channel and is used for guiding a heat dissipation airflow to flow among the heat dissipation channel and the heat dissipation gaps among the flow pipes of the condensers so as to cool the working fluid flowing in the flow pipes.

2. The heat removal assembly of claim 1, wherein each of the condensers further includes a heat removal fin set, and wherein in each of the condensers the plurality of flow tubes extend through the heat removal fin set and opposite ends of the heat removal fin set are secured to the first tank and the second tank, respectively.

3. The heat sink assembly of claim 2, wherein each of the condensers further comprises a first mounting plate and a second mounting plate, and wherein opposite sides of the set of heat dissipating fins in each of the condensers are secured to the first tank and the second tank through the first mounting plate and the second mounting plate, respectively.

4. The heat removal assembly of claim 1, wherein in each of the condensers the plurality of flow tubes includes a plurality of first flow tubes arranged parallel to each other on a first reference plane.

5. The heat dissipation assembly of claim 4, wherein in each of said condensers said plurality of flow tubes further comprises a plurality of second flow tubes, said plurality of second flow tubes being arranged parallel to each other on a second reference plane, said first reference plane being parallel to said second reference plane, said plurality of first flow tubes and said plurality of second flow tubes being offset from each other.

6. The heat dissipating assembly of claim 1, further comprising a fan housing, wherein the first boxes of the condensers together surround a first opening communicating with the heat dissipating channel, the fan housing is disposed at the first opening and comprises a mounting opening, the mounting opening communicates with the heat dissipating channel, and the fan is disposed at the mounting opening.

7. The heat dissipation assembly of claim 6, further comprising a wind shielding plate, wherein the second boxes of the condensers form a second opening together, the first opening and the second opening are respectively communicated with opposite ends of the heat dissipation channel, the fan frame comprises a first plate, a plurality of support columns, a second plate and a plurality of bumps, the first plate is disposed at the first opening, the mounting opening is located in the first plate, opposite ends of each support column are respectively fixed to the first plate and the second plate, the bumps protrude from the second plate, and the wind shielding plate is sandwiched between the bumps and the second boxes and located in the second opening.

8. The heat dissipation assembly of claim 1, further comprising a plurality of first connection pipes through which the plurality of first tanks of the plurality of condensers communicate with each other, and a plurality of second connection pipes through which the plurality of second tanks of the plurality of condensers communicate with each other.

9. The heat dissipating assembly of claim 8, further comprising an inlet pipe and an outlet pipe, wherein the inlet pipe communicates with one of the first connecting pipes and the outlet pipe communicates with one of the second connecting pipes.

10. An electronic assembly for providing a flow of a working fluid, the electronic assembly comprising:

a cabinet;

the rack is arranged on the cabinet;

the electronic device is arranged in the rack;

a heat dissipation assembly, comprising:

a fan disposed in the condensers and connected to the heat dissipation channel for guiding a heat dissipation airflow to flow between the heat dissipation channel and the heat dissipation gaps between the flow tubes of the condensers, so as to cool the working fluid flowing in the flow tubes;

the heat dissipation assembly is arranged on the cabinet and positioned on one side of the rack, and the plurality of condensers of the heat dissipation assembly are communicated with the electronic device; and

the filtering component is arranged on one side of the heat dissipation component far away from the rack, so that the heat dissipation airflow guided by the fan of the heat dissipation component passes through the filtering component before passing through the heat dissipation channel.