CN115747738A - Target material support and coating equipment - Google Patents

Abstract

The invention provides a target material support and a coating device, which relate to the technical field of coating, wherein the target material support comprises: rotatable target holds in palm the body, it has a plurality of installation positions to hold in the palm to distribute along the circumference on the first surface of body to hold in the palm the target, the installation position includes: a blind plate position and a plurality of target material positions for mounting target materials. At the initial stage of coating film, rotatory target holds in the palm the body, makes working gas aim at the blind plate position, because the material of blind plate position can not be sputtered by the ion, consequently, the sputter beam can not appear, avoids the influence of unstable sputter beam to the coating film effect, promotes the coating film fineness. When the coating material is replaced, the target material support body is rotated, so that the working gas is aligned to the corresponding target material position, the disassembly and the assembly of the coating head are omitted, and the operation is simple and time-saving.

Description

Target material support and coating equipment

Technical Field

The invention relates to the technical field of coating, in particular to a target holder and coating equipment.

Background

At present, in order to improve the imaging effect of the electron microscope, the surface of the sample is generally coated in advance. Wherein: the coating method can be divided into: magnetron sputtering, carbon evaporation, electron beam evaporation, etc., magnetron sputtering being one of the most common coating methods.

The magnetron sputtering coating equipment that current electron microscope system appearance was used includes: the sample storehouse is provided with a coating head for mounting a target material. In the magnetron sputtering operation, a sample is placed in a sample bin, the sample bin is sealed and vacuumized, then working gas (such as argon) is injected into the sealed sample bin body, high-voltage electricity is applied through an electrode, the working gas is ionized under the high-voltage electric excitation to obtain cations, the cations impact a target on a coating head under the action of an electric field, the target is sputtered, and target atoms (or molecules) sputtered out are deposited on the surface of the sample to form a film, so that the coating process is completed.

Through the analysis of the coating equipment, the following problems exist:

1. when the working gas just starts to ionize, the ion beam flow is unstable, and sputtered target atoms (or molecules) are unstable, which affects the uniformity and stability of the coating.

2. Only one coating head is arranged in the coating equipment, so that only one target can be installed, and if different coating materials need to be replaced, the target needs to be frequently disassembled and assembled, which wastes time and labor.

3. Ionization occurs in the whole sample bin, all areas of the target are sputtered, so that the consumption of the target and working gas is high, and waste is obvious when a small sample is coated.

Disclosure of Invention

The present invention is directed to a target holder and a coating apparatus, which at least partially solve at least one of the above problems.

In a first aspect, to solve the above technical problem, the present invention provides a target holder, including: rotatable target holds in palm the body, it has a plurality of installation positions to hold in the palm to distribute along the circumference on the first surface of body to hold in the palm the target, the installation position includes: a blind plate position and a target material position for mounting a target material.

According to a preferred embodiment of the present invention, the mounting positions are disposed on mounting surfaces, each mounting surface has a fixed included angle with the first surface, and all the mounting surfaces enclose a closed side surface.

According to a preferred embodiment of the present invention, the mounting surface is formed by an arc edge, two opposite side edges and a top edge opposite to the arc edge, the side edges of adjacent mounting surfaces are overlapped to form a closed side surface, the top edges of adjacent mounting surfaces are connected to form an upper bottom surface, and the arc edges of adjacent mounting surfaces are connected to each other and are connected to the first surface in a closed manner through a transition side surface.

According to a preferred embodiment of the present invention, the target portion is circular, the target portion is concave or convex to the target surface, and the side surface of the target portion is provided with a thread.

According to a preferred embodiment of the present invention, the target position is provided with an outer frame which is concave or convex to the target surface.

According to a preferred embodiment of the invention, a connecting rod is arranged on the back of the first surface, a rotating disc is sleeved on the connecting rod, and scales are arranged on the rotating disc.

According to a preferred embodiment of the present invention, a sputtering cylinder is installed on the blind spot, and a window for the ion beam to enter is formed on the sputtering cylinder.

In order to solve the above technical problems, a second aspect of the present invention provides a plating apparatus, comprising: the target holder comprises a working cavity, an ion gun arranged in the working cavity and any one of the target holders.

According to a preferred embodiment of the present invention, the target holder is disposed perpendicular to the ion gun.

According to a preferred embodiment of the present invention, the ion gun comprises: the cavity is provided with a muzzle and a hollow connecting rod which are perpendicular to each other, the working cavity is provided with a through hole, and the connecting rod penetrates through the through hole to be connected with external working gas supply equipment.

In summary, in the target holder and the coating apparatus of the present invention, the first surface of the target holder body is provided with the blind plate position and the target position for mounting the target, and the blind plate position and the plurality of target positions are circumferentially distributed on the first surface. At the initial stage of coating film, rotatory target holds in the palm the body, makes working gas aim at the blind plate position, because the material of blind plate position can not be sputtered by the ion, consequently, the sputter beam can not appear, avoids the influence of unstable sputter beam to the coating film effect, promotes the coating film fineness. When the coating material is replaced, the target material support body is rotated, so that the working gas is aligned to the corresponding target material position, the disassembly and the assembly of the coating head are omitted, and the operation is simple and time-saving.

Drawings

Fig. 1 is a schematic structural view of a target holder according to an embodiment of the present invention;

FIG. 2a is a schematic diagram of the positional relationship between the target holder and the sample stage and the working gas generating device in FIG. 1;

fig. 2b is a schematic diagram illustrating a positional relationship between a target holder and a sample stage and a working gas generating device according to an embodiment of the present invention;

fig. 3a to 3d are schematic structural diagrams of different surfaces of another target holder according to a first embodiment of the invention;

FIG. 4 is a schematic view of an embodiment of the present invention with a target mounted on a target site;

FIG. 5 is a schematic view of a sputtering cartridge according to an embodiment of the present invention;

fig. 6 is a schematic structural view of another target holder according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a coating apparatus according to a second embodiment of the present invention;

FIG. 8 is a schematic view of an ion gun according to a second embodiment of the present invention;

FIGS. 9 a-9 b are schematic structural views of a cavity of a second ion gun according to an embodiment of the present invention;

fig. 10 is a schematic diagram of a coating process of a coating apparatus provided in the second embodiment of the present invention.

Detailed Description

Features of various aspects and exemplary embodiments of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

Example one

Referring to fig. 1, a target holder according to a first embodiment of the present invention includes: rotatable target holds in palm body 1, it has a plurality of installation positions to distribute along the circumference on the first surface of body 1 to hold in the palm the target, the installation position includes: a blind spot 2 and a target spot 3 for mounting a target, such that the blind spot 2 and the plurality of target spots 3 are circumferentially distributed on the first surface.

In this embodiment, the target material used or installed in the blind spot 2 cannot be sputtered by the working gas, such as: the target material support body 1 can be made of materials which are not easy to be sputtered by ions, and the blind plate position 2 can be provided with no target material; of course, a target material which is not easily sputtered by ions may be mounted on the blind spot 2, and the material which is not easily sputtered by ions may be stainless steel, for example. Each target site 3 is used for mounting a different target. Different targets can be mounted at the target position 3. Because blind plate position 2 and a plurality of target position 3 distribute on the first surface of target support body 1 along the circumference, support body 1 through rotatory target, can control the ion gun muzzle and aim at blind plate position 2 or a certain target position 3, then at the coating initial stage, can rotate target support body 1, make the ion gun muzzle aim at blind plate position 2, because the material of blind plate position 2 can not be sputtered by working gas, consequently, the beam current that spatters can not appear, avoid the influence of unstable beam current that spatters to the coating film effect, promote the coating film fineness. When the coating material is replaced, the target holder body 1 is rotated, so that the working gas is aligned to the corresponding target position 3, the coating head is not required to be disassembled, and the operation is simple and time-saving.

Wherein: the shape of the target holder body 1 can be set arbitrarily, in this embodiment, taking a cylinder as an example, the upper bottom surface of the cylinder can be used as the first surface. During sputtering, the ion beam is injected into the target position 3 and then the sputtered molecules or atoms of the target are injected into the sample, so that a certain angle is required among the working gas for ionizing the ion beam, the plane of the target position 3 and the sample. For this purpose, the working gas generating device, the target holder and the sample stage 12 may be set to have a certain angle therebetween during the installation process, for example, in fig. 2a, the gas outlet of the working gas generating device 11 (such as the gun mouth of an ion gun) is at an angle of 45 degrees with the first surface of the target holder body 1, and the first surface is at an angle of 45 degrees with the sample carrying surface of the sample stage 12. In a preferred example, as shown in fig. 2b, for convenience of installation, a plurality of installation surfaces forming a fixed angle with the first surface can be arranged on the first surface, and all the installation surfaces enclose a closed side, wherein: the mounting surface may include: the blind plate comprises a blind plate surface 21 and target material surfaces 31, wherein blind plate positions 2 are arranged on the blind plate surface 21, and each target material position 3 is arranged on the corresponding target material surface 31; like this, all installation positions all become fixed contained angle with the first surface, and in the installation, according to fixed contained angle, confirm the angle between working gas generating device, target hold in the palm, sample platform 12, for example: the fixed angle is set to 45 degrees, when the target holder is installed, an ion beam gas exit port (for example, a muzzle of an ion gun) of the working gas generation device 11 is perpendicular to the first surface of the target holder body 1, and the first surface is parallel to the sample bearing surface of the sample stage 12. In this example, the closed side surface enclosed by the blind plate surface 21 and the plurality of target material surfaces 31 and the upper bottom surface of the first surface and the closed side surface together form a polyhedron, the polyhedron may be a solid polyhedron, and the blind plate surface 21, the plurality of target material surfaces 31 and the target material holder body 1 may be manufactured by an integral molding process. The polyhedron may be a hollow polyhedron, and the upper bottom surface may be provided on the upper part of the closed side surface.

Taking a tetrahedron as an example, see fig. 3 a-3 d, the tetrahedron can include: an upper bottom surface 20, which is a first surface (not shown) of the lower bottom surface, and a mounting surface forming a fixed angle with the first surface encloses a closed side surface; wherein: the mounting surface is composed of an arc edge 201, two opposite side edges 202 and a top edge 203 opposite to the arc edge 201, the side edges 202 of adjacent mounting surfaces are overlapped to form a closed side surface, the top edges 203 of adjacent mounting surfaces are connected to form a square upper bottom surface 20, and the arc edges 201 of adjacent mounting surfaces are connected and are connected with the first surface in a closed mode through a transition side surface 23. The mounting surface includes: a blind plate face 21 and a target face 31. Illustratively, the mounting surface in fig. 3a to 3d includes: a blind plate face 21 and a plurality of target faces 31.

In this embodiment, the mounting position may be any shape, and the mounting position is further provided with a mounting mechanism for mounting the target. Wherein: the shapes of the blind plate position 2 and the target position 3 can be the same or different, considering that the cross section of the ion beam is generally circular, and meanwhile, in order to facilitate the installation of the target, the blind plate position 2 and/or the target position 3 are set to be circular, and the area of the blind plate position 2 and/or the target position 3 is larger than or equal to the cross section area of the ion beam, so that the ion beam is ensured to be emitted to the blind plate position 2 and/or the target position 3. In addition, in order to prevent the ion beam from sputtering onto other target sites 3, a fence may be provided around each target site 3. Illustratively, the circular target position 3 may be configured to be concave or convex on the target surface 31, and meanwhile, the concave or convex side surface of the target position is configured with threads as a mounting mechanism, so that a circular target of a corresponding size may be mounted on the target position 3 through the threads. For example, in fig. 4, the target is a wafer with the same size as the target position 3, and when the target is installed, the wafer is firstly attached to the target position 3, and then the target is installed by screwing the installation ring 311 with threads on the side surface into the target position 3. It should be noted that: if the blind plate position 2 is made of a material which is not sputtered by the ion beam, the blind plate position 2 does not need to be provided with a mounting mechanism and does not need to be provided with any target material.

In another example, an outer frame which may be concave or convex on the target surface 31 is disposed on the target position 3 as a mounting mechanism, and a convex or concave connecting frame which is matched with the outer frame may be disposed on the target, and the target is fastened on the target position 3 by the matching of the outer frame and the connecting frame, wherein: the shape of the outer frame can be set as required.

Further, as shown in fig. 5, a sputtering cylinder 211 may be installed on the blind spot 2, and a window 212 for an ion beam to enter is formed on the sputtering cylinder 211. For example, the blind plate position 2 is set to be a cylinder recessed in the blind plate surface 31, and the side surface is provided with a thread, the sputtering cylinder 211 can be set to be a cylinder with a corresponding size and provided with a thread on the outer side surface, the window 212 can be set on the upper bottom surface of the cylinder, as shown in fig. 5, the window 212 can be set to be a semicircular opening on the upper bottom surface. Thus, if a small amount of unstable sputter beams are generated, the sputter beams will be reflected multiple times in the sputter column 211, and the sputter beams will not be incident on the sample, which will affect the coating effect. In addition, the sputtering cylinder 211 can also prevent the ion beam from being reflected to positions other than the blind plate position 2 after being emitted to the blind plate position 2, so that materials at the positions are sputtered to generate unstable sputtering beams, and the film coating effect is influenced.

In this embodiment, the target holder may be fixed on a rotating platform to rotate the target body 1, for example: the back of the first surface is fixed on the rotating platform, the rotating platform is driven by a hand or a motor to drive the target holder body 1 to rotate, and then the target position 3 is rotated, so that the target position 3 is replaced. In a preferred example, as shown in fig. 6, a connecting rod 4 is disposed on the back of the first surface, the target holder body 1 is driven to rotate by the connecting rod 4, and the target holder body 1 can be driven to move along the direction of the connecting rod 4 by moving the connecting rod 4, so as to adjust the position of the target position 3. The connecting rod 4 can be fixed in the coating equipment through the lateral pressure of the vacuum sealing ring, and the rotation and the movement of the connecting rod 4 are realized through a servo motor. Preferably, can keep away from the target at connecting rod 4 and hold in the palm one end cover of body 1 and establish the rotary disk to set up the rotation scale on the rotary disk, hold in the palm the body 1 back fixed when the target, can be according to the rotatory scale control servo motor rotation connecting rod 4 on the rotary disk, and then drive the target and hold in the palm body 1 and rotate, accomplish the change of target position 3.

Example two

Based on the target holder in the first embodiment, a second embodiment of the present invention provides a coating apparatus, as shown in fig. 7, the coating apparatus including: a working chamber 51, an ion gun 52 arranged in the working chamber 51, a sample stage 12 and a target holder 53 according to any one of the embodiments. Wherein: the positional relationship among the ion gun 52, the sample stage 12 and the target holder 53 in the working chamber 51 is fixed according to the structure of the target holder 53, so that the ion beam emitted from the ion gun 52 is emitted to the target position 3, and then the sputtered target molecules or atoms are emitted to the sample on the sample stage 12, thereby realizing the sputtering of the ion gun 52 to the target position 3, meeting the requirement of simply and quickly replacing the target, simultaneously saving the target and working gas during the sputtering process, and avoiding the sputtering of other target positions 3 by the working gas.

In this embodiment, the working chamber 51 is a hollow cavity, and the shape thereof can be arbitrarily set according to requirements, and the rectangular working chamber 51 in fig. 7 is taken as an example for description.

As shown in fig. 7, the working chamber 51 has six sides, i.e., a front side, a back side, a top side, a bottom side, a left side and a right side, and if the target holder 53 shown in fig. 2a is used, it is necessary to ensure that the muzzle of the ion gun 52 is at an angle of 45 degrees with respect to the first surface (i.e., the target holder 53) which is at an angle of 45 degrees with respect to the sample carrying surface of the sample stage 12. Illustratively, the ion gun 52 may be mounted on the right side, the sample stage 12 may be mounted on the bottom side, and the first surface of the target holder 53 may be fixed to a plane at an angle of 45 degrees with respect to the bottom side, with the first surface facing the ion gun 52. If the target holder 53 shown in fig. 2b is used, it is necessary to ensure that the muzzle of the ion gun 52 is perpendicular to the first surface (i.e. the target holder 53 is perpendicular to the ion gun 52), and the first surface is parallel to the sample carrying surface of the sample stage 12. Illustratively, the ion gun 52 may be mounted on the back side, the target holder 53 on the top side, and the sample stage 12 on the bottom side.

Further, for the convenience of observation, an observation window 511 may be embedded in the front surface of the working chamber 51. To facilitate the placement of the sample, a sample injection valve 512 may be disposed on the left and/or right side of the working chamber 51.

In this embodiment, the ion gun 52 can ensure accurate sputtering of the target, thereby avoiding waste of the target and the working gas during sputtering. Illustratively, as shown in fig. 8, the ion gun 52 includes: a gun mouth and a hollow connecting rod 522 which are perpendicular to each other are arranged on the cavity 521, and a circuit and an air circuit can be arranged in the hollow connecting rod 523 to respectively provide voltage and working gas for the ion gun 52 so as to realize the normal work of the ion gun 52; meanwhile, a through hole is provided in the working chamber 51 at a position where the ion gun 52 is installed, and the link 523 passes through the through hole to be connected to an external working gas supply apparatus. In fig. 8, the chamber 521 is configured as a cylinder, the muzzle is configured on a bottom surface of the cylinder, and the hollow link 522 is fixed on a side surface of the cylinder and is perpendicular to the cylinder. Referring to fig. 9a and 9b, a vacuum sealing structure 523 is hermetically sealed in the cavity 521, and the vacuum sealing structure 523 includes: a first outer ring 5231, a second outer ring 5232 nested within the first outer ring 5231, and a symmetrical seal 5233 nested within the second outer ring 5232, wherein: the symmetrical seal 5233 comprises: the bottom surfaces of the first cylinder and the second cylinder are connected through two hollow connecting pieces and are respectively sleeved in the two connecting rings 5234, the outer ends of the two connecting rings 5234 are respectively provided with outer edges, the two second outer rings 5232 are respectively clamped in the outer edges, the first outer ring 5231 is simultaneously sleeved outside the two second outer rings 5232, and the hollow connecting rod 522 passes through the symmetrical sealing pieces 5233 from the middle and is fixed in the cavity 521, so that the vacuum environment of the hollow connecting rod 522 is ensured.

Wherein: the hollow link 522 can drive the cavity 521 to rotate, and moving the hollow link 522 can drive the cavity 521 to move along the direction of the hollow link 522, so as to adjust the position of the muzzle. The hollow link 522 may be fixed to the coating apparatus by a side pressure of the vacuum sealing ring, and the hollow link 522 may be rotated and moved by a servo motor. Preferably, a rotating disc can be sleeved at one end, far away from the cavity 521, of the hollow connecting rod 522, different rotating angles of the rotating scale marks are arranged on the rotating disc, and after the cavity 521 is fixed, the servo motor can be controlled to rotate the hollow connecting rod 522 according to the rotating scale on the rotating disc, so that the cavity 521 is driven to rotate, and the position adjustment of the ion gun 52 is completed.

In addition, the working chamber 51 is also provided with a first interface for connecting a vacuum pump, a second interface for connecting a vacuum gauge and a third interface for connecting a vacuum breaking valve; wherein: the vacuum pump is used for extracting vacuum, the vacuum gauge is used for measuring vacuum, and the vacuum breaking valve is used for introducing air into the working cavity 51 to restore atmospheric pressure. The specific installation positions of the first interface, the second interface and the third interface can be set according to needs, and the invention is not particularly limited.

In operation, the left or right inlet valve of the working chamber 51 is opened to place the sample on the bottom surface alone or together with the sample stage 12. The control system calculates the position and angle of the target position 3 according to the size and the position of the sample, and simultaneously calculates the position and angle of the ion gun 52, so that the muzzle emergent angle of the ion gun 52 is aligned to the target position 3, and the muzzle emergent ion beam of the ion gun 52 is aligned to the sample position after being reflected by the target on the target position 3. The working cavity 51 is closed and then vacuumized, the target material support 52 is rotated, the blind plate position 2 is aligned to the ion gun 52, the power supply and the gas circuit of the ion gun 52 are started, the working gas of the ion gun 52 is emitted to the blind plate position 2, and the material of the blind plate position 2 cannot be sputtered by the working gas, so that the ion beam cannot appear, the influence of unstable ion beams on the film coating effect is avoided, and the film coating fineness is improved. After the ion gun 52 works stably, as shown in fig. 10, the target holder 52 is rotated, so that the target position 3 on which the target required for the current coating is mounted is aligned with the ion gun 52, the ion beam emitted from the ion gun 52 sputters the target of the target position 3, and atoms or molecules on the target are sputtered by the ion beam and deposited on the surface of the sample. When the film is coated for a designated time, the ion gun 52 is closed, the vacuum breaking valve is opened, and the working chamber 52 is restored to the state of the atmospheric pressure. And opening the sample injection valve, taking out the sample and finishing film coating.

It should be noted that: the ion gun 52, the target holder 53 and the sample stage 12 have fixed installation positions, a sample placing area can be arranged on the sample stage 12, and under the condition that a sample is small, the sample is directly placed in the sample placing area, so that the ion beam emitted from the muzzle of the ion gun 52 can be ensured to be aligned with the sample position after being reflected by the target on the target position 3; when the sample is large, the heights and angles of the target position 3 and the ion gun 52 need to be calculated according to the geometric position of the sample, and the heights and angles of the target position 3 and the ion gun 52 need to be adjusted, so that the sputtered beam current is efficiently deposited on the surface of the sample.

In summary, in the target holder and the film coating apparatus of the present invention, the first surface of the target holder body is provided with the blind plate position and the plurality of target positions for mounting the target, and the blind plate position and the plurality of target positions are circumferentially distributed on the first surface. Compared with the prior art, the method has the following beneficial effects:

1. at the initial stage of coating film, rotatory target holds in palm body 1, makes working gas aim at blind plate position, because blind plate position 2's material can not sputtered by working gas, consequently, ion beam can not appear, avoids unstable ion beam to the influence of coating film effect, promotes the coating film fineness.

2. When the coating material is replaced, the target material support body 1 is rotated, so that the working gas is aligned to the corresponding target material position 3, the disassembly and the assembly of the coating head are omitted, and the operation is simple and time-saving.

3. The ion gun 52 is introduced into the coating equipment, and the positions among the ion gun 52, the target holder 53 and the sample table 12 are fixed according to the structure of the target holder, so that the target is ensured to be accurately sputtered, and the waste of the target and working gas in the sputtering process is avoided.

It is to be understood that the invention is not limited to the precise construction and process illustrated in the drawings and described above. A detailed description of known methods is omitted herein for the sake of brevity. In the above embodiments, several specific steps are described and shown as examples. However, the method processes of the present invention are not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications and additions or change the order between the steps after comprehending the spirit of the present invention.

It should also be noted that the exemplary embodiments mentioned in this patent describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above-described steps, that is, the steps may be performed in the order mentioned in the embodiments, may be performed in an order different from the order in the embodiments, or may be performed simultaneously.

As described above, only the specific embodiments of the present invention are provided, and it can be clearly understood by those skilled in the art that, for convenience and simplicity of description, the specific working processes of the system, the module and the unit described above may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again. It should be understood that the scope of the present invention is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present invention.

Claims (10)

1. A target holder, comprising: rotatable target holds in palm the body, it has a plurality of installation positions to hold in the palm to distribute along the circumference on the first surface of body to hold in the palm the target, the installation position includes: a blind plate position and a target material position for mounting a target material.

2. The target holder of claim 1, wherein the mounting locations are disposed on mounting surfaces, each mounting surface having a fixed included angle with the first surface, all mounting surfaces enclosing a closed side.

3. The target holder of claim 2, wherein the mounting surface comprises a circular arc edge, two opposite side edges, and a top edge opposite to the circular arc edge, wherein the side edges of adjacent mounting surfaces are overlapped to form a closed side surface, the top edges of adjacent mounting surfaces are connected to form an upper bottom surface, and the circular arc edges of adjacent mounting surfaces are connected to each other and are connected to the first surface in a closed manner through transition side surfaces.

4. The target holder according to claim 2, wherein the target portion is circular, the target portion is concave or convex to the target surface, and the side surface of the target portion is provided with threads.

5. A target holder according to claim 2, wherein the target site is provided with an outer frame that is concave or convex to the target surface.

6. A target holder according to any one of claims 1-5, wherein a connecting rod is arranged on the back of the first surface, a rotating disc is sleeved on the connecting rod, and scales are arranged on the rotating disc.

7. The target holder according to claim 6, wherein a sputtering cylinder is mounted on the blind spot, and a window for ion beam incidence is formed on the sputtering cylinder.

8. A plating apparatus, characterized by comprising: a working chamber, an ion gun disposed within the working chamber and a target holder according to any one of claims 1-7.

9. The plating apparatus according to claim 8, wherein the target holder is disposed perpendicular to the ion gun.

10. The plating apparatus according to claim 9, wherein the ion gun comprises: the cavity is provided with a muzzle and a hollow connecting rod which are perpendicular to each other, the working cavity is provided with a through hole, and the connecting rod penetrates through the through hole and is connected with external working gas supply equipment.

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