CN115734468A - Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof - Google Patents

Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof Download PDF

Info

Publication number
CN115734468A
CN115734468A CN202211583140.7A CN202211583140A CN115734468A CN 115734468 A CN115734468 A CN 115734468A CN 202211583140 A CN202211583140 A CN 202211583140A CN 115734468 A CN115734468 A CN 115734468A
Authority
CN
China
Prior art keywords
aluminum
layer
foil
aluminum foil
glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211583140.7A
Other languages
Chinese (zh)
Inventor
王小伟
辛先进
王禹潼
王禹坤
王有才
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taishan Kewei Electronic Technology Co ltd
Original Assignee
Taishan Kewei Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taishan Kewei Electronic Technology Co ltd filed Critical Taishan Kewei Electronic Technology Co ltd
Priority to CN202211583140.7A priority Critical patent/CN115734468A/en
Publication of CN115734468A publication Critical patent/CN115734468A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Laminated Bodies (AREA)

Abstract

The invention relates to the technical field of circuit boards, and particularly discloses a novel aluminum-based double-sided aluminum-clad plate and a manufacturing process thereof. According to the invention, the first aluminum foil layer and the second aluminum foil layer are covered on the aluminum substrate layer, and the traditional copper foil is replaced by the aluminum foil, so that the production cost can be greatly reduced, and compared with the traditional copper-clad plate, the production cost is lower, and the aluminum-clad plate is lighter and thinner. And because the aluminum substrate layer is positioned in the middle of the whole material, the stress distribution is more uniform, the thermal deformation of the material after being heated is greatly reduced, and the quality of the material is improved.

Description

Novel aluminum-based double-sided aluminum foil-coated plate and manufacturing process thereof
Technical Field
The invention relates to the technical field of circuit boards, in particular to a novel aluminum-based double-sided aluminum foil-clad plate and a manufacturing process thereof.
Background
The copper clad laminate is divided into a single-sided copper clad laminate and a double-sided copper clad laminate, wherein the single-sided copper clad laminate is a plate-shaped material prepared by soaking electronic glass fiber cloth or other reinforcing materials with resin and covering copper foil on one side and hot-pressing, and printed circuit boards in different forms and different functions are manufactured on the copper clad laminate by selectively carrying out the working procedures of processing, etching, drilling, copper plating and the like. However, the existing copper-clad plate has the following disadvantages: on one hand, copper is a relatively expensive metal, and the circuit board is produced by adopting pure copper, so that the cost of the circuit board is high, and the production cost is high; on the other hand, the density of copper is higher than that of aluminum, so that the requirement of lighter and thinner circuit boards cannot be met; therefore, how to design a low-cost circuit board to replace the existing copper-clad plate becomes a difficult problem to be solved urgently by the technical personnel in the field.
Disclosure of Invention
The invention aims to solve the technical problems of high production cost and heavy quality of the existing copper-clad plate, and provides a novel aluminum-based double-sided aluminum foil-clad plate and a manufacturing process thereof.
In order to solve the technical problem, the technical scheme of the invention is as follows:
the utility model provides a novel aluminium base two-sided aluminium foil board that covers, includes aluminium base layer, first rubberised layer, first aluminium foil layer, second rubberised layer and second aluminium foil layer, first rubberised layer set up in the upper end on aluminium base layer, first aluminium foil layer set up in the upper end on first rubberised layer, second rubberised layer set up in the bottom on aluminium base layer, second aluminium foil layer set up in the bottom on second rubberised layer.
Preferably, the thickness of the aluminum substrate layer is 300um-2000um.
Preferably, the aluminum substrate layer is coated with an insulating layer, and the thickness of the insulating layer is 30um-300um.
Preferably, the thickness of the first aluminum foil layer and the thickness of the second aluminum foil layer are both 10um-150um.
Preferably, the first glue coating layer is respectively adhered to the upper end of the aluminum substrate layer and the bottom surface of the first aluminum foil layer, and the second glue coating layer is respectively adhered to the bottom surface of the aluminum substrate layer and the upper end of the second aluminum foil layer.
Preferably, the first glue coating layer and the second glue coating layer are one or more of a phenolic resin glue layer, an epoxy resin glue layer, an acrylate glue layer, a polyester glue layer, a polyurethane glue layer, a silicon-containing glue layer, a PET film layer, a PI film layer, a PP film layer and the like.
In order to solve the technical problem, the invention also provides a manufacturing process of the novel aluminum-based double-sided aluminum-clad plate, which comprises the following steps:
coating glue on an aluminum foil or an aluminum substrate, and coating heat-conducting insulating glue on the surface of the aluminum foil or the aluminum substrate by a roller coating machine;
step two, baking and semi-curing, namely baking the aluminum foil in a tunnel furnace to obtain a semi-cured aluminum foil or aluminum substrate;
and step three, hot pressing or rolling, namely pressing the aluminum substrate and the aluminum foil through a hot press or a roller press for 60-240min to obtain a novel aluminum-based double-sided aluminum foil-coated plate finished product.
Preferably, before the first step, the method further comprises performing a preliminary surface treatment on the aluminum foil, wherein the preliminary surface treatment comprises a primary surface treatment and a secondary surface treatment.
Preferably, the surface primary treatment comprises the following steps: step S1, treating a coupling agent, namely soaking the aluminum foil in a solution prepared from the coupling agent for 20-60S, taking out the aluminum foil after soaking, and drying the aluminum foil; s2, performing corona treatment, namely putting the aluminum foil into a corona machine for corona treatment, wherein the corona time is 30-120S; and S3, grafting treatment, namely soaking the aluminum foil in the grafting solution for 60-180S, taking out after soaking, and drying.
Preferably, the surface secondary treatment comprises the steps of: s4, removing oil, namely soaking the aluminum foil in alkaline degreasing liquid for 60-180S, and then washing and cleaning; step S5, coarsening, namely sequentially putting the aluminum foil into nitric acid solution and ternary/quaternary zinc dipping solution for dipping; and S7, washing and cleaning the aluminum foil and drying the aluminum foil.
By adopting the technical scheme, the novel aluminum-based double-sided aluminum foil clad plate and the manufacturing process thereof have the following beneficial effects: this novel aluminium base two-sided coating aluminium foil board in first rubber coating layer sets up in the upper end on aluminium base plate layer, and first aluminium foil layer sets up in the upper end on first rubber coating layer, the second rubber coating layer set up in the bottom on aluminium base plate layer, the second aluminium foil layer sets up in the bottom on second rubber coating layer, sets up first aluminium foil layer and second aluminium foil layer through covering on aluminium base plate layer, and first aluminium foil layer and second aluminium foil layer are respectively through first rubber coating layer and second rubber coating layer adhesion at the upper and lower both ends on aluminium base plate layer, realize being replaced traditional copper foil by the aluminium foil, can greatly reduced manufacturing cost, compare in traditional copper-clad plate, and manufacturing cost is lower to more frivolous.
Drawings
FIG. 1 is a schematic cross-sectional view of the present invention;
FIG. 2 is a flow chart of a fabrication process of the present invention;
FIG. 3 is a flow chart of the process of the aluminum foil surface treatment in the previous stage of the present invention;
in the figure, 1-aluminum substrate layer, 2-first glue coating layer, 3-first aluminum foil layer, 4-second glue coating layer and 5-second aluminum foil layer.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically defined otherwise.
As shown in fig. 1, in the schematic cross-sectional structure diagram of the present invention, the novel aluminum-based double-sided aluminum-clad foil plate includes an aluminum substrate layer 1, a first glue layer 2, a first aluminum foil layer 3, a second glue layer 4 and a second aluminum foil layer 5, the first glue layer 2 is disposed on the upper end of the aluminum substrate layer 1, the first aluminum foil layer 3 is disposed on the upper end of the first glue layer 2, the second glue layer 4 is disposed on the bottom of the aluminum substrate layer 1, and the second aluminum foil layer 5 is disposed on the bottom of the second glue layer 4.
It can be understood that the first glue coating layer 2 and the second glue coating layer 4 are one or more combinations of a phenolic resin glue layer, an epoxy resin glue layer, an acrylate glue layer, a polyester glue layer, a polyurethane glue layer, a silicon-containing glue layer, a PET film layer, a PI film layer, a PP film layer, and the like; the aluminum substrate layer 1 may be a general aluminum substrate; both the first aluminum foil layer 3 and the second aluminum foil layer 5 may be made of a general-purpose aluminum foil or the like. Specifically, the thickness of the aluminum substrate layer 1 is 300um to 2000um; the thickness of the first aluminum foil layer 3 and the thickness of the second aluminum foil layer 5 are both 10um-150um; the first glue coating layer 2 is respectively adhered to the upper end of the aluminum substrate layer 1 and the bottom surface of the first aluminum foil layer 3, and the second glue coating layer 4 is respectively adhered to the bottom surface of the aluminum substrate layer 1 and the upper end of the second aluminum foil layer 5.
It can be understood that, as shown in fig. 2-3, the process flow of the novel aluminum-based double-sided aluminum-clad plate includes the following steps:
firstly, coating an aluminum foil or an aluminum substrate with glue, and coating heat-conducting insulating glue on the surface of the aluminum foil or the aluminum substrate through a roller coating machine; step two, baking and semi-curing, namely baking the aluminum foil or the aluminum substrate in a tunnel furnace to obtain a semi-cured aluminum foil or aluminum substrate; and step three, hot pressing or rolling, namely pressing the aluminum substrate and the aluminum foil through a hot press or a roller press for 60-240min to obtain a novel aluminum-based double-sided aluminum foil-coated plate finished product.
It can be understood that the aluminum foil in the novel aluminum-based double-sided aluminum-clad foil plate needs to be subjected to a previous surface treatment, including a primary surface treatment and a secondary surface treatment, wherein the primary surface treatment comprises the following steps: step S1, treating a coupling agent, namely soaking the aluminum foil in a solution prepared from the coupling agent for 20-60S, taking out the aluminum foil after soaking, and drying the aluminum foil; s2, performing corona treatment, namely putting the aluminum foil into a corona machine for corona treatment for 30-120S; and S3, grafting, namely soaking the aluminum foil in the grafting solution for 60-180S, taking out after soaking, and drying. The aluminum foil after the primary surface treatment can be etched by adopting a general etching process, the surface of the etched aluminum foil is provided with an ink layer, and the aluminum foil is subjected to secondary surface treatment, wherein the secondary surface treatment comprises the following steps: s4, removing oil, namely soaking the aluminum foil in alkaline degreasing liquid for 60-180S, and then washing and cleaning; step S5, coarsening, namely soaking the aluminum foil in nitric acid liquor for 20-60S, and then washing and cleaning the aluminum foil; soaking the aluminum foil in ternary/quaternary zinc dipping solution for 10-60 s, and then washing and cleaning; soaking the aluminum foil in nitric acid solution for 20-60s, and cleaning with water; soaking the aluminum foil in ternary/quaternary zinc dipping solution for 10-60 s, and then washing and cleaning; s6, chemically plating nickel, namely soaking the aluminum foil in a chemical nickel plating solution for 30S-10min at the temperature of 85 ℃; and S7, washing and cleaning the aluminum foil and drying the aluminum foil. The aluminum-based aluminum-coated plate manufactured by the process can be used for welding circuit components on the surface of the aluminum foil, has good heat-conducting property, can perfectly replace the traditional copper-clad plate, is lower in cost and has good market prospect.
It can be understood that the invention has reasonable design and unique structure, the first aluminum foil layer 3 and the second aluminum foil layer 5 are covered on the aluminum substrate layer 1, and the first aluminum foil layer 3 and the second aluminum foil layer 5 are respectively adhered to the upper end and the lower end of the aluminum substrate layer 1 through the first glue coating layer 2 and the second glue coating layer 4, so that the traditional copper foil is replaced by the aluminum foil, the production cost can be greatly reduced, and compared with the traditional copper-clad plate, the invention has lower production cost and is lighter and thinner; and because the substrate layer is positioned in the middle of the whole material, the stress distribution is more uniform, the thermal deformation of the material after being heated is greatly reduced, and the quality of the material is improved.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and these embodiments are still within the scope of the invention.

Claims (10)

1. The utility model provides a novel aluminium base two-sided aluminium foil clad plate which characterized in that: including aluminium base plate layer, first rubber coating layer, first aluminium foil layer, second rubber coating layer and second aluminium foil layer, first rubber coating layer set up in the upper end on aluminium base plate layer, first aluminium foil layer set up in the upper end on first rubber coating layer, second rubber coating layer set up in the bottom on aluminium base plate layer, second aluminium foil layer set up in the bottom on second rubber coating layer.
2. The novel aluminum-based double-sided aluminum-clad foil sheet as claimed in claim 1, wherein: the thickness of the aluminum substrate layer is 300um-2000um.
3. The novel aluminum-based double-sided aluminum-clad foil sheet as claimed in claim 1, wherein: the cladding has the insulating layer on the aluminium base plate layer, the thickness of insulating layer is 30um-300um.
4. The novel aluminum-based double-sided aluminum-clad foil sheet as claimed in claim 1, wherein: the thickness of first aluminium foil layer and the thickness of second aluminium foil layer are 10um-150um.
5. The novel aluminum-based double-sided aluminum-clad foil sheet as claimed in claim 1, wherein: the first glue coating layers are respectively adhered to the upper end of the aluminum substrate layer and the bottom surface of the first aluminum foil layer, and the second glue coating layers are respectively adhered to the bottom surface of the aluminum substrate layer and the upper end of the second aluminum foil layer.
6. The novel aluminum-based double-sided aluminum-clad foil sheet as claimed in claim 1, wherein: the first glue coating layer and the second glue coating layer are one or a combination of a phenolic resin glue layer, an epoxy resin glue layer, an acrylate glue layer, a polyester glue layer, a polyurethane glue layer, a silicon-containing glue layer, a PET film layer, a PI film layer, a PP film layer and the like.
7. A process for manufacturing a novel aluminum-based double-sided aluminum-clad sheet as defined in any one of claims 1 to 6, wherein: the method comprises the following steps:
coating glue on an aluminum foil or an aluminum substrate, and coating heat-conducting insulating glue on the surface of the aluminum foil or the aluminum substrate by a roller coating machine;
baking and semi-curing, namely baking the aluminum foil or the aluminum substrate in a tunnel furnace to obtain a semi-cured aluminum foil or aluminum substrate;
and step three, hot pressing or rolling, namely pressing the aluminum substrate and the aluminum foil through a hot press or a roller press for 60-240min to obtain a novel aluminum-based double-sided aluminum foil-coated plate finished product.
8. The process of claim 7, wherein: before the first step, the method also comprises the step of carrying out the previous surface treatment on the aluminum foil, wherein the previous surface treatment comprises primary surface treatment and secondary surface treatment.
9. The process of claim 8, wherein: the surface primary treatment comprises the following steps: step S1, treating a coupling agent, namely soaking the aluminum foil in a solution prepared from the coupling agent for 20-60S, taking out the aluminum foil after soaking, and drying the aluminum foil; s2, performing corona treatment, namely putting the aluminum foil into a corona machine for corona treatment for 30-120S; and S3, grafting, namely soaking the aluminum foil in the grafting solution for 60-180S, taking out after soaking, and drying.
10. The process of claim 8, wherein: the surface secondary treatment comprises the following steps: s4, removing oil, namely soaking the aluminum foil in alkaline degreasing liquid for 60-180S, and then washing and cleaning; step S5, coarsening, namely sequentially putting the aluminum foil into nitric acid solution and ternary/quaternary zinc dipping solution for dipping; and S7, washing and cleaning the aluminum foil and drying the aluminum foil.
CN202211583140.7A 2022-12-10 2022-12-10 Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof Pending CN115734468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211583140.7A CN115734468A (en) 2022-12-10 2022-12-10 Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211583140.7A CN115734468A (en) 2022-12-10 2022-12-10 Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof

Publications (1)

Publication Number Publication Date
CN115734468A true CN115734468A (en) 2023-03-03

Family

ID=85301105

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211583140.7A Pending CN115734468A (en) 2022-12-10 2022-12-10 Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof

Country Status (1)

Country Link
CN (1) CN115734468A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116406090A (en) * 2023-05-15 2023-07-07 台山市科伟电子科技有限公司 Production process of aluminum-based copper-clad aluminum foil plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116406090A (en) * 2023-05-15 2023-07-07 台山市科伟电子科技有限公司 Production process of aluminum-based copper-clad aluminum foil plate
CN116406090B (en) * 2023-05-15 2024-02-02 台山市科伟电子科技有限公司 Production process of aluminum-based copper-clad aluminum foil plate

Similar Documents

Publication Publication Date Title
EP0930811B1 (en) Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same
EP0960725B1 (en) Resin-coated composite foil, production and use thereof
US5573632A (en) Multilayer printed-circuit substrate, wiring substrate and process of producing the same
KR100595381B1 (en) Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same
CN115734468A (en) Novel aluminum-based double-sided aluminum foil-clad plate and manufacturing process thereof
KR20010089713A (en) Surface-treated copper foil and method for manufacturing the surface-treated copper foil
JP2014139347A (en) Method of treating surface of copper foil for printed circuit, copper foil produced by the same and plating apparatus for the same
CN105704948A (en) Manufacturing method of ultra-thin printed circuit board and ultra-thin printed circuit board
JP3392066B2 (en) Composite copper foil, method for producing the same, copper-clad laminate and printed wiring board using the composite copper foil
JP5026217B2 (en) Peelable metal foil and manufacturing method thereof
JPH10341066A (en) Copper foil for printed circuit and copper foil with resin adhesive for printed circuit and copper-clad lamination board for printed circuit using it
CN220139810U (en) Novel aluminum-based double-sided aluminum foil-coated plate
JP6104260B2 (en) Metal foil with carrier
JP6353193B2 (en) Copper foil with carrier, method for producing a copper-clad laminate using the copper foil with carrier, method for producing a printed wiring board using the copper foil with carrier, and method for producing a printed wiring board
CN215818755U (en) High-strength aluminum alloy substrate structure for manufacturing backlight plate
JP4430020B2 (en) Copper foil for flexible printed wiring board, manufacturing method thereof and flexible printed wiring board
JP2004273531A (en) Copper-foil composite sheet for printed wiring board and method of manufacturing printed wiring board using the sheet
CN212949521U (en) Polyimide stiffening plate
KR100641341B1 (en) Flexible copper clad laminate using coducting polymer and the method for producing the same
EP0996318A2 (en) Novel composite foil, process for producing the same and copper-clad laminate
CN217983388U (en) Semiconductor substrate of LED thin film chip
CN215203824U (en) High-toughness spliced aluminum-based copper-clad plate
KR100888229B1 (en) Method of fabricating a metal inter-layer using clad lamination, a flexible copper clad laminate and a fabrication method thereof
CN219678790U (en) Aluminum-based single-sided aluminum foil-coated plate
KR100652158B1 (en) Copper foil and fabrication method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination