CN115701751A - Antenna module with built-in components and manufacturing method thereof - Google Patents

Abstract

The application discloses antenna module group containing components and parts and a manufacturing method thereof, wherein the manufacturing method of the antenna module group containing components and parts comprises the following steps: providing a first substrate and a second substrate; welding a component on one side surface of the first substrate, and forming an array antenna on the other side surface of the first substrate; forming a prepreg on one side surface of the second substrate, and forming an interface pin on the other side surface of the second substrate; and arranging one side surface of the first substrate, on which the components are welded, close to one side surface of the second substrate, on which the prepreg is formed, so as to form the antenna module. Through the method, the thickness of the antenna module is reduced.

Description

Antenna module with built-in components and manufacturing method thereof

Technical Field

The invention relates to the technical field of millimeter wave 5G, in particular to an antenna module with a built-in component and a manufacturing method thereof.

Background

At present, as the 5G (fifth generation mobile communication) business is closer to us, the application of millimeter waves on mobile communication devices is more emphasized. Millimeter waves refer to electromagnetic waves with a wavelength of 1mm to 10mm, that is, a frequency of 30 to 300GHz (for example, 28GHz, 37GHz, 39GHz, and the like, wherein a frequency of about 60GHz is an unlicensed frequency band), and the available bandwidth of the millimeter waves is far larger than that of a currently used 6GHz microwave frequency band.

Due to the high-frequency characteristic of millimeter waves, the circuit transmission line loss of the antenna at the radio frequency front end needs to be reduced as much as possible, the traditional mode that the antenna and each functional module are designed and processed separately and then connected through a high-frequency cable cannot be met, and the problem that the integrated design of the antenna array and the radio frequency front end needs to be solved urgently is solved.

In the design process of millimeter wave AiP module project, because of the height reason of the radio frequency chip after the encapsulation, when designing the motherboard, need carry out the fluting on the motherboard, dodge the position of opening the chip on the AIP, influence the motherboard design.

Disclosure of Invention

The application provides an antenna module with a built-in component and a manufacturing method thereof, which are used for reducing the thickness of the antenna module.

In order to solve the technical problem, the present application provides a method for manufacturing an antenna module with a built-in component, where the method for manufacturing the antenna module with the built-in component includes: providing a first substrate and a second substrate; welding a component on the first side surface of the first substrate, and forming an array antenna on the second side surface; forming a prepreg on the first side surface of the second substrate, and forming an interface pin on the second side surface; and pressing the first side surface of the first substrate and the first side surface of the second substrate by using a pressing process to form the antenna module.

After the step of forming a prepreg on one side surface of the second substrate and forming an interface pin on the other side surface, the method further includes: and manufacturing a groove with the same size as the component on the surface of the prepreg.

The step of pressing the first side surface of the first substrate and the first side surface of the second substrate by using a pressing process to form the antenna module comprises the following steps: and correspondingly pressing the components and the grooves.

Wherein the component comprises a bare chip of the radio frequency transceiver chip.

The interface pin comprises a plurality of ball-planting bonding pads; the step of forming a prepreg on one side surface of the second substrate and forming an interface pin on the other side surface of the second substrate includes: and welding a plurality of ball planting welding pads on one side surface of the second substrate far away from the prepreg.

The first substrate comprises a through hole, and the through hole penetrates through the first substrate to enable the array antenna of the first substrate to be connected with the component.

Wherein the first substrate includes a plurality of PCB boards.

In order to solve the above technical problem, the present application further provides an antenna module including a component, the antenna module includes: the antenna comprises a first substrate, a second substrate and a plurality of radiating fins, wherein a component is welded on the first side surface of the first substrate, and an array antenna is formed on the second side surface of the first substrate; the first side surface of the second substrate is provided with a prepreg, and the second side surface of the second substrate is provided with an interface pin; wherein the first side of the first substrate is disposed proximate to the first side of the second substrate.

The prepreg surface is provided with a groove with the same size as the component, and the groove is arranged corresponding to the component.

Wherein the component comprises a bare chip of the radio frequency transceiver chip.

The beneficial effect of this application is: this application is through first base plate and second base plate, at the first side welding components and parts of first base plate, the second side forms array antenna, form the prepreg at the first side of second base plate, the second side forms the interface pin, utilize the pressfitting technology to carry out the pressfitting with the first side of first base plate and the first side of second base plate, in order to form the antenna module, make the components and parts of the first side of first base plate and the prepreg of the first side of second base plate correspond the setting, thereby bury the bare chip of radio frequency transceiver chip in the antenna module, the holistic thickness of antenna module has been reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic flowchart illustrating an embodiment of a method for manufacturing an antenna module including components according to the present application;

fig. 2 is a schematic structural diagram of an embodiment of an antenna module including components according to the present application;

fig. 3 is a schematic structural diagram of another embodiment of an antenna module including a component according to the present application.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plural" includes at least two in general, but does not exclude the presence of at least one.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be understood that the terms "comprises," "comprising," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

It should be noted that, if directional indications (such as up, down, left, right, front, back, 8230; etc.) are involved in the embodiment of the present invention, the directional indications are only used for explaining the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the figure), and if the specific posture is changed, the directional indications are correspondingly changed.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, fig. 1 is a schematic flow chart illustrating an embodiment of a method for manufacturing an antenna module with a component. As shown in fig. 1, includes:

step S11: a first substrate and a second substrate are provided.

The first substrate and the second substrate may each include one PCB or a plurality of PCBs.

Step S12: and welding components on the first side surface of the first substrate, and forming an array antenna on the second side surface.

The element comprises a bare chip of the radio frequency transceiver chip, the bare chip of the radio frequency transceiver chip is an unpackaged radio frequency transceiver chip, and the height of the antenna module can be reduced by using the bare chip of the radio frequency transceiver chip.

Wherein, a copper foil is formed on the surface of one side of the first substrate, on which the components are welded, and the components are welded on the copper foil.

Specifically, flip-chip bonding is used to bond components to the first side of the first substrate.

And forming a copper layer with a certain thickness on the second side surface of the first substrate far away from the component, and manufacturing the copper layer into a plurality of antenna units which are arranged in an array mode by using the modes of photo-development, chemical etching and the like so as to form the array antenna.

The first substrate is further provided with a through hole, and the through hole penetrates through the first substrate so that the array antenna located on the second side face of the first substrate is electrically connected with the component located on the first side face of the first substrate.

The first substrate can be a substrate formed by a plurality of PCB boards, in one embodiment, the first substrate comprises a first PCB board and a second PCB board, two opposite side surfaces of the first PCB board and the second PCB board are respectively provided with a copper foil layer, and the first PCB board and the second PCB board are connected through a connecting layer to form a complete first substrate. The first PCB board and the second PCB board are both provided with through holes, and the through holes penetrate through the first PCB board, the second PCB board and the connecting layer, so that the copper foil layer on the surface of the first PCB board is electrically connected with the copper foil layer on the surface of the second PCB board. The connection layer may be a prepreg, which is an insulating resin layer.

Step S13: and forming a prepreg on the first side surface of the second substrate, and forming interface pins on the second side surface.

The grooves with the same size as the components are formed in the surface of the prepreg and are arranged corresponding to the components to accommodate the components on the first substrate, so that the components cannot be damaged in the process of pressing the components on one side of the first substrate and the prepreg on one side of the second substrate.

The interface pins comprise ball-planting bonding pads, and in the embodiment, a plurality of ball-planting bonding pads can be arranged according to actual requirements so that the formed antenna module containing components can be connected with an external device.

Step S14: and laminating the first side surface of the first substrate and the first side surface of the second substrate by utilizing a laminating process to form the antenna module.

Specifically, the side face, on which the components are welded, close to the side face, on which the prepreg is formed, of the second substrate is pressed by using a pressing process, so that the side face, on which the components are welded, of the first substrate is close to the side face, on which the prepreg is formed, of the second substrate, so that the antenna module containing the components is formed, the first substrate and the second substrate are connected through the prepreg, the components are embedded between the first substrate and the second substrate, the overall performance of the antenna module is guaranteed, and the thickness of the antenna module is reduced.

The beneficial effect of this embodiment is: through first base plate and second base plate, weld components and parts at one side of first base plate, another side forms array antenna, forms the prepreg at one side of second base plate, and another side forms the interface pin, and the side that has welded components and parts with first base plate is close to the side that the second base plate is formed with the prepreg and sets up to form the antenna module, buries the antenna module through the bare chip of radio frequency transceiver chip in, has reduced the holistic thickness of antenna module.

The present application further provides an antenna module including a component, specifically please refer to fig. 2, and fig. 2 is a schematic structural diagram of an embodiment of the antenna module including a component. As shown in fig. 2, includes: the array antenna comprises a first substrate 1, a component 11 welded on a first side surface of the first substrate 1, an array antenna 12 formed on a second side surface, a prepreg 21 formed on the first side surface of the second substrate 2 close to the first substrate 1, and an interface pin 22 formed on the second side surface far away from the first substrate 1, wherein the component 11 of the first substrate 1 is arranged close to the prepreg 21 of the second substrate 2.

In this embodiment, the first substrate 1 is further provided with a pad or copper layer 101 on the first side thereof adjacent to the component 11, so that the component 11 can be flip-chip bonded to the surface of the first substrate 1. The thickness and shape and size of the pad or copper layer 101 are not limited herein. The first substrate 1 is further provided with a through hole 102, the through hole 102 penetrates through the first substrate so as to electrically connect the array antenna on one side of the first substrate 1 and the component on the other side of the first substrate 1, and in another embodiment, the through hole 102 may also penetrate through the first substrate 1 and the second substrate 2 so as to electrically connect the pad or copper layer of the first substrate 1 and the interface pin 22 of the second substrate 2. Wherein, this through-hole is kept away from components and parts and is set up.

The surface of the prepreg 21 close to the component 11 in this embodiment is also provided with a groove having the same size as the component 11, so that the component 11 is not crushed in the process of laminating the first substrate 1 and the second substrate 2.

The first substrate 1 and the second substrate 2 are both PCB boards, the main component of the PCB boards is a PCB resin layer, and the prepreg 21 is arranged between the first substrate 1 and the second substrate 2 to effectively reduce the hardness between the substrates, thereby protecting the component 11 between the first substrate 1 and the second substrate 2. In the embodiment, the prepreg 21 is a resin layer that deforms under the thermal compression, so that the thickness of the whole antenna module is further reduced after the prepreg 21 between the first substrate 1 and the second substrate 2 is compressed. In addition, the prepreg 21 in this embodiment has viscosity, and the first substrate 1 and the second substrate 2 can be connected to form an integral body after lamination.

Further, in this embodiment, the component 11 may be a bare chip of the radio frequency transceiver chip, and the bare chip has a simpler structure and a thinner thickness than a packaged chip, so that the thickness of the antenna module can be further reduced by disposing the bare chip of the radio frequency transceiver chip between the first substrate 1 and the second substrate 2, and disposing the bare chip of the radio frequency transceiver chip inside the antenna module realizes packaging of the bare chip of the radio frequency transceiver chip, thereby protecting the performance of the bare chip of the radio frequency transceiver chip. The component 11 may also be other devices such as a power divider, and is not limited herein.

The beneficial effect of this embodiment is: the first substrate and the second substrate of the antenna module integrate components inside the antenna module, so that the overall thickness of the antenna module is reduced, and the overall performance of the antenna module is guaranteed. In the design of the traditional antenna module, the components are arranged on the external motherboard of the antenna module, so that the antenna module can realize the radio frequency transceiving function only by being connected with the specific motherboard, and the overall thickness of the antenna module is increased.

The present application further includes another antenna module including a component, specifically referring to fig. 3, and fig. 3 is a schematic structural diagram of another embodiment of the antenna module including a component. As shown in fig. 3, includes: the PCB comprises a first substrate and a second substrate, wherein the first substrate comprises a first PCB 31, a second PCB 32, a third PCB 33 and a fourth PCB 34, and the second substrate comprises a fifth PCB 35. The array antenna L1 is formed on one side surface of the first PCB 31, the second copper foil layer L2 is formed on the other side surface of the first PCB, the third copper foil layer L3 and the fourth copper foil layer L4 are disposed on two opposite sides of the second PCB 32, the fifth copper foil layer L5 and the sixth copper foil layer L6 are disposed on two opposite sides of the third PCB 33, and the seventh copper foil layer L7 and the eighth copper foil layer L8 are disposed on two opposite sides of the fourth PCB 34. The second copper foil layer L2 of the first PCB 31 is disposed adjacent to the third copper foil layer L3 of the second PCB 32, wherein a first partition P1 is further disposed between the first PCB 31 and the second PCB 32, so that the first PCB 31 and the second PCB 32 are disposed at an interval. The fourth copper foil layer L4 of the second PCB 32 is disposed adjacent to the fifth copper foil layer L5 of the third PCB 33, wherein a second partition plate P2 is disposed between the second PCB 32 and the third PCB 33, so that the second PCB 32 and the third PCB 33 are disposed at an interval. The sixth copper foil layer L6 of the third PCB 33 is disposed adjacent to the seventh copper foil layer L7 of the fourth PCB 34, wherein a third partition P3 is further disposed between the third PCB 33 and the fourth PCB 34, so that the third PCB 33 and the fourth PCB are disposed at an interval. The first spacer P1, the second spacer P2, and the third spacer P3 may be made of a PP resin layer or a prepreg, which is not limited herein.

And a component Q is welded on the surface of the eighth copper foil layer L8 on the side surface of the fourth PCB 34 far away from the third PCB 33, wherein the component Q is a bare chip of the radio frequency transceiver chip in the embodiment, and specifically, the component Q is welded on the surface of the eighth copper foil layer L8 by using flip chip bonding. One side of the eighth copper foil layer L8, which is far away from the fourth PCB 34, is provided with a fifth PCB 35, one side of the fifth PCB 35, which is close to the eighth copper foil layer L8, is further provided with a prepreg P, one side of the prepreg P, which is close to the eighth copper foil layer L8, is provided with a groove, the size of which is the same as that of the component Q, the groove is arranged corresponding to the component Q, the prepreg P of the fifth PCB 35 and the eighth copper foil layer L8 of the fourth PCB 34 are specifically connected through a press-fit process, so as to encapsulate the component Q, and the component Q is formed inside the antenna module. The groove is formed in the prepreg P on one side close to the component Q, so that the component Q cannot be crushed by the PCB in the pressing process, and the component Q is protected. In addition, the prepreg P has viscosity after being pressed to connect the third PCB 33 and the fourth PCB 34.

An interface pin L9 is further disposed on one side of the fifth PCB 35, which is away from the antenna array of the first PCB 31, where the interface pin L9 includes a plurality of ball-mounting pads, and the number of the ball-mounting pads may be set according to actual requirements, which is not limited herein. Specifically, a plurality of ball-planting pads are soldered or otherwise welded to a side surface of the fifth PCB 35 away from the fourth PCB, so as to facilitate connection with an external device, so that the formed antenna module can be directly used.

In this embodiment, the first PCB 31, the second PCB 32, the third PCB 33 and the fourth PCB 34 are further provided with a through hole T, and the through hole T penetrates through the first PCB 31, the second PCB 32, the third PCB 33 and the fourth PCB 34, so that the copper foil layers on the first PCB 31, the second PCB 32, the third PCB 33 and the fourth PCB 34 can be conducted with each other.

In other embodiments, a through hole T 'may be further disposed on the first PCB 31, the second PCB 32, the third PCB 33, the fourth PCB 34, and the fifth PCB 35, and the through hole T' penetrates through the first PCB 31, the second PCB 32, the third PCB 33, the fourth PCB 34, and the fifth PCB 35, so that the copper foil layers on the first PCB 31, the second PCB 32, the third PCB 33, the fourth PCB 34, and the fifth PCB 35 can be conducted with each other, thereby forming a complete antenna module. Wherein, this through-hole T' keeps away from components and parts and sets up to avoid damaging components and parts.

It should be noted that, in this embodiment, the first substrate includes four PCB boards, and the second substrate includes one PCB board, in other embodiments, the number of the first substrate and the number of the second substrate may be set according to actual requirements, and this embodiment is a specific implementation manner in the second embodiment, and does not limit the first substrate and the second substrate.

The beneficial effect of this embodiment is: through the base plate with a plurality of PCB board pressfitting formation antenna module, form array antenna and plant the ball pad in the relative both sides of base plate to set up components and parts between two wherein PCB boards, with components and parts encapsulation inside the antenna module, thereby both reduced the holistic thickness of antenna module, guaranteed the effect that components and parts played in the antenna module again.

The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.

Claims (10)

1. A manufacturing method of an antenna module with a built-in component is characterized by comprising the following steps:

providing a first substrate and a second substrate;

welding a component on the first side surface of the first substrate, and forming an array antenna on the second side surface;

forming a prepreg on the first side surface of the second substrate, and forming an interface pin on the second side surface;

and pressing the first side surface of the first substrate and the first side surface of the second substrate by using a pressing process to form the antenna module.

2. The method according to claim 1, wherein after the step of forming a prepreg on one side of the second substrate and forming interface pins on the other side of the second substrate, the method further comprises:

and manufacturing a groove with the same size as the component on the surface of the prepreg.

3. The method according to claim 2, wherein the step of laminating the first side of the first substrate and the first side of the second substrate by a lamination process to form the antenna module comprises:

and correspondingly pressing the component and the groove.

4. The method of manufacturing of claim 1, wherein the component comprises a die of a radio frequency transceiver chip.

5. The method of manufacturing according to claim 1, wherein the interface pins comprise a plurality of ball-attachment pads;

the step of forming a prepreg on one side surface of the second substrate and forming an interface pin on the other side surface of the second substrate includes:

and welding a plurality of ball planting bonding pads on one side surface of the second substrate, which is far away from the prepreg.

6. The method of manufacturing according to claim 1, wherein the first substrate includes a through hole, and the through hole penetrates through the first substrate to connect the array antenna of the first substrate and the component.

7. The method of manufacturing of claim 1, wherein the first substrate comprises a plurality of PCB boards.

8. The utility model provides an antenna module of built-in components and parts which characterized in that, antenna module includes:

the antenna comprises a first substrate, a second substrate and a plurality of radiating fins, wherein a component is welded on the first side of the first substrate, and an array antenna is formed on the second side of the first substrate;

the first side surface of the second substrate is provided with a prepreg, and the second side surface of the second substrate is provided with an interface pin;

wherein the first side of the first substrate is disposed proximate to the first side of the second substrate.

9. The antenna module of claim 8,

the prepreg surface is provided with a groove with the same size as the component, and the groove is arranged corresponding to the component.

10. The antenna module of claim 8,

the component comprises a bare chip of a radio frequency transceiver chip.

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