CN115776766A - Circuit board connecting structure and manufacturing method thereof - Google Patents
Circuit board connecting structure and manufacturing method thereof Download PDFInfo
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- CN115776766A CN115776766A CN202111052116.6A CN202111052116A CN115776766A CN 115776766 A CN115776766 A CN 115776766A CN 202111052116 A CN202111052116 A CN 202111052116A CN 115776766 A CN115776766 A CN 115776766A
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Abstract
A circuit board connecting structure and a manufacturing method thereof. The circuit board connecting structure comprises a circuit board and a protection structure arranged on the circuit board. The protection structure comprises a protection film, a first circuit layer embedded in the protection film and a conductive part electrically connected with the first circuit layer, wherein the conductive part is a first conductive part and a second conductive part. The circuit board comprises a circuit substrate and an electronic element which is arranged on the surface of the circuit substrate and electrically connected with the circuit substrate, a third conductive part is arranged on the top surface of the electronic element far away from the circuit substrate, and the circuit substrate comprises a welding pad. The protective film is arranged on the top surface and the side surface of the electronic element and the surface of the circuit substrate, so that the electronic element is coated in the protective film; the first circuit layer is arranged on the top surface and the side surface of the electronic element and the surface of the circuit substrate with the electronic element, the first conductive part is connected with the third conductive part, and the second conductive part is connected with the welding pad, so that the electronic element is electrically connected with the circuit substrate through the first circuit layer.
Description
Technical Field
The present application relates to a circuit board connection structure and a method of manufacturing the circuit board connection structure.
Background
A wiring board typically includes a wiring layer and an electronic component (e.g., a chip) electrically connected to the wiring layer. The electronic element can be connected with the circuit layer by means of soldering tin balls or metal routing. In order to protect the electronic components, it is also generally necessary to cover the electronic components with an electromagnetic shielding film or coat a protective film. However, the solder ball increases the thickness of the circuit board, and the subsequent coating film cannot completely fill the gap around the solder ball, resulting in the popcorn effect. The metal routing increases the lateral size occupied by the chip, and the metal wire is easy to punch after being coated with the film to cause short circuit.
Disclosure of Invention
In view of the above, it is desirable to provide a circuit board connecting structure and a method for manufacturing the same, which can solve the above problems.
The application provides a manufacturing method of a circuit board connecting structure, which comprises the following steps: providing a protection structure, wherein the protection structure comprises a protection film, a first circuit layer embedded in the protection film and a conductive part electrically connected to the first circuit layer, the conductive part protrudes out of the protection film, and the conductive part comprises a first conductive part and a second conductive part; providing a circuit board, wherein the circuit board comprises a circuit substrate and an electronic element which is arranged on the surface of the circuit substrate and is electrically connected with the circuit substrate, a third conductive part is arranged on the top surface of the electronic element far away from the circuit substrate, and the circuit substrate comprises a welding pad; covering the protection structure on the circuit board, so that the electronic element is positioned between the circuit substrate and the protection structure, and the first conductive part corresponds to the third conductive part, thereby obtaining an intermediate body; and pressing the intermediate body, so that the first conductive part is connected with the third conductive part, and the protective film is bent to the side surface of the electronic element and the surface of the circuit substrate with the electronic element, so as to coat the electronic element therein, and the first circuit layer is bent to the side surface of the electronic element and the surface of the circuit substrate with the electronic element, so that the second conductive part is connected with the welding pad, thereby obtaining the circuit board connection structure.
In some possible implementations, the first circuit layer includes a plurality of circuits, two ends of each circuit are the first conductive part and the second conductive part respectively, and each circuit is in a curved shape.
In some possible implementations, the method for manufacturing the protection structure includes: providing a substrate, wherein the substrate comprises a first release layer, a first protective layer and a second release layer which are arranged in a stacking mode; forming a circuit groove in the first release layer; manufacturing the first circuit layer in the circuit groove; forming a second protective layer on the first protective layer having the first wiring layer so that the first wiring layer is buried in the second protective layer, the first protective layer and the second protective layer together constituting the protective film; forming a third release layer on the second protective layer; openings are formed in the third release layer and the second protective layer, and part of the first circuit layer is exposed out of the openings; forming the conductive portion in the opening; and removing the second release layer and the third release layer to obtain the protection structure.
In some possible implementations, the first circuit layer is manufactured by printing, electroplating, sputtering or vapor deposition.
In some possible implementations, the conductive portion is fabricated by printing a conductive paste, electroplating, sputtering, or vapor deposition.
In some possible implementations, the circuit substrate includes a base layer, at least one second circuit layer disposed on a surface of the base layer, and an insulating layer disposed on the outermost second circuit layer, the electronic component is bonded to the insulating layer by an adhesive layer, and a portion of the outermost second circuit layer is exposed from the insulating layer to form the pad.
The application also provides a circuit board connecting structure, which comprises a circuit board and a protection structure arranged on the circuit board. The protection structure comprises a protection film, a first circuit layer embedded in the protection film and a conductive part electrically connected with the first circuit layer, wherein the conductive part comprises a first conductive part and a second conductive part. The circuit board comprises a circuit substrate and an electronic element which is arranged on the surface of the circuit substrate and electrically connected with the circuit substrate, wherein a third conductive part is arranged on the top surface of the electronic element far away from the circuit substrate, and the circuit substrate comprises a welding pad. The protective film is arranged on the top surface and the side surface of the electronic element and the surface of the circuit substrate, so that the electronic element is coated in the protective film; the first circuit layer is arranged on the top surface and the side surface of the electronic element and the surface of the circuit substrate with the electronic element, the first conductive part is connected with the third conductive part, and the second conductive part is connected with the welding pad, so that the electronic element is electrically connected with the circuit substrate through the first circuit layer.
In some possible implementations, the first circuit layer includes a plurality of circuits, two ends of each circuit are the first conductive part and the second conductive part respectively, and each circuit is in a curve shape.
In some possible implementations, the circuit substrate includes a base layer, at least one second circuit layer disposed on a surface of the base layer, and an insulating layer disposed on the outermost second circuit layer, and the outermost second circuit layer is partially exposed to the insulating layer to form the pad.
In some possible implementations, the electronic component is bonded to the insulating layer by an adhesive layer.
In this application, the electronic component is electrically connected to the circuit substrate through the first circuit layer in the protection structure, and the electronic component is embedded in the protection structure to perform a protection function. The electronic element is not required to be welded by a welding ball or mounted on the welding pad of the circuit substrate by a metal routing, so that the whole size of the circuit board connecting structure is reduced, and the product integration level is improved. In addition, the metal lead is omitted, so that the short circuit problem caused by wire punching of the metal lead in the pressing process is avoided.
Drawings
Fig. 1 is a schematic cross-sectional view of a substrate according to an embodiment of the present disclosure.
Fig. 2 is a schematic cross-sectional view of the substrate shown in fig. 1 after forming a circuit trench therein.
Fig. 3 is a schematic cross-sectional view of the first circuit layer formed in the circuit groove of fig. 2.
Fig. 4a is a schematic cross-sectional view of the substrate shown in fig. 3 after the first release layer is removed.
Fig. 4b is a top view of fig. 4 a.
Fig. 5 is a schematic cross-sectional view of the second passivation layer formed on the first circuit layer shown in fig. 4 a.
Fig. 6 is a schematic cross-sectional view illustrating a third release layer formed on the second passivation layer shown in fig. 5.
Fig. 7 is a schematic cross-sectional view of the third release layer and the second passivation layer shown in fig. 6 with openings.
Fig. 8 is a schematic cross-sectional view of the opening shown in fig. 7 after forming a conductive portion therein.
Fig. 9a is a schematic cross-sectional view of the protective structure obtained by removing the second release layer and the third release layer shown in fig. 8.
Fig. 9b is a top view of fig. 9 a.
Fig. 10 is a schematic cross-sectional view of an intermediate obtained after the protective structure shown in fig. 9a is coated on a wiring board.
Fig. 11 is a schematic sectional view of a wiring board connection structure obtained after the intermediate body shown in fig. 10 is press-fitted.
Description of the main elements
Circuit board connection structure 1
First protective layer 12
Second protective layer 15
Third conductive part 31
First conductive part 181
Second conductive part 182
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The following description refers to the accompanying drawings to more fully describe the present disclosure. Exemplary embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Like reference numerals designate identical or similar components.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Further, as used herein, the terms "comprises," "comprising," "includes" and/or "including" and/or "having," integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Furthermore, unless otherwise defined herein, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present application and will not be interpreted in an idealized or overly formal sense.
The following description of exemplary embodiments refers to the accompanying drawings. It should be noted that the components depicted in the referenced drawings are not necessarily shown to scale; and the same or similar components will be given the same or similar reference numerals or similar terms.
Embodiments of the present application will now be described in further detail with reference to the accompanying drawings.
One embodiment of the present application provides a method for manufacturing a circuit board connection structure 1 (see fig. 11), including the steps of:
referring to fig. 1, a substrate 10 is provided, which includes a first release layer 11, a first protective layer 12 and a second release layer 13 stacked on top of each other.
In some embodiments, the material of the first release layer 11 and the second release layer 13 may be polyethylene Terephthalate (PET) or Polycarbonate (PC). The material of the first release layer 11 may be the same as the material of the second release layer 13. The first protective layer 12 may be made of epoxy resin (epoxy resin) or Polyurethane (PU).
Referring to fig. 2, a circuit groove 110 is formed in the first release layer 11.
In some embodiments, the line groove 110 may be formed by laser drilling, punching, or exposure development.
Referring to fig. 3, a first circuit layer 14 is formed in the circuit groove 110.
In some embodiments, the first circuit layer 14 can be fabricated in the circuit groove 110 by printing, electroplating, sputtering, or vapor deposition. Wherein, the top surface of the first circuit layer 14 may be flush with the top surface of the first release layer 11.
Referring to fig. 4a and 4b, the first release layer 11 is removed.
Referring to fig. 5, a second passivation layer 15 is formed on the first passivation layer 12 having the first circuit layer 14, such that the first circuit layer 14 is embedded in the second passivation layer 15.
In some embodiments, the thickness of the second protection layer 15 is greater than the thickness of the first line layer 14, so that the first line layer 14 is completely buried in the second protection layer 15. The material of the second passivation layer 15 may be the same as the material of the first passivation layer 12. The first protective layer 12 and the second protective layer 15 may together constitute a protective film 16.
Referring to fig. 6, a third release layer 17 is formed on the second passivation layer 15.
In some embodiments, the material of the third release layer 17 may be the same as the material of the first release layer 11 or the second release layer 13.
Step seven, please refer to fig. 7, an opening 170 is formed in the third release layer 17 and the second passivation layer 15. The opening 170 is used to expose a portion of the first circuit layer 14.
In step eight, referring to fig. 8, the conductive portion 18 electrically connected to the first circuit layer 14 is formed in the opening 170. The conductive portions 18 are divided into first conductive portions 181 and second conductive portions 182, the first conductive portions 181 are used for connecting electronic components, and the second conductive portions 182 are used for connecting circuit substrates.
In some embodiments, the conductive portion 18 may be fabricated by printing a conductive paste, electroplating, sputtering, or vapor deposition.
In step nine, referring to fig. 9a and 9b, the second release layer 13 and the third release layer 17 are removed, so that the conductive portion 18 protrudes from the protection film 16, thereby obtaining the protection structure 100.
Step ten, referring to fig. 10, a circuit board 200 is provided, which includes a circuit substrate 20 and an electronic component 30 disposed on the surface of the circuit substrate 20 and electrically connected to the circuit substrate 20, wherein a third conductive portion 31 is disposed on a top surface of the electronic component 30 away from the circuit substrate 20. The wiring substrate 20 includes a pad 220. Then, the protection structure 100 is covered on the wiring board 200, such that the electronic component 30 is located between the circuit substrate 20 and the protection structure 100, and such that the first conductive portion 181 of the protection structure 100 corresponds to the third conductive portion 31 of the electronic component 30. At this point, an intermediate (not shown) was obtained.
In some embodiments, the circuit substrate 20 includes a base layer 21, two second circuit layers 22 disposed on opposite surfaces of the base layer 21, and an insulating layer 23 disposed on each of the second circuit layers 22. That is, the circuit substrate 20 may be a double-sided board. The electronic component 30 is adhered to one of the insulating layers 23 by an adhesive layer 40. The second circuit layer 22 near the electronic component 30 is partially exposed out of the insulating layer 23 to form the pad 220. In some embodiments, the insulating layer 23 may be a solder mask or a coverlay film (CVL).
It is understood that the circuit substrate 20 of the present application is not limited to a double-sided board, i.e., the number of the second circuit layers 22 may be changed according to specific requirements. For example, in other embodiments, the circuit substrate 20 may include more than two second circuit layers 22, and the insulating layer 23 is disposed on the outermost second circuit layers 22. The electronic component 30 is adhered to one of the insulating layers 23 by an adhesive layer 40. For another example, in some embodiments, the circuit substrate 20 may include only one second circuit layer 22, and the insulating layer 23 is disposed on the second circuit layer 22.
Further, a surface treatment layer 221 may be formed on the bonding pad 220 to prevent the surface of the bonding pad 220 from being oxidized and affecting the electrical characteristics thereof. The surface treatment layer 221 may be a chemical plating layer formed by electroless gold plating, electroless nickel plating, or the like, or may be an organic solder resist protective layer.
In some embodiments, the material of the base layer 21 may be selected from one of Polyimide (PI), liquid Crystal Polymer (LCP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and the like. The adhesive layer 40 is made of a viscous resin, and more specifically, the resin may be at least one selected from polypropylene (PP), epoxy resin (epoxy resin), polyurethane (PU), phenol resin (phenolic resin), urea-formaldehyde resin (UF), melamine-formaldehyde resin (melamine-formaldehyde resin), polyimide (PI), and the like.
In some embodiments, the third conductive portion 31 may be a pin of the electronic component 30.
Step eleven, referring to fig. 11, the intermediate is pressed to obtain the circuit board connection structure 1.
The first conductive portion 181 of the first circuit layer 14 of the protection structure 100 is connected to the third conductive portion 31 of the electronic component 30 by pressing, and the first circuit layer 14 is bent to the side surface of the electronic component 30 and the surface of the circuit substrate 20 having the electronic component 30, so that the second conductive portion 182 is connected to the bonding pad 220 of the circuit substrate 20. Thus, the electronic component 30 can be electrically connected to the circuit substrate 20 through the first circuit layer 14. Since the electronic component 30 is adhered to the circuit substrate 20, and the electronic component 30 is electrically connected to the circuit substrate 20 through the first circuit layer 14 by pressing the protection structure 100, a high temperature reflow process required for electrically connecting the electronic component 30 to the circuit substrate 20 is omitted, and an influence of a thermal process on the electronic component 30 is reduced, so that the electronic component 30 can be suitable for connecting the electronic component 30 and the circuit substrate 20 which are not resistant to high temperature. Moreover, the pressing process also makes the protection film 16 of the protection structure 100 bend to the side of the electronic component 30 and the surface of the circuit substrate 20 having the electronic component 30, so as to cover the electronic component 30 therein for protection.
Meanwhile, the electronic component 30 does not need to be mounted on the bonding pad 220 of the circuit substrate 20 by solder ball bonding or metal wire bonding, which is beneficial to reducing the overall size of the circuit board connection structure 1 and also beneficial to improving the product integration level. Moreover, because the metal lead is omitted, the short circuit problem caused by wire punching of the metal lead in the pressing process is also avoided.
In some embodiments, the pressing may be performed under vacuum conditions. Baking may also be performed after the pressing, so that the protective film 16 is sufficiently cured.
In some embodiments, as shown in fig. 4b, the first circuit layer 14 obtained in step three includes a plurality of circuits 140, and two ends of each circuit 140 are respectively a first conductive portion 181 and a second conductive portion 182. Each of the wires 140 is curved in shape to enhance stretchability of the first wire layer 14. In this way, in the pressing process of the eleventh step, the first circuit layer 14 can be sufficiently deformed by stretching, so that the first circuit layer 14 is bent to the side surface of the electronic component 30 and the surface of the circuit substrate 20.
Referring to fig. 11, an embodiment of the present application further provides a circuit board connection structure 1, which includes a circuit board 200 and a protection structure 100 disposed on the circuit board 200.
The protection structure 100 includes a protection film 16, a first circuit layer 14 embedded in the protection film 16, and a conductive portion 18 electrically connected to the first circuit layer 14. The conductive portions 18 are divided into first conductive portions 181 and second conductive portions 182.
The circuit board 200 includes a circuit substrate 20 and an electronic component 30 disposed on the surface of the circuit substrate 20 and electrically connected to the circuit substrate 20, and a third conductive portion 31 is disposed on the top surface of the electronic component 30 away from the circuit substrate 20. The wiring substrate 20 includes a pad 220.
The protection structure 100 covers the wiring board 200. The protective film 16 is provided on the top and side surfaces of the electronic component 30 and the surface of the circuit substrate 20, so as to cover the electronic component 30 therein for protection. The first circuit layer 14 is disposed on the top surface and the side surface of the electronic component 30 and the surface of the circuit substrate 20 having the electronic component 30, the first conductive portion 181 is connected to the third conductive portion 31 of the electronic component 30, and the second conductive portion 182 is connected to the bonding pad 220 of the circuit substrate 20, so that the electronic component 30 is electrically connected to the circuit substrate 20 through the first circuit layer 14.
In the present application, the electronic component 30 is electrically connected to the circuit substrate 20 through the first circuit layer 14 in the protection structure 100, and the electronic component 30 is embedded in the protection structure 100 for protection. Since the electronic component 30 is not required to be mounted on the pad 220 of the circuit substrate 20 by solder ball bonding or metal wire bonding, the overall size of the circuit board connection structure 1 is reduced, and the product integration level is improved. Moreover, because the metal lead is omitted, the short circuit problem caused by wire punching of the metal lead in the pressing process is also avoided.
It should be understood by those skilled in the art that the above embodiments are only for illustrating the present application and are not used as limitations of the present application, and that suitable modifications and changes of the above embodiments are within the scope of the claims of the present application as long as they are within the spirit and scope of the present application.
Claims (10)
1. A manufacturing method of a circuit board connecting structure is characterized by comprising the following steps:
providing a protection structure, wherein the protection structure comprises a protection film, a first circuit layer embedded in the protection film and a conductive part electrically connected to the first circuit layer, the conductive part protrudes out of the protection film, and the conductive part comprises a first conductive part and a second conductive part;
providing a circuit board, wherein the circuit board comprises a circuit substrate and an electronic element which is arranged on the surface of the circuit substrate and is electrically connected with the circuit substrate, a third conductive part is arranged on the top surface of the electronic element far away from the circuit substrate, and the circuit substrate comprises a welding pad;
covering the protection structure on the circuit board, so that the electronic element is positioned between the circuit substrate and the protection structure, and the first conductive part corresponds to the third conductive part, thereby obtaining an intermediate body;
and pressing the intermediate body, so that the first conductive part is connected with the third conductive part, and the protective film is bent to the side surface of the electronic element and the surface of the circuit substrate with the electronic element, so as to coat the electronic element therein, and the first circuit layer is bent to the side surface of the electronic element and the surface of the circuit substrate with the electronic element, so that the second conductive part is connected with the welding pad, thereby obtaining the circuit board connection structure.
2. The method for manufacturing a circuit board connection structure according to claim 1, wherein the first circuit layer includes a plurality of circuits, both ends of each of the circuits are the first conductive portion and the second conductive portion, respectively, and each of the circuits is curved.
3. The method for manufacturing a circuit board connection structure according to claim 1, wherein the method for manufacturing the protection structure comprises:
providing a substrate, wherein the substrate comprises a first release layer, a first protective layer and a second release layer which are arranged in a stacking mode;
forming a circuit groove in the first release layer;
manufacturing the first circuit layer in the circuit groove;
forming a second protective layer on the first protective layer having the first circuit layer so that the first circuit layer is buried in the second protective layer, the first protective layer and the second protective layer together constituting the protective film;
forming a third release layer on the second protective layer;
openings are formed in the third release layer and the second protective layer, and part of the first circuit layer is exposed out of the openings;
forming the conductive portion in the opening;
and removing the second release layer and the third release layer to obtain the protection structure.
4. The method for manufacturing the circuit board connecting structure according to claim 3, wherein the first circuit layer is manufactured by printing, electroplating, sputtering or vapor deposition.
5. The method for manufacturing a circuit board connection structure according to claim 3, wherein the conductive portion is manufactured by printing conductive paste, electroplating, sputtering or vapor deposition.
6. The method for manufacturing a circuit board connection structure according to claim 1, wherein the circuit substrate includes a base layer, at least one second circuit layer disposed on a surface of the base layer, and an insulating layer disposed on the outermost second circuit layer, the electronic component is bonded to the insulating layer by an adhesive layer, and the outermost second circuit layer is partially exposed to the insulating layer to form the pad.
7. A circuit board connecting structure is characterized by comprising a circuit board and a protection structure arranged on the circuit board;
the protective structure comprises a protective film, a first circuit layer embedded in the protective film and a conductive part electrically connected with the first circuit layer, wherein the conductive part is divided into a first conductive part and a second conductive part;
the circuit board comprises a circuit substrate and an electronic element which is arranged on the surface of the circuit substrate and electrically connected with the circuit substrate, wherein a third conductive part is arranged on the top surface of the electronic element, which is far away from the circuit substrate, and the circuit substrate comprises a welding pad;
the protective film is arranged on the top surface and the side surface of the electronic element and the surface of the circuit substrate, so that the electronic element is coated in the protective structure; the first circuit layer is arranged on the top surface and the side surface of the electronic element and the surface of the circuit substrate with the electronic element, the first conductive part is connected with the third conductive part, and the second conductive part is connected with the welding pad, so that the electronic element is electrically connected with the circuit substrate through the first circuit layer.
8. The wiring board connection structure according to claim 7, wherein the first wiring layer includes a plurality of wirings, both ends of each of the wirings are the first conductive portion and the second conductive portion, respectively, and each of the wirings has a curved shape.
9. The circuit board connecting structure according to claim 7, wherein the circuit substrate includes a base layer, at least one second circuit layer provided on a surface of the base layer, and an insulating layer provided on the outermost second circuit layer, and the outermost second circuit layer is partially exposed to the insulating layer to form the pad.
10. The wiring board connection structure according to claim 9, wherein the electronic component is bonded to the insulating layer by an adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111052116.6A CN115776766A (en) | 2021-09-08 | 2021-09-08 | Circuit board connecting structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111052116.6A CN115776766A (en) | 2021-09-08 | 2021-09-08 | Circuit board connecting structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115776766A true CN115776766A (en) | 2023-03-10 |
Family
ID=85388230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111052116.6A Pending CN115776766A (en) | 2021-09-08 | 2021-09-08 | Circuit board connecting structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115776766A (en) |
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2021
- 2021-09-08 CN CN202111052116.6A patent/CN115776766A/en active Pending
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