CN115753832B - Detection method for integrated circuit board of new energy automobile - Google Patents
Detection method for integrated circuit board of new energy automobile Download PDFInfo
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- CN115753832B CN115753832B CN202211405851.5A CN202211405851A CN115753832B CN 115753832 B CN115753832 B CN 115753832B CN 202211405851 A CN202211405851 A CN 202211405851A CN 115753832 B CN115753832 B CN 115753832B
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- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
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Abstract
The invention discloses a detection method for a new energy automobile integrated circuit board, which comprises the following steps: s1: and (2) counting maintenance data of maintenance welding spots of the integrated circuit board, wherein S2: acquiring and identifying an integrated circuit board image, and S3: acquiring and identifying an integrated circuit board sample drawing, and S4: the detection module is used for detecting according to soldering tin sample data and comparison data, the number of times of maintenance of the soldering points on the integrated circuit board is counted, the soldering points with different rates of abnormal conditions are distinguished, and when the soldering points are detected subsequently, the soldering points with different levels can be detected with different precision, so that the operation amount of the soldering points with the soldering problems not frequently occurring can be reduced, the detection speed can be increased, and the detection speed is further increased.
Description
Technical Field
The invention relates to the technical field of circuit board detection, in particular to a detection method for a new energy automobile integrated circuit board.
Background
With the development of technology, more integrated circuit boards on automobiles and new energy automobiles relate to information such as batteries, so that the information related to the integrated circuit boards on the new energy automobiles is more, lines are thinner and denser, the requirement of mass production cannot be met by the traditional manual visual detection, and therefore, detection equipment for automatically detecting the integrated circuit boards is generated.
Chinese patent discloses a method and system for inspecting a circuit board (publication number CN105004727 a), which uses an optical imaging device to collect an image of the circuit board and transmit the collected image information to a data processing system, and processes and analyzes the collected image information, and the method of processing all information in the image requires a long processing time, so that there is a residence time when inspecting the integrated circuit board, resulting in a slow inspection speed.
Disclosure of Invention
The invention aims to provide a detection method for a new energy automobile integrated circuit board, which solves the problem that the time required for processing the acquired image information is long:
the aim of the invention can be achieved by the following technical scheme:
a detection method for a new energy automobile integrated circuit board comprises the following steps:
s1: counting maintenance data of the integrated circuit board maintenance welding spots, distinguishing and counting the welding spots on the integrated circuit board to obtain layered detection data, and uploading the layered detection data to a detection module;
s2: acquiring and identifying an integrated circuit board image, storing image information of the integrated circuit board as contrast data, and uploading the contrast data to a detection module;
s3: acquiring and identifying an integrated circuit board sample drawing, acquiring positioning points on the integrated circuit board and position information of a welding hole through the integrated circuit board design drawing, and presetting soldering tin sample data at the position of the welding hole according to layered detection data in a detection module;
s4: and detecting according to the solder sample data and the contrast data by a detection module.
As a further scheme of the invention: the detection module comprises an integrated circuit board identification unit, a welding spot identification unit and a judgment unit;
the integrated circuit board identification unit is used for identifying the integrated circuit board image in the comparison data, the welding spot identification unit is used for identifying the welding spot position information in the integrated circuit board image, and the judgment unit is used for judging whether the welding spot is a normal welding spot or an abnormal welding spot.
As a further scheme of the invention: the layering detection data comprise a fine detection welding point, a coarse detection welding point and a normal detection welding point.
As a further scheme of the invention: the distinguishing and counting of the welding points on the integrated circuit board specifically comprises;
s11: obtaining an abnormal welding point through an electrifying test, and obtaining position information of the abnormal welding point according to a positioning point of the integrated circuit board;
s12: finding the position of the corresponding welding point according to the position information of the abnormal welding point and the positioning point in the integrated circuit board design drawing, and marking the corresponding abnormal welding point as a vulnerable welding point;
s13: the other welding points except the vulnerable welding points are marked as normal welding points in the design drawing of the integrated circuit board;
s14: counting the number of abnormal welding times of each welding point of the maintenance integrated circuit board, and calculating the occupation ratio of the abnormal times of each welding point;
s15: the number of times of abnormal welding is N 2 The welding points with the percentage of between 100 and 0 percent are marked as fine inspection welding points, and the number of times of occurrence of the cold joint is between 0 and N 1 % of the solder joints are marked as rough solder joints, and the number of times of cold solder joint occurrence is N 1 ％-N 2 % of the welds are marked as normal welds.
As a further scheme of the invention: the acquisition mode of the position information is as follows: the integrated circuit board identification unit identifies the boundary of the integrated circuit board to determine the positioning point of the integrated circuit board, suggests a plane rectangular coordinate system by taking the positioning point of the integrated circuit board as a reference, and acquires the abscissa and the ordinate of the welding point in the plane rectangular coordinate system.
As a further scheme of the invention: the solder sample data is preset on the position of the welding hole according to the layered detection data in the detection module, and the method specifically comprises the following steps:
s31: performing one-to-one correspondence between the position information of the fine detection welding point, the coarse detection welding point and the normal detection welding point in the layered detection data and the position information of the welding hole on the integrated circuit board sample drawing;
s32: marking the welding holes corresponding to the fine inspection welding points as fine inspection welding holes, marking the welding holes corresponding to the rough inspection welding points as rough inspection welding holes, and marking the welding holes corresponding to the normal inspection welding points as normal inspection welding holes;
s33: marking the center position of a welding hole in the integrated circuit board sample drawing as a welding center;
s34: the surfaces of the fine inspection welding hole, the normal inspection welding hole and the rough inspection welding hole are respectively preset with the diameter and the length of d 1 、d 2 And d 3 Is a solder ring;
as a further scheme of the invention: detecting according to solder sample data and contrast data through a detection module, specifically comprising:
s41: acquiring an image of an integrated circuit board, and performing one-to-one correspondence between welding holes on a sample drawing of the integrated circuit board and welding points and positioning points on the image of the integrated circuit board according to position information through a detection module;
s42: invoking a welding spot identification unit in the detection module to identify welding spots in the integrated circuit board image, identifying the positions of the welding spots according to the integrated circuit board image, and decomposing the welding spots in the integrated circuit image into a plurality of welding spot pixel clusters;
s43: judging whether the unit solder circle is a solder joint pixel cluster or not through the detection module, if the unit solder circle is covered with the solder joint pixel cluster, the solder joint is a normal solder joint, and if the unit solder circle is not covered with the solder joint pixel cluster, the solder joint is an abnormal solder joint.
As a further scheme of the invention: the pixel cluster is composed of m pixels in the image, and the value of m is 1 2、 2 2 ……n 2 And 1<m 1 <m 2 <m 3 。
The invention has the beneficial effects that:
(1) According to the invention, the maintenance times of the welding points on the integrated circuit board are counted, the welding points with different proportions and abnormal conditions are distinguished, and the welding points with different layers can be detected with different precision in the subsequent detection of the welding points, so that the operation amount in the detection of the welding points with less frequent welding problems can be reduced, the detection speed can be further increased, and the detection speed is further improved.
(2) According to the invention, a plurality of pixels form one pixel cluster, the pixel information of the pixel cluster is determined according to the average pixel information in the pixel cluster, the pixel information of the pixel cluster is identified and judged in the judging unit, each pixel is not required to be judged, the operation amount can be greatly reduced, the number of pixels of different pixel clusters is correspondingly set according to the layering detection data, the precision degree of the precise detection welding point can be ensured, the detection speed can be improved, and the practicability of the precise detection welding point is further improved.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of the detection flow in the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the present invention is a method for detecting an integrated circuit board of a new energy automobile, comprising:
s1: the method comprises the steps of testing welding points on an integrated circuit board, counting maintenance data of the integrated circuit board for maintaining the welding points, distinguishing and counting the welding points on the integrated circuit board to obtain layered detection data, and uploading the layered detection data to a detection module;
s2: acquiring and identifying an integrated circuit board image, positioning the integrated circuit board to be detected in a detected area, shooting the integrated circuit board through a CCD camera, storing image information of the integrated circuit board as contrast data, and uploading the contrast data to a detection module;
s3: acquiring and identifying an integrated circuit board sample drawing, acquiring positioning points on the integrated circuit board and position information of a welding hole through the integrated circuit board design drawing, and presetting soldering tin sample data at the position of the welding hole according to layered detection data in a detection module;
s4: and detecting according to the solder sample data and the contrast data by a detection module.
The detection module comprises an integrated circuit board identification unit, a welding spot identification unit and a judgment unit;
the integrated circuit board identification unit is used for identifying the integrated circuit board image in the comparison data, the welding spot identification unit identifies the welding spot position information in the integrated circuit board image through the pixel information of the picture, and the judgment unit judges whether the welding spot is a normal welding spot or an abnormal welding spot according to the pixel information.
The invention has the advantage that when the integrated circuit board is maintained, a maintenance person conducts power-on investigation on the circuit board through the design drawing of the integrated circuit board so as to detect whether the welding point has the problems of cold joint, cold joint and the like and judge that the welding point is frequently appeared.
Further, the layered detection data comprises a fine detection welding point, a coarse detection welding point and a normal detection welding point.
In the application, the distinguishing and counting of the welding points on the integrated circuit board specifically comprises;
s11: obtaining an abnormal welding point through an electrifying test, and obtaining position information of the abnormal welding point according to a positioning point of the integrated circuit board;
s12: finding the position of the corresponding welding point according to the position information of the abnormal welding point and the positioning point in the integrated circuit board design drawing, and marking the corresponding abnormal welding point as a vulnerable welding point;
s13: the other welding points except the vulnerable welding points are marked as normal welding points in the design drawing of the integrated circuit board;
s14: counting the number of abnormal welding times of each welding point of the maintenance integrated circuit board, and calculating the occupation ratio of the abnormal times of each welding point;
s15: the number of times of abnormal welding is N 2 The welding points with the percentage of between 100 and 0 percent are marked as fine inspection welding points, and the number of times of occurrence of the cold joint is between 0 and N 1 % of the solder joints are marked as rough solder joints, and the number of times of cold solder joint occurrence is N 1 ％-N 2 % of the welds are marked as normal welds.
In the application, the welding point frequently abnormal is processedCounting, and detecting different welding points with different precision according to abnormal duty ratio, wherein 0%<N 1 ％<N 2 ％<100％。
Further, when the integrated circuit board is subjected to CCD camera alignment, a plane rectangular coordinate system is suggested by taking the positioning point of the integrated circuit board as a reference, the abscissa and the ordinate of the welding point in the plane rectangular coordinate system form the position information of the welding point, and the boundary of the integrated circuit board is identified by the integrated circuit board identification unit to determine the positioning point of the integrated circuit board; and finding out the positions of the welding points in the integrated circuit board image and corresponding welding holes in the integrated circuit board sample drawing according to the position information of the welding points.
The invention is characterized in that the integrated circuit board sample drawing comprises characteristic information such as the size, shape, color and diameter of a welding hole on the integrated circuit board.
In this application, predetermine soldering tin sample data according to layering detection data among the detection module in the position of welding hole, specifically include:
s31: performing one-to-one correspondence between the position information of the fine detection welding point, the coarse detection welding point and the normal detection welding point in the layered detection data and the position information of the welding hole on the integrated circuit board sample drawing;
s32: marking the welding holes corresponding to the fine inspection welding points as fine inspection welding holes, marking the welding holes corresponding to the rough inspection welding points as rough inspection welding holes, and marking the welding holes corresponding to the normal inspection welding points as normal inspection welding holes;
s33: marking the center position of a welding hole in the integrated circuit board sample drawing as a welding center;
s34: the surfaces of the fine inspection welding hole, the normal inspection welding hole and the rough inspection welding hole are respectively preset with the diameter and the length of d 1 、d 2 And d 3 Is a solder ball of (a).
Wherein d 1 、d 2 And d 3 Has a value d of 1 >d 2 >d 3 >0, the diameter length of the soldering tin circle is used for measuring whether the diameter length of the soldering point is qualified or not, namely the diameter of the identified soldering point is largeAnd the diameter of the solder round is qualified.
In this application, detect through detection module and according to soldering tin sample data and contrast data, specifically include:
s41: acquiring an image of an integrated circuit board, and performing one-to-one correspondence between welding holes on a sample drawing of the integrated circuit board and welding points and positioning points on the image of the integrated circuit board according to position information through a detection module;
s42: invoking a welding spot identification unit in the detection module to identify welding spots in the integrated circuit board image, identifying the positions of the welding spots according to the integrated circuit board image, and decomposing the welding spots in the integrated circuit image into a plurality of welding spot pixel clusters;
s43: judging whether the unit solder circle is a solder joint pixel cluster or not through the detection module, if the unit solder circle is covered with the solder joint pixel cluster, the solder joint is a normal solder joint, and if the unit solder circle is not covered with the solder joint pixel cluster, the solder joint is an abnormal solder joint.
In the application, the pixel cluster is composed of m pixels in the image, and the value of m is 1 2、 2 2 ……n 2 And can select m according to the welding precision requirements of the fine inspection welding hole, the normal inspection welding hole and the rough inspection welding hole 1 ，m 2 And m 3 The pixel information of one pixel cluster is the average information of all pixel composition information in the one pixel cluster, (for example, one pixel cluster comprises four pixels, wherein the first pixel information is R:100, G:100 and B:100, the second pixel information is R:102, G:102 and B:102, the third pixel information is R:98, G:98 and B:98, the first pixel information is R:100, G:100 and B:100, the pixel information of the one pixel cluster is R:100, G:100 and B: 100) is used for reducing the operation amount while ensuring the detection accuracy so as to improve the operation speed and reduce the operation cost, and 1<m 1 <m 2 <m 3 。
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (1)
1. The detection method for the integrated circuit board of the new energy automobile is characterized by comprising the following steps of:
s1: counting maintenance data of the integrated circuit board maintenance welding spots, distinguishing and counting the welding spots on the integrated circuit board to obtain layered detection data, and uploading the layered detection data to a detection module;
s2: acquiring and identifying an integrated circuit board image, storing image information of the integrated circuit board as contrast data, and uploading the contrast data to a detection module;
s3: acquiring and identifying an integrated circuit board sample drawing, acquiring positioning points on an integrated circuit board and position information of a welding hole through the integrated circuit board sample drawing, and presetting soldering tin sample data at the position of the welding hole according to layered detection data in a detection module;
s4: detecting according to the soldering tin sample data and the comparison data through a detection module;
the detection module comprises an integrated circuit board identification unit, a welding spot identification unit and a judgment unit;
the integrated circuit board identification unit is used for identifying the integrated circuit board image in the comparison data, the welding point identification unit is used for identifying the welding point position information in the integrated circuit board image, and the judgment unit is used for judging whether the welding point is a normal welding point or an abnormal welding point;
the layering detection data comprise a fine detection welding point, a coarse detection welding point and a normal detection welding point;
the distinguishing and counting of the welding points on the integrated circuit board specifically comprises;
s11: obtaining an abnormal welding point through an electrifying test, and obtaining position information of the abnormal welding point according to a positioning point of the integrated circuit board;
s12: finding the position of a corresponding welding point in the integrated circuit board sample drawing according to the position information of the abnormal welding point and the positioning point, and marking the corresponding abnormal welding point as a vulnerable welding point;
s13: marking other welding points except the vulnerable welding points as normal welding points in a sample drawing of the integrated circuit board;
s14: counting the number of abnormal welding times of each welding point of the maintenance integrated circuit board, and calculating the occupation ratio of the abnormal times of each welding point;
s15: the number of times of abnormal welding is N 2 The welding points with the percentage of between 100 and 0 percent are marked as fine inspection welding points, and the number of times of occurrence of the cold joint is between 0 and N 1 % of the solder joints are marked as rough solder joints, and the number of times of cold solder joint occurrence is N 1 %-N 2 % of the welding points are marked as normal welding points;
the acquisition mode of the position information is as follows: the integrated circuit board identification unit identifies the boundary of the integrated circuit board to determine the positioning point of the integrated circuit board, establishes a plane rectangular coordinate system by taking the positioning point of the integrated circuit board as a reference, and acquires the abscissa and the ordinate of the welding point in the plane rectangular coordinate system;
the solder sample data is preset on the position of the welding hole according to the layered detection data in the detection module, and the method specifically comprises the following steps:
s31: performing one-to-one correspondence between the position information of the fine detection welding point, the coarse detection welding point and the normal detection welding point in the layered detection data and the position information of the welding hole on the integrated circuit board sample drawing;
s32: marking the welding holes corresponding to the fine inspection welding points as fine inspection welding holes, marking the welding holes corresponding to the rough inspection welding points as rough inspection welding holes, and marking the welding holes corresponding to the normal inspection welding points as normal inspection welding holes;
s33: marking the center position of a welding hole in the integrated circuit board sample drawing as a welding center;
s34: the surfaces of the fine inspection welding hole, the normal inspection welding hole and the rough inspection welding hole are respectively preset with the diameter and the length of d 1 、d 2 And d 3 Is a solder ring;
the detection module detects according to solder sample data and contrast data, and specifically comprises:
s41: acquiring an image of an integrated circuit board, and performing one-to-one correspondence between welding holes on a sample drawing of the integrated circuit board and welding points and positioning points on the image of the integrated circuit board according to position information through a detection module;
s42: invoking a welding spot identification unit in the detection module to identify welding spots in the integrated circuit board image, identifying the positions of the welding spots according to the integrated circuit board image, and decomposing the welding spots in the integrated circuit board image into a plurality of welding spot pixel clusters;
s43: judging whether the solder circle is a welding spot pixel cluster or not by a judging unit in the detecting module, if the welding spot pixel cluster performs full coverage on the solder circle, the welding spot is a normal welding spot, and if the welding spot pixel cluster does not perform full coverage on the solder circle, the welding spot is an abnormal welding spot;
the pixel cluster is composed of m pixels in the image, and m is selected according to the welding precision requirements of the fine inspection welding hole, the normal inspection welding hole and the rough inspection welding hole 1 ，m 2 And m 3 Wherein m has a value of 1 2 、2 2 ……n 2 And 1<m 1 <m 2 <m 3 。
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| CN109813728A (en) * | 2019-03-01 | 2019-05-28 | 沈阳建筑大学 | A kind of circuit board solder joint detection method and system |
| CN114544669A (en) * | 2020-11-24 | 2022-05-27 | 英业达科技有限公司 | System and method for analyzing concentration of bad welding spots of solder paste detector |
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