CN115702033A - Dehumidifying air conditioner - Google Patents

Dehumidifying air conditioner Download PDF

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Publication number
CN115702033A
CN115702033A CN202080101926.3A CN202080101926A CN115702033A CN 115702033 A CN115702033 A CN 115702033A CN 202080101926 A CN202080101926 A CN 202080101926A CN 115702033 A CN115702033 A CN 115702033A
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conditioner
region
gas
air
heater
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宋东郁
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LG Electronics Inc
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LG Electronics Inc
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/26Drying gases or vapours
    • B01D53/261Drying gases or vapours by adsorption
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/0407Constructional details of adsorbing systems
    • B01D53/0438Cooling or heating systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/26Drying gases or vapours
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/86Catalytic processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2253/00Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10Inorganic adsorbents
    • B01D2253/106Silica or silicates
    • B01D2253/108Zeolites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2255/00Catalysts
    • B01D2255/20Metals or compounds thereof
    • B01D2255/207Transition metals
    • B01D2255/20761Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2258/00Sources of waste gases
    • B01D2258/02Other waste gases
    • B01D2258/0216Other waste gases from CVD treatment or semi-conductor manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2259/00Type of treatment
    • B01D2259/40Further details for adsorption processes and devices
    • B01D2259/40083Regeneration of adsorbents in processes other than pressure or temperature swing adsorption
    • B01D2259/40088Regeneration of adsorbents in processes other than pressure or temperature swing adsorption by heating

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Environmental & Geological Engineering (AREA)
  • Biomedical Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Gases (AREA)
  • Central Air Conditioning (AREA)

Abstract

A dehumidifying air conditioner includes: a gas displacer for removing moisture by displacing atmospheric air and supplying the moisture-removed gas into the chamber to lower the first moisture concentration in the chamber to a second moisture concentration; and a purifier that circulates the gas in the chamber to maintain the chamber within the target moisture concentration range and not at the second moisture concentration.

Description

Dehumidifying air conditioner
Technical Field
Embodiments relate to a dehumidifying air conditioner.
Background
In the manufacturing process of the electronics industry, such as semiconductors and OLEDs, even minute amounts of impurities, such as moisture, will directly affect yield.
Therefore, the manufacturing process of electronic parts/products such as semiconductors and OLEDs is performed in a chamber (also referred to as a "glove box") that is replaced with Clean Dry Air (CDA) gas purified to a very high level while being secretly isolated from the outside.
In the related art, the moisture concentration in the chamber is first reduced with nitrogen or CDA gas, and then the chamber is circulated to maintain the target moisture concentration. For example, nitrogen or CDA gas is used to reduce the moisture concentration in the chamber from 209,000ppm to 50ppm.
In the related art, a large amount of nitrogen is consumed so that it is reduced to a moisture concentration of 50ppm, which results in expensive process maintenance costs.
In the related art, since the flow rate of nitrogen is not uniformly supplied to the chamber, a separate device is required to uniformly adjust the flow rate of nitrogen in the chamber.
In the related art, a pipe for supplying nitrogen should be installed, and thus the apparatus structure is complicated.
Disclosure of Invention
Technical problem
The present embodiment is directed to solving the above problems and other problems.
Another object of the present embodiment is to provide a dehumidifying air-conditioner capable of reducing process maintenance costs.
Another object of the present embodiment is to provide a dehumidifying air-conditioner having a simple device structure.
Technical scheme
According to an aspect of the present embodiment for achieving the above or other objects, a dehumidifying air conditioner includes: a gas displacer for removing moisture by displacing atmospheric air and supplying the moisture-removed gas into the chamber to lower the first moisture concentration in the chamber to a second moisture concentration; and a purifier that circulates the gas in the chamber to maintain the chamber within a target moisture concentration range that is lower than the second moisture concentration.
Advantageous effects
The effect of the dehumidifying air conditioner according to the present embodiment is described as follows.
According to at least one of the embodiments, the gas displacer may directly displace atmospheric air to remove moisture and supply the moisture-removed gas into the chamber to reduce the moisture concentration in the chamber. Therefore, in the case where the temperature in the chamber must be lowered from the first moisture concentration to the second moisture concentration in the chamber often for a long time, costs are not separately generated, and therefore, the process maintenance costs can be greatly reduced.
According to at least one of the embodiments, the first moisture concentration in the chamber is reduced to the second moisture concentration by the gas displacer before the purifier is operated, and then adjusted to a range of target moisture concentration lower than the second moisture concentration by the purifier, and thus, the dehumidification of the chamber can be effectively managed. In addition, since the range from the first moisture concentration to the target moisture concentration can be rapidly adjusted, the dehumidification efficiency can be improved. In particular, the gas displacer does not use gas of a gas cylinder, which generates cost, and can generate gas for supply to the chamber using atmospheric air, so that process maintenance cost can be greatly reduced.
According to at least one of the embodiments, the diameters of the plurality of holes of the dispersion plate increase toward the outside from the central portion of the first region (region defined on the dispersion plate) of the casing, so that the atmospheric air in the second region (region defined below the dispersion plate) does not flow intensively in the central portion of the first region but flows uniformly in the entire first region. Therefore, since moisture has been removed from the atmospheric air uniformly supplied to the second region by the moisture absorbent in the entire region of the second region, saturation of the moisture absorption power of the moisture absorbent filled in the first region is uniformly achieved in the entire first region, so that the moisture absorption performance can be improved. In addition, by uniformly distributing the atmospheric air in the second region to the first region by means of the diameters of the plurality of holes of the dispersion plate, the saturation point of the moisture absorbent is further delayed and the regeneration process is also delayed, so that the number of regeneration processes can be reduced to improve the dehumidification efficiency.
According to at least one of the embodiments, by the heater unit having the double coil structure, when the moisture catalyst is regenerated, the heat source of the heater unit is uniformly absorbed by the entire moisture absorbent of the first region of the housing to form a uniform temperature gradient, the time to reach the regeneration temperature of the moisture absorbent can be shortened, and the regeneration process time can be shortened.
Further areas of applicability of the present embodiments will become apparent from the detailed description provided hereinafter. However, since various changes and modifications within the spirit and scope of the present embodiments will become apparent to those skilled in the art, it is intended that certain embodiments (such as the detailed description and the preferred embodiments) be considered as given by way of example only.
Drawings
Fig. 1 shows a dehumidifying air conditioner according to one embodiment.
Fig. 2 shows a gas displacer according to an embodiment.
Fig. 3 shows an internal view of the gas displacer of fig. 2 with some of the housing removed.
Fig. 4 is a sectional view illustrating the gas displacer of fig. 2.
Fig. 5 shows the coil unit and the dispersion plate as seen in the upper diagonal direction.
Fig. 6 shows the coil unit and the dispersion plate as seen in the lower diagonal direction.
Fig. 7 is a plan view showing the dispersion plate.
Fig. 8 shows a temperature distribution of the first region of the gas displacer.
Fig. 9 shows a traveling path of gas in the moisture absorbent.
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical spirit of the present invention is not limited to the described embodiments, but may be implemented in various different forms, and one or more components thereof may be selectively combined, substituted and used between the embodiments within the technical spirit of the present invention. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted in a meaning commonly understood by one of ordinary skill in the art to which the present invention belongs, unless explicitly and specifically defined and described and commonly used terms (such as predefined terms) may be interpreted in consideration of the contextual meaning of the related art. Furthermore, the terminology used in the embodiments of the present invention is intended to describe the embodiments and is not intended to limit the present invention. In this specification, the singular form may also include the plural form, and unless otherwise specified in the phrase, when describing "at least one (or more than one) of A, B and C", it may include one or more of all combinations combinable with A, B and C. Further, in describing the components of the embodiments of the present invention, terms such as 1 st, 2 nd, A, B, (a), (b) and the like may be used. Such terms are intended to distinguish one element from another element, and are not intended to limit the nature, order, or sequence of the elements. Also, if one element is described as being "connected," "coupled" or "coupled" to another element, it may include not only a direct connection, link, or coupling of the element to the other element, but also a case where the element is "connected," "coupled," or "coupled" due to the other element between the element and the other element. Further, when it is described as being formed or disposed "on (top) or" on (bottom) "of each component, the upper (top) or the lower (bottom) includes a case where two elements are in direct contact with each other, and a case where one or more other elements are formed or disposed between the two elements. Further, when it is stated as "upward (upper) or downward (lower)", not only an upward direction but also a downward direction based on one component may be included.
Fig. 1 shows a dehumidifying air conditioner according to one embodiment.
Referring to fig. 1, a dehumidifying air conditioner 100 according to an embodiment may include a gas displacer 110 and a scrubber 200. The dehumidifying air-conditioner 100 according to one embodiment may or may not include the chamber 300. The dehumidifying air-conditioner 100 according to one embodiment may include more components than these components.
In one embodiment, the gas displacer 110 may remove moisture by displacing atmospheric air. In one embodiment, the gas displacer 110 may supply the gas from which moisture has been removed to the chamber 300. In this way, the first moisture concentration of the chamber 300 may be reduced to the second moisture concentration by the dehumidified gas. For example, the first moisture concentration may be the same as the moisture concentration in the atmosphere, but is not limited thereto.
According to one embodiment, the gas displacer 110 may directly displace atmospheric air to remove moisture and supply the moisture-removed gas to the chamber 300 to reduce the moisture concentration in the chamber 300. In other words, in the present embodiment, it is not necessary to separately purchase a gas at a separate cost, and a gas from which moisture has been removed may be used as a gas for reducing the moisture concentration in the chamber 300. Therefore, in the case where the temperature in the chamber 300 must be lowered from the first moisture concentration to the second moisture concentration often for a long time, a separate cost is not required, so that the process maintenance cost can be greatly reduced.
On the other hand, the scrubber 200 may circulate the gas of the chamber 300 to maintain the chamber 300 within a range of the target moisture concentration lower than the second moisture concentration. That is, in a state where the moisture concentration is sufficiently reduced by the gas displacer 110, the gas in the chamber 300 is circulated so that the gas is supplied back to the chamber 300 via the scrubber 200. Accordingly, the moisture concentration in the chamber 300 may be adjusted to the range of the target moisture concentration.
The purifier 200 may remove oxygen or moisture from the gas supplied from the chamber 300 and then supply it back to the chamber 300. To this end, the purifier 200 may include a moisture absorbent and/or a catalyst (not shown). For example, molecular sieves may be used as the moisture absorbent, and copper particles may be used as the catalyst, but are not limited thereto. For example, the moisture absorbent may remove moisture from the gas supplied from the chamber 300. For example, oxygen from the gas supplied from the chamber 300 may be separated by a catalyst and changed into water vapor (H) 2 O)。
For example, the first moisture concentration may be a moisture concentration in the atmosphere. For example, the first moisture concentration may be about 209,000ppm, but is not limited thereto. For example, the second moisture concentration may be about 50ppm, but is not limited thereto. For example, the target moisture concentration may range from about 1ppm to about 10ppm, but is not limited thereto.
In general, since the chamber 300 is of a large capacity, it is difficult to maintain the first moisture concentration in the chamber 300 within the range of the target moisture concentration by using the scrubber 200. Therefore, the gas displacer 110 can be added to the present embodiment. Therefore, before the operation of the purifier 200, the first moisture concentration in the chamber 300 is reduced to the second moisture concentration by the gas displacer 110 and then adjusted to a target moisture concentration range lower than the second moisture concentration by the purifier 200. Therefore, the dehumidification of the chamber 300 may be effectively managed. In addition, since the moisture concentration can be quickly adjusted from the first moisture concentration to the target moisture concentration range, the dehumidification efficiency can be improved. In particular, the gas displacer 110 does not use gas from a gas cylinder, which creates costs, but can use distributed atmospheric air to create the gas supplied to the chamber 300. Therefore, the process maintenance cost can be greatly reduced.
Fig. 2 shows a gas displacer according to an embodiment.
Referring to fig. 2, a gas displacer 110 according to an embodiment may include a plurality of gas displacers 111 to 114. The plurality of gas displacers 111 to 114 may be disposed adjacent to each other. Although four gas displacers 111 to 114 are shown in the drawing, fewer or more gas displacers may be provided.
For example, the plurality of gas displacers 111 to 114 may be provided in an even number. For example, the plurality of gas displacers 111 to 114 may be provided in 2, 4, 6, 8, or the like. For example, when two gas displacers 111, 113 are provided, when one gas displacer 111 is used to remove water from the atmospheric air, the other gas displacer 113 may be used for regeneration of the moisture absorbent (140 of fig. 9).
The gas displacers 111 to 114 may include a moisture absorbent 140. Moisture can be removed from the atmospheric air by the moisture absorbent 140. For example, molecular sieves can be used as the moisture absorbent, but are not limited thereto.
When the gas displacers 111 to 114 are used for a long period of time, the moisture absorbent continues to absorb moisture, and eventually becomes saturated. In this case, the moisture removing performance of the moisture absorbent may be greatly reduced. Therefore, the performance of the desiccant should be periodically restored to its original state through the regeneration process of the gas displacers 111 to 114. For example, the gas displacers 111 to 114 may perform the regeneration process once for 2 weeks, but are not limited thereto.
If there is one gas displacer 111 to 114, the gas displacer 111 to 114 cannot be used to remove moisture while performing the regeneration process.
Therefore, when the gas displacers 111 to 114 are provided in an even number, even if one gas displacer is used to perform the regeneration process, the other gas displacer can be used for moisture removal. Accordingly, the dehumidifying process of the chamber 300 may be continuously performed without stopping.
The gas displacers 111 to 114 according to the present embodiment may include a housing 120. The housing 120 maintains the appearance of the gas displacers 111 to 114, and may support components to be stored therein, such as a heater unit (130 of fig. 3) and a dispersion plate (150 of fig. 3). That is, the heater unit 130 and the dispersion plate 150 may be installed in the case 120.
The case 120 may be formed of a material having excellent insulating properties and supporting strength. For example, it may be formed of stainless steel, but is not limited thereto.
The shape of the case 120 may correspond to, for example, the external appearance of the dispersion plate 150, but is not limited thereto. For example, if the dispersion plate 150 has a shape having 8 corners and 8 outer sides, the outer side of the housing 120 may also have 8 corners and 8 outer sides. In this way, by forming the casing 120 to correspond to the shape of the dispersion plate 150, the outer side of the dispersion plate 150 may be installed in direct contact with the inner side of the casing 120 to eliminate the separation between the dispersion plate 150 and the casing 120. Therefore, the atmospheric air can be moved up and down in the dispersion plate 150 only through the dispersion plate 150.
The gas displacers 111 to 114 according to the present embodiment may include a first pipe 161 and a second pipe 162.
For example, the first pipe 161 is a pipe into which atmospheric air enters, and the second pipe 162 may be a pipe through which atmospheric air circulates in the case 120 and then is discharged into the chamber 300. Accordingly, one side of the first pipe 161 is exposed to the atmosphere, so that atmospheric air can be introduced at any time. One side of the second pipe 162 may be connected with the chamber 300 to supply the gas discharged from the second pipe 162 to the chamber 300. For example, the gas discharged in the second pipe 162 may be a gas from which moisture has been removed.
For example, the first and second pipes 161 and 162 may be installed at one side, for example, at an upper side of the housing 120. For example, in the first and second pipes 161 and 162, the housings 120 may be disposed apart from each other at the top of the housings. For example, the first and second tubes 161 and 162 may be disposed adjacent to a central portion of the housing 120. For example, the first tube 161 may be installed at a first side of the central portion of the case 120, and the second tube 162 may be installed at a second side of the central portion of the case 120.
For example, the first tubes 161 of each of the adjacent gas displacers 111 to 114 may be connected by a first main tube (not shown). The first main tube and the first tube 161 may be integrally formed, but are not limited thereto.
As an example, the first pipe 161 of the first gas displacer 111 and the first pipe 161 of the second gas displacer 112 may be connected by a first main pipe, and the first pipe 161 of the third gas displacer 113 and the first pipe 161 of the fourth gas displacer 114 may be connected by another first main pipe. For example, a first main pipe connecting the first gas displacer 111 and the second gas displacer 112 and another first main pipe connecting the third gas displacer 113 and the fourth gas displacer 114 may be connected to each other. In this case, the first main pipe and the further first main pipe may be selected by at least one gate valve so that atmospheric air may be supplied to the first main pipe or the further first main pipe.
As another example, the first pipe 161 of the first gas displacer 111 and the first pipe 161 of the third gas displacer 113 may be connected by a first main pipe, and the first pipe 161 of the second gas displacer 112 and the first pipe 161 of the fourth gas displacer 114 may be connected by another first main pipe.
In one example, the second tubes 162 of each of the adjacent gas displacers 111 to 114 are connected by a second main tube (not shown), and the second main tube and the second tubes 162 may be integrally formed, but are not limited thereto.
For example, the second pipe 162 of the first gas displacer 111 and the second pipe 162 of the second gas displacer 112 may be connected by a second main pipe. For example, the second pipe 162 of the third gas displacer 113 and the second pipe 162 of the fourth gas displacer 114 may be connected by another second main pipe. For example, a second main pipe connecting the first gas displacer 111 and the second gas displacer 112 and another second main pipe connecting the third gas displacer 113 and the fourth gas displacer 114 may be connected to each other. In this case, the second main pipe and the further second main pipe may be selected by at least one or more gate valves so that atmospheric air may be supplied to the second main pipe or the further second main pipe.
As another example, the second tube 162 of the first gas displacer 111 and the second tube 162 of the third gas displacer 113 may be connected by a second main tube, and the second tube 162 of the second gas displacer 112 and the second tube 162 of the fourth gas displacer 114 may be connected by another second main tube.
The gas displacers 111 to 114 according to the present embodiment may include a power terminal block 133. The power terminal block 133 may be included in the heater unit (130 of fig. 3), but is not limited thereto.
For example, the power terminal block 133 may be mounted on the upper side of the case 120. For example, the power terminal block 133 may be disposed adjacent to the first and second tubes 161 and 162. For example, the power terminal block 133 may be installed to be separated from the first and second tubes 161 and 162.
For example, each power terminal block 133 of the adjacent gas displacers 111 to 114 may be electrically connected by a connection line (not shown). Power may be applied to the power terminal block 133 through a connection line.
Although not shown, the plurality of gas displacers 111 to 114 may be electrically connected to one connection line, and a voltage divider (divider) may be disposed between the plurality of gas displacers 111 to 114 and the connection line. In this case, the power supplied to one connection line may be supplied to the power terminal station 133 of at least one or more of the plurality of gas displacers 111 to 114 through the voltage divider.
Fig. 3 shows an internal view with some of the casings removed from the gas displacer of fig. 2, and fig. 4 is a sectional view showing the gas displacer of fig. 2.
Referring to fig. 3 and 4, the gas displacers 111 to 114 according to the present embodiment may include a dispersion plate 150.
The interior of the housing 120 may have an empty space. The space may be divided into a first area 121 and a second area 122 by the dispersion plate 150. That is, of the space in the casing 120, the space above the dispersion plate may be defined as a first region 121, and the space below the dispersion plate may be defined as a second region 122.
For example, the dispersion plate may control the flow of atmospheric air. For example, the dispersion plate can uniformly adjust the flow of atmospheric air.
For example, the first pipe 161 may be connected to the second region 122 through the first side (i.e., the first region 121 and the dispersion plate of the case 120).
As shown in fig. 7, the dispersion plate may include a hole 155. The hole 155 may be a pipe connection hole to which the first pipe 161 is connected. The first pipe 161 may extend from the first region 121 through the first side of the housing 120 in a downward direction and then be connected with the hole 155 of the dispersion plate. Atmospheric air entering the first tube 161 may be supplied to the second region 122.
The dispersion plate may include a plurality of holes 151 to 153. The diameters of the plurality of holes 151 to 153 may be different from each other. Atmospheric air may flow through the plurality of holes 151 to 153. For example, air supplied to the second region 122 through the plurality of holes 151 to 153 via the first pipe 161 may flow to the first region 121.
As one example, the diameters of the plurality of holes 151 to 153 may increase outward from the central portion of the first region 121 in the horizontal direction. Accordingly, the atmospheric air in the second region 122 may flow more from the periphery of the first region 121 than the central portion of the first region 121.
Therefore, the atmospheric air in the second region 122 may uniformly flow throughout the first region 121 without densely flowing to the central portion of the first region 121 by the diameters of the plurality of holes 151 to 153 of the dispersion plate. Therefore, as shown in fig. 9, since moisture is removed from the atmospheric air uniformly supplied to the second region 122 by the moisture absorbent in the entire region of the second region 122, saturation of the moisture absorbent filled in the first region 121 is uniformly achieved in the entire region of the first region 121. Therefore, the moisture absorption performance can be improved. In addition, by uniformly distributing atmospheric air in the second region 122 to the first region 121 by means of the diameters of the plurality of holes 151 to 153 of the dispersion plate, the saturation point of the moisture absorbent is further delayed and the regeneration process is also delayed. Therefore, the number of regeneration processes can be reduced to improve dehumidification efficiency.
In another example, the plurality of holes 151 to 153 may include a plurality of first holes 151 formed at a central portion of the dispersion plate and a plurality of second holes 152, 153 formed at a periphery around the central portion of the dispersion plate. In this case, the diameter of the second holes 152, 153 may be larger than the diameter of the first hole 151.
For example, the diameters of the plurality of first holes 151 may be the same, but are not limited thereto. For example, the diameters of the plurality of second holes 152, 153 may be different from each other, but are not limited thereto.
Accordingly, since the diameters of the plurality of second holes 152, 153 formed at the periphery of the dispersion plate are larger than the diameters of the plurality of first holes 151 formed in the central portion of the dispersion plate, the atmospheric air in the second region 122 may uniformly flow in the entire first region 121 without densely flowing to the central portion of the first region 121. Therefore, as shown in fig. 9, since moisture is removed from the atmospheric air uniformly supplied to the second region 122 by the moisture absorbent in the entire region of the second region 122, saturation of the moisture absorbent filled in the first region 121 is uniformly achieved in the entire region of the first region 121. Therefore, the moisture absorption performance can be improved. Further, since the diameters of the plurality of second holes 152, 153 formed on the periphery of the dispersion plate are larger than the diameters of the plurality of first holes 151 formed in the central portion of the dispersion plate, the atmospheric air in the second region 122 can be uniformly distributed to the first region 121. Therefore, the saturation point of the moisture absorbent is delayed and the regeneration process is also delayed. Therefore, the number of regeneration processes can be reduced to improve dehumidification efficiency.
The gas displacers 111 to 114 according to the present embodiment may include a heater unit 130. The heater unit 130 may be used for a regeneration process of the moisture absorbent. That is, when the moisture absorbent is saturated in moisture absorption performance due to continuous use of the moisture absorbent, moisture molecules captured by electrostatic force in the moisture absorbent may be obtained by heating the heater unit 130 to obtain thermal energy, and separated from the moisture absorbent and discharged as water vapor (H) 2 O). A separate pipe (not shown) may be provided to discharge such water vapor (H) in addition to the first pipe 161 and the second pipe 162 2 O)。
During regeneration, CDA gas is injected into the first region 121 of the housing 120. Therefore, the regeneration of the moisture absorbent can be effectively achieved by such CDA gas.
For example, heater unit 130 may have a dual coil structure, as shown in fig. 5 and 6. For example, the heater unit 130 may be installed in the first region 121 of the case 120.
For example, the heater unit 130 may include a first heater 131, a second heater 132, and a power terminal block 133.
For example, the first and second heaters 131 and 132 may be disposed on the dispersion plate. The first and second heaters 131 and 132 may be disposed adjacent to the top surface of the dispersion plate, but are not limited thereto.
For example, the first and second heaters 131 and 132 may be respectively connected to the power terminal block 133, but are not limited thereto.
For example, the first and second heaters 131 and 132 may be simultaneously heated by power supplied to the power terminal block 133, but is not limited thereto. For example, the heating temperature of each of the first and second heaters 131 and 132 may be different from each other, but is not limited thereto. For this, power applied to the first and second heaters 131 and 132 may be different.
For example, the heating temperature of the second heater 132 may be equal to or greater than the heating temperature of the first heater 131. The heat generated by the heating of the first and second heaters 131 and 132 is transferred to the central portion of the first region 121 instead of the periphery, so that the temperature of the central portion may be higher than that of the periphery of the first region 121. Therefore, in order to heat uniformly in the entire first region 121, the heating temperature of the second heater 132 may be greater than the heating temperature of the first heater 131.
Although not shown, an insulating plate may be installed on an inner surface of the case 120 contacting the first and second heaters 131 and 132. The insulating plate may be formed of an insulating material coated inside the case 120. By such an insulating plate, heat in the first region 121 of the case 120 is not lost to the outside of the case 120. Accordingly, since the target heating temperature of the first region 121 of the casing 120 can be more rapidly reached, the regeneration process can be rapidly performed and efficiently managed.
For example, the second heater 132 may be installed to surround the first heater 131. For example, the first heater 131 may be installed adjacent to a central portion of the first region 121 of the case 120, and may be connected to the first region 121 of the upper side of the power terminal block 133. For example, the second heater 132 may be installed in a circumference around a central portion of the first region 121 of the case 120, and may be connected with the second region 122 of the upper side of the power terminal block 133.
For example, the first heater 131 may form a closed loop electrical path with the power terminal block 133. That is, the current of the power terminal block 133 may flow to one side of the first heater 131, and pass through to the power terminal block 133 through the other side. For example, the second heater 132 may form a closed loop electrical path with the power terminal block 133. That is, the current of the power terminal block 133 may flow to one side of the second heater 132, and pass through to the power terminal block 133 through the other side.
For example, the first heater 131 may include the first coil unit 135 wound in a plurality of turns in a vertical direction. One side and the other side of the first coil unit 135 may be connected to the first region 121 of the upper side of the power terminal block 133. In this case, the current of power terminal block 133 may flow through first coil unit 135 through one side of first coil unit 135 and then through the other side of first coil unit 135 to power terminal block 133.
For example, the second heater 132 may include the second coil unit 136 wound in a plurality of turns in a vertical direction. One side and the other side of the second coil unit 136 may be connected to the second region 122 of the upper side of the power terminal block 133. In this case, the current of the power terminal block 133 may flow through the second coil unit 136 through one side of the second coil unit 136 and then through the other side of the second coil unit 136 to the power terminal block 133.
For example, the first coil unit 135 may maintain the same diameter in a vertical direction, and the second coil unit 136 may maintain the same diameter in a vertical direction, but is not limited thereto.
For example, the second coil unit 136 may be installed to be wound around the first coil unit 135. For example, the first coil unit 135 and the second coil unit 136 may be separated from each other. In this case, the distance between the first coil unit 135 and the second coil unit 136 may be smaller than the radius of the first coil unit 135.
For example, the first coil unit 135 may be disposed adjacent to a central portion of the first region 121 of the case 120, and the second coil unit 136 may be disposed at a periphery of the case 120.
For example, the first tube 161 into which atmospheric air enters may be disposed inside the first coil unit 135. That is, the first tube 161 may be disposed in the hollow portion of the first coil unit 135. The first coil unit 135 and the second coil unit 136 are disposed in the first region 121 so that there is a space constraint for the first tube 161 to be installed therein. Accordingly, since no component is provided in the hollow portion of the first coil unit 135, the first tube 161 is provided in the hollow portion of the first coil unit 135 to achieve an optimal layout structure per unit area.
Therefore, by the arrangement of the first and second heaters 131 and 132, as shown in fig. 8, the portions (the first and second portions 165 and 166) corresponding to each of the first and second heaters 131 and 132 have a higher temperature than the other portions (the third portion 167). For example, the second portion 166 corresponding to the second heater 132 may have a higher temperature distribution in a wider area than the first portion 165 corresponding to the first heater 131, but is not limited thereto. The heat in the first and second portions 165, 166 may be transferred to the periphery, i.e., to the third portion 167, eventually creating a uniform temperature gradient in the first region 121.
Therefore, in the present embodiment, since the heater unit 130 having the dual coil structure is provided, when the moisture catalyst is regenerated, the heat source generated by the heater unit 130 is uniformly absorbed by the moisture absorbent in the entire region of the first region 121 of the case 120. Therefore, a temperature gradient is formed, the time to reach the regenerable temperature of the moisture absorbent can be shortened, and the time of the regeneration process can also be shortened.
The above detailed description is not to be taken in a limiting sense, but is to be taken in an illustrative sense. The scope of the present embodiment should be determined by reasonable interpretation of the appended claims, and any change within the equivalent scope of the present embodiment is included in the scope of the present embodiment.
Industrial applicability
The present embodiment can be applied to a device requiring dehumidification. For example, embodiments may be applied to process units that require dehumidification. For example, the embodiments can be applied to a manufacturing process apparatus of a semiconductor or a display panel.

Claims (20)

1. A desiccant air-conditioner comprising:
a gas displacer for removing moisture by displacing atmospheric air and supplying the moisture-removed gas into a chamber to lower a first moisture concentration in the chamber to a second moisture concentration; and
a purifier circulating the gas in the chamber to maintain the chamber within a target moisture concentration range that is lower than the second moisture concentration.
2. The dehumidification air conditioner of claim 1, wherein the gas displacer comprises:
a housing having a first region and a second region below the first region;
a heater unit having a dual coil structure installed in the first region;
a moisture absorbent filled in the first region; and
a dispersion plate installed between the first region and the second region.
3. The dehumidifying air conditioner of claim 2, wherein the gas displacer includes:
a first pipe passing through the first side of the casing, the first region and the dispersion plate and communicating with the second region; and
a second tube connected to the chamber and communicating with the first region through a second side of the housing.
4. The dehumidifying air-conditioner of claim 3, wherein air is supplied to the second area through the first duct and is supplied to the first area via the dispersion plate, and
after moisture is removed from air by the moisture absorbent, the air is supplied to the chamber through the second duct.
5. The desiccant air conditioner of claim 2, wherein the second zone is a space.
6. The dehumidifying air-conditioner according to claim 2, wherein the heater unit comprises:
a first heater;
a second heater installed adjacent to the first heater; and
a power terminal block mounted at one side of the case and connected to the first heater and the second heater, respectively.
7. The desiccant air-conditioner of claim 6, wherein the second heater is installed to surround the first heater.
8. The dehumidifying air-conditioner of claim 7, wherein the first heater is installed near a central portion of the first zone, and the second heater is installed in a peripheral portion of the first zone around the central portion.
9. The dehumidifying air-conditioner of claim 8, wherein the first heater includes a first coil unit wound in a plurality of turns in a vertical direction,
the second heater includes a second coil unit wound in a plurality of turns in the vertical direction, and
the second coil unit is installed to surround the first coil unit.
10. The dehumidifying air-conditioner according to claim 9, wherein the first coil unit is disposed near the central portion, and
the second coil unit is disposed on the peripheral portion.
11. The dehumidifying air-conditioner according to claim 2, wherein the dispersion plate includes a plurality of holes.
12. The dehumidifying air-conditioner of claim 11, wherein diameters of the plurality of holes increase from a central portion of the first region toward an outer side in a horizontal direction.
13. The dehumidifying air-conditioner of claim 11, wherein the plurality of holes include a plurality of first holes formed in a central portion of the dispersion plate and a plurality of second holes formed in a peripheral portion of the dispersion plate surrounding the central portion, and
the diameter of the second hole is larger than the diameter of the first hole.
14. The desiccant air-conditioner of claim 13, wherein the diameters of the first plurality of holes are the same.
15. The dehumidifying air-conditioner of claim 13, wherein diameters of the plurality of second holes are different from each other.
16. The dehumidifying air-conditioner according to claim 2, wherein the dispersion plate has a polygonal shape.
17. The desiccant air-conditioner of claim 16, wherein the dispersion plate has an octagonal shape.
18. The desiccant air-conditioner of claim 2, wherein the desiccant is a molecular sieve.
19. The desiccant air-conditioner of claim 2, wherein the gas displacer is configured in plurality.
20. The dehumidifying air-conditioner of claim 2, wherein when at least one or more gas displacers among the plurality of gas displacers are used to remove water from air, the remaining gas displacers are used for regeneration of the moisture absorbent.
CN202080101926.3A 2020-06-10 2020-06-10 Dehumidifying air conditioner Pending CN115702033A (en)

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Application Number Priority Date Filing Date Title
PCT/KR2020/007536 WO2021251520A1 (en) 2020-06-10 2020-06-10 Dehumidifying air conditioner

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002229651A (en) * 2001-01-30 2002-08-16 Toshiba Plant Kensetsu Co Ltd Method and device for controlling humidity inside of board
JP2008190746A (en) * 2007-02-02 2008-08-21 Fuji Electric Retail Systems Co Ltd Dehumidifying air conditioner
KR101071350B1 (en) * 2010-04-01 2011-10-07 삼성물산 주식회사 Hybrid desiccant cooling oac system for cleanroom
KR101920821B1 (en) * 2016-09-01 2019-02-15 파나스(주) Cleanroom air conditioner
JP6383467B1 (en) * 2017-07-19 2018-08-29 株式会社西部技研 Dehumidifying air conditioner

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