TW202309635A - Lens module and method for manufacturing the same - Google Patents

Abstract

A lens module includes a circuit board, an image sensor, a magnet, and a lens. The circuit board includes a first area, a second area, and a third area connected in sequence. There is an angle between the third area and the first area to form an accommodating space. The third area has a coil facing the accommodating space, and the second area is bent. The image sensor is disposed in the accommodating space and is fixedly connected to the first area. The magnet is fixedly connected to the image sensor and is spaced apart from the coil. The lens and the coil are fixedly connected. The fixedly connected image sensor and the magnet, and the fixedly connected coil and the lens are elastically connected through the bent second zone. The present disclosure also provides a method for manufacturing the lens module.

Description

Lens module and manufacturing method of the lens module

The present application relates to the field of lens modules, in particular to a lens module and a manufacturing method of the lens module.

Whether the user is shooting during sports or non-moving, it is often prone to jitter (such as hand shake) that causes the image or video captured by the lens module to be shaken and blurred. In order to solve this technical problem, optical image stabilization (OIS) technology has emerged. This technology is a vibration detection of electronic devices (such as mobile phones, tablet computers, etc.) through structures such as suspension wires, balls, or gyroscopes. Then, OIS and the voice coil motor (Voice Coil Motor, VCM) move the lens in the opposite direction to compensate for the offset of the light on the image sensor (CMOS image sensor, CMOS) caused by the shake of the lens module, thus effectively Overcome the problem of shaking and blurring in captured images or videos caused by shaking.

However, the above structure needs to have a separate voice coil motor and optical image stabilization structure, resulting in a large size of the lens module, which does not meet the requirements for component integration; in addition, the pixels of the lens module and the image sensor in the lens module The size of the image sensor is related to the size of the sensor. The larger the size of the image sensor, the higher the pixels. Under the premise that the installation volume of the lens module is limited, the size of the image sensor is limited, which makes it difficult to increase the pixel of the lens module.

Therefore, it is necessary to provide a lens module with an anti-shake function and a small size to solve the above technical problems.

In addition, it is also necessary to provide a method for making a lens module.

A lens module includes a circuit board, an image sensor, a magnet, and a lens. The circuit board includes a first area, a second area, and a third area connected in sequence, and an included angle is formed between the third area and the first area to form The accommodating space, the third area has a coil on the side facing the accommodating space, and the second area is bent; the image sensor is located in the accommodating space and is fixedly connected with the first area; the magnet and the image sensor The lens is fixedly connected to the coil, and the fixedly connected image sensor and the magnet, as well as the fixedly connected coil and the lens are elastically connected through the bent second area.

In some embodiments, the second area is a soft board area.

In some embodiments, the bent shape is at least one of wave shape, W shape and S shape.

In some embodiments, the circuit board further includes a shape-setting layer, and the shape-setting layer is located at the corner area bent in the second region.

In some embodiments, the material of the styling layer is selected from one of polyethylene naphthalate and polyester resin.

In some embodiments, the lens module further includes a first bracket, the first bracket is accommodated in the accommodating space and fixed on the circuit board located in the first area, and the magnet is fixed on the first bracket.

In some embodiments, the lens module further includes a second bracket, the second bracket is located at a peripheral area of the first bracket and spaced from the first bracket, and the circuit board located in the third area is fixed on the second bracket.

In some embodiments, the side of the circuit board located in the third area facing away from the coil has connection pads.

A method for manufacturing a lens module, comprising: providing a circuit board, the circuit board includes a first area, a second area, and a third area connected in sequence, and bending the third area toward the side of the first area to form an accommodating space , the third area has a coil on one side facing the accommodating space, and the second area is bent; an image sensor is placed in the accommodating space and fixedly connected with the first area; a magnet is connected to the image sensor The detector is fixedly connected and spaced apart from the coil; a lens is fixedly connected to the coil, so that the image sensor and the magnet, as well as the coil and the lens are elastically connected through the bent second area.

In some embodiments, the step of forming a circuit board includes: providing a first circuit substrate, including a first region, a second region and a third region connected in sequence; covering the surface of the first circuit substrate located in the second region with insulation layer; forming a second circuit substrate on the surface of the first circuit substrate located in the first area and the third area, the insulating layer located in the second area is exposed to the second circuit substrate, and the second circuit substrate located in the third area includes a coil; Bending is performed on the second region to form a circuit board in which the second region is bent.

In some embodiments, the step of forming the circuit board further includes: forming a third circuit substrate on the surface of the first circuit substrate located in the first area and the third area away from the second circuit substrate, and the third circuit substrate located in the third area Includes connection pads.

In some embodiments, the bent shape is at least one of wave shape, W shape and S shape.

In some embodiments, the manufacturing method further includes the step of forming a shaping layer at the corner area of the bend in the second region.

In some embodiments, the material of the styling layer is selected from one of polyethylene naphthalate and polyester resin.

The lens module provided by this application includes a circuit board, an image sensor, a magnet and a lens. Among them, there is a coil on the circuit board, the coil is fixedly connected to the lens, the image sensor is fixedly connected to the magnet, and the fixedly connected image sensor and magnet, as well as the fixedly connected coil and lens are elastically connected through the bent soft board area. When the lens module is shaken by external force, the lens and the coil will vibrate synchronously and drive the image sensor and the magnet to move synchronously through the bent soft board area, compensating the light caused by the shake of the lens module on the image sensor The offset on the detector can effectively overcome the problem of jitter and blur in captured images or videos caused by jitter. The coil is formed on the circuit board, and the magnet is arranged in the accommodating space formed by the circuit board. On the premise of satisfying the function of the lens module, it replaces the additional voice coil motor and effectively reduces the volume of the lens module.

In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. A lot of specific details are set forth in the following description to facilitate a full understanding of the application, and the described implementations are only a part of the implementations of the application, but not all of the implementations.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application. As used herein, the term "and/or" includes all and any combinations of one or more of the associated listed items.

In each embodiment of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the description of the patent application and the patent scope of the present application is not limited to physical or mechanical connection, whether direct or indirect of. "Up", "Down", "Above", "Bottom", "Left", "Right" and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship is also corresponding Change.

Please refer to FIG. 1 to FIG. 12 , the embodiment of the present application provides a lens module 200 with an anti-shake function and a small size. The preparation method of the lens module 200 includes the following steps:

Step S1 : Referring to FIG. 1 , a first circuit substrate 10 is provided, including a first region I, a second region II and a third region III connected in sequence.

The first circuit substrate 10 includes a first dielectric layer 11 and a first circuit layer 13 stacked along a first direction L1 , at least part of the first circuit layer 13 is exposed to the first dielectric layer 11 . The number of first circuit layers 13 can be one or more layers. When the number of first circuit layers 13 is multiple layers, the multiple layers of first circuit layers 13 are arranged at intervals by the first dielectric layer 11 and electrically connected to each other through conductive holes 15 . In this embodiment, the first circuit substrate 10 is a double-layer circuit substrate, that is, the number of the first dielectric layer 11 is one layer, the number of the first circuit layer 13 is two layers, and the two layers of the first circuit layer 13 are respectively located on the first opposite surfaces of the dielectric layer 11 .

The material of the first dielectric layer 11 is generally selected from flexible materials such as polyimide (PI), liquid crystal polymer (LCP) and modified polyimide (MPI). One of them, so that the first circuit substrate 10 has flexibility, so as to facilitate the bending process in the subsequent process and have elastic buffering force.

The first circuit substrate 10 includes a first area I, a second area II and a third area III, and the second area II connects the first area I and the third area III. The number of the second zone II and the third zone III are equal and respectively multiple. Please refer to FIG. 6. In this embodiment, the number of the second area II and the third area III are four spaced areas, and the four second areas II and the third area III are along the direction perpendicular to the first direction L1 Planar extension, the four second regions II and the third region III extend in different directions in the plane, that is, the four second regions II and the third region III extend along the second direction L2, and the second direction L2 is perpendicular to the first direction There are multiple L1 and second directions L2 so that subsequent multiple third regions III can be bent along one side of the first region I to form an accommodating space 60 (see FIG. 9 ).

Step S2: Referring to FIG. 2 , cover the surface of the first circuit substrate 10 located in the second area II with an insulating layer 20 .

The insulating layer 20 covers the surface of the first wiring layer 13 of the first wiring substrate 10 located in the second region II. In this embodiment, the two opposite surfaces of the first circuit substrate 10 located in the four second regions II are covered with the insulating layer 20 . The insulating layer 20 is not only used to facilitate the subsequent opening process in the area where the insulating layer 20 is located, for example, to facilitate the removal of the copper clad laminate covering the surface of the insulating layer 20; but also to facilitate the protection of the first circuit layer 13 after the cover is opened to prevent the first circuit layer from 13 is oxidized.

Step S3 : Referring to FIG. 3 , cover the first copper clad laminate 35 and the second copper clad laminate 45 on opposite surfaces of the first circuit substrate 10 in the first zone I, the second zone II and the third zone III.

The first copper clad laminate 35 includes the second dielectric layer 31 and the first copper layer 352 . The first copper layer 352 is located on the surface of the second dielectric layer 31 away from the first circuit substrate 10 . The first copper clad laminate 35 covers the insulating layer 20 located on the same side of the first circuit substrate 10 as the first copper clad laminate 35 .

The second copper clad laminate 45 includes a third dielectric layer 41 and a second copper layer 452 . The second copper layer 452 is located on the surface of the third dielectric layer 41 away from the first circuit substrate 10 . The second copper clad laminate 45 covers the insulating layer 20 located on the same side of the first circuit substrate 10 as the second copper clad laminate 45 .

The materials of the second dielectric layer 31 and the third dielectric layer 41 can be selected from polyimide (polyimide, PI), liquid crystal polymer (liquid crystal polymer, LCP) and modified polyimide (modified polyimide, One of flexible materials such as MPI) and one of hard materials such as polypropylene (Polypropylene, PP) and polytetrafluoroethylene (Polytetrafluoroethylene, PTFE).

In some embodiments, an adhesive layer (not shown) may also be provided between the first copper-clad laminate 35 and the first circuit substrate 10 and between the second copper-clad laminate 45 and the first circuit substrate 10 to bond the first The copper clad laminate 35 and the first circuit substrate 10 and the second copper clad laminate 45 and the first circuit substrate 10 .

Step S4: Please refer to FIG. 4 , respectively perform circuit fabrication on the first copper-clad laminate 35 and the second copper-clad laminate 45, wherein the first copper-clad laminate 35 located in the third area III is manufactured to form a coil 332 (see FIG. 6 ), and the The second copper clad laminate 45 located in the third region III is fabricated to form a connection pad 432 .

Specifically, referring to FIG. 3 and FIG. 4 , wiring is performed on the first copper layer 352 to form a second wiring layer 33 electrically connected to the first wiring layer 13 , and the second wiring layer 33 includes a coil 332 . Circuit fabrication is performed on the second copper layer 452 to form a third circuit layer 43 electrically connected to the first circuit layer 13 , and the third circuit layer 43 includes a connection pad 432 .

Step S5 : Referring to FIG. 5 and FIG. 6 , remove the first copper-clad laminate 35 and the second copper-clad laminate 45 located in the second area II and after circuit fabrication.

Remove the second dielectric layer 31 and the second wiring layer 33 in the second region II to expose the insulating layer 20, and obtain the second dielectric layer 31 and the second wiring layer 33 in the first region I and the third region III. Two circuit substrates 30 . Remove the third dielectric layer 41 and the third wiring layer 43 in the second region II to expose the insulating layer 20, and obtain the third dielectric layer 41 and the third wiring layer 43 in the first region I and the third region III. Three circuit substrates 40 . Wherein, the second area II includes the first circuit substrate 10 and the insulating layer 20 covering the surface of the first circuit substrate 10 , and the second area II is a flexible area.

It can be understood that the number of layers of circuits in the second circuit substrate 30 and the third circuit substrate 40 is not limited to one layer, and may be multiple layers. The above-mentioned steps of forming the second circuit substrate 30 and the third circuit substrate 40 are for illustration only, and are not limited thereto.

Before step S5, please refer to FIG. 4, may also include the step of forming a solder resist layer 50, the solder resist layer 50 covers the second dielectric layer 31 and the second circuit layer 33, and also covers the third dielectric layer 41 and the third circuit layer 43.

Step S6 : Referring to FIG. 7 and FIG. 8 , bend the second region II to form the circuit board 100 in which the second region II is bent.

The bent shape includes but not limited to wave shape, W shape and S shape, that is, the cross section of the second zone II along the first direction L1 or the second direction L2 may include but not limited to wave shape, W shape and S shape.

In some embodiments, the manufacturing method further includes the step of forming a shaping layer 70 (see FIG. 7 and FIG. 8 ) in the second zone II, and the shaping layer 70 is located at the corner area where the second zone II is bent, so that the second zone II After the II is bent and shaped, the material of the shaped layer 70 needs to have a certain hardness. The hardness of the material of the shaped layer 70 is greater than that of the first medium layer 11, so as to prevent the second zone II after shaping from recovering deformation under its own force. It can be understood that the material of the shaping layer 70 itself needs to have a certain degree of toughness. Under the effect of shaping, when the second area II is deformed by an external force, the second area II can be restored to the original bending state. In turn, the second zone II has an elastic effect. The material of the shaping layer 70 may be selected from resin materials such as polyethylene naphthalate two formic acid glycol ester (PEN), polyester resin (polyethylene terephthalate, PET) and the like.

Step S7: Referring to FIG. 9, an image sensor 210 is provided, and the image sensor 210 is fixedly connected to the first area I, and the surface of the third area III with the coil 332 faces the side of the first area I bent.

In this embodiment, the image sensor 210 is fixed on the surface of the second circuit substrate 30 in the first region I on the side with the coil 332, and then the four third regions III face the image sensor 210 The one side is bent to form the accommodating space 60 for accommodating the image sensor 210, that is, the coil 332 faces the accommodating space 60, and the connection pad 432 faces away from the accommodating space 60, and the connection pad 432 is used for the connection between the circuit board 100 and the external The circuit is electrically connected. Wherein, the image sensor 210 is electrically connected to the circuit board 100 .

Understandably, in some implementations, the accommodating space 60 may also be formed first, and then the image sensor 210 is placed in the accommodating space 60 and electrically connected to the circuit board 100 .

Step S8: Referring to FIG. 9 , a magnet 220 is fixedly connected to the image sensor 210 and spaced apart from the coil 332 .

In this embodiment, a first bracket 240 is accommodated in the accommodating space 60 and fixed on the solder resist layer 50 located in the first area I, that is, the first bracket 240 located in the first area I has an image sensor One side of the sensor 210; and then fix the magnet 220 on the first bracket 240, then the image sensor 210 is fixedly connected with the magnet 220. Wherein, there is a certain distance between the magnet 220 and the coil 332 .

In some embodiments, the manufacturing method further includes the step of fixing a filter 260 on the first bracket 240, the filter 260 is located on the side of the image sensor 210 away from the circuit board 100 and is connected to the image sensor 210 interval settings.

Step S9: Referring to FIG. 10, a lens 230 is fixedly connected to the coil 332, so that the image sensor 210 is connected to the magnet 220 and the coil 332 is elastically connected to the lens 230 through the bent second zone II to obtain a lens mold. Group 200.

In this embodiment, a second bracket 250 is provided, the second bracket 250 is located in the peripheral area of the first bracket 240 and is spaced apart from the first bracket 240, the third zone III is fixed on the second bracket 250, and the lens 230 After being fixed on the second bracket 250 , the lens 230 is fixedly connected with the coil 332 .

Wherein, the third area III is connected to the first area I through the bent second area II, and the third area III is elastically connected to the first area I, so that the fixedly connected image sensor 210 and the magnet 220 and fixed The connected coil 332 is elastically connected to the lens 230 through the bent second zone II.

In some embodiments, please refer to FIG. 11 and FIG. 12 , the manufacturing method further includes the step of forming a connector 80 on the circuit board 100, and the formation of the connector 80 can be related to the formation of the circuits located in the second area II and the third area III. The steps for the board 100 are similar, and the position of the connector 80 is not limited, as long as it is electrically connected with the circuit board 100 .

Please refer to FIG. 10 , the embodiment of the present application also provides a small-sized lens module 200 with an anti-shake function, and the lens module 200 can be manufactured by the above manufacturing method.

The lens module 200 includes a circuit board 100 , an image sensor 210 , a magnet 220 and a lens 230 . Wherein, there is a coil 332 on the circuit board 100, the coil 332 is fixedly connected with the lens 230, the image sensor 210 is fixedly connected with the magnet 220, the fixedly connected image sensor 210 and the magnet 220 and the fixedly connected coil 332 and the lens 230 elastic connection.

The circuit board 100 includes a first region I, a second region II and a third region III connected in sequence. The number of the second zone II and the third zone III are equal, and each is multiple. In this embodiment, there are four second areas II and third areas III, which are respectively arranged around the periphery of the first area I and symmetrically arranged. The four third regions III are bent toward one side of the first region I to form an accommodating space 60, that is, the third region III and the first region I have a certain angle and are connected by the second region II, so that the third region III A zone I, a second zone II and a third zone III form the accommodating space.

The circuit board 100 may be a flexible board or a rigid-flex board, wherein the second area II is a flexible board area. The circuit board 100 is a multilayer circuit board 100. The circuit board 100 includes a dielectric layer and a circuit layer stacked up. The number of layers of the circuit layer is multi-layer, and the multi-layer circuit layers are electrically connected.

In this embodiment, the circuit board 100 includes a first circuit substrate 10 , and a second circuit substrate 30 and a third circuit substrate 40 respectively located on two opposite surfaces of the first circuit substrate 10 . The second circuit substrate 30 and the third circuit substrate 40 are only located in the first zone I and the third zone III, that is, the second zone II only includes the first circuit substrate 10, and the surface of the first circuit substrate 10 in the second zone II is composed of Insulation layer 20 covers.

The first circuit substrate 10 includes a stacked first dielectric layer 11 and a first wiring layer 13; the second circuit substrate 30 includes a stacked second dielectric layer 31 and a second wiring layer 33; the third circuit substrate 40 includes a stacked stacked The third dielectric layer 41 and the third circuit layer 43. The material of the first medium layer 11 can be selected from one of flexible materials such as polyimide, liquid crystal polymer and modified polyimide; the material of the second medium layer 31 and the third medium layer 41 can be One selected from flexible materials such as polyimide, liquid crystal polymer, and modified polyimide, and one selected from rigid materials such as polypropylene and polytetrafluoroethylene. The first circuit layer 13 , the second circuit layer 33 and the third circuit layer 43 may be electrically connected to each other.

The second circuit substrate 30 is located on one side of the accommodating space 60 , and the second circuit substrate 30 located in the third zone III has a coil 332 .

The circuit board 100 also includes a connection pad 432. The connection pad 432 is located on the third circuit substrate 40 in the third area, and the coil 332 is located on the opposite sides of the circuit board 100. The connection pad 432 is used to realize the electrical connection between the circuit board 100 and the external circuit. connect.

The image sensor 210 is accommodated in the accommodating space 60 and fixed on the surface of the circuit board 100 located in the first region I. The image sensor 210 is electrically connected to the circuit board 100 .

The magnet 220 can be fixedly connected to the image sensor 210 through the first bracket 240 , and the magnet 220 and the coil 332 are spaced apart. Specifically, the first bracket 240 is accommodated in the accommodating space 60, and is fixed on the surface of the circuit board 100 located in the first area I, and the magnet 220 is fixed on the first bracket 240 and faces the coil 332, so that the magnet 220 and the The image sensor 210 is fixedly connected and spaced apart from the coil 332 .

The lens 230 can be fixedly connected with the coil 332 through a second bracket 250 . Specifically, the second bracket 250 is arranged in the peripheral area of the first bracket 240 and is spaced apart from the first bracket 240, the circuit board 100 is passed through the second bracket 250, and the inner side of the second bracket 250 in the first area 1 has a coil 332 The third zone III is fixed on the second bracket 250 from the outside of the second bracket 250, the lens 230 is fixed on the second bracket 250, and the lens 230 is located on the side of the image sensor 210 away from the circuit board 100, so that The fixed connection between the lens 230 and the coil 332 is realized. It can be understood that in other embodiments, the manner of fixing the first bracket 240 and the second bracket 250 can be adjusted as required, and is not limited thereto.

The second zone II is in a bent shape, and the bent shape includes but not limited to a wave shape, a W shape, and an S shape.

In some embodiments, the circuit board 100 further includes a shaping layer 70, the shaping layer 70 is located at the corner area where the second region II is bent and is located on the surface of the insulating layer 20, so as to facilitate shaping after the second region II is bent, and then the shaping layer The material of 70 needs to have a certain hardness, and the hardness of the material of the shaped layer 70 is greater than that of the first medium layer 11, so as to prevent the shaped second zone II from recovering deformation under its own force. It can be understood that the material of the shaping layer 70 itself needs to have a certain degree of toughness. Under the effect of shaping, when the second area II is deformed by an external force, the second area II can be restored to the original bending state. Furthermore, the second zone has an elastic effect. The material of the shaping layer 70 can be selected from resin materials such as polyethylene naphthalate and polyester resin.

In some implementations, the lens module 200 further includes a filter 260, the filter 260 can be fixed on the first bracket 240, the filter 260 is located between the image sensor 210 and the lens 230, and is connected with the The image sensor 210 and the lens 230 are arranged at intervals.

In some embodiments, please refer to FIG. 11 and FIG. 12 , the lens module 200 further includes a connector 80, the connector 80 is electrically connected to the circuit board 100, the position of the connector 80 is not limited, and the electrical connection to the circuit board 100 is Can.

The lens module 200 provided in this application includes a circuit board 100 , an image sensor 210 , a magnet 220 and a lens 230 . Wherein, there is a coil 332 on the circuit board 100, the coil 332 is fixedly connected with the lens 230, the image sensor 210 is fixedly connected with the magnet 220, the fixedly connected image sensor 210 and the magnet 220 and the fixedly connected coil 332 and the lens 230 is elastically connected through the bent soft board area. When the lens module 200 is shaken by external force, the lens 230 and the coil 332 vibrate synchronously and drive the image sensor 210 to synchronize with the magnet 220 through the bent soft board area. The movement compensates for the offset of light on the image sensor 210 caused by the shaking of the lens module 200 , thereby effectively overcoming the problem of shaking and blurring in captured images or videos caused by shaking. The coil 332 is formed on the circuit board 100, and the magnet 220 is arranged in the accommodating space 60 formed by the circuit board 100. On the premise of satisfying the function of the lens module 200, it replaces the additional voice coil motor, effectively reducing the lens module. Group volume of 200.

The above embodiments are only used to illustrate the technical solutions of the present application without limitation. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced All should not deviate from the spirit and scope of the technical solution of the present application.

200: Lens module 100: circuit board 10: The first circuit substrate 11: The first dielectric layer 13: The first line layer 15: Conductive hole 20: insulation layer 30: Second circuit substrate 31: Second dielectric layer 33: Second line layer 332: Coil 35: The first copper clad laminate 352: The first copper layer 40: The third circuit substrate 41: The third medium layer 43: The third line layer 432: connection pad 45: Second copper clad laminate 452: second copper layer 50: Solder mask 60:Accommodating space 70:Styling layer 80: Connector 210: image sensor 220: magnet 230: Lens 240: The first bracket 250: second bracket 260: filter I: District 1 II: Second District III: District III L1: the first direction L2: the second direction

FIG. 1 is a schematic cross-sectional view of a first circuit substrate provided by an embodiment of the present application. FIG. 2 is a schematic cross-sectional view of covering the surface of the first circuit substrate shown in FIG. 1 with an insulating layer. FIG. 3 is a schematic cross-sectional view of covering the first copper-clad laminate and the second copper-clad laminate on the surface of the first circuit substrate shown in FIG. 2 . Fig. 4 is a schematic cross-sectional view of the first copper-clad laminate and the second copper-clad laminate shown in Fig. 3 after respectively making circuits and covering the solder resist layer FIG. 5 is a schematic cross-sectional view of a circuit board obtained by removing the first copper-clad laminate and the second copper-clad laminate located in the second area and after circuit fabrication. FIG. 6 is a top view of the circuit board shown in FIG. 5 . FIG. 7 is a structural schematic diagram of a bent shape formed after bending the circuit board in the second area shown in FIG. 5 according to an embodiment. FIG. 8 is a structural schematic diagram of another embodiment of bending the circuit board in the second area shown in FIG. 5 to form a bent shape. FIG. 9 is a schematic cross-sectional view after the image sensor and the bent circuit board shown in FIG. 5 are fixedly installed. FIG. 10 is a schematic cross-sectional view of a lens module obtained by assembling the lens with the structure shown in FIG. 9 . FIG. 11 is a top view of the lens module in FIG. 10 connected to a connector in an embodiment. FIG. 12 is a top view of another embodiment in which the lens module in FIG. 10 is connected to a connector.

none.

200: Lens module

100: circuit board

332: Coil

432: connection pad

60:Accommodating space

210: image sensor

220: magnet

230: Lens

240: The first bracket

250: second bracket

260: filter

I: District 1

II: Second District

III: District III

Claims (10)

A lens module, the improvement of which includes: The circuit board includes a first area, a second area and a third area connected in sequence, the third area and the first area have an included angle to form an accommodating space, and the third area faces the accommodating There is a coil on one side of the space, and the second area is bent; an image sensor, located in the accommodating space and fixedly connected to the first area; a magnet fixedly connected to the image sensor and spaced apart from the coil; and The lens is fixedly connected with the coil; Wherein, the fixedly connected image sensor is connected to the magnet, and the fixedly connected coil is connected elastically to the lens through the bent second region. The lens module according to claim 1, wherein the second area is a soft board area. The lens module according to claim 2, wherein the circuit board further includes a shaping layer, and the shaping layer is located at the corner area where the second area is bent. The lens module according to claim 1, wherein the lens module further includes a first bracket, the first bracket is accommodated in the accommodating space and fixed on the On the circuit board, the magnet is fixed on the first bracket. The lens module according to claim 4, wherein the lens module further includes a second bracket, the second bracket is located in the peripheral area of the first bracket and is spaced apart from the first bracket, and is located at the The circuit board in the third area is fixed on the second bracket. The lens module according to claim 5, wherein the side of the circuit board located in the third area facing away from the coil has connection pads. A method for making a lens module, the improvement of which includes: A circuit board is provided, the circuit board includes a first area, a second area and a third area connected in sequence, the third area is bent toward the side of the first area to form an accommodation space, the first area The third area has coils on one side facing the accommodating space, and the second area is bent; placing an image sensor in the accommodating space and fixedly connecting with the first region; a magnet is fixedly connected to the image sensor and spaced apart from the coil; and A lens is fixedly connected to the coil so that the image sensor is elastically connected to the magnet and the coil to the lens through the bent second region. The manufacturing method of the lens module according to claim 7, wherein the step of forming the circuit board includes: providing a first circuit substrate, including a first area, a second area and a third area connected in sequence; covering the surface of the first circuit substrate located in the second area with an insulating layer; A second circuit substrate is formed on the surface of the first circuit substrate located in the first area and the third area, the insulating layer located in the second area is exposed to the second circuit substrate, and the insulating layer located in the second area is exposed to the second circuit substrate. The second circuit substrate of the three regions includes a coil; and Bending is performed on the second region to form the circuit board in which the second region is bent. The manufacturing method of the lens module according to claim 8, wherein the step of forming the circuit board further includes: A third circuit substrate is formed on the surface of the first circuit substrate located in the first area and the third area away from the second circuit substrate, and the third circuit substrate located in the third area includes a connection pad. The manufacturing method of the lens module as claimed in item 7, wherein the manufacturing method further includes the step of forming a shaping layer in the corner area where the second area is bent.

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