JPH02197195A - Multistage mounting cooling structure of electronic equipment - Google Patents

Abstract

PURPOSE:To improve a cooling structure of this design in cooling efficiency by a method wherein a cooling pipe is provided to cool air again warmed by a body which is provided lower and to be cooled before the air is guided to a body which is provided upper and to be cooled. CONSTITUTION:Two or more cooling pipes 6 are provided between units 2 mounted in a multistage manner and inside a dehumidifying mechanism unit 13 and provided with many fins 8 on their faces. And, coolant cooled lower than a room temperature by a cooling device provided outside an equipment is made to flow through the pipes 6, whereby cooling air risen in temperature by heat released from lower units is cooled down again with the surfaces of the fins 8 by absorbing heat by coolant inside pipes 8 and sent to upper units 2. In the dehumidifying mechanism unit 2, cooling air sucked in from the outside is cooled again by absorbing heat with the fins 8 and moisture contained in air is removed also through the fins 8 to dehumidify air. so that moisture is prevented from condensing on the surfaces of the pipes 6 between the units 2. Moisture condensed inside the unit 13 is made to flow through a ditch under a separating plate and discharged outside through a dehumidification piping.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a multi-stage mounting cooling structure in an electronic device including units each consisting of a plurality of pancages arranged in a plurality of layers.

[Prior Art] Conventionally, a multi-stage mounting cooling structure for this type of electronic device includes a plurality of cooling fans, an air intake duct for guiding cooling air to the object to be cooled mounted in multiple stages, and a cooling structure for cooling the object mounted in multiple stages. and an exhaust duct for discharging air from the electronic device to the outside of the electronic device.

In other words, when units 2 each having a package 3 that generates heat inside a housing l are stacked in multiple stages as shown in FIG. The package 3, which is the object to be cooled in the cooling passage 5E, is cooled by the taken-in cooling air while being forcibly discharged from the exhaust duct 11 for air cooling.

[Problem to be Solved by the Invention] However, according to such conventional technology, the cooling capacity of the unit 2 mounted at the top is significantly reduced due to the influence of heat generated from inside the unit mounted at the bottom. There was a drawback to that.

1'lfi Solution Vi] The present invention has been made in view of the above-mentioned problems, and its purpose is to cool all units in an electronic device more efficiently.

Specifically, the present invention includes a plurality of cooling fans, an intake duct for guiding cooling air to objects to be cooled mounted in multiple stages, and an air intake duct for discharging air from the objects to be cooled to the outside of an electronic device housing. It is arranged between the exhaust duct of the tank and each stage of the object to be cooled, and has a large number of fins on its surface, and is arranged in the cooling pipe through which the cooling liquid below room temperature flows, and the air intake part at the bottom of the case, and has a large number of fins on its surface. It has a configuration including a cooling pipe having a large number of fins and through which a cooling liquid below room temperature flows, and a dehumidifying mechanism composed of a partition plate that rectifies the cooling air and receives water droplets that condense on the cooling pipe.

[Example] The present invention will be explained with reference to the drawings.

FIGS. 1 to 4 show an embodiment of a multi-stage mounting cooling structure for electronic equipment according to the present invention. Note that common reference numerals are used for parts common to the conventional example, and duplicate explanations will be omitted.

In the embodiment, the multi-stage mounting cooling structure for electronic equipment includes a housing l.
A fan 4 that forcibly cools the unit 2 mounted on the unit 2, a cooling pipe 6 that cools the cooling air sent from the fan 4 again in each unit population, and a cooling air intake port that cools the cooling air from the outside. Dehumidification mechanism unit 13 that performs dehumidification
It is equipped with

A plurality of cooling pipes 6 are provided between the units 2 mounted in multiple stages and within the dehumidification mechanism unit 13, as shown in FIG.
A large number of fins 8 are provided on the surface of the sea urchin, and by flowing cooling liquid cooled to below room temperature from a cooling device installed outside the equipment into the tube, the cooling air whose temperature has risen due to heat generation in the lower unit is transferred to the fins 8. The temperature is absorbed on the surface, cooled again by the cooling liquid flowing inside the tube, and then sent to the upper unit.

Inside the dehumidifying mechanism unit 13, the cooling air taken in from the outside is recooled, and the 8 fins absorb the temperature and extract moisture from the air to dehumidify it, preventing condensation in the 6 cooling pipes between the units 2. are doing. Dehumidification mechanism unit 13
The water removed by the fins 8 of the cooling pipe 6 inside is removed by the partition plate 14.
It flows into the groove at the bottom, flows into the dehumidifying pipe 15, and is discharged to the outside (see Fig. 2.3).

[Effects of the Invention] The multi-stage mounting cooling structure for electronic equipment of the present invention re-cools the air warmed by the lower stage cooled body to 0τf by guiding it to the upper stage cooled body by adding a cooling pipe, Cool air can be supplied to the upper stage, which has the effect of improving cooling efficiency.

That is, the multi-stage mounting cooling structure for electronic equipment of the present invention improves the cooling efficiency when the electronic equipment is mounted in multiple stages by providing the above-mentioned cooling pipes between the objects to be cooled and at the intake l of the cooling air. There is an effect.

[Brief explanation of the drawing]

FIG. 1 is a front sectional view showing an embodiment of the multi-stage mounting cooling structure for electronic equipment of the present invention, FIG. 2 is a perspective view of a dehumidifying mechanism unit provided in the intake air [1] of the housing, and FIG. 3 is a dehumidifying mechanism FIG. 4 is a longitudinal sectional view of the unit, FIG. 4 is a perspective view of the cooling pipe shown in FIGS. 2 and 3, and FIG. 5 is a front sectional view showing a conventional embodiment. 1-, Housing 2: Unit 3: Package 4 Nifan 5: Cooling air flow path 6: Cooling pipe 7: Frame 8: Fin 9: Coolant flow path lO: Intake duct = υF air duct 12:? ? r Coolant liquid piping: Dehumidification mechanism unit 14: Partition plate 15: Dehumidification piping

Claims (1)

[Scope of Claims] A plurality of cooling fans, an intake duct for guiding cooling air to a multistage mounted object to be cooled, and an air intake duct for discharging air from the object to be cooled to the outside of an electronic device housing. an exhaust duct located between each stage of the object to be cooled, having a large number of fins on its surface, and a cooling pipe through which a cooling liquid below room temperature flows, and a cooling pipe located in an intake section at the bottom of the casing and having a number of fins on its surface. An electronic device comprising: a cooling pipe having fins, through which a cooling liquid at room temperature or lower flows; and a dehumidifying mechanism comprising a partition plate that rectifies cooling air and receives water droplets condensing on the cooling pipe. Multi-stage mounting cooling structure.