CN115734061A

CN115734061A - Lens module and manufacturing method thereof

Info

Publication number: CN115734061A
Application number: CN202110997682.8A
Authority: CN
Inventors: 卢昕; 李卫祥
Original assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Current assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Priority date: 2021-08-27
Filing date: 2021-08-27
Publication date: 2023-03-03
Also published as: TW202309635A; TWI826856B

Abstract

A lens module comprises a circuit board, an image sensor, a magnet and a lens, wherein the circuit board comprises a first area, a second area and a third area which are sequentially connected, an included angle is formed between the third area and the first area to form an accommodating space, a coil is arranged on one side of the third area facing the accommodating space, and the second area is bent; the image sensor is positioned in the accommodating space and is fixedly connected with the first area; the magnet is fixedly connected with the image sensor and is arranged at intervals with the coil; the lens is fixedly connected with the coil; the image sensor and the magnet which are fixedly connected and the coil and the lens which are fixedly connected are elastically connected through the second bent area. The application also provides a manufacturing method of the lens module.

Description

Lens module and manufacturing method thereof

Technical Field

The present disclosure relates to lens modules, and particularly to a lens module and a method for manufacturing the lens module.

Background

When a user shoots in the process of movement or in the process of non-movement, the problem that images or videos shot by the lens module are blurred due to shaking (such as hand shaking) often occurs easily. In order to solve the technical problem, an Optical Image Stabilization (OIS) technology is provided, which detects the shake of an electronic device (e.g., a mobile phone, a tablet computer, etc.) through a structure such as a suspension wire, a ball or a gyroscope, and then compensates the offset of light on a CMOS (complementary metal oxide semiconductor) caused by the shake of a lens module by moving a lens in the opposite direction through the OIS and a Voice Coil Motor (VCM), so as to effectively overcome the problem that the photographed image or video has shake blur due to the shake.

However, the above structure needs to have a separate voice coil motor and an optical image stabilizing structure, which results in a large volume of the lens module and does not meet the requirement for element integration; in addition, the size of the pixels of the lens module is related to the size of the image sensor in the lens module, and the larger the size of the image sensor is, the higher the pixels are, and on the premise that the installation volume of the lens module is limited, the size of the image sensor is limited, which causes the pixels of the lens module to be difficult to be increased.

Disclosure of Invention

In view of the above, it is desirable to provide a small-sized lens module with an anti-shake function to solve the above-mentioned problems.

In addition, a method for manufacturing a lens module is also needed.

A lens module comprises a circuit board, an image sensor, a magnet and a lens, wherein the circuit board comprises a first area, a second area and a third area which are sequentially connected, an included angle is formed between the third area and the first area to form an accommodating space, a coil is arranged on one side of the third area facing the accommodating space, and the second area is bent; the image sensor is positioned in the accommodating space and is fixedly connected with the first area; the magnet is fixedly connected with the image sensor and is arranged at intervals with the coil; the lens is fixedly connected with the coil; the image sensor and the magnet which are fixedly connected and the coil and the lens which are fixedly connected are elastically connected through the second bent area.

In some embodiments, the second zone is a floppy zone.

In some embodiments, the bend-like shape is at least one of a wave, a W, an S shape.

In some embodiments, the circuit board further includes a sizing layer, and the sizing layer is located in a corner region where the second region is bent.

In some embodiments, the material of the sizing layer is selected from one of polyethylene naphthalate and polyester resin.

In some embodiments, the lens module further includes a first bracket, the first bracket is accommodated in the accommodating space and fixed on the circuit board located in the first region, and the magnet is fixed on the first bracket.

In some embodiments, the lens module further includes a second bracket, the second bracket is located in a peripheral region of the first bracket and is spaced apart from the first bracket, and the circuit board located in the third region is fixed to the second bracket.

In some embodiments, the side of the circuit board located in the third area facing away from the coil has connection pads.

A method for manufacturing a lens module comprises the following steps: providing a circuit board, wherein the circuit board comprises a first area, a second area and a third area which are sequentially connected, bending one side of the third area facing the first area to form an accommodating space, and forming a coil on one side of the third area facing the accommodating space, wherein the second area is bent; placing an image sensor in the accommodating space and fixedly connecting the image sensor with the first area; fixedly connecting a magnet with the image sensor and arranging the magnet and the coil at intervals; and fixedly connecting a lens with the coil, so that the image sensor is elastically connected with the magnet and the coil is elastically connected with the lens through the bent second area.

In some embodiments, the step of forming the circuit board comprises: providing a first circuit substrate which comprises a first area, a second area and a third area which are connected in sequence; covering an insulating layer on the surface of the first circuit substrate in the second area; forming a second circuit substrate on the surface of the first circuit substrate in the first area and the third area, wherein the insulating layer in the second area is exposed to the second circuit substrate, and the second circuit substrate in the third area comprises a coil; and bending the second region to form the circuit board with the bent second region.

In some embodiments, the step of forming the circuit board further comprises: and forming a third circuit substrate on the surface of the first circuit substrate, which is positioned in the first area and the third area and is deviated from the second circuit substrate, wherein the third circuit substrate positioned in the third area comprises a connecting pad.

In some embodiments, the manufacturing method further comprises the step of forming a sizing layer in the corner regions where the second region bends.

The application provides a lens module, including circuit board, image sensor, magnet and camera lens. The circuit board is provided with a coil, the coil is fixedly connected with the lens, the image sensor is fixedly connected with the magnet, the fixedly connected image sensor and the magnet are elastically connected with the lens through a bent soft board area, when the lens module shakes under the action of external force, the lens and the coil synchronously shake and drive the image sensor and the magnet to synchronously move through the bent soft board area, and the offset of light on the image sensor caused by shaking of the lens module is compensated, so that the problem that a shot image or video shakes and blurs due to shaking is effectively solved. The coil is formed on the circuit board, and the magnet is arranged in the accommodating space formed by the circuit board, so that the volume of the lens module is effectively reduced by replacing an additionally arranged voice coil motor on the premise of meeting the functions of the lens module.

Drawings

Fig. 1 is a schematic cross-sectional view of a first circuit substrate according to an embodiment of the present disclosure.

Fig. 2 is a schematic cross-sectional view of the first circuit board shown in fig. 1 covered with an insulating layer.

Fig. 3 is a schematic cross-sectional view of the first copper-clad plate and the second copper-clad plate covered on the surface of the first circuit substrate shown in fig. 2.

FIG. 4 is a schematic cross-sectional view of the first copper-clad plate and the second copper-clad plate shown in FIG. 3, which are respectively subjected to circuit fabrication and then covered with a solder mask layer

Fig. 5 is a schematic cross-sectional view of the circuit board obtained by removing the first copper-clad plate and the second copper-clad plate which are located in the second area and subjected to circuit manufacturing.

Fig. 6 is a top view of the circuit board shown in fig. 5.

Fig. 7 is a schematic diagram of a bent structure formed by bending the circuit board in the second area shown in fig. 5 according to an embodiment.

Fig. 8 is a schematic view of another embodiment of a bending structure formed by bending the circuit board in the second region shown in fig. 5.

Fig. 9 is a schematic cross-sectional view of the image sensor and the bent circuit board shown in fig. 5 after being fixedly mounted.

Fig. 10 is a schematic cross-sectional view of a lens module obtained by assembling the lens and the structure shown in fig. 9.

FIG. 11 is a top view of the lens module of FIG. 10 coupled to a connector in accordance with an embodiment.

FIG. 12 is a top view of another embodiment of the lens module shown in FIG. 10 connected to a connector.

Description of the main elements

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be made below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes all and any combination of one or more of the associated listed items.

In various embodiments of the present application, for convenience in description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical connections, either direct or indirect. "upper", "lower", "above", "below", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.

Referring to fig. 1 to 12, an embodiment of the present invention provides a lens module 200 with an anti-shake function and a small volume, and a method for manufacturing the lens module 200 includes the following steps:

step S1: referring to fig. 1, a first circuit substrate 10 is provided, which includes a first region I, a second region II and a third region III connected in sequence.

The first circuit board 10 includes a first dielectric layer 11 and a first circuit layer 13 stacked along the first direction L1, and at least a portion of the first circuit layer 13 is exposed to the first dielectric layer 11. The number of the first circuit layers 13 may be one or more, and when the number of the first circuit layers 13 is more than one, the more than one first circuit layers 13 are spaced apart from the first dielectric layer 11 and electrically connected to each other through the conductive via 15. In the present embodiment, the first circuit board 10 is a double-layer circuit board, that is, the number of the first dielectric layers 11 is one, the number of the first circuit layers 13 is two, and the two first circuit layers 13 are respectively located on two opposite surfaces of the first dielectric layer 11.

The first dielectric layer 11 may be made of one of flexible materials such as Polyimide (PI), liquid Crystal Polymer (LCP), modified Polyimide (MPI), and the like, so that the first circuit board 10 has flexibility, and is convenient for bending processing and elastic buffering action in the subsequent process.

The first circuit substrate 10 includes a first region I, a second region II, and a third region III, and the second region II connects the first region I and the third region III. The number of the second zones II and the third zones III is equal, and each zone is plural. Referring to fig. 6, in the present embodiment, the number of the second areas II and the third areas III is four spaced areas, the four second areas II and the third areas III extend along a plane perpendicular to the first direction L1, and the four second areas II and the third areas III extend along different directions in the plane, that is, the four second areas II and the third areas III extend along the second direction L2, the second direction L2 is perpendicular to the first direction L1, and the second direction L2 is plural, so that the subsequent plural third areas III can be bent along one side of the first area I to form an accommodating space 60 (see fig. 9).

Step S2: referring to fig. 2, an insulating layer 20 covers the surface of the first circuit substrate 10 in the second region II.

The insulating layer 20 covers the surface of the first wiring layer 13 of the first wiring substrate 10 located in the second region II. In the present embodiment, the opposite surfaces of the first circuit substrate 10 located in the four second regions II are each covered with an insulating layer 20. The insulating layer 20 is used for facilitating a subsequent uncovering process in the area where the insulating layer 20 is located, for example, facilitating removal of a copper-clad plate covering the surface of the insulating layer 20; and the first circuit layer 13 is protected to prevent the first circuit layer 13 from being oxidized after the cover is opened.

And step S3: referring to fig. 3, the first copper clad laminate 35 and the second copper clad laminate 45 are covered on two opposite surfaces of the first circuit substrate 10 in the first area I, the second area II and the third area III.

The first copper clad laminate 35 includes a second dielectric layer 31 and a first copper layer 352. The first copper layer 352 is located on the surface of the second dielectric layer 31 facing away from the first circuit substrate 10. The first copper-clad plate 35 covers the insulating layer 20 which is positioned on the same side of the first circuit substrate 10 as the first copper-clad plate 35.

The second copper clad laminate 45 includes a third dielectric layer 41 and a second copper layer 452. The second copper layer 452 is located on the surface of the third dielectric layer 41 facing away from the first circuit substrate 10. The second copper-clad plate 45 covers the insulating layer 20 which is positioned at the same side of the first circuit substrate 10 as the second copper-clad plate 45.

The second dielectric layer 31 and the third dielectric layer 41 may be made of one of flexible materials such as Polyimide (PI), liquid Crystal Polymer (LCP), modified Polyimide (MPI), and the like, or one of hard materials such as Polypropylene (PP) and Polytetrafluoroethylene (PTFE).

In some embodiments, adhesive layers (not shown) may be further disposed between the first copper-clad plate 35 and the first circuit substrate 10 and between the second copper-clad plate 45 and the first circuit substrate 10 to respectively bond the first copper-clad plate 35 and the first circuit substrate 10 and the second copper-clad plate 45 and the first circuit substrate 10.

And step S4: referring to fig. 4, the first copper-clad plate 35 and the second copper-clad plate 45 are respectively subjected to circuit manufacturing, wherein the first copper-clad plate 35 located in the third area III is manufactured to form a coil 332 (see fig. 6), and the second copper-clad plate 45 located in the third area III is manufactured to form a connection pad 432.

Specifically, referring to fig. 3 and fig. 4, the first copper layer 352 is wired to form the second circuit layer 33 electrically connected to the first circuit layer 13, and the second circuit layer 33 includes the coil 332. The second copper layer 452 is routed to form a third circuit layer 43 electrically connected to the first circuit layer 13, and the third circuit layer 43 includes a connection pad 432.

Step S5: referring to fig. 5 and fig. 6, the first copper clad laminate 35 and the second copper clad laminate 45 located in the second area II and subjected to the circuit manufacturing are removed.

The second dielectric layer 31 and the second circuit layer 33 in the second region II are removed to expose the insulating layer 20, and a second circuit substrate 30 including the second dielectric layer 31 and the second circuit layer 33 in the first region I and the third region III is obtained. The third dielectric layer 41 and the third circuit layer 43 in the second region II are removed to expose the insulating layer 20, and the third circuit substrate 40 including the third dielectric layer 41 and the third circuit layer 43 in the first region I and the third region III is obtained. The second region II includes a first circuit substrate 10 and an insulating layer 20 covering the surface of the first circuit substrate 10, and the second region II is a flexible region.

It is to be understood that the number of layers of the wires in the second and

third circuit substrates

30 and 40 is not limited to one layer, and may be multiple layers. The steps of forming the second circuit substrate 30 and the third circuit substrate 40 are merely illustrative, and not restrictive.

Before step S5, referring to fig. 4, a step of forming a solder mask layer 50 may be further included, where the solder mask layer 50 covers the second dielectric layer 31 and the second circuit layer 33, and also covers the third dielectric layer 41 and the third circuit layer 43.

Step S6: referring to fig. 7 and 8, the second region II is bent to form a circuit board 100 with the second region II being bent.

The bending shape includes, but is not limited to, a wave shape, a W shape, and an S shape, i.e., the cross section of the second region II along the first direction L1 or the second direction L2 may include, but is not limited to, a wave shape, a W shape, and an S shape.

In some embodiments, the manufacturing method further includes a step of forming a sizing layer 70 (see fig. 7 and 8) in the second area II, where the sizing layer 70 is located in a corner region where the second area II is bent, so as to facilitate sizing after the second area II is bent, and the material of the sizing layer 70 needs to have a certain hardness, and the hardness of the material of the sizing layer 70 is greater than that of the first dielectric layer 11, so as to prevent the second area II after sizing from recovering deformation under its own acting force. Understandably, the material itself of the shaping layer 70 still needs to have certain toughness, and under the action of shaping, when the second area II is deformed under the action of external force, the second area II can be restored to the original bending state, so that the second area II has the elastic action. The material of the setting layer 70 may be selected from resin materials such as Polyethylene naphthalate (PEN), polyester resin (PET), and the like.

Step S7: referring to fig. 9, an image sensor 210 is provided, the image sensor 210 is fixedly connected to the first region I, and a surface of the third region III having the coil 332 is bent toward a side of the first region I.

In this embodiment, the image sensor 210 is fixed on the surface of the side of the second circuit substrate 30 having the coil 332, which is located in the first area I, and then the four third areas III are bent toward the side where the image sensor 210 is located to form the accommodating space 60 for accommodating the image sensor 210, that is, the coil 332 faces the accommodating space 60, the connecting pads 432 face away from the accommodating space 60, and the connecting pads 432 are used for electrically connecting the circuit board 100 with an external circuit. Wherein the image sensor 210 is electrically connected to the circuit board 100.

It is understood that, in some embodiments, the accommodating space 60 may be formed first, and then the image sensor 210 is disposed in the accommodating space 60 and electrically connected to the circuit board 100.

Step S8: referring to fig. 9, a magnet 220 is fixedly connected to the image sensor 210 and spaced apart from the coil 332.

In the embodiment, a first bracket 240 is accommodated in the accommodating space 60 and fixed on the solder mask layer 50 located in the first area I, that is, the first bracket 240 is located on a side of the first area I having the image sensor 210; the magnet 220 is fixed on the first bracket 240, and the image sensor 210 is fixedly connected with the magnet 220. Wherein the magnet 220 is spaced apart from the coil 332.

In some embodiments, the manufacturing method further includes a step of fixing a filter 260 on the first support 240, wherein the filter 260 is located on a side of the image sensor 210 facing away from the circuit board 100 and is spaced apart from the image sensor 210.

Step S9: referring to fig. 10, a lens 230 is fixedly connected to the coil 332, such that the image sensor 210 and the magnet 220 and the coil 332 and the lens 230 are elastically connected through the second bent region II to obtain the lens module 200.

In this embodiment, a second bracket 250 is provided, the second bracket 250 is located at the peripheral region of the first bracket 240 and is spaced apart from the first bracket 240, the third region III is fixed on the second bracket 250, and the lens 230 is fixed on the second bracket 250, so that the lens 230 is fixedly connected with the coil 332.

The third area III is connected to the first area I through the second bending area II, and the third area III is elastically connected to the first area I, so that the image sensor 210 and the magnet 220, which are fixedly connected, and the coil 332 and the lens 230, which are fixedly connected, are elastically connected through the second bending area II.

In some embodiments, referring to fig. 11 and 12, the manufacturing method further includes a step of forming a connector 80 on the circuit board 100, the connector 80 may be formed similarly to the step of forming the circuit board 100 located in the second region II and the third region III, and the position of the connector 80 is not limited and may be electrically connected to the circuit board 100.

Referring to fig. 10, the present embodiment further provides a small-sized lens module 200 with an anti-shake function, and the lens module 200 can be manufactured by the above-mentioned manufacturing method.

The lens module 200 includes a circuit board 100, an image sensor 210, a magnet 220, and a lens 230. The circuit board 100 has a coil 332, the coil 332 is fixedly connected to the lens 230, the image sensor 210 is fixedly connected to the magnet 220, and the fixedly connected image sensor 210 and the magnet 220 are elastically connected to the fixedly connected coil 332 and the lens 230.

The circuit board 100 includes a first region I, a second region II, and a third region III connected in sequence. The number of the second zone II and the third zone III is equal, and the number of the second zone II and the number of the third zone III are respectively multiple. In this embodiment, the second area II and the third area III are four, and are respectively disposed at the periphery of the first area I and symmetrically disposed. Four third district III bend towards one side of first district I and form accommodation space 60, promptly have certain contained angle and connect through second district II between third district III and the first district I for first district I, second district II and third district III form accommodation space.

The circuit board 100 may be a flexible board or a flexible-rigid board, wherein the second area II is a flexible board area. The circuit board 100 is a multilayer circuit board 100, the circuit board 100 includes stacked dielectric layers and circuit layers, the number of the circuit layers is multiple, and the multiple circuit layers are electrically connected.

In the present embodiment, the circuit board 100 includes a first circuit substrate 10, and a second circuit substrate 30 and a third circuit substrate 40 respectively disposed on two opposite surfaces of the first circuit substrate 10. The second circuit board 30 and the third circuit board 40 are only located in the first region I and the third region III, that is, the second region II includes only the first circuit board 10, and the surface of the first circuit board 10 located in the second region II is covered with the insulating layer 20.

The first circuit board 10 includes a first dielectric layer 11 and a first circuit layer 13 stacked; the second circuit board 30 includes a second dielectric layer 31 and a second circuit layer 33 stacked on each other; the third wiring substrate 40 includes a third dielectric layer 41 and a third wiring layer 43 stacked on each other. The material of the first dielectric layer 11 may be selected from one of flexible materials such as polyimide, liquid crystal polymer, and modified polyimide; the material of the second dielectric layer 31 and the third dielectric layer 41 may be selected from one of flexible materials such as polyimide, liquid crystal polymer, and modified polyimide, or may be selected from one of hard materials such as polypropylene and polytetrafluoroethylene. The first circuit layer 13, the second circuit layer 33, and the third circuit layer 43 may be electrically connected to each other.

The second circuit board 30 is located at one side of the accommodating space 60, and the second circuit board 30 located at the third area III has a coil 332.

The circuit board 100 further includes connection pads 432, the connection pads 432 are located on the third circuit substrate 40 at the third area, and are located at two opposite sides of the circuit board 100 from the coil 332, and the connection pads 432 are used for electrically connecting the circuit board 100 with an external circuit.

The image sensor 210 is accommodated in the accommodating space 60 and fixed on the surface of the circuit board 100 in the first area I. The image sensor 210 is electrically connected to the circuit board 100.

The magnet 220 may be fixedly coupled to the image sensor 210 via the first bracket 240, and the magnet 220 is spaced apart from the coil 332. Specifically, the first bracket 240 is accommodated in the accommodating space 60 and fixed on the surface of the circuit board 100 located in the first area I, and the magnet 220 is fixed on the first bracket 240 and faces the coil 332, so that the magnet 220 is fixedly connected with the image sensor 210 and is spaced from the coil 332.

The lens 230 may be fixedly coupled to the coil 332 by a second bracket 250. Specifically, the second bracket 250 is disposed at the peripheral region of the first bracket 240 and spaced from the first bracket 240, the circuit board 100 is disposed through the second bracket 250, the first region I is inside the second bracket 250, the third region III having the coil 332 is fixed to the second bracket 250 from the outside of the second bracket 250, the lens 230 is fixed to the second bracket 250, and the lens 230 is located at a side of the image sensor 210 away from the circuit board 100, so that the lens 230 and the coil 332 are fixedly connected. It is understood that in other embodiments, the fixing manner of the first bracket 240 and the second bracket 250 may be adjusted as needed, and is not limited thereto.

The second region II has a bent shape, which includes but is not limited to a wave shape, a W shape, and an S shape.

In some embodiments, the circuit board 100 further includes a sizing layer 70, the sizing layer 70 is located in the corner region where the second region II is bent and on the surface of the insulating layer 20, so as to facilitate sizing after the second region II is bent, the material of the sizing layer 70 needs to have a certain hardness, the hardness of the material of the sizing layer 70 is greater than the hardness of the first dielectric layer 11, and deformation of the second region II after sizing is avoided from being recovered under self-acting force. Understandably, the material itself of the shaping layer 70 still needs to have certain toughness, and under the shaping effect, when the second area II is deformed under the action of external force, the second area II can be restored to the original bending state, so that the second area has the elastic effect. The setting layer 70 may be made of a resin material such as polyethylene naphthalate and polyester resin.

In some embodiments, the lens module 200 further includes a filter 260, the filter 260 may be fixed on the first bracket 240, and the filter 260 is located between the image sensor 210 and the lens 230 and spaced apart from the image sensor 210 and the lens 230, respectively.

In some embodiments, referring to fig. 11 and 12, the lens module 200 further includes a connector 80, the connector 80 is electrically connected to the circuit board 100, and the position of the connector 80 is not limited and may be electrically connected to the circuit board 100.

The lens module 200 provided by the present application includes a circuit board 100, an image sensor 210, a magnet 220, and a lens 230. The circuit board 100 has a coil 332, the coil 332 is fixedly connected with the lens 230, the image sensor 210 is fixedly connected with the magnet 220, the fixedly connected image sensor 210 and the magnet 220 and the fixedly connected coil 332 and the lens 230 are elastically connected through a bent soft board area, when the lens module 200 shakes under the action of an external force, the lens 230 and the coil 332 shake synchronously and drive the image sensor 210 and the magnet 220 to move synchronously through the bent soft board area, so as to compensate the offset of light on the image sensor 210 caused by the shake of the lens module 200, thereby effectively overcoming the problem that the photographed image or video has shake blur due to the shake. The coil 332 is formed on the circuit board 100, and the magnet 220 is disposed in the accommodating space 60 formed by the circuit board 100, so as to replace an additional voice coil motor and effectively reduce the volume of the lens module 200 on the premise of satisfying the functions of the lens module 200.

Although the present application has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.

Claims

1. A lens module, comprising:

the circuit board comprises a first area, a second area and a third area which are sequentially connected, an included angle is formed between the third area and the first area to form an accommodating space, a coil is arranged on one side of the third area facing the accommodating space, and the second area is bent;

the image sensor is positioned in the accommodating space and is fixedly connected with the first area;

the magnet is fixedly connected with the image sensor and is arranged at intervals with the coil; and

the lens is fixedly connected with the coil;

the image sensor and the magnet are fixedly connected, and the coil and the lens are elastically connected through the bent second area.

2. The lens module as claimed in claim 1, wherein the second region is a soft plate region.

3. The lens module as claimed in claim 2, wherein the circuit board further includes a shaping layer, the shaping layer being located in a corner region where the second region is bent.

4. The lens module as claimed in claim 1, further comprising a first bracket received in the receiving space and fixed to the circuit board in the first region, wherein the magnet is fixed to the first bracket.

5. The lens module as claimed in claim 4, further comprising a second bracket disposed at a peripheral region of the first bracket and spaced apart from the first bracket, wherein the circuit board disposed at the third region is fixed to the second bracket.

6. The lens module as recited in claim 5, wherein a side of the circuit board located in the third area away from the coil has a connection pad.

7. A method for manufacturing a lens module is characterized by comprising the following steps:

providing a circuit board, wherein the circuit board comprises a first area, a second area and a third area which are sequentially connected, bending one side of the third area facing the first area to form an accommodating space, and arranging a coil on one side of the third area facing the accommodating space, wherein the second area is bent;

placing an image sensor in the accommodating space and fixedly connecting the image sensor with the first area;

fixedly connecting a magnet with the image sensor and arranging the magnet and the coil at intervals; and

and fixedly connecting a lens with the coil, so that the image sensor is elastically connected with the magnet and the coil is elastically connected with the lens through the bent second area.

8. The method for manufacturing a lens module according to claim 7, wherein the step of forming the circuit board comprises:

providing a first circuit substrate which comprises a first area, a second area and a third area which are connected in sequence;

covering an insulating layer on the surface of the first circuit substrate in the second area;

forming a second circuit substrate on a surface of the first circuit substrate located in the first region and the third region, an insulating layer located in the second region being exposed to the second circuit substrate, the second circuit substrate located in the third region including a coil; and

and bending the second area to form the circuit board with the bent second area.

9. The method for manufacturing a lens module according to claim 8, wherein the step of forming the circuit board further comprises:

and forming a third circuit substrate on the surface of the first circuit substrate, which is positioned in the first area and the third area and deviates from the second circuit substrate, wherein the third circuit substrate positioned in the third area comprises a connecting pad.

10. The method of claim 7, further comprising forming a sizing layer in a corner region where the second region is bent.