CN115718544A - an electronic device - Google Patents

Abstract

The invention provides an electronic device, which comprises a substrate, a first electrode, a second electrode, a first signal line, a second signal line, a sensing electrode and a sensing signal line. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate and adjacent to the first electrode in a first direction. The first signal line is electrically connected to the first electrode. The second signal line is electrically connected with the second electrode. The sensing signal line is electrically connected with the sensing electrode. In a top view, the sensing signal line is disposed between the first signal line and the second signal line in the first direction.

Description

an electronic device

technical field

The present disclosure relates to an electronic device, in particular to an electronic device with sensing electrodes.

Background technique

In recent years, touch display devices have been widely used in various electronic products, such as mobile phones, personal digital assistants (PDAs), or handheld personal computers. A touch display device usually includes a touch panel and a display panel. Users can touch the images displayed on the touch display device to input information or control electronic products. The performance of touch display devices still needs to be improved.

Contents of the invention

An embodiment of the present disclosure provides an electronic device, including a substrate, a first electrode, a second electrode, a first signal line, a second signal line, a sensing electrode and a sensing signal line. The first electrode is disposed on the substrate. The second electrode is disposed on the substrate and is adjacent to the first electrode in a first direction. The first signal line is electrically connected to the first electrode. The second signal line is electrically connected to the second electrode. The sensing signal line is electrically connected to the sensing electrodes. In a plan view, the sensing signal line is arranged between the first signal line and the second signal line along the first direction.

Description of drawings

In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, wherein:

1 is a schematic diagram of an electronic device of the present disclosure;

FIG. 2 is another schematic diagram of the electronic device of the present disclosure;

3 is another schematic diagram of the electronic device of the present disclosure;

FIG. 4 is another schematic diagram of the electronic device of the present disclosure;

5 is another schematic diagram of the electronic device of the present disclosure;

6 is another schematic diagram of the electronic device of the present disclosure;

7 is a schematic diagram of the relationship among gate lines, signal lines, sensing electrodes, and sensing signal lines of the present disclosure;

FIG. 8 is another schematic diagram of the electronic device of the present disclosure;

FIG. 9 is a schematic diagram of a processing unit of the present disclosure.

reference sign

100, 500, 600, 800: Electronics

110, 712: Substrate

110S, 510, 610, 710S, 810: array substrate

520, 620_1～620_P, 630, 820_1～820_P: circuit board

SE1, SE2: Sensing electrodes

RP1, RP2: pixel columns

PIX ₁₁ ～PIX _1N 、 PIX _M1 ～PIX _MN : pixel

D1～D3: direction

E _{11_1} ～E _{11_3} , E _{1N_1} ～E _{1N_3} , E _{M1_1} ～E _{M1_3} , E _{MN_1} ～E _{MN_3} : electrodes

LN ₁ ～LNK _K : signal line

LS1, LS2: Sensing signal lines

PD ₁ ～PD _K , PA ₁ ～PA _K , PB, 980: Pad

S1, S2, SA1: Sensing pads

PC1, PC2: Empty pads

511, 611, 612: gate driver

GL ₁ ~GL _M : Gate lines

111~113: sub-pixel

521, 621_1~621_P, 821_1~821_P: processing unit

631: Power circuit

632: Timing Controller

633: Voltage Converter

711, 724: Polarizer

713, 715, 717, 719, 721: insulating layer

714: first conductive layer

716: second conductive layer

718: common electrode

720: third conductive layer

722: liquid crystal layer

723: Color filter substrate

725: Cover layer

910: Analog circuits

920: micro control circuit

930: Touch Sensing Circuit

940: Display drive circuit

950: High Impedance Circuit

960: Register setting circuit

971～973: switch

DS1～DS4: distance;

W21～W28, W41～W48: Width

A ₁ ～A _K , AS1: Conductive adhesive

AA: active area

NA: peripheral area

100: Electronics

110: Substrate

110S: array substrate

SE1, SE2: Sensing electrodes

RP1, RP2: pixel columns

PIX ₁₁ ～PIX _1N 、 PIX _M1 ～PIX _MN : pixel

D1～D3: direction

E _{11_1} ～E _{11_3} , E _{1N_1} ～E _{1N_3} , E _{M1_1} ～E _{M1_3} , E _{MN_1} ～E _{MN_3} : electrodes

LN ₁ ～LNK _K : signal line

LS1, LS2: Sensing signal lines

PD ₁ ～PD _K : Pads

S1, S2: Sensing pads

111~113: sub-pixel

DS1～DS4: distance

AA: active area

NA: peripheral area

Detailed ways

In order to make the purpose, features and advantages of the present disclosure more comprehensible, the following specifically cites the embodiments, together with the accompanying drawings, for a detailed description. The specification of the disclosure provides different embodiments to illustrate the technical features of different implementations of the disclosure. Wherein, the configuration of each component in the embodiment is for illustration, not for limiting the present disclosure. In addition, the partial repetition of reference numerals in the embodiments is for simplifying description, and does not imply the correlation between different embodiments.

In various embodiments of the present disclosure described below, the so-called orientations “up” and “down” are used to represent relative positional relationships, and are not intended to limit the present disclosure. A structure (or layer, component, substrate) described in this disclosure is located on/over another structure (or layer, component, substrate), which may mean that the two structures are adjacent and directly connected, or may be Refers to two structures that are adjacent but not directly connected. Indirect connection means that there is at least one intermediary structure (or intermediary layer, intermediary component, intermediary substrate, intermediary space) between the two structures, and the lower surface of a structure is adjacent or It is directly connected to the upper surface of the intermediary structure, and the upper surface of another structure is adjacent to or directly connected to the lower surface of the intermediary structure, and the intermediary structure can be composed of a single-layer or multi-layer solid structure or a non-solid structure, There is no limit. In this disclosure, when a certain structure is set "on" other structures, it may mean that a certain structure is "directly" on other structures, or that a certain structure is "indirectly" on other structures, that is, between a certain structure and other structures. At least one structure is also interposed.

The electrical connection or coupling described in this disclosure can refer to direct connection or indirect connection. In some cases, there are switches, diodes, capacitors, inductors, resistors, other suitable components, or a combination of the above components between the terminals of the components on the two circuits, but not limited thereto.

In the present disclosure, the thickness, length and width can be measured by using an optical microscope, and the thickness can be measured by a cross-sectional image in an electron microscope, but not limited thereto. In addition, any two values or directions used for comparison may have certain errors. If the first value is equal to the second value, it implies that there may be an error between the first value and the second value within about 10%, more preferably within 5%, or within 2%, or within 1% , or an error within 0.5%.

The ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify components, which do not imply and represent that the (or these) components have any previous ordinal numbers, nor The use of these ordinal numbers to represent the order of an element with respect to another element, or the order of the method of manufacture, is used only to clearly distinguish an element with a certain designation from another element with the same designation. The claims and the description may not use the same term, accordingly, the first component in the description may be the second component in the claim.

It should be noted that in the following embodiments, without departing from the spirit of the present disclosure, features in several different embodiments may be replaced, reorganized, and mixed to complete other embodiments. As long as the features of the various embodiments do not violate the spirit of the invention or conflict, they can be mixed and matched arbitrarily.

In addition, in the drawings or descriptions in the specification, the same symbols are used for similar or identical parts. In the drawings, the shape or thickness of the embodiments may be exaggerated to simplify or facilitate labeling. Components not shown or described in the figures are of a form known to those skilled in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein belong to the common understanding of those skilled in the art of the present disclosure. In addition, unless expressly stated, the definition of a word in a general dictionary should be interpreted as consistent with the meaning in the article in its related technical field, and should not be interpreted as an ideal state or an overly formal voice.

FIG. 1 is a schematic diagram of an electronic device of the present disclosure. As shown in the figure, the electronic device 100 includes an array substrate 110S. The array substrate 110S may include a substrate 110 , sensing electrodes SE1 , SE2 , pixel columns RP1 and RP2 , signal lines LN ₂ , LN ₃ and a sensing signal line LS1 . The sensing electrodes SE1, SE2, the pixel columns RP1 and RP2, the signal line _LN2 (or called the first signal line), the signal line _LN3 (or called the second signal line) and the sensing signal line LS1 can be disposed on the substrate 110 . The pixel column RP1 may include electrodes E _{11_2} and E _{11_3} . The electrodes E _{11_2} and E _{11_3} are adjacent in a direction D1 (or called the first direction). The signal line LN ₂ (first signal line) is electrically connected to the electrode E _{11_2} (or called the first electrode). The signal line LN ₃ (second signal line) is electrically connected to the electrode E _{11_3} (or called the second electrode). The sensing signal line LS1 is electrically connected to the sensing electrode SE1. As shown in FIG. 1 , in a top view, the sensing signal line LS1 is disposed between the signal lines LN ₂ and LN ₃ in the direction D1 . According to some embodiments, the direction D1 may be the extending direction of the gate lines (as shown in FIG. 5 ) on the substrate 110 .

According to some embodiments, the array substrate 110S may include a plurality of driving components (not shown) configured in an array, such as a plurality of thin film transistors (TFT). The present disclosure does not limit the type of the electronic device 100 . In a possible embodiment, the electronic device 100 may include a display device, an antenna device, a sensing device or a splicing device, but not limited thereto. In addition, the electronic device 100 can be a bendable or flexible electronic device. In some embodiments, the electronic device 100 may include liquid crystal, or light emitting diodes, for example. The light emitting diode may, for example, include an organic light emitting diode (organic light emitting diode, OLED), a submillimeter light emitting diode (mini LED), a micro light emitting diode (micro LED) or a quantum dot light emitting diode (quantum dot, QD, which may be, for example, QLED, QDLED ), fluorescence (fluorescence), phosphorescence (phosphor) or other suitable materials and the materials can be arranged and combined arbitrarily, but not limited thereto. In addition, the antenna device may be, for example, a liquid crystal antenna, but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device 100 can be any permutation and combination mentioned above, but not limited thereto.

As shown in FIG. 1 , the substrate 110 can be divided into an active area AA and a peripheral area NA. The peripheral area NA is adjacent to the active area AA. According to some embodiments, the active area AA is in the middle of the substrate 110 , the peripheral area NA is near the edge of the substrate, and one side of the peripheral area NA may be the edge of the substrate 110 . The pixel columns RP1 and RP2 are disposed on the substrate 110 , may be disposed in the active area AA of the substrate 110 , and are arranged in the direction D2 (or called the second direction). The pixel row RP1 has pixels PIX ₁₁ to PIX _1N . The pixels PIX ₁₁ -PIX _1N are arranged sequentially in the direction D1. The directions D1 and D2 may be different, for example, may be perpendicular to each other, but not limited thereto. In this embodiment, each of the pixels PIX ₁₁ -PIX _1N may have a plurality of electrodes, for example, three electrodes. For example, the pixel PIX ₁₁ has electrodes E _{11_1} ˜E _{11_3} , and the pixel PIX _1N has electrodes E _{1N_1} ˜E _{1N_3} . When the electronic device 100 has a display function, the active area AA may be a display area.

In some embodiments, each of the pixels PIX ₁₁ -PIX _1N has a plurality of sub-pixels, for example, three sub-pixels. Each sub-pixel presents a corresponding color. Taking the pixel PIX ₁₁ as an example, the pixel PIX ₁₁ includes sub-pixels 111 - 113 . The present disclosure does not limit the colors displayed by the pixels 111 - 113 . In a possible embodiment, the sub-pixel 111 is one of red, green and blue, the sub-pixel 112 is the other of red, green and blue, and the sub-pixel 113 is red, green and blue. the last one. In this example, the electrode E _{11_1} refers to the pixel electrode included in the sub-pixel 111 , the electrode E _{11_2} refers to the pixel electrode included in the sub-pixel 112 , and the electrode E _{11_3} refers to the pixel electrode included in the sub-pixel 113 . According to some embodiments, a sub-pixel may include a pixel electrode and a driving component (such as a TFT, not shown). A driving component may include a semiconductor, a gate, a source, and a drain. The source can be electrically connected to the corresponding data line, and the gate can be electrically connected to the corresponding gate line. The pixel electrode may be an electrode electrically connected to a driving component (such as a TFT, not shown) on the substrate 110 , for example, may be an electrode electrically connected to a drain of the TFT.

The pixels PIX _M1 -PIX _MN are sequentially arranged in the direction D1. Since the characteristics of the pixels PIX _M1 ˜PIX _MN are similar to those of the pixels PIX ₁₁ ˜PIX _1N , details are omitted here. For convenience of illustration, FIG. 1 only shows pixel rows RP1 and RP2 , but this is not intended to limit the present disclosure. In other embodiments, the electronic device 100 has more pixel columns. In this example, the pixel columns are arranged in sequence along the direction D2. For convenience of illustration, FIG. 1 only presents the sensing electrodes SE1 and SE2 , but this is not intended to limit the present disclosure. The present disclosure does not limit the number of sensing electrodes. In other embodiments, the electronic device 100 has more sensing electrodes. In other embodiments, a plurality of sensing electrodes may be disposed on the substrate 100 , for example, arranged in a direction D1 and a direction D2 to form a plurality of sensing electrodes in a matrix.

The electrodes E _{11_1} -E _{11_3} are arranged sequentially in the direction D1. The electrode E _{11_2} is adjacent to the electrode E _{11_1} (or called the third electrode) and the electrode E _{11_3} in the direction D1. The electrodes E _{1N_1} -E _{1N_3} are arranged in sequence along the direction D1. The electrode E _{1N_2} is adjacent to the electrodes E _{1N_1} and E _{1N_3} in the direction D1 . The electrodes E _{M1_1} -E _{M1_3} are arranged sequentially in the direction D1. The electrode E _{M1_2} is adjacent to the electrodes E _{M1_1} and E _{M1_3} in the direction D1 . The electrodes E _{MN_1} -E _{MN_3} are arranged in sequence along the direction D1. The electrode _{EMN_2} is adjacent to the electrodes _{EMN_1} and _{EMN_3} in the direction D1. In the case that the electrode E _{11_2} and the electrode E _{11_1} are pixel electrodes, the electrode E _{11_2} is arranged adjacent to the electrode E _{11_1} in the direction D1, which means that in the direction D1, there is no other pixel electrode E _{11_2} and the pixel electrode E _{11_1} . pixel electrodes.

As shown in FIG. 1 , in a top view, the sensing electrode SE1 overlaps with the pixel column RP1 and may be disposed in the active area AA of the substrate 110 . In other embodiments, the sensing electrode SE1 may overlap with more pixel columns. In this embodiment, the sensing electrode SE1 and the electrodes E _{11_1} -E _{1N_} are located on different layers. For example, the sensing electrode SE1 and the electrode _{E11_2} are located on different layers. For example, in the direction D3, the sensing electrode SE1 may be located above the electrodes E _{11_1} -E _{1N_3} and overlap with the electrodes E _{11_1} -E _{1N_3} . For example, in a plan view, the sensing electrode SE1 overlaps the electrodes _{E11_2} and _{E11_3} . According to the present disclosure, the sensing electrode may have a touch function, a fingerprint recognition function, or a combination thereof.

The sensing electrode SE2 overlaps the pixel column RP2. In other embodiments, the sensing electrode SE2 overlaps with more pixel columns. In this embodiment, the sensing electrode SE2 and the electrodes _{EM1_1 -EMN_3} are located on different layers. For example, in a top view, the sensing electrode SE2 is located above the electrodes _{EM1_1 ˜EMN_3} and overlaps with the electrodes _{EM1_1 ˜EMN_3} . In some embodiments, the electrodes overlapped by the sensing electrode SE2 (such as E _{M1_1 ˜EMN_3} ) are different from the electrodes overlapped by the sensing electrode SE1 (such as E _{11_1} ˜E _{1N_3} ). In other embodiments, the number of electrodes overlapped by the sensing electrode SE2 may be different from the number of electrodes overlapped by the sensing electrode SE1.

In some embodiments, the sensing electrode SE1 serves as the common electrode of the pixels PIX ₁₁ -PIX _1N , and the sensing electrode SE2 serves as the common electrode of the pixels PIX _M1 -PIX _MN . In this example, during a display period, the sensing electrodes SE1 and SE2 receive a common voltage (Vcom).

In some embodiments, the electronic device 100 further includes signal lines LN _{1 ˜LNK} . The signal lines LN _{1 ˜LNK} may extend along the direction D2. Each of the signal lines LN _{1 -LNK} is electrically connected to a plurality of electrodes. For example, the signal line LN ₁ (or called the third signal line) is electrically connected to the electrodes E _{11_1} and E _{M1_1} . The signal line LN ₂ is electrically connected to the electrodes E _{11_2} and E _{M1_2} . The signal line LN ₃ is electrically connected to the electrodes E _{11_3} and E _{M1_3} . The signal line LNK _-2 is electrically connected to the electrodes E _{1N_1} and E _{MN_1} . The signal line LNK _-2 is electrically connected to the electrodes E _{1N_2} and E _{MN_2} . The signal line _LNK is electrically connected to the electrodes E _{1N_3} and E _{MN_3} . For convenience of illustration, FIG. 1 only shows that the signal line LN ₁ is electrically connected to the electrodes E _{11_1} and E _{M1_1} , but the disclosure is not limited thereto. In some embodiments, the signal line _LN1 is in the direction D2 and can be connected to other electrodes (not shown) other than the electrodes _{E11_1} and E _{M1_1} . Similarly, other signal lines may also be connected to other electrodes in the direction D2, which will not be repeated here. The signal lines LN _{1 -LNK} are sequentially arranged in the direction D1 and extend in the direction D2. In some embodiments, the signal lines LN _{1 ˜LNK} are used to transmit data signals, and may serve as data lines.

In other embodiments, the electronic device 100 further includes sensing signal lines LS1 and LS2. The sensing signal line LS1 is electrically connected to the sensing electrode SE1. The present disclosure does not limit the position of the sensing signal line LS1. In this embodiment, the sensing signal line LS1 is located between signal lines of adjacent sub-pixels of the same pixel (such as PIX ₁₁ ). For example, in a top view, as shown in FIG. 1 , the sensing signal line LS1 may be disposed between the signal lines LN ₂ and LN ₃ in the direction D1 , but this is not intended to limit the present disclosure. As shown in FIG. 1 , according to some embodiments, the electrodes E _{11_2} and E _{11_3} to which the signal lines LN ₂ and LN ₃ are respectively electrically connected may be in the same pixel PIX ₁₁ . In another possible embodiment, the sensing signal line LS1 is disposed between the signal lines _LN1 and _LN2 in the direction D1.

The sensing signal line LS2 is electrically connected to the sensing electrode SE2. In a top view, the sensing signal line LS2 is disposed between the signal lines _{LNK- 1} and _LNK in the direction D1 , but this is not intended to limit the present disclosure. In another embodiment, the sensing signal line LS2 may be disposed between the signal lines _{LNK- 2} and _{LNK- 1} in the direction D1 . In a possible embodiment, the number of sensing signal lines may be the same as the number of sensing electrodes.

In this embodiment, the sensing signal line LS1 and the signal lines LN ₁ -LN ₃ are located on different layers. For example, the signal line _LN2 and the sensing signal line LS1 are located on different layers. For example, in a sectional view, as shown in FIG. 7 , the sensing signal line LS1 is located above the signal lines LN ₁ -LN ₃ . Likewise, the sensing signal line LS2 and the signal lines _{LNK- 2 ˜LNK} are in different layers. For example, in a sectional view, the sensing signal line LS2 is located above the signal lines _{LNK-2 ˜LNK} . In this example, the sensing signal lines LS1 and LS2 are located in the same conductive layer, and the signal lines LN ₁ -LN ₃ and _{LNK- 2 -LNK} are located in another conductive layer. The lamination relationship between the sensing signal lines LS1 and LS2 and the signal lines LN ₁ -LN ₃ and _{LNK- 2 -LNK} will be described later through FIG. 7 .

In some embodiments, as shown in FIG. 1 , the electronic device 100 further includes pads PD ₁ -PD _K . The pads PD ₁ -PD _K are disposed on the substrate 110 , and may be disposed in the peripheral area NA of the substrate 110 . In this example, the pads PD ₁ -PD _K are electrically connected to the signal lines LN _{1 -LNK} respectively. For example, the pad PD ₂ (or the first pad) is electrically connected to the signal line LN ₂ , the pad PD ₃ (or the second pad) is electrically connected to the signal line LN ₃ , and the pad PD ₁ (or The third pad) is electrically connected to the signal line LN ₁ , the pad PD _K-2 is electrically connected to the signal line LN _K-2 , the pad PD K-1 is electrically connected to the signal line LN K-1 , and the pad PD _K-1 is electrically connected to the signal line LN _{K -1} Electrically connected to the signal line _LNK . In some embodiments, the pads PD ₁ -PD _K are used to receive voltage levels provided by a control circuit (not shown) outside the substrate 110 . In this example, the control circuit controls the voltage levels of the electrodes E _{11_1} -E _{1N_3} and E _{M1_1} -E _{MN_3} through the pads PD ₁ -PD _K .

The electronic device 100 further includes sensing pads S1 and S2 . The sensing pads S1 and S2 are disposed on the substrate 110 , and may be disposed in the peripheral area NA of the substrate 110 . The sensing pad S1 is electrically connected to the sensing signal line LS1. The sensing pad S2 is electrically connected to the sensing signal line LS2. In the direction D1, the sensing pad S1 is disposed between the pads _PD2 and _PD3 . In a possible embodiment, in a top view, as shown in FIG. 1 , the distance DS2 between the pads PD ₂ and PD ₃ in the direction D1 is greater than the distance DS1 between the pads PD ₂ and PD ₁ in the direction D1 . In other embodiments, the sensing pad S2 is disposed between the pads PD _K-1 and PD _K in the direction D1. In the top view, as shown in FIG. 1 , the distance DS4 between the pads PD _{K- 1} and PD _K in the direction D1 is greater than the distance DS3 between the pads PD _{K- 1} and PD _{K- 2} in the direction D1 . In some embodiments, in the top view, in the direction D1, the widths of the sensing pads S1 and S2 and the widths of the pads PD ₁ -PD _K may be equal. According to some embodiments, in the direction D1, the width of the sensing pad S1 and the width of at least one of the pads PD ₁ -PD _K may be equal.

In another possible embodiment, the sensing signal line LS2 is located between the signal lines _{LNK- 2} and _{LNK- 1} (not shown). In this example, in the direction D1, the sensing pad S2 is disposed between the pads PD _K-2 and PD _K-1 . Therefore, in a top view (not shown), the distance between the pads PD _K-1 and PD _K-2 in the direction D1 may be greater than the distance between the pads PD _K-1 and PD _K in the direction D1.

FIG. 2 is another schematic diagram of the electronic device of the present disclosure. FIG. 2 is similar to FIG. 1 , except that, in the direction D1 , the widths of the sensing pads S1 and S2 are greater than the widths of the pads PD ₁ -PD _K . Moreover, in FIG. 2 , the positions of the sensing signal lines LS1 and LS2 and the sensing pads S1 and S2 are different from those in FIG. 1 . And, as shown in FIG. 2 , according to some embodiments, the sensing signal line LS1 is located between the signal lines LN ₃ and LN ₄ . In this example, the electrodes E _{11_3} and E _{12_1} electrically connected to the signal lines LN ₃ and LN ₄ are in different pixels (such as PIX ₁₁ and PIX ₁₂ ). The pixel _PIX11 and the pixel _PIX12 are different pixels adjacent in the direction D1. The sensing signal line LS1 is disposed between the signal line _LN3 electrically connected to the pixel _PIX11 and the signal line _LN4 electrically connected to the pixel _PIX12 in the direction D1. Although the signal line LN ₄ in FIG. 2 is coupled to the electrode E _{12_1} , it is not intended to limit the present disclosure. In some embodiments, the signal line LN ₄ is connected to more electrodes. For example, in the direction D1, the right side of the pixel PIX _M1 is adjacent to another pixel (not shown). In this example, the signal line _LN4 is further connected to the electrode (not shown) of the pixel on the right side of the adjacent pixel PIX _M1 . Moreover, according to some embodiments, in the direction D1 , the width of the sensing pad S1 may be greater than the width of at least one of the pads PD ₁ -PD _K . For example, in the direction D1, the width W24 of the sensing pad S1 may be greater than the width W22 of the pad _PD2 . For example, the width W24 of the sensing pad S1 is larger than the widths W21˜W23 of the pads PD ₁ ˜PD ₃ , and the width W28 of the sensing pad S2 is larger than the pads PD _K-2 , PD _K-1 , PD _K The width W25 ~ W27. In this example, the widths W21-W23 of the pads PD ₁ -PD ₃ can be equal, and the widths W25-W27 of the pads PD _K-2 , PD _K-1 , and PD _K can be equal, but this disclosure does not limit. Width W21 and width W25 may be equal or unequal. In addition, in FIG. 2 , the pads PD ₁ -PD ₃ and the sensing pad S1 are arranged sequentially in the direction D1, and the pads PD _K-2 , PD _K-1 , PD _K and the sensing pad S2 are arranged in the direction D1. Arranged sequentially on D1.

In this embodiment, in a top view, as shown in FIG. 2 , the sensing pad S1 is not located between the pads PD ₂ and PD ₃ in the direction D1 . In the direction D1, the sensing pad S1 may be located outside the pad _PD3 , and the sensing pad S2 may be located outside the pad _PDk . In this example, the distance between the pads PD ₂ and PD ₃ in the direction D1 may be equal to the distance between the pads PD ₂ and PD ₁ in the direction D1 . The distance between the pads PD ₃ and PD ₄ in the direction D1 may be greater than the distance between the pads PD ₂ and PD ₃ in the direction D1 . In addition, in a top view, the distance between the pads PD _K-1 and PD _K in the direction D1 may be equal to the distance between the pads PD _K-1 and PD _K-2 in the direction D1.

FIG. 3 is another schematic diagram of the electronic device of the present disclosure. FIG. 3 is similar to FIG. 1 , except that, in the direction D1, adjacent pads are arranged in a staggered manner. As shown in FIG. 3 , in the direction D1 , the pads PD ₁ and PD ₂ are adjacent and alternately arranged, and the pad PD ₂ and the sensing pad S1 are adjacent and alternately arranged. Specifically, in the direction D1, the pad PD ₁ can be misaligned with the pad PD ₂ , the sensing pad S1 can be misaligned with the pad PD ₂ , and the pad PD ₁ and the sensing pad S1 can be aligned. The pad PD ₁ , the sensing pad S1 , the pad PD _{K- 2} and the sensing pad S2 are sequentially arranged and aligned in the direction D1 . The pads PD ₂ , PD ₃ , PD _K-1 and PD _K are sequentially arranged and aligned in the direction D1. In this embodiment, in the direction D1, the pad PD ₁ , the sensing pad S1 , the pad PD _K-2 and the sensing pad S2 are not in contact with the pads PD ₂ , PD ₃ , PD _K-1 and PD _K overlaps. In other embodiments, in the direction D1, at least one portion of the pad PD ₁ , the sensing pad S1 , the pad PD _K-2 , and the sensing pad S2 is in contact with the pads PD ₂ , PD ₃ , PD _K At least one of _-1 and PD _K overlap. In the present disclosure, alignment may mean that the centers of the two pads are aligned parallel to the direction D1 , and misalignment may mean that the centers of the two pads are aligned not parallel to the direction D1 . The direction D1 may be the extending direction of the gate lines (as shown in FIG. 5 ) on the substrate 110 .

FIG. 4 is another schematic diagram of the electronic device of the present disclosure. 4 is similar to FIG. 3, except that the width W42 of the sensing pad S1 in the direction D1 of FIG. 4 is greater than the width W41 of the pad PD ₁ , the width W43 of the pad PD ₂ , and the width of the pad PD ₃ . W44, and the width W46 of the sensing pad S2 in the direction D1 is greater than the width W45 of the pad PD _K-2 , the width W47 of the pad PD _K-1 , and the width W48 of the pad PD _K. According to some embodiments, the width W42 of the sensing pad S1 in the direction D1 may be greater than the width of at least one pad. In this embodiment, the widths W41 , W43 - W45 , W47 and W48 may be equal.

As shown in FIG. 4 , in the direction D1 , the pads PD ₁ and the sensing pads S1 are adjacent and alternately arranged, and the sensing pads S1 and pads _PD2 are adjacent and alternately arranged. Specifically, in the direction D1, the pad _PD1 and the sensing pad S1 are misaligned, the sensing pad S1 and the pad _PD2 may be misaligned, and the pads _PD1 and _PD2 may be aligned. The pads PD ₁ , PD ₂ , PD _K-2 and PD _K-1 are sequentially arranged and aligned in the direction D1. The sensing pad S1 , the pad PD ₃ , the sensing pad S2 and the pad PD _K are sequentially arranged and aligned in the direction D1 . In other embodiments, in the direction D1, at least one portion of the pads PD ₁ , PD ₂ , PD _K-2 , and PD _K-1 is connected to the sensing pad S1 , the pad PD ₃ , and the sensing pad S2 . overlaps with at least one of the pads PD _K.

The disclosure does not limit the positions of the sensing pads S1 and S2 . In this embodiment, the sensing pad S1 is located between the pads PD ₁ and PD ₂ , and the sensing pad S2 is located between the pads PD _{K- 2} and PD _{K- 1} . In another possible embodiment, the sensing pad S1 is located between the pads PD ₂ and PD ₃ . In another possible embodiment, the sensing pad S2 may be located between the pads PD _K-1 and PD _K.

FIG. 5 is another schematic diagram of the electronic device of the present disclosure. The electronic device 500 includes an array substrate 510 and a circuit board 520 . The array substrate 510 includes the substrate 110 and the electrodes, signal lines, sensing electrodes, sensing signal lines, pads, sensing pads, etc. on the substrate 110 , as described above in FIG. 1 , and will not be repeated here. There are conductive adhesives A ₁ -A _K and AS1 between the array substrate 510 and the circuit board 520 . Each of the conductive adhesives A ₁ -A _K and AS1 is used to electrically connect one of the pads PD ₁ -PD _K of the array substrate 510 and one of the sensing pads S1 and the pads PA ₁ -PA _K of the circuit board 520 and one of the sensing pads SA1. For example, the conductive adhesive _A1 is electrically connected to the pad _PD1 of the array substrate 510 and the pad _PA1 of the circuit board 520, and the conductive adhesive AS1 is electrically connected to the sensing pad S1 of the array substrate 510 and the sensing pad S1 of the circuit board 520. The pads SA1 and the conductive adhesive A _K are electrically connected to the pads PD _K of the array substrate 510 and the pads PA _K of the circuit board 520 . In a possible embodiment, the conductive adhesives A ₁ -A _K and AS1 are anisotropic conductive film (ACF). In this embodiment, the structure of the array substrate 510 is similar to the structure of the array substrate 110S shown in FIG. 1 , which will not be repeated here. For convenience of illustration, FIG. 5 omits the sensing signal line LS2 and the sensing electrode SE2 of FIG. 1 .

In some embodiments, the electronic device 500 further includes a gate driver 511 and a plurality of gate lines GL ₁ -GL _M . For convenience of illustration, only three gate lines are shown in FIG. 5 , but the disclosure is not limited thereto. The gate driver 511 provides driving signals to the gate lines GL ₁ -GL _M . The gate lines GL ₁ -GL _M may be disposed on the substrate 110, arranged in sequence in the direction D2, and extend in the direction D1. In this example, the gate driver 511 can be disposed on the substrate 110 at one side (eg, left side) of the substrate 110 . In this embodiment, the gate driver 511 can be integrated into the array substrate 510, so the gate driver 511 can be called a gate on panel (GOP). In another possible embodiment, the gate driver 511 may be located on another circuit board (different from the array substrate 510 ). The disclosure does not limit the number and location of gate drivers. In another possible embodiment, the electronic device 500 has more gate drivers.

In this embodiment, the electronic device 500 further includes a plurality of sub-pixels. Each sub-pixel is coupled to a gate line and a signal line. For convenience of illustration, FIG. 5 shows sub-pixels 111-113. The sub-pixel 111 is coupled to the gate line GL ₁ and the signal line LN ₁ . The sub-pixel 112 is coupled to the gate line GL ₁ and the signal line LN ₂ . The sub-pixel 113 is coupled to the gate line GL ₁ and the signal line LN ₃ . In this embodiment, the signal line LN ₁ is electrically connected to the electrode E _{11_1} in the sub-pixel 111, the signal line LN ₂ is electrically connected to the electrode E _{11_2} in the sub-pixel 112, and the signal line LN ₃ is electrically connected to the electrode E 11_2 in the sub-pixel 113. Electrode E _{11_3} . In a possible embodiment, the electrodes E _{11_1} -E _{11_3} are all pixel electrodes.

The circuit board 520 includes the pads PA ₁ -PA _K and the sensing pad SA1. The pads PA ₁ -PA _K are electrically connected to the pads PD ₁ -PD _K through the conductive glue A ₁ -A _K. The sensing pad SA1 is electrically connected to the sensing pad S1 through the conductive glue AS1. In other embodiments, the circuit board 520 further includes a processing unit 521 . The processing unit 521 is electrically connected to the pads PA ₁ -PA _K and the sensing pad SA1. In this example, the processing unit 521 indirectly electrically connects the pads PD ₁ -PD _K and the sensing pad S1 of the array substrate 510 through the pads PA ₁ -PA _K and the sensing pad SA1 of the circuit board 520 . For example, the pad PD ₂ (or called the first pad), the pad PD ₃ (or called the second pad) and the sensing pad S1 are electrically connected to the processing unit 521 .

The present disclosure does not limit the circuit architecture of the processing unit 521 . In a possible embodiment, the processing unit 521 is a Touch and Display Driver Integration Chip (Touch and Display Driver Integration Chip). During a display period, the processing unit 521 provides display signals to the pads PD ₁ -PD _K through the pads PA ₁ -PA _K . In this example, the pads PD ₁ -PD _K and the pads PA ₁ -PA _K can also be referred to as display pads. Since the sensing pad SA1 is located between two display pads (such as PA ₂ and PA ₃ ), the distance between adjacent display pads is relatively large. Please refer to FIG. 1 and FIG. 5. In a top view, the sensing signal line LS1 is located between two adjacent signal lines LN ₂ and LN ₃ , and the distance DS2 between adjacent signal lines can be increased, so that the array substrate 110S (or 510 ), the distance between the adjacent pads PD ₂ and PD ₃ increases. Moreover, the distance between the corresponding adjacent pads PA ₂ and PA ₃ on the circuit board 520 electrically connected to the array substrate 110S (or 510 ) is also increased, so that the distance between the pads PA ₂ and PA ₃ and the processing unit can be reduced. The length of the trace between 521, and reduce the impedance of the trace.

In another possible embodiment, during the display period, the processing unit 521 provides a common voltage to the sensing electrode SE1 through the sensing pad SA1. At this time, the sensing electrode SE1 serves as a common electrode. During a sensing period, the processing unit 521 provides a sensing signal to the sensing electrode SE1 through the sensing pad SA1, and detects a level change of the electrode SE1. The processing unit 521 determines whether the display area corresponding to the sensing electrode SE1 is touched according to the level change of the sensing electrode SE1 . In other embodiments, the processing unit 521 may be integrated in the array substrate 510 . In this example, the processing unit 521 can be directly electrically connected to the signal lines LN _{1 -LNK} and the sensing signal line LS1 .

In some embodiments, the position configuration and size of the pads PA ₁ -PA _K and the sensing pad SA1 of the circuit board 520 depend on the positions of the pads PD ₁ -PD _K and the sensing pad S1 of the array substrate 510 configuration and size. For example, since the sensing pad S1 of the array substrate 510 is located between the pads PD ₂ and PD ₃ , the sensing pad SA1 of the circuit board 520 is located between the pads PA ₂ and PA ₃ . In addition, since the width of the sensing pad S1 of the array substrate 510 in the direction D1 is equal to the width of the pads PD ₁ -PD _K in the direction D1, the width of the sensing pad SA1 of the circuit board 520 in the direction D1 is equal to the width of the pads in the direction D1. The widths of PA ₁ -PA _K in the direction D1 are the same.

In other embodiments, as shown in FIG. 2 , when the width of the sensing pad S1 of the array substrate 510 in the direction D1 is greater than the width of the pads PD ₁ -PD _K in the direction D1 , the sensing pads of the circuit board 520 The width of SA1 in the direction D1 is greater than the width of the pads PA ₁ -PA _K in the direction D1 .

FIG. 6 is another schematic diagram of the electronic device of the present disclosure. FIG. 6 is similar to FIG. 5 , except that the array substrate 610 in FIG. 6 has gate drivers 611 and 612 . In this embodiment, the array substrate 610 may include a plurality of gate lines, and the gate drivers 611 and 612 may be coupled to different gate lines. For example, the gate driver 611 is coupled to odd-numbered gate lines among the plurality of gate lines, such as GL ₁ and GL _M , and the gate driver 612 is coupled to even-numbered gate lines among the plurality of gate lines. , such as GL ₂ . For convenience of illustration, only three gate lines are shown in FIG. 6 , but the disclosure is not limited thereto. Since the characteristics of the gate drivers 611 and 612 are similar to those of the gate driver 511 in FIG. 5 , details are omitted here.

In FIG. 6 , an electronic device 600 may include an array substrate 610 , a first circuit board 620 , and a second circuit board 630 . The first circuit board 620 may be disposed between the array substrate 610 and the second circuit board 630 . The first circuit board 620 can be one or more than one, three first circuit boards 620_1 , 620_2 , 620_P are shown in FIG. 6 , but the disclosure is not limited thereto. The array substrate 610 is electrically connected to the first circuit boards 620_1 - 620_P through conductive glue (not shown). Since the characteristics of the first circuit boards 620_1 - 620_P are similar to those of the circuit board 520 in FIG. 5 , details are not repeated here. In addition, the first circuit boards 620_1˜620_P are electrically connected to the second circuit board 630 through conductive glue (not shown) for receiving power and signals. For example, a power supply circuit 631 is disposed in the second circuit board 630 for providing power to the processing units 621_1˜621_P of the first circuit boards 620_1˜620_P. In some embodiments, the first circuit boards 620_1˜620_P may be flexible circuit boards, and the second circuit board 630 may be a rigid circuit board, but the disclosure is not limited thereto.

In other embodiments, the second circuit board 630 further has a timing controller (TCON) 632 and a voltage converter (level shift) 633 . The timing controller 632 provides control signals to the processing units 621_1 - 621_P of the first circuit boards 620_1 - 620_P. The voltage converter 633 provides at least one converted voltage to the processing units 621_1 - 621_P of the first circuit boards 620_1 - 620_P. In a possible embodiment, the second circuit board 630 further includes a display interface (not shown) for receiving an image signal. In this example, the display port may be an embedded display port (eDP).

FIG. 7 is a cross-sectional view showing the stacked relationship among the gate line GL ₁ , the signal lines LN _{1 -LNK} , the sensing electrode SE, and the sensing signal lines LS1 and LS2 . The top view relationship among the components in FIG. 7 can also refer to the top view of FIG. 1 .

An array substrate 710S includes a substrate 712 , a first conductive layer 714 , a second conductive layer 716 , and a third conductive layer 720 . In the third direction D3 , from bottom to top, the first conductive layer 714 , the second conductive layer 716 , and the third conductive layer 720 are sequentially disposed on the substrate 712 . Direction D3 is different from directions D1 and D2, for example, direction D3 may be perpendicular to directions D1 and D2. According to some embodiments, the direction D3 may be a direction perpendicular to the upper surface of the substrate 712 , and may be a normal direction of the substrate 712 . The insulating layer 713 is disposed on the upper surface of the substrate 712 . The first conductive layer 714 is disposed on the upper surface of the insulating layer 713 . In a possible embodiment, the first conductive layer 714 has the gate line of FIG. 5 , such as GL ₁ . The insulating layer 715 is disposed on the upper surface of the first conductive layer 714 . The second conductive layer 716 is disposed on the upper surface of the insulating layer 715 . In a possible embodiment, the second conductive layer 716 includes signal lines LN _{1 ˜LNK} . As shown in the figure, the signal lines LN _{1 ˜LNK} are separated from each other. The insulating layer 717 is disposed on the upper surface of the second conductive layer 716 . A common electrode (common electrode) 718 is disposed on the upper surface of the insulating layer 717 . In a possible embodiment, the common electrode 718 also serves as the sensing electrode SE. During a display period, the common electrode 718 is maintained at a common voltage, such as 0V. During a sensing period, the common electrode 718 receives a sensing voltage. During this period, if the common electrode 718 is not touched, the voltage of the common electrode 718 is equal to the sensing voltage. However, when the common electrode 718 is touched, the voltage of the common electrode 718 is no longer equal to the sensing voltage. Therefore, by detecting the voltage change of the common electrode 718, it can be known whether the common electrode 718 is touched. According to some embodiments, the first conductive layer 714 , the second conductive layer 716 , and the third conductive layer 720 may be metal layers, but the disclosure is not limited thereto. For convenience of illustration, the pixel electrodes are not shown in FIG. 7 . According to some embodiments, the pixel electrode may be disposed between the second conductive layer 716 and the third conductive layer 720 , and may be disposed above or below the common electrode 718 , the present disclosure is not limited thereto.

The insulating layer 719 is disposed on the upper surface of the common electrode 718 . The third conductive layer 720 is disposed on the upper surface of the insulating layer 719 . In a possible embodiment, the third conductive layer 720 may include sensing signal lines (such as LS1 and LS2 ). The projection position of the sensing signal line on the substrate 712 does not overlap with the projection position of any one of LN ₁ -LNK _K on the substrate 712 . The insulating layer 721 is disposed on the upper surface of the third conductive layer 720 . The liquid crystal layer 722 is disposed between the color filter substrate 723 and the array substrate 710S. The polarizer 711 can be disposed on the lower surface of the substrate 712 , and the polarizer 724 can be disposed on the upper surface of the color filter substrate 723 . The cover layer 725 can be disposed on the upper surface of the polarizer 724 .

As shown in FIG. 7 , the second conductive layer 716 may include signal lines LN _{1 ˜LNK} . The third conductive layer 720 may include sensing signal lines (such as LS1 and LS2 ). That is, the signal lines LN _{1 -LNK} and the sensing signal lines (such as LS1 and LS2 ) can be located on different layers. For example, as shown in FIG. 1 , the signal line _LN2 and the sensing signal line LS1 may be located on different layers.

FIG. 8 is another schematic diagram of the electronic device of the present disclosure. In this embodiment, the electronic device 800 includes an array substrate 810 and circuit boards 820_1 - 820_P. The array substrate 810 is electrically connected to the circuit boards 820_1 - 820_P through conductive glue. Since the structure of the array substrate 810 is similar to the structure of the array substrate 110S in FIG. 1 , details are not repeated here. In addition, the characteristics of the circuit boards 820_1 - 820_P are similar to those of the circuit board 520 in FIG. 5 , so details are not repeated here.

In this embodiment, at least one of the circuit boards 820_1 - 820_P has a dummy pad. For example, the circuit board 820_2 has an empty pad PC1, and the circuit board 820_P has an empty pad PC2. The disclosure does not limit the location of the empty pads. In FIG. 8 , the empty pad PC1 of the circuit board 820_2 is located approximately in the middle of the processing unit 821_2 , and the empty pad PC2 of the circuit board 820_P is located approximately on the right side of the processing unit 821_P. In addition, the present disclosure does not limit the number of empty pads per circuit board. In some embodiments, at least one of the circuit boards 820_1 - 820_P may have more empty pads.

Since the characteristics of the empty pads PC1 and PC2 are similar, the circuit board 820_2 is taken as an example to illustrate the function of the empty pad PC1. In some embodiments, when the processing unit 821_2 cannot be electrically connected to the array substrate 810 through a defective wire or a defective pad, the processing unit 821_2 can use the empty pad PC1 to electrically connect to the array substrate 810 . In some embodiments, when the processing unit 821_2 does not output a signal to the array substrate 810 through the empty pad PC1, the processing unit 821_2 sets the empty pad PC1 to a high impedance (high-Z) state.

FIG. 9 is a schematic diagram of a processing unit of the present disclosure. The processing unit 900 includes an analog circuit (analogengineer) 910, a micro control circuit (MCU) 920, a touch sensing circuit (touch sensing circuit) 930, a display driving circuit (display driving circuit) 940, a high impedance circuit ( High-Z circuit) 950 , a register setting circuit (register setting circuit) 960 , switches 971 - 973 and a pad 980 . In some embodiments, the processing unit 900 may be the processing unit in the foregoing embodiments, such as the processing unit 521 in FIG. 5 or any one of the processing units 821_1˜821_P in FIG. 8 .

During a display period, the micro-control circuit 920 controls the analog circuit 910 to enable a trigger signal SO2 through a control signal SC. The display driving circuit 940 generates a display signal SD according to the trigger signal SO2. At this time, the micro control circuit 920 drives the register setting circuit 960 so that the register setting circuit 960 enables a switching signal B. Therefore, the switch 972 is turned on to transmit the display signal SD to the pad 980 . In a possible embodiment, the processing unit 900 serves as the processing unit 521 in FIG. 5 . In this example, the pad 980 is electrically coupled to the pad PD ₁ of the array substrate 510 in FIG. 5 . In this example, the electrode _{E11_1} of the sub-pixel 111 receives the display signal SD.

During a sensing period, the micro control circuit 920 controls the analog circuit 910 to enable a trigger signal SO1 through the control signal SC. The touch sensing circuit 930 generates a sensing signal ST according to the trigger signal SO1. During the sensing period, the microcontroller circuit 920 drives the register setting circuit 960 so that the register setting circuit 960 enables a switching signal A. Therefore, the switch 971 is turned on to transmit the sensing signal ST to the pad 980 . In a possible embodiment, the processing unit 900 serves as the processing unit 521 in FIG. 5 . In this example, the pad 980 is electrically coupled to the sensing pad S1 of the array substrate 510 in FIG. 5 . In this example, the sensing electrode SE receives the sensing signal ST.

In other embodiments, when the pad 980 is used as an empty pad, the micro-control circuit 920 drives the register setting circuit 960 so that the register setting circuit 960 enables a switching signal C. Therefore, the switch 973 is turned on. The high impedance circuit 950 sets the pad 980 to a high impedance state.

In a possible embodiment, the register setting circuit 960 has two registers (not shown). The microcontroller circuit 920 sets the values of the two registers of the register setting circuit 960 . The register setting circuit 960 enables one of the switching signals A˜C according to the values of the two internal registers. For example, when the microcontroller circuit 920 sets the values of the two registers of the register setting circuit 960 to 01, the register setting circuit 960 enables the switching signal A. When the microcontroller circuit 920 sets the values of the two registers of the register setting circuit 960 to 10, the register setting circuit 960 enables the switching signal B. When the microcontroller circuit 920 sets the values of the two registers of the register setting circuit 960 to 00, the register setting circuit 960 enables the switching signal C.

To sum up, according to some embodiments, by adjusting the positions of the sensing signal lines and the signal lines, the positions of the sensing pads and the pads on the array substrate can be correspondingly adjusted. According to some embodiments, in a top view, the sensing signal line is located between two adjacent signal lines, and the distance between adjacent signal lines can be increased, so that adjacent pads (such as PD ₂ and The distance between PD ₃ ) increases. Moreover, the distance between corresponding adjacent pads (such as PA ₂ and PA ₃ ) on the circuit board (such as 520 ) electrically connected to the array substrate is also increased, so that the distance between the pads (such as PA ₂ and PA ₃ ) can be reduced. ) and the processing unit (such as 521), and reduce the impedance of the wiring. Therefore, the electrical performance of the sensing electrodes can be improved and the process yield can be stabilized, thereby improving the reliability of the overall electronic device.

Although the present disclosure has been disclosed above with preferred embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present disclosure. For example, the system, device or method described in the embodiments of the present disclosure can be implemented in physical embodiments of hardware, software, or a combination of hardware and software. Therefore, the scope of protection of the present disclosure should be defined by the appended claims.

Claims (10)

1. An electronic device, characterized in that: a substrate; a first electrode disposed on the substrate; a second electrode, disposed on the substrate, and adjacent to the first electrode in a first direction; a first signal line electrically connected to the first electrode; a second signal line electrically connected to the second electrode; a sensing electrode; and A sensing signal line is electrically connected to the sensing electrode. In a plan view, the sensing signal line is disposed between the first signal line and the second signal line along the first direction. 2. The electronic device according to claim 1, further comprising: a first pad disposed on the substrate; a second pad disposed on the substrate; and A sensing pad is disposed on the substrate, wherein the first pad is electrically connected to the first signal line, the second pad is electrically connected to the second signal line, and the sensing pad is electrically connected to the Sensing signal line. 3. The electronic device according to claim 2, wherein, in the first direction, the sensing pad is disposed between the first pad and the second pad. 4. The electronic device as claimed in claim 2, further comprising: a third signal line; a third pad; and A third electrode, adjacent to the first electrode in the first direction, wherein the third electrode is electrically connected to the third pad through the third signal line, wherein in the plan view, the first pad The distance between the pad and the second pad in the first direction is the distance between the first pad and the third pad in the first direction. 5 . The electronic device according to claim 2 , wherein, in the top view, in the first direction, the width of the sensing pad is larger than the width of the first pad. 6. The electronic device as claimed in claim 2, further comprising: A processing unit, wherein the first pad, the second pad and the sensing pad are electrically connected to the processing unit. 7. The electronic device of claim 2, wherein the sensing pad is not aligned with the first pad in the first direction. 8. The electronic device of claim 1, wherein the sensing electrode and the first electrode are located in different layers. 9. The electronic device of claim 1, wherein the first signal line and the sensing signal line are located on different layers. 10. The electronic device of claim 1, wherein in the plan view, the sensing electrode overlaps the first electrode and the second electrode.

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