CN115775664A - Composite thermistor - Google Patents

Abstract

The invention provides a composite thermistor. The composite thermistor includes: a unitary structure comprising a first resistor body and a second resistor body connected to each other; wherein the first resistor body comprises a thermistor body; the second resistor body comprises any one or combination of a thermistor body, a thick-film resistor body, a thin-film resistor body and a winding resistor body. According to the invention, through the compounding between the single or multiple thermistors and the thermistors, and the compounding between the single or multiple thermistors and the thick-film resistor, the thermistors and the thin-film resistor, and the thermistors and the winding resistor, under the condition of ensuring that the circuit realizes unchanged functions, the consumption of single element devices in the circuit is reduced, the circuit design is simplified, the wiring is simple, and the installation space of the components is saved; meanwhile, the manufacturing of the composite device can also reduce the usage amount of raw materials, shorten the process manufacturing flow, be beneficial to saving the cost and be suitable for large-scale mass production.

Description

Composite thermistor

Technical Field

The invention relates to the technical field of electronic components, in particular to a composite thermistor.

Background

A thermistor is a widely used semiconductor device, and is classified into a positive temperature coefficient thermistor (PTC thermistor) and a negative temperature coefficient thermistor (NTC thermistor) according to a temperature coefficient, and a semiconductor thermistor, a metal thermistor, an alloy thermistor, and the like according to a material. The circuit has the advantages of high sensitivity, wide working temperature range, small volume, easiness in processing, capability of batch production and the like, and has good application in the aspects of temperature compensation circuits, RC oscillator amplitude stabilizing circuits, delay circuits, protection circuits, overheating protection circuits of electrical equipment, motor starting circuits, fire alarm circuits and the like.

However, in the self-balancing circuit of the conventional thermistor, the number of the thermistors is large and the thermistors are all of a single structure, so that the wiring of the circuit is complicated, and the large number of the single thermistors occupy a large installation space, which is not beneficial to realizing the miniaturization and integration of the product.

Disclosure of Invention

In view of the above disadvantages of the prior art, the present invention provides a composite thermistor, which simplifies the circuit design, reduces the usage of the thermistor, and saves the space for mounting components, while ensuring the function of the circuit to be unchanged; meanwhile, the manufacturing of the composite device can also reduce the usage amount of raw materials, shorten the manufacturing process, save the cost and be suitable for large-scale mass production.

To achieve the above and other related objects, the present invention provides a composite thermistor comprising: a unitary structure comprising a first resistor body and a second resistor body connected to each other; wherein the first resistor body comprises a thermistor body; the second resistor body comprises any one or combination of a thermistor body, a thick-film resistor body, a thin-film resistor body and a winding resistor body.

In a preferred embodiment of the present invention, the second resistor body includes a thermistor body; the first resistor body and the second resistor body are connected through a conducting layer, an insulating layer or an adapter, or the first resistor body and the second resistor body are structurally spliced.

In a preferred embodiment of the present invention, the first resistor body and the second resistor body are structurally spliced; the first resistor body is provided with a hollow part, and the second resistor body is embedded in the hollow part.

In a preferred embodiment of the invention, the second resistor body is not tightly embedded in the hollow portion, and a heat dissipation channel is disposed between the second resistor body and the first resistor body.

In a preferred embodiment of the present invention, the composite thermistor includes: a packaging part for integrally packaging the first resistor body and the second resistor body; the package portion includes: packaging glue, packaging resin, a metal packaging shell, a plastic packaging shell or a ceramic packaging shell.

In a preferred embodiment of the present invention, the second resistor body includes a thermistor body; the first resistor body and the second resistor body are of a laminated structure formed by simultaneously pressing thermistor powder.

In a preferred embodiment of the invention, the second resistor body comprises a thick film resistor body applied to the first resistor body by screen printing.

In a preferred embodiment of the invention, the first and second resistor bodies are connected by a conductive layer; the conductive layer comprises conductive paste, conductive solder or conductive glue.

In a preferred embodiment of the present invention, the first resistor body and the second resistor body are connected by an insulating layer; the insulating layer comprises insulating paint, insulating glue, insulating ceramic, insulating rubber or mica.

In a preferred embodiment of the present invention, the second resistor body comprises a thin film resistor body; the thin film resistor body includes a carbon film, a metal oxide film, or a paint film.

As described above, the composite thermistor according to the present invention has the following advantageous effects: through compounding between the single or multiple thermistors and the thermistors, compounding between the single or multiple thermistors and the thick-film resistor, the thermistors and the thin-film resistor, and compounding between the single or multiple thermistors and the winding resistor, under the condition of ensuring that the circuit realizes unchanged functions, the using amount of single components in the circuit is reduced, the circuit design is simplified, the wiring is concise, and the installation space of the components is saved; meanwhile, the manufacturing of the composite device can also reduce the usage amount of raw materials, shorten the process manufacturing flow, be beneficial to saving the cost and be suitable for large-scale mass production; the composite thermistor adopting structural splicing reduces the usage amount of connecting materials, and can flexibly adjust splicing gaps to set heat dissipation channels, thereby improving the heat dissipation performance of products.

Drawings

Fig. 1 is a schematic structural diagram of a composite thermistor connected to a conductive layer according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a composite thermistor connected by an insulating layer according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a composite thermistor connected to an adaptor according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a composite thermistor integrated with a thick film resistor according to an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a composite thermistor in which a thermistor and a winding resistor are integrally packaged according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a composite thermistor integrally packaged by a plurality of thermistors according to an embodiment of the present invention.

Fig. 7 is a schematic structural diagram of another composite thermistor with a plurality of thermistors integrally packaged according to an embodiment of the invention.

Fig. 8A is a schematic diagram illustrating a non-tight-spliced composite thermistor according to an embodiment of the invention.

Fig. 8B is a schematic diagram of another non-tight-splice composite thermistor according to an embodiment of the invention.

Fig. 9 is a schematic diagram illustrating a closely-spliced composite thermistor according to an embodiment of the invention.

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the purpose of the present invention. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present invention is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "secured," "retained," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," and/or "comprising," when used in this specification, specify the presence of stated features, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, operations, elements, components, items, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "a, B or C" or "a, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions or operations are inherently mutually exclusive in some way.

The invention provides a composite thermistor, which simplifies the circuit design, reduces the usage of the thermistor and saves the installation space of components under the condition of ensuring that the circuit realization function is not changed; meanwhile, the manufacturing of the composite device can also reduce the usage amount of raw materials, shorten the manufacturing process, save the cost and be suitable for large-scale mass production.

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention are further described in detail by the following embodiments in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As shown in fig. 1, an embodiment of the invention provides a schematic structural diagram of a composite thermistor with a connected conductive layer, the composite thermistor is an integrated structure, and includes a first resistor body 11 and a second resistor body 12 connected to each other. The first resistor body 11 and the second resistor body 12 are connected with each other through a conductive layer 13, and the first resistor body 11 and the second resistor body 12 are respectively provided with an electrode 14 and lead wires 15 led out. The first resistor body 11 and the second resistor body 12 are thermistor bodies, and semiconductor thermistor materials, metal thermistor materials, alloy thermistor materials, and the like can be selected, wherein the semiconductor thermistor materials can be selected from single crystal semiconductors, polycrystalline semiconductors, glass semiconductors, organic semiconductors, metal oxides, and the like.

In some examples, the conductive layer 13 may be optionally provided with conductive paste, conductive solder, conductive paste, or the like. The conductive paste comprises carbon paste (graphite conductor), metal paste (gold powder, silver powder, copper powder and silver-copper alloy) and modified ceramic paste; or include thermal curing pastes, uv curing pastes, and the like. Conductive solders in turn include metallic solders, alloy solders, and the like. The conductive adhesive material also comprises a curing reaction type conductive adhesive, a hot-melt type conductive adhesive, a high-temperature sintering type conductive adhesive, a solvent type conductive adhesive and a pressure-sensitive conductive adhesive; or comprises silver conductive adhesive, gold conductive adhesive, copper conductive adhesive and carbon conductive adhesive; or inorganic conductive adhesive and organic conductive adhesive; or may include structured conductive adhesives and filled conductive adhesives. The organic conductive adhesive comprises epoxy resin conductive adhesive, phenolic resin conductive adhesive, polyurethane conductive adhesive, thermoplastic resin conductive adhesive, polyimide conductive adhesive and the like. In this embodiment, the series-parallel connection between the first resistor body 11 and the second resistor body 12 can be directly realized through the conductive layer, so that the line connection is simplified, and the raw material cost is saved.

Optionally, the composite thermistor may include an encapsulating structure 16 to protect the resistor body from being interfered by external environments such as moisture and dust, and is particularly suitable for the case where the working environment is severe. The composite thermistor can also select a non-packaging structure, the non-packaging structure is favorable for the heat dissipation of the resistor, the working performance of the resistor is improved, and the composite thermistor is suitable for the conditions that the working environment is closed and the external interference is not easy to occur.

Optionally, the package structure 16 of the composite thermistor may be made of a package adhesive, such as an epoxy package adhesive, a silicone package adhesive, a polyurethane package adhesive, an ultraviolet light curing package adhesive, or the like; resinous materials such as phenolic resins may also be selected; optionally, a package housing, such as a metal package housing, a plastic package housing, a ceramic package housing, or the like, may be used.

As shown in fig. 2, another embodiment of the present invention provides a structure diagram of an insulation-layer-connected composite thermistor, which includes a first thermistor body 11 and a second thermistor body 12, and the first thermistor body 11 and the second thermistor body 12 are connected to each other through an insulation layer 23. The insulating layer 23 may be selected from insulating varnish, insulating glue, insulating ceramic, insulating rubber, mica, insulating plastic, insulating glass, and the like. Wherein, the first thermistor body 11 and the second thermistor body 12 can be the same thermistor, such as glass semiconductor thermistors; the first thermistor body 11 and the second thermistor body 12 may be different thermistors, such as a semiconductor thermistor and a metal thermistor.

Further, the first thermistor body 11 and the second thermistor body 12 are plated with electrodes 14, lead wires 151, 152, 153 and 154 are led out from the electrodes 14, and series connection or parallel connection among the resistor bodies is realized through connection among the lead wires 151, 152, 153 and 154. For example: the lead wire 151 is connected to the lead wire 152, and the lead wire 153 is connected to the lead wire 154, thereby achieving parallel connection of the first thermistor body 11 and the second thermistor body 12. For another example, the lead wires 151 and 152 are connected to an external circuit, respectively, and the lead wire 154 is connected to the lead wire 153, thereby achieving the series connection of the first thermistor body 11 and the second thermistor body 12. In the embodiment, as the integrated packaging structure is adopted, the structure between the resistors is compact, the mounting volume is reduced, individual component packaging is not needed, the packaging process flow is simplified, and the connecting distance between the leads is shorter, so that raw materials are saved and the production cost is reduced.

As shown in fig. 3, another embodiment of the present invention provides a schematic structural diagram of a composite thermistor connected by an adaptor, which includes a thermistor body 11 and a thermistor body 12, and the two resistor bodies are integrally packaged after being connected to each other by the adaptor 13. The adapter 13 reserves a certain gap between the thermistor body 11 and the thermistor body 12, which is beneficial to improving the heat dissipation efficiency of the product while simplifying the circuit design and the packaging process of the product through the integrated packaging structure. The adaptor may be of a conductive material to assist in achieving the series or parallel connection between the thermistor body 11 and the thermistor body 12. The adapter piece can also be made of insulating materials and used for connecting the resistor bodies and limiting the respective positions to realize integral packaging.

As shown in fig. 4, another embodiment of the present invention provides a structural schematic diagram of a composite thermistor in which a thermistor and a thick film resistor are integrally packaged, which includes a thermistor body 11 and a thick film resistor body 12, wherein the thick film resistor body 12 covers a surface layer of the thermistor body 11. Optionally, the thick film resistor body 12 may be directly covered on the surface layer of the thermistor body 11, or an insulating layer may be disposed between the thermistor body 11 and the thick film resistor body 12. In some examples, the thick film resistor body 12 is applied to the surface layer of the thermistor body 11 or an insulating layer therebetween using screen printing.

Alternatively, the electrodes of the coated thick film resistor body 12 and the thermistor body 11 may be fired simultaneously or separately. This embodiment preferably fires at the same time, further simplifying the sintering and packaging process. The series or parallel connection of the thick film resistor body 12 and the thermistor body 11 is then achieved by wire connection.

In the preferred embodiment of the present embodiment, the thick film resistor body 12 may be replaced by a thin film resistor body, such as a carbon film, a metal oxide film or a paint film, specifically, a material with a certain resistivity may be deposited on the surface of the thermistor body 11 by evaporation-like method, or a material with a certain resistivity may be deposited on the surface of the thermistor after the insulating layer is coated on the surface of the thermistor. The material for making the thin film resistor body can be selected from pure metal, metal alloy, metal compound or metal ceramic (combination of ceramic and metal), and the like, wherein the material is suitable for the metal ceramic with the single chip analog integrated circuit and the thin film hybrid circuit, such as nickel-chromium, chromium-silicon and chromium-silicon oxide.

As shown in fig. 5, another embodiment of the present invention provides a structural schematic diagram of a composite thermistor in which a thermistor and a winding resistor are integrally packaged, which includes a thermistor body 11 and a winding resistor body 12, wherein the winding resistor body 12 can be fixed with the thermistor body 11 by a bonding process, a welding process, etc., and then packaged together. The thermistor body 11 and the winding resistor body 12 can be connected with each other through a lead 15, and series connection or parallel connection is realized. The winding resistor body 12 can be a fixed value resistor or an adjustable resistor, and under the condition that the winding resistor body is the adjustable resistor, the thermistor body 11 is connected with different lead wires led out by the winding resistor, so that the resistance of the composite thermistor can be adjusted, and the use flexibility of a product is further improved.

As shown in fig. 6 and 7, another embodiment of the present invention provides a composite thermistor in which a thermistor and a thermistor are integrally packaged, wherein the composite thermistor includes a plurality of thermistor bodies, such as a first thermistor body 11, a second thermistor body 121, and a third thermistor body 122, and the thermistors are integrally packaged after being stacked and connected. It should be noted that fig. 6 and fig. 7 are only exemplary illustrations, and the number, shape, and the like of the thermistors are not particularly limited.

In a preferred embodiment of this embodiment, the composite thermistor is formed by simultaneously pressing two or more thermistor powders, and then the processes of sintering, electrode plating, pin soldering, integral packaging, and the like are performed. According to the embodiment, the powder with different resistivity is simultaneously pressed, molded and sintered, so that the process flow of sintering and packaging is further simplified, the production efficiency of products is improved, and the mass production and manufacturing are facilitated.

Fig. 6 and 7 show different electrode structures, respectively, in fig. 6 the electrodes are located at the upper and lower end faces, and in fig. 7 the electrodes are located at both side faces. The positions of the electrodes can be set according to the circuit connection relationship, and then the series connection or the parallel connection among the resistor bodies can be realized directly through the connection of the end electrodes or the leads.

As shown in fig. 8A, 8B and 9, another embodiment of the present invention respectively shows structural schematic diagrams of a composite thermistor with two spliced structures, where fig. 8A and 8B show a composite thermistor without tight splicing, and fig. 9 shows a composite thermistor with tight splicing. The composite thermistor shown in fig. 8A, 8B and 9 includes a first thermistor body 11 and a second thermistor body 12, wherein the first thermistor body 11 is provided with a hollow portion, so that the second thermistor body 12 is embedded therein to realize structural splicing of the two thermistor bodies.

In fig. 8A and 8B, the first thermistor body 11 and the second thermistor body 12 are not tightly embedded, that is, a splicing gap 81 is left between the two thermistor bodies, which can be used as a heat dissipation channel to improve the heat dissipation performance of the composite thermistor, and an insulating layer, such as insulating paint, insulating glue, insulating ceramic, insulating rubber, mica, insulating plastic, insulating glass, insulating gas, etc., can be disposed in the gap 81. Furthermore, an encapsulating layer 82 is arranged on the periphery of the first thermistor body 11, and an encapsulating layer 83 is arranged on the periphery of the second thermistor body 12, so that the structure splicing is realized, the product volume is reduced, and meanwhile, the independent realization of the working performance of each resistor body can be guaranteed.

In fig. 8A, the second thermistor main body 12 is provided with a lead 155 (indicated by a dotted line on the back) and a lead 156, and correspondingly, the first thermistor main body 11 is provided with two fixing positions, and the lead 155 and the lead 156 are fixed to the corresponding fixing positions by solder or adhesive, so that the two thermistor main bodies are connected in parallel. In fig. 8B, the second thermistor body 12 is provided with a lead wire 157 (dotted line indicates the presence on the back surface) and a lead wire 158, and the first thermistor body 11 is provided with a lead wire 159; the lead 158 and the lead 159 are on one surface, the lead 157 is on the other surface, the lead 159 and the lead 158 are connected to an external circuit, and the lead 157 is connected to the first thermistor main body 11 and the second thermistor main body 12, thereby realizing the series connection of the two resistor main bodies.

In the composite thermistor with the structure shown in fig. 9, the first thermistor body 11 and the second thermistor body 12 are tightly embedded, that is, no splicing gap exists between the two thermistor bodies, so that the product volume is further reduced, the process flow is shortened, the usage amount of raw materials is reduced, and the installation space of components is saved.

The manufacturing method of the conventional thermistor comprises the following steps: preparing thermistor powder, pressing and molding the powder, sintering the powder, printing an electrode, sintering the electrode again, calculating the size, and cutting the electrode to obtain the thermistor. In some embodiments of the present application, the thermistor and the thermistor are connected by a conductive layer, an insulating layer or an adaptor, or are spliced by using a selected structure, or are pressed into a laminated structure at the same time, so as to obtain the composite thermistor. In other embodiments of the present application, the composite thermistor is obtained by screen printing between the thermistor and the thick film resistor and between the thermistor and the thin film resistor. In other embodiments of the present application, the thermistor and the winding resistor are welded or bonded by glue to obtain a composite thermistor. Therefore, the composite thermistor occupies a smaller space than each single component which can realize the same function, shortens the manufacturing process flow, simplifies the design of related circuits, and is beneficial to improving the integration level of products.

In summary, the present invention provides a composite thermistor, which includes: a unitary structure comprising a first resistor body and a second resistor body connected to each other; wherein the first resistor body comprises a thermistor body; the second resistor body comprises any one or combination of a plurality of thermistor bodies, thick-film resistor bodies, thin-film resistor bodies and winding resistor bodies. The invention can realize the compounding between a single or a plurality of thermistors and the thermistors, the compounding between the single or a plurality of thermistors and thick film resistors, thin film resistors and winding resistors, and provides various implementation modes aiming at different composite materials, such as conductive layer connection, insulating layer connection, adaptor connection, structure splicing, screen printing, synchronous pressing and sintering and the like, and the invention has various products and flexible use; the composite thermistor adopting structural splicing reduces the usage amount of connecting materials, and can flexibly adjust splicing gaps to set heat dissipation channels, thereby improving the heat dissipation performance of products. Under the condition of ensuring that the circuit realizes unchanged functions, the invention reduces the using amount of the monomer element in the circuit, simplifies the circuit design, has concise wiring and saves the installation space of the element; meanwhile, the manufacturing of the composite device can also reduce the usage amount of raw materials, shorten the process manufacturing flow, be beneficial to saving the cost and be suitable for large-scale mass production. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims (10)

1. A composite thermistor, comprising:

a unitary structure comprising a first resistor body and a second resistor body connected to each other;

wherein the first resistor body comprises a thermistor body; the second resistor body comprises any one or combination of a thermistor body, a thick-film resistor body, a thin-film resistor body and a winding resistor body.

2. A composite thermistor according to claim 1, characterized in that the second resistor body comprises a thermistor body; the first resistor body and the second resistor body are connected through a conducting layer, an insulating layer or an adapter, or the first resistor body and the second resistor body are structurally spliced.

3. A composite thermistor according to claim 2, characterized in that the first and second resistor bodies are structurally spliced; the first resistor body is provided with a hollow part, and the second resistor body is embedded in the hollow part.

4. A composite thermistor according to claim 3, wherein the second resistor body is not tightly embedded in the hollow part, and a heat dissipation channel is provided between the second resistor body and the first resistor body.

5. A composite thermistor according to claim 1, characterized by comprising: a packaging part for integrally packaging the first resistor body and the second resistor body; the package portion includes: packaging glue, packaging resin, a metal packaging shell, a plastic packaging shell or a ceramic packaging shell.

6. A composite thermistor according to claim 1, characterized in that the second resistor body comprises a thermistor body; the first resistor body and the second resistor body are laminated structures formed by simultaneously pressing thermistor powder.

7. A composite thermistor according to claim 1, characterized in that the second resistor body comprises a thick-film resistor body, which is applied to the first resistor body by screen printing.

8. A composite thermistor according to claim 2, characterized in that the first and second resistor bodies are connected by a conductive layer; the conductive layer comprises conductive paste, conductive solder or conductive glue.

9. A composite thermistor according to claim 2, characterized in that the first and second resistor bodies are connected by an insulating layer; the insulating layer comprises insulating paint, insulating glue, insulating ceramic, insulating rubber or mica.

10. A composite thermistor according to claim 1, characterized in that the second resistor body comprises a thin-film resistor body; the thin film resistor body includes a carbon film, a metal oxide film, or a paint film.

Images