CN115702338A - Foreign matter inspection substrate, substrate processing apparatus, and substrate processing method - Google Patents

Foreign matter inspection substrate, substrate processing apparatus, and substrate processing method Download PDF

Info

Publication number
CN115702338A
CN115702338A CN202180041508.4A CN202180041508A CN115702338A CN 115702338 A CN115702338 A CN 115702338A CN 202180041508 A CN202180041508 A CN 202180041508A CN 115702338 A CN115702338 A CN 115702338A
Authority
CN
China
Prior art keywords
substrate
inspection
liquid
light
foreign matter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180041508.4A
Other languages
Chinese (zh)
Inventor
小杉仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN115702338A publication Critical patent/CN115702338A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/85—Investigating moving fluids or granular solids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/49—Scattering, i.e. diffuse reflection within a body or fluid
    • G01N21/53—Scattering, i.e. diffuse reflection within a body or fluid within a flowing fluid, e.g. smoke
    • G01N21/532—Scattering, i.e. diffuse reflection within a body or fluid within a flowing fluid, e.g. smoke with measurement of scattering and transmission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Abstract

The foreign matter inspection substrate includes an inspection substrate, an irradiator, and a light receiver. A passage portion through which the processing liquid passes is formed in the inspection substrate. The irradiator irradiates inspection light to the treatment liquid. The light receiver receives scattered light generated by passage of foreign matter in the processing liquid through the inspection light or transmitted light attenuated by passage of foreign matter in the processing liquid through the inspection light. The light receiver includes a photoelectric conversion element for converting the received scattered light or transmitted light into an electric signal. The irradiator and the photoreceiver are provided on the inspection substrate.

Description

Foreign matter inspection substrate, substrate processing apparatus, and substrate processing method
Technical Field
The present disclosure relates to a foreign matter inspection substrate, a substrate processing apparatus, and a substrate processing method.
Background
The coating module described in patent document 1 includes: a rotary holding disk for horizontally holding the substrate from below the substrate; a nozzle for ejecting a chemical solution onto an upper surface of a substrate held by a spin chuck; and a cup for collecting the chemical solution spun from the substrate held by the rotary holding plate. A foreign matter detection means is provided on the side of the cup. The foreign object detection unit includes a laser irradiation unit, a light receiving unit, and a flow path array. The laser irradiation unit and the light receiving unit are disposed so as to face each other with the flow path array sandwiched therebetween from front to back. The laser irradiation unit irradiates one channel selected from a plurality of channels of the channel array. The light receiving unit receives the light transmitted through the flow path.
The 2 types of jig substrates described in patent document 2 are used for automatic teaching of a transfer robot. A jig substrate is a detected-side jig substrate. The jig substrate on the side to be detected is provided with a jig main body in a disk shape and a cylindrical part to be detected which stands vertically from the center of the jig main body. The other jig substrate is a sensor-side jig substrate. The sensor-side jig substrate includes a disc-shaped jig main body having a circular hole formed in the center thereof for receiving the detection target portion, and a light emitting portion and a light receiving portion disposed opposite to each other at the edge of the hole. The sensor side substrate is held by the first substrate holding portion, the detection side substrate is held by the second substrate holding portion, and the light emitting portion and the light receiving portion detect the detection portion, thereby detecting a positional relationship between the first substrate holding portion and the second substrate holding portion.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2019-220712
Patent document 2: japanese patent laid-open publication No. 2006-332543
Disclosure of Invention
Problems to be solved by the invention
One embodiment of the present disclosure provides a technique for measuring foreign matter in a processing liquid immediately before being supplied to a substrate.
Means for solving the problems
A foreign matter inspection substrate according to one embodiment of the present disclosure includes an inspection substrate, an irradiator, and a photoreceiver. A passage portion through which the processing liquid passes is formed in the inspection substrate. The irradiator is configured to irradiate inspection light to the processing liquid. The light receiver receives scattered light generated by passage of foreign matter in the processing liquid through the inspection light or transmitted light attenuated by passage of foreign matter in the processing liquid through the inspection light. The light receiver includes a photoelectric conversion element for converting the received scattered light or transmitted light into an electric signal. The irradiator and the photoreceiver are provided on the inspection substrate.
ADVANTAGEOUS EFFECTS OF INVENTION
According to one embodiment of the present disclosure, foreign matter in the processing liquid immediately before being supplied to the substrate can be measured.
Drawings
Fig. 1 is a plan view showing a substrate processing apparatus according to an embodiment.
Fig. 2 is a front view of the substrate processing apparatus of fig. 1.
Fig. 3 is a sectional view showing a liquid treatment module according to an embodiment.
Fig. 4 is a flowchart illustrating a substrate processing method according to an embodiment.
Fig. 5 is a perspective view illustrating a foreign matter inspection substrate according to an embodiment.
Fig. 6 (a) is a plan view of the foreign substance inspection substrate of fig. 5, and fig. 6 (B) is a cross-sectional view taken along line B-B of fig. 6 (a).
Fig. 7 is a horizontal cross-sectional view showing an example of switching of the nozzles to which the inspection light is irradiated.
Fig. 8 (a) is a perspective view showing an example of the irradiator and the nozzle before alignment, and fig. 8 (B) is a perspective view showing an example of the irradiator and the nozzle after alignment.
Fig. 9 (a) is a perspective view showing an example of the electric wiring before connection, fig. 9 (B) is a perspective view showing an example of the electric wiring after connection, and fig. 9 (C) is a cross-sectional view showing an example of the electric wiring after connection.
Fig. 10 (a) is a sectional view showing an example of the positioning portion before positioning, and fig. 10 (B) is a sectional view showing an example of the positioning portion after positioning.
Fig. 11 is a flowchart showing an example of processing performed before S101 or after S106 in fig. 4.
Fig. 12 is a flowchart showing an example of processing subsequent to fig. 11.
Fig. 13 (a) is a perspective view showing an example of S204 in fig. 11, (B) in fig. 13 is a perspective view showing an example of S205 in fig. 11, and (C) in fig. 13 is a perspective view showing an example of S206.
Fig. 14 (a) is a perspective view showing an example of S208 in fig. 11, (B) in fig. 14 is a perspective view showing an example of S211 in fig. 12, and (C) in fig. 14 is a perspective view showing an example of S212 in fig. 12.
Fig. 15 is a diagram showing an example of the assignment module and the inspection unit.
Fig. 16 is a diagram showing an example of an image displayed on the display device.
Fig. 17 is a plan view showing a modification of the foreign substance inspection substrate shown in fig. 6 (a).
Detailed Description
Embodiments of the present disclosure will be described below with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same reference numerals, and description thereof may be omitted.
First, a substrate processing apparatus 1 according to an embodiment will be described with reference to fig. 1 and 2. In fig. 1 and 2, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other, the X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction.
As shown in fig. 1, the substrate processing apparatus 1 includes a loading/unloading station 2 and a processing station 3. The carry-in/out station 2 is provided adjacent to the processing station 3 in the X-axis direction.
The loading/unloading station 2 includes a mounting table 21, a conveying unit 22, and a delivery unit 23. The mounting table 21 is used for mounting the plurality of carriers C. The plurality of carriers C respectively accommodate a plurality of horizontal substrates W at intervals in the vertical direction.
The conveying unit 22 is provided adjacent to the table 21. The conveying device 4 is disposed inside the conveying unit 22. The transfer device 4 transfers the substrate W inside the transfer unit 22, and transfers the substrate W between a plurality of devices disposed beside the transfer unit 22.
The transfer device 4 includes a transfer arm 41 for holding the substrate W. The transfer arm 41 is movable in the horizontal direction (both the X-axis direction and the Y-axis direction) and the vertical direction, and is rotatable about a vertical axis. The number of the transfer arms 41 may be one or more. One transfer arm 41 takes out the substrate W from the carrier C, and the other transfer arm 41 stores the substrate W in the carrier C.
The transfer unit 23 is provided adjacent to the conveying unit 22. The transfer unit 23 includes a transfer device 23a that temporarily stores the substrate W. As shown in fig. 2, the transfer unit 23 includes a storage 23b for storing the foreign-substance inspection substrate 8 and the dummy substrate 9. In the present embodiment, the foreign-matter inspection substrate 8 and the dummy substrate 9 are stored in the same storage 23b, but may be stored in different storages 23b. The arrangement and number of the transfer device 23a and the storage 23b are not particularly limited.
The processing station 3 includes a transfer block 31 and a processing block 32. The conveying block 31 is provided adjacent to the transfer portion 23. The conveying block 31 has a rectangular parallelepiped shape. The conveying device 5 is disposed inside the conveying block 31. The transfer device 5 transfers the substrate W between a plurality of devices disposed beside the transfer block 31.
The transfer device 5 includes a transfer arm 51 for holding the substrate W. The transfer arm 51 is movable in the horizontal direction (both directions of the X-axis direction and the Y-axis direction) and the vertical direction, and is rotatable about the vertical axis. The number of the transfer arms 51 may be one or more. In the latter case, for example, different transfer arms 51 are used before and after the treatment by the liquid treatment module 6 described later.
The processing block 32 is provided adjacent to the conveying block 31. The processing block 32 may be provided in plurality. For example, as shown in fig. 1, a plurality of processing blocks 32 are symmetrically arranged on both sides of the transport block 31 in the Y-axis direction. As shown in fig. 2, a plurality of processing blocks 32 are stacked in the vertical direction. However, the arrangement and number of the processing blocks 32 are not particularly limited.
The processing block 32 includes a liquid treatment module 6. The liquid treatment module 6 is configured to supply a treatment liquid to the substrate W to treat the substrate W. The processing block 32 may include a plurality of liquid treatment modules 6. The plurality of liquid treatment modules 6 are arranged in a line in the X-axis direction and adjacent to one side of the conveyance block 31.
The substrate processing apparatus 1 includes a control device 7. The control device 7 is, for example, a computer, and includes a storage medium 72 such as a memory and a CPU (Central Processing Unit) 71. A program for controlling various processes executed in the substrate processing apparatus 1 is stored in the storage medium 72. The control device 7 controls the operation of the substrate processing apparatus 1 by causing the CPU 71 to execute a program stored in the storage medium 72.
First, the liquid treatment module 6 according to the embodiment will be described with reference to fig. 3. The liquid treatment module 6 is configured to supply a treatment liquid to the substrate W to treat the substrate W. The substrate W includes, for example, a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. A conductive film or an insulating film is formed on a surface of a semiconductor substrate, a glass substrate, or the like. A plurality of films may be formed. The substrate W may include a device such as an electronic circuit on its surface, or may include a not-shown uneven pattern.
The liquid treatment module 6 includes a treatment vessel 61 for accommodating the substrate W therein, a holding unit 62 for holding the substrate W, and a rotating unit 63 for rotating the holding unit 62. The liquid treatment module 6 includes a liquid supply unit 64 for supplying the treatment liquid to the substrate W held by the holding unit 62, and a cup 68 for collecting the treatment liquid L thrown off from the substrate W.
The processing container 61 includes a not-shown shutter and a not-shown gate valve for opening and closing the shutter. The substrate W is carried into the processing container 61 through the shutter, processed in the processing container 61, and then carried out of the processing container 61 through the shutter.
The holding portion 62 holds the substrate W horizontally, for example. The holding unit 62 horizontally holds the substrate W such that the device-forming surface of the substrate W faces upward and the center of the upper surface of the substrate W coincides with the rotation center line of the rotation shaft 63a. The holding portion 62 is a mechanical holding tray (chuck) in the present embodiment, but may be a vacuum holding tray, an electrostatic holding tray, or the like. The holding portion 62 may be a rotatable holding disk.
The rotating portion 63 includes, for example, a vertical rotating shaft 63a and a rotating motor 63b for rotating the rotating shaft 63a. The rotational driving force of the rotary motor 63b can be transmitted to the rotary shaft 63a via a rotation transmission mechanism such as a timing belt or a gear. When the rotation shaft 63a rotates, the holding portion 62 also rotates.
The liquid supply unit 64 supplies the processing liquid to the substrate W held by the holding unit 62. The liquid supply unit 64 includes, for example, a nozzle 65 for discharging the processing liquid, a moving mechanism 66 for moving the nozzle 65 in the radial direction of the substrate W, and a supply line 67 for supplying the processing liquid to the nozzle 65.
The nozzle 65 supplies the processing liquid to, for example, the center of the upper surface of the rotating substrate W. The processing liquid wets and spreads from the center to the periphery of the upper surface of the substrate W by centrifugal force. As the processing liquid, for example, a chemical liquid, a rinse liquid, and a drying liquid are sequentially supplied to the substrate W. Further, a plurality of chemical solutions may be supplied to the substrate W, and the rinse liquid may be further supplied between the supply of one chemical solution and the supply of the other chemical solution. The plurality of treatment liquids may be ejected from the same nozzle 65 or may be ejected from different nozzles 65.
The chemical solution may be any of acidic, basic, and neutral. The acidic chemical solution is, for example, DHF (dilute hydrofluoric acid) or the like. The alkaline chemical solution is, for example, SC1 (an aqueous solution containing hydrogen peroxide and ammonium hydroxide) or the like. The neutral chemical liquid may be functional water such as ozone water. The rinse is, for example, DIW (deionized water). The drying liquid is, for example, an organic solvent such as IPA (isopropyl alcohol).
The moving mechanism 66 includes, for example, a rotary head 66a for holding the nozzle 65, a rotary arm 66b having the rotary head 66a at the tip, and a rotary mechanism 66c for rotating the rotary arm 66b (see fig. 7). The turning mechanism 66c may also serve as an elevating mechanism for elevating the turning arm 66 b.
In addition, the moving mechanism 66 may have a guide rail and a linear motion mechanism instead of the swing arm 66b and the swing mechanism 66c. The guide rail is disposed horizontally, and the linear motion mechanism moves the nozzle 65 along the guide rail.
The supply line 67 supplies the processing liquid to the nozzle 65. A supply line 67 is provided for each treatment liquid. An on-off valve V for opening and closing a flow path of the processing liquid, a flow rate controller F for controlling a flow rate of the processing liquid, and a flow meter M for measuring the flow path of the processing liquid are provided in the middle of the supply line 67, for example.
The cup 68 surrounds the peripheral edge of the substrate W held by the holding portion 62, and receives the processing liquid scattered from the peripheral edge of the substrate W. The cup 68 does not rotate together with the rotating shaft 63a in the present embodiment, but may rotate together with the rotating shaft 63a. The cup 68 includes a horizontal bottom wall 68a, a cylindrical side wall 68b extending upward from the entire periphery of the bottom wall 68a, and an inclined wall 68c extending obliquely upward from the upper end of the side wall 68b toward the radially inner side of the side wall 68 b. The bottom wall 68a is provided with a drain pipe 68d for discharging the processing liquid accumulated in the cup 68, and a gas discharge pipe 68e for discharging the gas accumulated in the cup 68.
Next, a substrate processing method according to an embodiment will be described with reference to fig. 4. Steps S101 to S106 shown in fig. 4 are executed under the control of the control device 7. The substrate W is switched and a series of processes S101 to S106 are repeated.
First, the transport device 4 takes out the substrate W from the carrier C and transports the taken-out substrate W to the transport device 23a. Next, the transfer device 5 takes out the substrate W from the transfer device 23a and carries the taken-out substrate W into the liquid treatment module 6 (S101).
Next, the liquid supply unit 64 supplies the chemical liquid to the substrate W (S102). The chemical liquid is supplied to the center of the upper surface of the rotating substrate W, and is spread in the entire radial direction of the upper surface by the centrifugal force to form a liquid film. The chemical solution may be further supplied to the lower surface of the substrate W.
Next, the liquid supply unit 64 supplies the rinse liquid to the substrate W (S103). The rinse liquid is supplied to the center of the upper surface of the rotating substrate W, and is spread in the entire radial direction of the upper surface by centrifugal force to form a liquid film. The liquid film of the chemical solution is replaced with the liquid film of the rinse solution. The rinse liquid may be further supplied to the lower surface of the substrate W.
Next, the liquid supply unit 64 supplies the drying liquid to the substrate W (S104). The drying liquid is supplied to the center of the upper surface of the rotating substrate W, and the drying liquid is spread in the entire radial direction of the upper surface by a centrifugal force to form a liquid film. The liquid film of the rinse liquid is replaced with the liquid film of the drying liquid.
Subsequently, the rotating unit 63 rotates the substrate W together with the holding unit 62 to dry the substrate W (S105). The drying liquid remaining on the substrate W is spun off without supplying the processing liquid to the substrate W, and the substrate W is dried.
Next, the holding portion 62 releases the holding of the substrate W, and the transfer device 5 receives the substrate W from the holding portion 62 and carries out the received substrate W to the outside of the liquid treatment module 6 (S106). After that, the present process is ended.
The substrate processing method is not limited to the method shown in fig. 4. For example, a plurality of chemical solutions may be supplied to the substrate W, and a rinse solution may be further supplied between the supply of one chemical solution and the supply of another chemical solution. In addition, the supply of the drying liquid may be omitted.
As described above, the processing liquid is supplied to the substrate W. In the processing liquid, particles generated by deterioration of the piping such as the supply line 67 and particles generated by operation of various devices (for example, the opening/closing valve V or the flow rate controller F) provided in the middle of the piping may be mixed. In addition, bubbles may be generated in the treatment liquid. If foreign matter such as particles and bubbles adheres to the substrate W, the quality of the substrate W is degraded. Therefore, in the present embodiment, the foreign matter in the processing liquid is measured before S101 or after S106 shown in fig. 4.
Next, the foreign matter inspection substrate 8 according to the embodiment will be described with reference to fig. 5 and 6. The foreign matter inspection substrate 8 includes an inspection substrate 81, an irradiator 82, and a photoreceiver 83. A passage 81a through which the processing liquid L passes is formed through the inspection substrate 81. The irradiator 82 irradiates the processing liquid L with inspection light. The light receiver 83 receives scattered light generated by the passage of foreign matter in the processing liquid L through the inspection light. The light receiver 83 includes a photoelectric conversion element 83a that converts the received scattered light into an electrical signal. The irradiator 82 and the photoreceiver 83 are provided on the inspection board 81. When the scattered light is received by the light receiver 83, the optical axis of the illuminator 82 (the center line CA of the inspection light) and the optical axis of the light receiver 83 intersect obliquely or perpendicularly (obliquely in fig. 6) with respect to the center line CB of the flow of the processing liquid L.
According to the present embodiment, the irradiator 82 and the photoreceiver 83 are provided on the inspection substrate 81, and the inspection substrate 81 has a through portion 81a through which the processing liquid L passes. Therefore, as shown in fig. 5, foreign matter in the processing liquid L can be measured in the vicinity of the nozzle 65. Foreign matter in the processing liquid L may increase in the process of passing through the pipe. If the foreign matter in the processing liquid L is measured in the vicinity of the nozzle 65, which is the downstream end of the pipe, the foreign matter in the processing liquid L can be measured when the foreign matter is about to be supplied to the substrate W, and the quality of the substrate W can be accurately managed.
The inspection substrate 81 has a disk shape and has the same diameter as the substrate W. Therefore, the inspection substrate 81 and the substrate W can be conveyed by the same conveying device 5. A circular passage portion 81a is formed through the center of the inspection substrate 81. The processing liquid L discharged from the nozzle 65 passes through the passage 81a. The shape of the passing portion 81a is not limited to a circular shape, and may be, for example, a slit shape, or the like, and specifically, as shown in fig. 17, may be a U shape extending from the peripheral edge of the inspection board 81 to the center in the radial direction. The passing portion 81a may be a hole or a slit, and the shape of the passing portion 81a is not particularly limited. The test substrate 81 has etching resistance to the processing liquid L. The material of the inspection substrate 81 is, for example, resin or ceramic.
The irradiator 82 irradiates the processing liquid L with inspection light. The wavelength of the inspection light is not particularly limited. The illuminator 82 includes, for example, a laser oscillator. An absorption plate 84 for absorbing the inspection light is provided on the side opposite to the irradiator 82 with reference to the passage 81a through which the processing liquid L passes.
The light receiver 83 receives scattered light generated by the passage of foreign matter in the processing liquid L through the inspection light. The light receiver 83 includes a photoelectric conversion element 83a that converts the received scattered light into an electrical signal. The number of occurrences of the electrical signal having an intensity above the threshold value indicates the number of foreign objects. In addition, the intensity of the electric signal indicates the particle size of the foreign matter.
The light receiver 83 may further include a lens 83b for collecting scattered light from the processing liquid L to the photoelectric conversion element 83a. The lens 83b is included in the light receiver 83 in the present embodiment, but may be provided in the nozzle 65. In the latter case, the lens 83b can be disposed in the vicinity of the processing liquid L as compared with the former case. In the latter case, a lens 83b is provided for each nozzle 65, and the lens 83b moves together with the nozzle 65. On the other hand, in the former case, the number of lenses 83b can be reduced as compared with the latter case.
The inspection light enters the side surface of the flow of the treatment liquid L, and the scattered light exits the side surface of the flow of the treatment liquid L. In the interior of the nozzle 65, the flow of the processing liquid L is rectified as compared with the flow directly below the nozzle 65, and the side surface of the flow is not scattered.
Therefore, in order to improve the accuracy of foreign matter measurement, the irradiator 82 irradiates the treatment liquid L with inspection light via the nozzle 65, and the photoreceiver 83 receives scattered light from the treatment liquid L via the nozzle 65. The nozzle 65 is formed of, for example, quartz, resin, or the like so as to transmit both the inspection light and the scattered light.
The light receiver 83 receives scattered light in the present embodiment, but may receive transmitted light. The transmitted light is attenuated by the passage of foreign matter in the processing liquid L in the inspection light. The light receiver 83 includes a photoelectric conversion element 83a that converts the received transmitted light into an electrical signal. The number of occurrences of attenuation above the threshold value of the electrical signal indicates the number of foreign substances. The attenuation amount of the electric signal indicates the particle size of the foreign matter. When the light receiver 83 receives the transmitted light, the optical axis of the irradiator 82 (the center line CA of the inspection light) and the optical axis of the light receiver 83 are arranged on the same straight line passing through the center line CB of the flow of the treatment liquid L. The light receiver 83 is provided at the position of the absorption plate 84.
When the light receiver 83 receives scattered light, foreign matter having a small particle diameter can be measured as well as compared with the case where the light receiver 83 receives transmitted light. On the other hand, when the light receiver 83 receives the transmitted light, the absorption plate 84 is not necessary because the light receiver 83 is provided at the position of the absorption plate 84, unlike the case where the light receiver 83 receives the scattered light.
Next, an example of switching the nozzles 65 will be described with reference to fig. 7. As shown in fig. 7, the nozzle 65 may be provided in plural (e.g., 3). The plurality of nozzles 65 are fixed to, for example, one rotary head 66a, and are arranged at intervals on a circumference centered on a rotary shaft 66d of the rotary arm 66 b.
When the turning mechanism 66c turns the turning arm 66b around the turning shaft 66d, the plurality of nozzles 65 sequentially intersect the center line CA of the inspection light, and the nozzle 65 to which the inspection light is irradiated is switched. In order to smoothly switch the nozzles 65, as shown in fig. 6 (B), the nozzles 65 are not inserted into the passage portions 81a of the inspection substrate 81, and the inspection substrate 81 is disposed below the nozzles 65.
Next, an example of alignment between the center line CA of the inspection light and the center line CB of the flow of the processing liquid L will be described with reference to fig. 8. The foreign matter inspection substrate 8 may further include a position detector 85 (see fig. 5) for detecting a relative position of the center line CB of the flow of the processing liquid L with respect to the center line CA of the inspection light. The center line CB of the flow of the treatment liquid L is the center line of the nozzle 65.
The position detector 85 is attached to the illuminator 82, for example. The position detector 85 is, for example, a camera, and images the center line CA of the inspection light and the center line CB of the flow of the processing liquid L as shown in fig. 8. The center line CA of the inspection light is horizontal, and the center line CB of the flow of the processing liquid L is vertical. The position of the nozzle 65 is controlled so that the two center lines CA, CB are orthogonal.
According to the present embodiment, the position detector 85 detects the relative position of the center line CB of the flow of the processing liquid L with respect to the center line CA of the inspection light, and can align the two center lines CA and CB. By the positioning, the amount of the treatment liquid L passing through the inspection light per unit time can be fixed, and the foreign matter in the treatment liquid L can be quantitatively monitored.
Next, an example of the electric wiring will be described with reference to fig. 9. As shown in fig. 9, the foreign object inspection substrate 8 further includes a transmission unit 86, and the transmission unit 86 transmits the electric signal generated by the light receiver 83 to the outside and/or receives the electric power consumed by the irradiator 82 from the outside.
By transmitting the electric signal generated by the light receiver 83 to the outside through the transmission unit 86, the calculation processing for analyzing the electric signal and measuring the foreign matter can be performed by an external computer (for example, the control device 7). The foreign matter inspection substrate 8 can be made lightweight without mounting a CPU for performing arithmetic processing, a storage medium for storing arithmetic results, and the like on the inspection substrate 81. The transmission unit 86 also transmits the electric signal generated by the position detector 85 to the outside.
Further, by receiving the power consumed by the irradiator 82 from the outside by the transmission unit 86, it is not necessary to mount a rechargeable battery on the inspection board 81, and the foreign matter inspection board 8 can be reduced in weight. The transmission unit 86 also receives power consumed by the position detector 85 from the outside. The transmission unit 86 also receives an electric signal for controlling the illuminator 82 from the outside. The transmission unit 86 also receives an electric signal for controlling the position detector 85 from the outside.
By transmitting the electric signal and/or the electric power between the foreign matter inspection substrate 8 and the outside through the transmission portion 86, the number of components mounted on the inspection substrate 81 can be reduced, and the foreign matter inspection substrate 8 can be made lightweight. As a result, the difference in weight between the foreign-substance-test substrate 8 and the substrate W can be reduced, and both the foreign-substance-test substrate 8 and the substrate W can be conveyed by the same conveying device 5.
The transmission section 86 includes a terminal 86a for contacting the terminal 56a of the conveying device 5. The electrical signals and/or power can be transferred by wire. The transmission portion 86 protrudes from the peripheral edge of the inspection substrate 81 to bring the terminal 56a of the conveying device 5 into contact with the terminal 86a of the transmission portion 86 when the conveying device 5 picks up the foreign-substance inspection substrate 8.
Similarly, as shown in fig. 5, the transfer part 56 including the terminal 56a of the carrying device 5 protrudes from the carrying arm 51. The transfer arm 51 includes a main arm 51a and a pair of sub-arms 51b formed to be bifurcated from the front end of the main arm 51 a. A transmission unit 56 is provided at the tip of the main arm 51 a.
In the present embodiment, the transmission unit 86 of the foreign object inspection substrate 8 transmits the electric signal and/or the electric power by wire, but may transmit the electric signal and/or the electric power by wireless. However, in the case of the wired system, transmission of large electric power is possible as compared with the case of the wireless system.
As shown in fig. 9, the foreign matter inspection substrate 8 may further include an adsorption portion 87 to be adsorbed by the electromagnet 57 of the conveyance device 5. The adsorption portion 87 is formed of a magnetic material such as iron. The suction portions 87 are provided in a pair, for example, with the transmission portion 86 interposed therebetween. A pair of electromagnets 57 is provided so as to face the pair of suction portions 87.
When power supply to the electromagnet 57 is performed, an adsorption force is generated. This suction force can suppress unintended separation between the terminal 56a of the conveying device 5 and the terminal 86a of the transmission section 86, and can suppress transmission failure of an electric signal and/or electric power.
On the other hand, when the power supply to the electromagnet 57 is stopped, the attraction force disappears, and the foreign matter inspection substrate 8 can be easily detached from the conveyance device 5.
Note that the secondary battery, the CPU, and the storage medium are not included in the foreign object inspection substrate 8 in the present embodiment, but may be included in the foreign object inspection substrate 8. The data stored in the storage medium of the foreign substance inspection substrate 8 can be collectively transferred to, for example, the storage 23b. That is, the storage 23b may have a terminal for contacting the terminal 86a of the foreign matter inspection substrate 8 instead of the terminal 86a of the foreign matter inspection substrate 8, instead of the transfer arm 51.
Next, an example of positioning between the conveying device 5 and the foreign substance inspection substrate 8 will be described with reference to fig. 10. As shown in fig. 10, the foreign matter inspection substrate 8 may further include a positioning portion 88 for positioning with respect to the conveyance device 5. The positioning portion 88 can suppress the misalignment between the terminal 56a of the conveying device 5 and the terminal 86a of the transmission portion 86.
The positioning portion 88 is, for example, a concave portion, and positioning is performed by fitting the concave portion 88 to the convex portion 58 of the conveying device 5. The recess 88 is provided on the lower surface of the transmission portion 86, for example. In the present embodiment, the recess 88 is provided on the lower surface of the transmission portion 86, but may be provided on the lower surface of the suction portion 87.
The concave portion 88 may also have a tapered surface 88a for correcting the deviation between the concave portion 88 and the convex portion 58. Similarly, the convex portion 58 may have a tapered surface 58a for correcting the deviation between the convex portion 58 and the concave portion 88. In addition, only one of the two tapered surfaces 88a and 58a may be provided.
In addition, the arrangement of the concave portions and the convex portions may be reversed, and the positioning portions 88 may be convex portions, and the convex portions may be fitted into the concave portions of the conveying device 5 to perform positioning. The concave portion and the convex portion are provided in plural numbers, for example.
Next, an example of processing performed before S101 or after S106 in fig. 4 will be described with reference to fig. 11 to 14. Steps S201 to S215 shown in fig. 11 to 12 are performed under the control of the control device 7. The series of processing steps S201 to S215 may be performed periodically or in response to a request.
First, the conveyance device 5 picks up the foreign-matter inspection substrate 8 from the holding base 23b (S201). As a result, the terminal 56a of the conveying device 5 abuts against the terminal 86a of the transmission portion 86. The convex portion 58 of the transfer device 5 is fitted into the concave portion 88 of the foreign matter inspection substrate 8. Then, power is supplied to the electromagnet 57 of the conveyance device 5, and the attraction section 87 of the foreign matter inspection substrate 8 is attracted by the electromagnet 57.
Next, the control device 7 confirms the connection between the terminal 56a of the conveying device 5 and the terminal 86a of the transmission portion 86 (S202). For example, the control device 7 causes an electric signal requesting a reply to be sent from the conveying device 5 to the foreign matter inspection substrate 8. The control device 7 receives the returned electric signal from the foreign matter inspection substrate 8 by the conveyance device 5, and thereby confirms the connection.
Next, the transport device 5 picks up the substrate dummy 9 from the storage 23b (S203). The dummy substrate 9 has etching resistance to the processing liquid L. The material of the dummy substrate 9 is, for example, resin or ceramic. The order of S201 to S202 and S203 may be reversed, and S203 may be performed before S201 to S202.
Next, as shown in fig. 13 a, the conveyance device 5 conveys the foreign-matter inspection substrate 8 and the substrate dummy sheet 9 (S204). The transfer device 5 includes a first transfer arm 51A, a second transfer arm 51B, and a moving mechanism 52.
The first transfer arm 51A holds the foreign-matter inspection substrate 8. The second transfer arm 51B holds the dummy substrate 9. The moving mechanism 52 moves the first transfer arm 51A and the second transfer arm 51B independently. The first transfer arm 51A is disposed above the second transfer arm 51B. The foreign-matter inspection substrate 8 can be held above the substrate dummy sheet 9.
Next, as shown in fig. 13 (B), the transfer device 5 transfers the dummy substrate 9 into the liquid treatment module 6 (S205). The holding portion 62 (see fig. 3) of the liquid treatment module 6 horizontally holds the substrate dummy piece 9 from below the substrate dummy piece 9.
Next, as shown in fig. 13C, the transport device 5 transports the foreign-substance inspection substrate 8 into the liquid treatment module 6 (S206). The foreign-matter inspection substrate 8 is disposed above the holding portion 62 (see fig. 3) of the liquid treatment module 6 and above the substrate dummy sheet 9.
Next, the control device 7 causes the position detector 85 to detect the relative position of the center line CB of the flow of the processing liquid L with respect to the center line CA of the inspection light, and performs registration of the two center lines CA and CB (S207). For example, the position of the nozzle 65 is controlled so that the two center lines CA, CB are orthogonal.
Next, the control device 7 controls the liquid supply unit 64 of the liquid treatment module 6 and the foreign matter inspection substrate 8 to inspect foreign matter in the treatment liquid L (S208).
For example, as shown in fig. 14 (a), the irradiator 82 irradiates the treatment liquid L with inspection light. On the other hand, the light receiver 83 receives scattered light generated by the passage of foreign matter in the processing liquid L through the inspection light. The light receiver 83 converts the received scattered light into an electrical signal. The control device 7 analyzes the electric signal generated by the light receiver 83 to measure the foreign matter. The number of occurrences of the electrical signal having an intensity above the threshold value indicates the number of foreign objects. In addition, the intensity of the electric signal indicates the particle size of the foreign matter.
As described above, the light receiver 83 may receive transmitted light attenuated by passage of foreign matter in the processing liquid L through the inspection light. The light receiver 83 converts the received transmitted light into an electric signal. The control device 7 analyzes the electric signal generated by the light receiver 83 to measure the foreign matter. The number of occurrences of attenuation above the threshold value of the electrical signal indicates the number of foreign objects. The attenuation amount of the electric signal indicates the particle size of the foreign matter.
The control device 7 causes the transport device 5 to horizontally hold the inspection substrate 81 at a position above the holding portion 62 of the liquid treatment module 6. The inspection substrate 81 is provided with an irradiator 82 and a photoreceiver 83. The irradiator 82 irradiates the treatment liquid L with inspection light through the nozzle 65, and the photoreceiver 83 receives scattered light from the treatment liquid L through the nozzle 65.
The control device 7 causes the transport device 5 to horizontally hold the inspection substrate 81 above the dummy substrate 9, and rotates the dummy substrate 9 together with the holding portion 62. The processing liquid L is supplied to the center of the upper surface of the rotating dummy substrate 9 through the passage 81a of the inspection substrate 81, wets and spreads from the center of the upper surface of the dummy substrate 9 to the peripheral edge by centrifugal force, is thrown off from the peripheral edge, and is collected in the cup 68. The processing liquid L can be collected into the cup 68 by the rotating dummy substrate 9, and scattering of the processing liquid L can be suppressed.
Next, the control device 7 checks whether or not there is any processing liquid L that has not been checked (S209). The number and type of the processing liquids L to be inspected are stored in the storage medium 72 in advance and are appropriately referred to. The processing liquid L to be inspected is, for example, a chemical liquid. The number and type of the processing liquid L to be inspected can be changed as appropriate by the user of the substrate processing apparatus 1.
If there is any processing liquid L that has not been examined (YES at S209), the control device 7 performs the processing of S207 and thereafter again. S207 to S209 are repeatedly performed until all of the processing liquids L to be inspected are inspected.
On the other hand, if there is no processing liquid L that has not been inspected (S209: NO), the control device 7 causes the conveyance device 5 to carry the foreign matter inspection substrate 8 out of the liquid processing module 6 (S210). The foreign-substance inspection substrate 8 is retracted from directly above the holding portion 62 of the liquid treatment module 6.
Next, as shown in fig. 14B, the liquid supply unit 64 supplies the rinse liquid from the nozzle 65 to the dummy substrate 9 rotating together with the holding unit 62 (see fig. 3) to clean the dummy substrate 9 (S211). The chemical adhering to the dummy substrate 9 can be washed away.
Next, as shown in fig. 14C, the rotating unit 63 rotates the dummy substrate 9 together with the holding unit 62 (see fig. 3) to dry the dummy substrate 9 (S212). The rinse liquid remaining on the dummy substrate 9 is not supplied to the dummy substrate 9 but is discharged.
Next, the transport device 5 carries out the dummy substrate 9 from the liquid treatment module 6 (S213).
Next, the control device 7 checks whether or not there is an unchecked liquid treatment module 6 (S214). The number and positions of the liquid treatment modules 6 to be inspected are stored in the storage medium 72 in advance and are appropriately referred to. The number and location of the liquid processing modules 6 to be inspected can be changed by the user of the substrate processing apparatus 1 as appropriate.
If there is an unchecked liquid treatment module 6 (S214: "YES"), the control device 7 performs the processing from S204 again. Until all the liquid processing modules 6 to be inspected are inspected, S204 to S214 are repeatedly performed.
On the other hand, if there is no liquid processing module 6 that has not been inspected (S214: NO), the transport device 5 transports and stores the foreign-matter inspection substrate 8 and the substrate dummy wafer 9 in the storage container 23b (S215). After that, the present process ends.
According to the present embodiment, the control device 7 causes the transport device 5 to sequentially transport the foreign substance inspection substrate 8 to the plurality of liquid treatment modules 6, performs irradiation of the inspection light and generation of the electric signal in each of the plurality of liquid treatment modules 6, and analyzes the electric signal to measure the foreign substance. Since one foreign substance inspection substrate 8 is sequentially conveyed to the plurality of liquid treatment modules 6, the plurality of liquid treatment modules 6 can be inspected by one foreign substance inspection substrate 8. In addition, a difference in process quality between the plurality of liquid process modules 6 can be detected.
According to the present embodiment, the plurality of liquid treatment modules 6 sequentially supply a plurality of treatment liquids L to the substrate W. The plurality of types of processing liquids L have different chemical compositions, and the plurality of types of processing liquids L are supplied to the substrate W through different supply lines 67. Therefore, the control device 7 performs irradiation of the inspection light and generation of the electric signal for each of the treatment liquids L in the plurality of liquid treatment modules 6. The plurality of treatment liquids L can be inspected by one foreign matter inspection substrate 8.
Next, an example of the assignment module 11 and the inspection unit 12 will be described with reference to fig. 15. As shown in fig. 15, the substrate processing apparatus 1 further includes a distribution module 11 for distributing a plurality of types of processing liquids L to the plurality of liquid processing modules 6, and an inspection unit 12 for inspecting the processing liquids L for each type of processing liquid L in the distribution module 11. If the supply source of the processing liquid L is inspected by the inspection unit 12 and the supply destination of the processing liquid L is inspected by the foreign matter inspection substrate 8, the place where the foreign matter is mixed can be specified.
Next, an example of an image displayed on the display device will be described with reference to fig. 16. As shown in fig. 16, the control device 7 displays the inspection location for inspecting the foreign matter in the treatment liquid L and the inspection result of the foreign matter on the display device for each treatment liquid L. The examination site comprises, for example, a dispensing module 11 and a liquid treatment module 6. The inspection result of the foreign matter includes, for example, the particle diameter of the foreign matter and the number of the foreign matters. The control device 7 may also display the date when the inspection for the foreign matter was performed on the display device. The user of the substrate processing apparatus 1 can specify the location of the foreign matter entering the display device by viewing the image of the display device. The control device 7 may specify a place where the foreign matter is mixed instead of the user of the substrate processing apparatus 1.
The control device 7 may stop the operation of the liquid treatment module 6 or the dispensing module 11 based on the inspection result of the foreign matter. The control device 7 may operate a notification device such as a display device or an audio device based on the result of the foreign matter inspection, and may notify an alarm by an image or sound.
The foreign matter inspection substrate, the substrate processing apparatus, and the substrate processing method according to the present disclosure have been described above, but the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations may be made within the scope of the claims. These are of course also within the technical scope of the present disclosure.
This application claims priority based on Japanese patent application No. 2020-104751, filed on the patent office on 17.6.2020, and the entire contents of Japanese patent application No. 2020-104751 are incorporated herein by reference.
Description of the reference numerals
8: a foreign matter inspection substrate; 81: inspecting the substrate; 81a: a passage section; 82: an irradiator; 83: a light receptor; 83a: a photoelectric conversion element.

Claims (16)

1. A foreign matter inspection substrate is provided with:
an inspection substrate having a through-hole formed therein through which a processing liquid passes;
an irradiator for irradiating inspection light to the processing liquid;
a light receiver that receives scattered light generated by passage of foreign matter in the processing liquid through the inspection light or transmitted light attenuated by passage of foreign matter in the processing liquid through the inspection light,
wherein the light receiver includes a photoelectric conversion element for converting the received scattered light or transmitted light into an electric signal,
the irradiator and the photoreceiver are provided on the inspection substrate.
2. The foreign matter inspection substrate according to claim 1,
the apparatus further includes a position detector that detects a relative position of a center line of the flow of the processing liquid with respect to a center line of the inspection light.
3. The foreign matter inspection substrate according to claim 1 or 2,
the light-emitting device further includes a transmission unit that transmits the electrical signal generated by the light-receiving unit to the outside and/or receives power consumed by the irradiator from the outside.
4. The foreign matter inspection substrate according to claim 3,
the transmission unit includes a terminal for coming into contact with a terminal of an external carrying device.
5. The foreign matter inspection substrate according to claim 4,
the suction unit is provided for being sucked by an electromagnet of the conveyance device.
6. The foreign-matter inspection substrate according to claim 4 or 5,
the conveying device is provided with a positioning part for positioning relative to the conveying device.
7. A substrate processing apparatus includes:
a foreign matter inspection substrate according to any one of claims 1 to 6;
a plurality of liquid treatment modules for supplying the treatment liquid to a substrate;
a transfer device for transferring the substrate to the plurality of liquid treatment modules; and
a control device for controlling the foreign matter inspection substrate, the liquid treatment module, and the conveyance device,
wherein the control device causes the transport device to transport the foreign matter inspection substrate to the plurality of liquid treatment modules in sequence, causes the inspection light to be irradiated to each of the plurality of liquid treatment modules and generates the electric signal, and analyzes the electric signal to measure the foreign matter.
8. The substrate processing apparatus according to claim 7,
each of the plurality of liquid treatment modules sequentially supplies a plurality of types of the treatment liquid to the substrate,
the control device causes the irradiation of the inspection light and the generation of the electric signal to be performed for each of the treatment liquids in each of the plurality of liquid treatment modules.
9. The substrate processing apparatus according to claim 8,
further provided with: a dispensing module for dispensing a plurality of said treatment fluids to a plurality of said fluid treatment modules; and an inspection unit that inspects the foreign matter in the processing liquid for each of the processing liquids in the distribution module.
10. The substrate processing apparatus according to any one of claims 7 to 9,
the control device displays, for each of the treatment liquids, an inspection site where the foreign matter of the treatment liquid is inspected and an inspection result of the foreign matter on a display device.
11. The substrate processing apparatus according to any one of claims 7 to 10,
the liquid treatment module includes a rotary holding tray for horizontally holding the substrate and a nozzle for ejecting the treatment liquid from above to the substrate held by the rotary holding tray,
when the inspection light is irradiated and the electric signal is generated, the control device causes the transport device to horizontally hold the inspection substrate above the rotary holding tray.
12. The substrate processing apparatus according to claim 11,
the irradiator irradiates the inspection light to the treatment liquid through the nozzle,
the light receiver receives the scattered light or the transmitted light from the treatment liquid through the nozzle.
13. The substrate processing apparatus according to claim 11 or 12,
further comprises a substrate dummy, which is horizontally held by the rotary holding disk,
when the irradiation of the inspection light and the generation of the electric signal are performed, the control device causes the transport device to horizontally hold the inspection substrate at a position above the substrate dummy, and causes the substrate dummy to rotate together with the rotary holding disk.
14. The substrate processing apparatus according to claim 13,
after the irradiation of the inspection light and the generation of the electric signal are performed, the control device causes a rinse liquid to be supplied from the nozzle to the dummy substrate that rotates together with the rotating holding disk.
15. The substrate processing apparatus according to claim 13 or 14,
the conveying device comprises a first conveying arm for holding the foreign matter inspection substrate, a second conveying arm for holding the substrate dummy wafer, and a moving mechanism for independently moving the first conveying arm and the second conveying arm,
wherein the first transfer arm is disposed above the second transfer arm.
16. A method of processing a substrate, comprising:
supplying a treatment liquid to a substrate to treat the substrate;
irradiating the inspection light to the processing liquid by the irradiator of the foreign substance inspection substrate according to any one of claims 1 to 6;
receiving the scattered light or the transmitted light by the light receiver, and converting the scattered light or the transmitted light into an electric signal by the photoelectric conversion element; and
the electrical signal is analyzed to measure the foreign matter.
CN202180041508.4A 2020-06-17 2021-06-07 Foreign matter inspection substrate, substrate processing apparatus, and substrate processing method Pending CN115702338A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020104751 2020-06-17
JP2020-104751 2020-06-17
PCT/JP2021/021565 WO2021256314A1 (en) 2020-06-17 2021-06-07 Foreign matter inspection substrate, substrate processing device and substrate processing method

Publications (1)

Publication Number Publication Date
CN115702338A true CN115702338A (en) 2023-02-14

Family

ID=79267913

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180041508.4A Pending CN115702338A (en) 2020-06-17 2021-06-07 Foreign matter inspection substrate, substrate processing apparatus, and substrate processing method

Country Status (4)

Country Link
JP (1) JP7221451B2 (en)
KR (1) KR102539402B1 (en)
CN (1) CN115702338A (en)
WO (1) WO2021256314A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327638A (en) * 2003-04-24 2004-11-18 Matsushita Electric Ind Co Ltd Thin film coating device
CN1940537A (en) * 2005-09-26 2007-04-04 东京毅力科创株式会社 Photological foreign body checkout gear and treatment fluid applying apparatus containing same
CN101685070A (en) * 2008-09-24 2010-03-31 东京毅力科创株式会社 Optical foreign matter detector and treatment liquid coating device loaded therewith
TW201128182A (en) * 2010-02-08 2011-08-16 Ygk Corp Foreign object inspection device and method
CN106252196A (en) * 2015-06-03 2016-12-21 东京毅力科创株式会社 Substrate board treatment and substrate processing method using same
WO2017126360A1 (en) * 2016-01-21 2017-07-27 東京エレクトロン株式会社 Foreign matter detection device and foreign matter detection method
CN110871153A (en) * 2018-08-30 2020-03-10 株式会社斯库林集团 Substrate processing apparatus and substrate processing method
CN111009478A (en) * 2018-10-05 2020-04-14 东京毅力科创株式会社 Substrate processing apparatus and inspection method
CN111009460A (en) * 2018-10-05 2020-04-14 东京毅力科创株式会社 Substrate processing apparatus and inspection method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3798201B2 (en) 1999-10-26 2006-07-19 大日本スクリーン製造株式会社 Substrate processing equipment
JP2010066241A (en) * 2008-09-12 2010-03-25 Olympus Corp Substrate inspection apparatus and substrate inspection method
KR101019213B1 (en) * 2008-11-18 2011-03-04 세메스 주식회사 Substrate treating apparatus and method for treating substrate using the same
KR20110019239A (en) * 2009-08-19 2011-02-25 세메스 주식회사 Substrate treating apparatus and method for treating thereof
TWI743288B (en) 2017-01-20 2021-10-21 日商東京威力科創股份有限公司 Foreign body detection device, foreign body detection method and storage medium
JP6547871B2 (en) * 2018-04-06 2019-07-24 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327638A (en) * 2003-04-24 2004-11-18 Matsushita Electric Ind Co Ltd Thin film coating device
CN1940537A (en) * 2005-09-26 2007-04-04 东京毅力科创株式会社 Photological foreign body checkout gear and treatment fluid applying apparatus containing same
CN101685070A (en) * 2008-09-24 2010-03-31 东京毅力科创株式会社 Optical foreign matter detector and treatment liquid coating device loaded therewith
TW201128182A (en) * 2010-02-08 2011-08-16 Ygk Corp Foreign object inspection device and method
CN106252196A (en) * 2015-06-03 2016-12-21 东京毅力科创株式会社 Substrate board treatment and substrate processing method using same
WO2017126360A1 (en) * 2016-01-21 2017-07-27 東京エレクトロン株式会社 Foreign matter detection device and foreign matter detection method
CN110871153A (en) * 2018-08-30 2020-03-10 株式会社斯库林集团 Substrate processing apparatus and substrate processing method
CN111009478A (en) * 2018-10-05 2020-04-14 东京毅力科创株式会社 Substrate processing apparatus and inspection method
CN111009460A (en) * 2018-10-05 2020-04-14 东京毅力科创株式会社 Substrate processing apparatus and inspection method

Also Published As

Publication number Publication date
KR20220142546A (en) 2022-10-21
KR102539402B1 (en) 2023-06-01
WO2021256314A1 (en) 2021-12-23
JPWO2021256314A1 (en) 2021-12-23
JP7221451B2 (en) 2023-02-13

Similar Documents

Publication Publication Date Title
KR100686762B1 (en) Substrate processing system
TWI627693B (en) Substrate processing apparatus and substrate processing method
US20070190437A1 (en) Substrate processing apparatus
US9097681B2 (en) Inspection device, bonding system and inspection method
KR20140092778A (en) Alignment device and substrate processing apparatus
TWI750815B (en) Coating and developing device and coating and developing method
KR102136084B1 (en) System for inspecting edge area of wafer
CN113702269A (en) Chemical liquid supply device and coating and developing system
KR102136085B1 (en) Apparatus for inspecting edge area of wafer
KR20090107400A (en) Wafer testing apparatus and processing equipment having the same
TWI638400B (en) Substrate processing device, substrate processing method, and memory medium
JP2000019095A (en) Device and method for measuring degree of cleanness of clean room
KR20200092256A (en) Substrate processing apparatus, substrate processing system, and substrate processing method
KR102539402B1 (en) Foreign material inspection substrate, substrate processing apparatus, and substrate processing method
US20210202285A1 (en) Chemical liquid supplying system and method of supplying chemical liquid
JP2006228862A (en) Device and method for removing foreign substance and processing system
JP2005101584A (en) Apparatus for inspecting substrate
JP3060394B2 (en) Surface treatment equipment
TW202312308A (en) Bubble measurement unit, substrate treating apparatus including the same, and bubble measurement method
KR20190119803A (en) Apparatus for inspecting edge area of wafer and method using the same
KR20140125167A (en) monitoring device for clean room
CN210573186U (en) Photomask detection device
TW202218022A (en) Substrate processing apparatus and substrate processing method
CN112433446A (en) Photomask inspection apparatus and photomask cleaning method
JPH05240797A (en) Surface inspecting device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination