JP6501510B2 - Electronic dehumidifier for board - Google Patents

Description

  The present invention relates to an electronic dehumidifier for a panel which is attached to a switchboard, a control panel or the like and dehumidifies air in the panel.

  In a switchboard, control panel, etc., if dew condensation occurs inside the chassis due to the internal environment, there is a possibility that the internal equipment will be adversely affected, so a panel dehumidifier will be provided to dehumidify the air in the cabinet to prevent condensation. There is.

  As a board dehumidifier, for example, as shown in Patent Document 1, an electronic dehumidifier using a Peltier element is widely used. In the electronic dehumidifier of Patent Document 1, the air cooled by the cooling body of the Peltier element is sent to the heat radiating body of the Peltier element to enhance the heat radiation effect, thereby improving the dehumidifying ability.

  However, the power supply device for energizing the Peltier element of the panel dehumidifier is only cooled by sucking the outside air or the panel air with a fan. Therefore, when the outside air temperature is high, there is a problem that the electronic components mounted on the power supply device are not sufficiently cooled, and the life of the power supply device is shortened.

  In addition, there is also a panel dehumidifier that cools the power supply unit by introducing the air that has cooled the heat sink to the power supply unit, but because the power supply unit is cooled by the air heated by the radiator, the outside temperature is high In the same manner as described above, there is a problem that the power supply can not be cooled sufficiently.

JP, 2010-75854, A

  Therefore, an object of the present invention is to provide an electronic dehumidifier for a panel which is excellent in dehumidifying ability and can efficiently cool a power supply device.

The present invention made to solve the above problems comprises an electronic cooling element, a cooling body and a heat radiating body respectively attached to the heat absorption surface and the heat dissipation surface, a power supply for energizing the electronic cooling element, and a fan. It is an electronic dehumidifier for a board provided in a housing, and it has a flow path for sucking air in the board and flowing upward to the heat dissipation body inside the housing, and sucks air in the board and faces upward to the cooling body And the flow path for flowing to the air flow path, and the power supply device is disposed in the flow path of the air cooled by the cooling body.

  According to a second aspect of the present invention, a first partition plate is provided in the inside of the housing for separating the flow passage flowing to the power supply device and the flow passage flowing to the cooling body, and the first partition plate A first flow passage may be formed to flow the cooled air to the power supply. According to the third aspect of the present invention, a second partition plate may be provided above the cooling body to guide the air cooled by the cooling body to the first flow passage.

  Further, in the present invention, as in claim 4, a first flow passing portion for flowing the air cooled by the cooling body to the power supply device, and a second passing portion for flowing the air cooled by the cooling body to the radiator. According to a fifth aspect of the present invention, the heat dissipating body can be disposed on one side of the cooling body and the power supply device can be disposed on the other side. According to the sixth aspect of the present invention, the radiator and the power supply can be arranged in parallel above the cooling body.

  In the electronic dehumidifier for board of the present invention, since the power supply device is disposed in the flow path of the air cooled by the cooling body, the power supply device can be cooled efficiently.

  According to the second aspect of the present invention, the air cooled by the cooling body flows through the power supply device to the first partition plate that separates the flow path flowing through the power supply device and the flow path flowing through the cooling body. As one flow passage part is formed, these flow paths can be connected, and the power supply device can be cooled. According to the invention of claim 3, the air cooled by the cooling body can be guided to the first flow passage portion by the second partition plate.

  According to the fourth aspect of the present invention, the air cooled by the cooling body can be sent to the heat radiating body, the heat radiating body can be cooled to improve the dehumidifying ability, and the power supply device can be efficiently cooled.

  According to the invention of claim 5, the air cooled by the cooling body can be easily diverted to the heat radiating body and the power supply device. According to the invention of claim 6, the power supply apparatus can be efficiently cooled while cooling the heat radiating body to improve the dehumidifying ability. In addition, the left and right width of the housing can be reduced to the extent that the power supply device can be disposed above the cooling body. Furthermore, since the radiator and the power supply device can be cooled by a single flow path, the device configuration can be simplified.

It is a longitudinal cross-sectional view which shows 1st Embodiment. It is an appearance perspective view showing a 1st embodiment. It is a cross-sectional perspective view which shows an internal structure. It is a cross-sectional perspective view which shows an internal structure. It is a longitudinal cross-sectional view which shows 2nd Embodiment.

  Hereinafter, embodiments of the present invention will be described. The board electronic dehumidifier of the present invention is mounted in a board such as a control board or a distribution board to prevent condensation.

  1 to 4 are views showing a first embodiment of the present invention, in which 1 is a case of a panel electronic dehumidifier, and 2 is an electronic cooling device 2 comprising a Peltier device provided therein. A fin-shaped cooling body 3 is attached to the heat absorption surface of the electronic cooling element 2, and a fin-shaped heat radiation body 4 is attached to the heat dissipation surface. It is preferable that these fin shapes have a flow path in the vertical direction. In this embodiment, the cooling body 3 is located at the center of the housing 1.

An exhaust fan 5 for forced exhaust is provided in a ceiling portion of the housing 1. These exhaust fans 5 draw in the air from the first suction port 7 formed in the lower front of the housing 1 shown in FIG. 2 and allow the air to flow upward through the fin-shaped cooling body 3, and The air in the board is sucked from the third suction port 8 formed on the lower surface of the housing 1 shown in FIG. 2 and has a function of flowing upward through the fin-shaped heat radiating body 4. The exhaust air from the exhaust fan 5 is returned to the inside of the panel from an exhaust port formed on the ceiling surface of the housing 1.

  The air in the board in contact with the cooling body 3 is cooled to condense the contained water, and the condensed water is discharged to the outside of the board through the water receiving portion 9 at the lower part of the housing 1 and the drain pipe 10. Further, the radiator 4 is cooled by the air in the board sucked from the third suction port 8.

  The first partition plate 11 is provided inside the housing 1, the power supply device 6 for supplying power to the electronic cooling element 2 is disposed on one side thereof, and the above-described cooling body 3 is disposed on the opposite side thereof. There is. Therefore, the inside of the housing 1 is divided by the first partition plate 11 into the flow passage 12 flowing to the power supply device 6 and the flow passage 13 flowing to the cooling body 3. A second suction port 14 shown in FIG. 2 is formed in the lower part of the flow path 12 flowing to the power supply device 6.

  In addition, a partition 15 is also formed between the electronic cooling element 2 and the radiator 4, and a second partition 16 is provided between the upper portion of the partition 15 and the upper portion of the first partition 11. There is. Further, in the first partition plate 11 slightly below the second partition plate 16, there is formed a first flow passage portion 17 for flowing the air cooled by the cooling body 3 to the power supply device 6. Therefore, the power supply device 6 is cooled by the air in the disc flowing in the flow path 12 and also cooled by the cooled air flowing in from the first flow passage 17. Thus, the second partition plate 16 has a role of guiding the air cooled by the cooling body 3 to the first flow passage portion 17. The air in the board, which has cooled the power supply 6, is sucked by the exhaust fan 5 via the third flow portion 18 on the upper side of the second partition plate 16, and is exhausted into the board.

  Further, in this embodiment, the second flow portion 19 is also formed in the partition wall 15 slightly below the second partition plate 16. The second flow portion 19 is for sending the air cooled by the cooling body 3 to the heat radiating body 4. As a result, since the radiator 4 is cooled not only by the air in the board sucked from the third suction port 8 but also by the air cooled by the cooling member 3, the heat radiation effect is enhanced and the dehumidifying ability of the electronic cooling element 2 is improved. It is possible to

  The electronic dehumidifier for a board configured in this way is to bring the air drawn from the inside of the board into contact with the cooling body 3 to condense the moisture in the air, and discharge it as condensation water through the drain pipe 10 to the outside of the board A part of the cooled and moisture-removed air flows into the flow path 12 where the power supply device 6 is installed through the first flow passage portion 17 and cools the power supply device 6. It is returned to the inside of the board by the exhaust fan 5 via the upper third circulation portion 18. This can reduce the humidity of the air in the board. Further, the power supply 6 can be cooled efficiently.

  Further, the remaining part of the air cooled by the cooling body 3 flows to the heat radiating body 4 through the second circulation portion 19 and cools the heat radiating body 4 and then the exhaust fan 5 discharges air from the exhaust port on the ceiling surface of the housing 1 Will be returned. As a result, the heat radiation efficiency of the heat radiator 4 can be enhanced, and the dehumidifying ability can be improved.

  As described above, in the first embodiment, the radiator 4 is disposed on one side of the cooling body 3 and the power supply 6 is disposed on the other side. Therefore, the air cooled by the cooling body 3 can be easily diverted.

A hole may be formed in a part of the second partition plate 16 to form an air flow passage, and the cooled air may flow to the flow passage and the power supply 6 side. Then, the resistance to the flow of the cooled air can be reduced, and the air in the board can be efficiently taken into the housing 1, so that the dehumidifying ability can be enhanced. In this embodiment, the exhaust fan 5 is disposed on the ceiling of the housing 1. However, the intake fan and the exhaust fan may be combined, or only the intake fan may be used alone, and the number of fans is also particularly limited. It is not a thing.

  FIG. 5 is a view showing a second embodiment of the present invention. In the second embodiment, the overhanging portion 20 is formed so that a part of the heat radiating body 4 is located above the cooling body 3, and the power supply device 6 is also located above the cooling body 3. The overhanging portion 20 of the heat dissipating member 4 and the power supply device 11 are disposed in parallel above.

  An exhaust fan 21 is provided in the ceiling portion of the housing 1, and air in the panel sucked from a first suction port (not shown) in the lower part of the housing 1 is passed through the cooling body 3 and cooled air The power supply 6 is cooled. Further, as in the first embodiment, the air in the board is also drawn to the heat radiating body 4. A water receiving portion 9 and a drain pipe 10 are provided at the lower part of the cooling body 3 to drain condensation water.

  The panel electronic dehumidifier of the second embodiment can also dehumidify the panel air to prevent condensation, and can also cool the power supply 6. Moreover, the cooled air can be sent to the radiator 4 for cooling, and the dehumidifying ability can be improved. If such a layout is adopted, the power supply device 6 can be disposed above the cooling body 3, so the lateral width of the housing can be reduced. Moreover, there is an advantage that the radiator 4 and the power supply 6 can be cooled by a single flow path.

  As described above, the board electronic dehumidifier of the present invention is excellent in the dehumidifying ability, and can efficiently cool the power supply device.

Reference Signs List 1 case 2 electronic cooling element 3 cooling body 4 radiator 5 exhaust fan 6 power supply device 7 first suction port 8 third suction port 9 water receiving portion 10 drain pipe 11 first partition plate 12 flow path 13 flow path 14 second Suction port 15 partition wall 16 second partition plate 17 first flow passage portion 18 third flow passage portion 19 second flow portion 20 overhanging portion 21 exhaust fan

Claims (6)

An electronic dehumidifier for a panel comprising an electronic cooling element, a cooling body and a heat radiating body respectively attached to the heat absorbing surface and the heat radiating surface, a power supply device for energizing the electronic cooling element, and a fan in a housing. A flow path for sucking air in the board and flowing upward to the radiator and a flow path for sucking air in the board and flowing upward to the cooling body are formed in the inside of the housing, and the cooling body An electronic dehumidifier for a panel, comprising the power supply device disposed in a flow path of cooled air.   A first partition plate is provided inside the housing to separate the flow passage flowing to the power supply device and the flow passage flowing to the cooling body, and the air cooled by the cooling body is provided to the first partition plate to the power supply device The electronic dehumidifier for a panel according to claim 1, wherein a first flow portion for flowing is formed.   The electronic dehumidifier for a panel according to claim 2, further comprising a second partition plate for guiding the air cooled by the cooling body to the first flow passage above the cooling body.   A first flowing portion for flowing the air cooled by the cooling body to the power supply device, and a second flowing portion for flowing the air cooled by the cooling body to the radiator. An electronic dehumidifier for a board according to claim 1.   The electronic dehumidifier for a panel according to claim 4, wherein the radiator is disposed on one side of the cooling body and the power supply device is disposed on the other side.   2. A panel electronic dehumidifier according to claim 1, wherein the heat dissipating member and the power supply device are disposed in parallel above the cooling member.

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