CN115684199A - Edge detection image capturing device for wafer manufacturing - Google Patents
Edge detection image capturing device for wafer manufacturing Download PDFInfo
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- CN115684199A CN115684199A CN202211188713.6A CN202211188713A CN115684199A CN 115684199 A CN115684199 A CN 115684199A CN 202211188713 A CN202211188713 A CN 202211188713A CN 115684199 A CN115684199 A CN 115684199A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000003708 edge detection Methods 0.000 title claims abstract description 11
- 238000001514 detection method Methods 0.000 claims abstract description 8
- 241000282472 Canis lupus familiaris Species 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 7
- 230000007547 defect Effects 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims 6
- 230000002040 relaxant effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 50
- 239000003344 environmental pollutant Substances 0.000 abstract description 15
- 231100000719 pollutant Toxicity 0.000 abstract description 15
- 238000000034 method Methods 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 239000000356 contaminant Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of wafer detection, and discloses an edge detection image capturing device for wafer manufacturing, which comprises a carrying platform, wherein a placing platform is arranged on the upper surface of the carrying platform, an inner side part is arranged on the inner side of the placing platform, an expansion part is arranged on the upper surface of the carrying platform, a sliding part is sleeved on the outer side of the expansion part, a connecting plate is arranged at the output end of the expansion part, a driving gear is arranged in an inner cavity of the sliding part, a rotating part is arranged on the inner wall of the left side of the sliding part, a connecting rope is wound on the left side of the driving gear, a driven gear is arranged in the sliding part, a limiting part is arranged in the sliding part, striking plates are arranged at the end parts of a left rod body and a right rod body of the driven gear, an accommodating cavity is defined by the outer side surface of the inner side part and the inner side surface of the placing platform, and a contact part is arranged at the upper position of the accommodating cavity. According to the invention, through the arrangement of the telescopic piece and the sliding piece, the probability of contacting a large amount of wafers with pollutants is reduced, and the quality of the wafers is indirectly improved.
Description
Technical Field
The invention relates to the technical field of wafer detection, in particular to an edge detection image capturing device for wafer manufacturing.
Background
The wafer refers to a silicon wafer used for manufacturing a semiconductor circuit, and after the manufacturing is completed, an edge detection image capturing device is needed to detect the edge of the wafer, so that unqualified wafers are screened out, and the influence of the unqualified wafers on related devices is avoided.
When the existing edge detection and image capture device is used, firstly, a single wafer is placed on a placing table of a wafer carrying table through a mechanical arm, then, negative pressure is generated inside the placing table, so that the wafer on the surface of the placing table is adsorbed and fixed, then, the wafer carrying table drives the wafer to intermittently move horizontally, the edge of the wafer is shot through a camera, and the shot image is transmitted to a computer, so that whether the edge of the wafer has defects or not is judged by the computer.
Disclosure of Invention
Aiming at the defects of the existing edge detection image capturing device in the background technology in the using process, the invention provides the edge detection image capturing device for wafer manufacturing, which has the advantages of reducing the probability of contacting a large amount of wafers with pollutants and improving the wafer quality, and solves the technical problems in the background technology.
The invention provides the following technical scheme: an edge detection and image capture device for wafer manufacturing comprises a carrier, wherein a placing table is fixedly arranged on the upper surface of the carrier, a manipulator is arranged on one side of the carrier and used for placing a wafer on the surface of the placing table, a camera is arranged at the position on the left side of the wafer and used for shooting an edge image of the wafer, a detection mechanism is arranged on the other side of the carrier and used for detecting whether the image shot by the camera has defects or not, an inner side piece is arranged on the inner side of the placing table, an expansion piece is fixedly arranged at the position, located on the inner side of the inner side piece, on the upper surface of the carrier, an expansion piece is fixedly arranged at the position, located on the inner side of the inner side piece, on the outer side of the expansion piece, a sliding piece is sleeved in a sliding mode, a connecting plate is fixedly arranged at the output end of the expansion piece, the periphery of the connecting plate and the inner wall of the sliding piece form sealing fixation, and a driving gear is rotatably arranged at the position, located on the upper side of the connecting plate, in an inner cavity of the sliding piece, the left side inner wall fixed mounting of slider has the rotating member, the driving gear is connected with the rotating member, the left side winding of driving gear has the connection rope, the both ends of connecting the rope form fixed connection with the left side of driving gear, the medial surface of interior part respectively, the inside position that is located the driving gear top of slider rotates installs and forms the driven gear of meshing transmission with the driving gear, the locating part is installed to the inside position that is located the driven gear top of slider for limit driven gear anticlockwise rotation, the equal fixed mounting in tip of the driven gear left and right sides body of rod has the striking plate, the lateral surface of interior part encloses jointly with the medial surface of placing the platform and becomes to hold the chamber, the sealed movable mounting in upper portion position who holds the chamber has the contact, the contact forms fixed connection with the striking plate.
Preferably, the placing table is provided with two sections in a sealing manner, a filter screen is arranged between the bottom surface of the inner member and the inclined surface of the placing table, the bottom surface of the filter screen is in sealing contact with the inclined surface of the inner side position of the placing table, a fixing plate is fixedly mounted on the bottom surface of the filter screen, the bottom surface of the fixing plate is fixedly connected with the upper surface of the carrying table, a fixing groove is formed in the position, located below the filter screen, inside the placing table, and the outer side surface of the fixing plate is attached to the outer side wall body of the fixing groove.
Preferably, the driving gear comprises wheel body, connecting rod, spout, the teeth of a cogwheel, dog, no. two dogs and elastic component, the wheel body is installed to the position that lies in the connecting plate upside in the slider inner chamber, the equal fixed mounting in the left and right sides of wheel body has the connecting rod, the right side the connecting rod forms to rotate with the right side inner wall of slider and is connected, the spout has been seted up to the inside circumference equidistance of wheel body, a lateral wall body of spout articulates there is the teeth of a cogwheel, the teeth of a cogwheel can income spout, common fixed mounting has an elastic component between the bottom surface of the teeth of a cogwheel and the lateral wall of spout, the equal fixed mounting in the left and right sides of the teeth of a cogwheel has a dog, the position fixed mounting that lies in the notch on the spout inner wall has No. two dogs, no. one dog and No. two dogs mutually contact for the restriction teeth of a cogwheel excessively stretch out the spout, the side that lies in the clockwise on the teeth of a cogwheel sets up for ARC structure, the number of the teeth of driving gear is less than driven gear number, the side that lies in the clockwise on the teeth of driven gear sets up at left side, connect rope surface of connecting rod, the one end and the connecting rod of connecting rope form fixed connection.
Preferably, the rotating member is composed of a shell and a torsion spring, the torsion spring is fixedly mounted on the circumferential inner wall of the shell, and the connecting rod is fixedly connected with the other end of the torsion spring on the left side.
Preferably, the lower surface of the striking plate contacts the upper surface of the inner member, and a section of the connecting rope near the inner member is arranged in a loose manner.
Preferably, the slider forms sealed sliding connection with the extensible member, the cavity that lies in connecting plate below position in the slider inner chamber is the suction chamber, the inside of connecting plate vertically runs through and has seted up No. two openings, fixed mounting has a check valve in No. two openings, the circulation direction of a check valve is for by the cavity that lies in connecting plate top position in the slider inner chamber to suction chamber circulation, the gas guide hole has been seted up to the position that lies in the connecting plate below in the slider inside, the one end and the suction chamber intercommunication of gas guide hole, the bottom position at the slider lateral surface is seted up to the other end of gas guide hole.
Preferably, the position of the inside of the placing table below the containing cavity is provided with an air cavity, a push plate is movably mounted in the air cavity in a sealing manner, a second elastic part is fixedly mounted between the lower surface of the push plate and the bottom surface of the air cavity, an air inlet is formed in the inner side position of the inside of the placing table, one end of the air inlet is communicated with the cavity in the air cavity, which is located at the upper side position of the push plate, the other end of the air inlet is formed in the bottom position of the inner side surface of the placing table, a hose is fixedly mounted between the inner side surface of the placing table and the outer side surface of the sliding part, the length of the hose is greater than the linear distance between the air guide hole and the air inlet, the hose is communicated with the air guide hole, a second check valve is fixedly mounted in the air inlet, the flow direction of the second check valve is communicated from the hose to the air inlet, an air outlet is formed in the position of the inside of the placing table above the air cavity and used for communicating the cavity located at the upper side position of the push plate and the containing cavity, the air cavity, the upper side port of the air outlet faces the lower surface of the contact part, a third check valve is fixedly mounted in the air outlet, and the flow direction of the straight hole is communicated from the straight hole to the annular hole.
Preferably, place the inboard position that is located venthole upside port of platform and seted up the spacing groove, the slip joint has the piece of opening and shutting in the spacing groove, the piece of opening and shutting comprises closed ring and catch bar, closed ring and spacing groove form the slip joint, the last fixed surface of closed ring installs the catch bar, the upper end of catch bar and the lower surface contact of contact, common fixed mounting has No. three elastic component between the lower surface of closed ring and the bottom surface of spacing groove, the piece of opening and shutting is two sections sealed settings.
The invention has the following beneficial effects:
1. according to the invention, through the arrangement of the telescopic piece and the sliding piece, after the wafer leaves the placing table, the telescopic piece drives the sliding piece to move upwards, so that the driving gear drives the driven gear to rotate for half a circle, the bottom surface and the upper surface of the contact piece are replaced, and then the sliding piece moves downwards, so that the contact piece does not rotate.
2. According to the invention, through the arrangement of the impact plate and the inner side part, when the sliding part moves downwards to the initial position, the impact plate is driven to impact the upper surface of the inner side part, so that the contact element generates vibration, and pollutants on the bottom surface of the contact element are separated from the contact element through the vibration, thereby further reducing the probability that a large number of wafers contact the pollutants.
3. According to the invention, through the arrangement of the air outlet and the push plate, when the contact element moves down to the initial position, the push plate extrudes the gas in the air cavity, so that the gas is blown to the bottom surface of the contact element through the air outlet, further, pollutants adhered to the bottom surface of the contact element are further promoted to fall off, and the probability of contacting a large number of wafers with the pollutants is reduced.
Drawings
FIG. 1 is a schematic view of an installation state of a carrier and a placing table according to the present invention;
FIG. 2 is a schematic view of the internal structure of the placement table of the present invention;
FIG. 3 is an enlarged view of a portion of the structure A of FIG. 2 according to the present invention;
FIG. 4 is an enlarged view of a portion of the structure shown at B in FIG. 2;
FIG. 5 is a schematic view showing the engagement state of the driving gear and the driven gear according to the present invention;
FIG. 6 is an enlarged view of a portion of the structure of FIG. 5 at C;
FIG. 7 is a schematic view of an internal structure of a driving gear according to the present invention.
In the figure: 1. carrying platform; 2. a placing table; 3. an inner member; 4. filtering with a screen; 5. a fixing plate; 6. a telescoping member; 7. a slider; 8. a connecting plate; 9. a driving gear; 10. a rotating member; 11. connecting ropes; 12. a driven gear; 13. a stopper; 14. an impact plate; 15. a contact member; 16. a gas-guide hole; 17. an air cavity; 18. pushing the plate; 19. an air inlet; 20. a hose; 21. an air outlet; 22. a limiting groove; 23. and (5) opening and closing the piece.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, an edge detecting and imaging device for wafer manufacturing includes a carrier 1, a placing table 2 is fixedly clamped on an upper surface of the carrier 1, a manipulator (not shown in the drawings) is disposed on one side of the carrier 1 for taking out a wafer in a containing box and placing the wafer on a surface of the placing table 2, a camera is disposed at a position above or below the left of the wafer for capturing an edge image of the wafer, a detecting mechanism (not shown in the drawings) is disposed on the other side of the carrier 1 for detecting whether the image captured by the camera has a defect, an inner side member 3 is disposed inside the placing table 2, a filter screen 4 is welded to a bottom surface of the inner side member 3, a lower end of the filter screen 4 is connected to an inclined surface of the placing table 2, an expansion member 6 is fixedly disposed at a position on the inner side of the inner side member 3 on the upper surface of the carrier 1 (the expansion member 6 is an electrically controlled expansion link in the prior art), the outer side of the telescopic part 6 is sleeved with a sliding part 7, the sliding part 7 is in sliding connection with the telescopic part 6, the output end of the telescopic part 6 extends into a cavity of the sliding part 7, the output end of the telescopic part 6 is welded with a connecting plate 8, the periphery of the connecting plate 8 and the inner wall of the sliding part 7 are welded and fixed, the cavity of the sliding part 7 is divided into an upper independent cavity and a lower independent cavity by the connecting plate 8, a driving gear 9 is rotatably arranged at a position, which is positioned at the upper side of the connecting plate 8, in the inner cavity of the sliding part 7, a rotating part 10 is fixedly arranged at the inner wall of the left side of the sliding part 7, the driving gear 9 is connected with the rotating part 10 and used for driving the driving gear 9 to rotate, a connecting rope 11 is wound at the left side of the driving gear 9, a first opening is transversely penetrated at the left side of the inner part of the sliding part 7, one end of the connecting rope 11 is fixedly connected with the left side of the driving gear 9, the other end of the connecting rope 11 passes through the first opening and is fixedly connected with the inner side surface of the inner side part 3, one section of the connecting rope 11 close to the inner side part 3 is arranged in a loosening way, a driven gear 12 is rotatably arranged at a position above the driving gear 9 in the sliding part 7, the driven gear 12 is in meshing transmission connection with the driving gear 9, a limiting part 13 is arranged at a position above the driven gear 12 in the sliding part 7 (the driven gear 12 and the limiting part 13 are combined by a ratchet wheel and a pawl in the prior art) and used for limiting the anticlockwise rotation of the driven gear 12, rod bodies at the left side and the right side of the driven gear 12 extend out of the sliding part 7 and are fixedly welded with the inner side end of the impact plate 14, the outer side surface of the inner side part 3 and the inner side surface of the placing table 2 form a containing cavity together, and a contact part 15 is hermetically and slidably arranged at the upper part of the containing cavity, the inner side of the contact element 15 and the outer side of the striking plate 14 form a welding fixation, after the wafer leaves the placing table 2, the expansion piece 6 drives the sliding element 7 to move upwards, the connecting rope 11 drives the driving gear 9 to rotate, and then the driven gear 12 rotates half a circle, at the same time, the rotating driven gear 12 drives the striking plate 14 and the contact element 15 to rotate synchronously, and then the bottom surface and the upper surface of the contact element 15 are displaced, then the expansion piece 6 drives the sliding element 7 to move downwards, so that the contact element 15 does not rotate, and the rotating element 10 drives the driving gear 9 to rotate and reset, finally, the wafer is placed on the surface of the displaced contact element 15, through the actions, the probability that a large amount of wafers contact pollutants is reduced, the quality of the wafer is indirectly improved, meanwhile, because one section of the connecting rope 11 is arranged in a loosening way, and then when the contact element 15 moves upwards preliminarily, can not take place to rotate, and then avoid inside part 3 and place the rotation that platform 2 influences contact 15, in addition, the above-mentioned winding number of turns of connecting rope 11 can be the adaptability adjustment, so that the number of turns of rotating of driving gear 9 can carry out the regulation setting, afterwards, when microscope carrier 1 to place 2 inboard application negative pressure, partial negative pressure can pass through filter screen 4, and then produce the attraction to the pollutant of 15 bottom surfaces adhesion of contact, make the pollutant fall to hold the chamber, and then reduce the probability of a large amount of wafer contact pollutants.
Place platform 2 and be two sections sealed settings (if two halfcylinders constitute a complete cylinder jointly, and laminating department is sealed setting), the bottom surface of filter screen 4 forms sealing contact with the inclined plane of placing 2 inboard positions of platform, the bottom surface welding of filter screen 4 has fixed plate 5, the bottom surface of fixed plate 5 forms welded fastening with the upper surface of microscope carrier 1, place the inside position that is located filter screen 4 below of platform 2 and seted up the fixed slot, the lateral surface of fixed plate 5 and the laminating of the outside wall body of fixed slot, setting through the above-mentioned structure, make after the pollutant that holds in the chamber reaches certain quantity, can open and place platform 2, and then take out and hold the pollutant in the chamber.
Referring to fig. 3-7, the driving gear 9 is composed of a gear body, a connecting rod, a sliding slot, gear teeth, a first stop block, a second stop block and a first elastic member, the gear body is installed at a position above the connecting plate 8 in the inner cavity of the sliding member 7, the connecting rod is welded at both sides of the gear body, the right connecting rod of the gear body is rotatably connected with the right inner wall of the sliding member 7, the sliding slot is formed in the gear body at equal intervals in the circumferential direction, one side wall body of the sliding slot is hinged with the gear teeth, the gear teeth can be accommodated in the sliding slot, the first elastic member is fixedly installed at the bottom surface of the gear teeth, the other end of the first elastic member is fixedly connected with the side wall of the sliding slot, the first stop block is welded at both sides of the gear teeth, the second stop block is welded at a position on the inner wall of the sliding slot, the first stop block is in contact with the second stop block to limit the excessive extension of the gear teeth out of the sliding slot, the side surface of the gear teeth in the clockwise direction is set in a cambered surface structure, the number of teeth of the driving gear 9 is less than that of the driven gear 12, the side surface of the teeth of the driven gear 12 in the clockwise direction is in an arc surface structure, the connecting rope 11 is wound on the surface of the left connecting rod, one end of the connecting rope 11 is fixedly connected with the left connecting rod, when the sliding piece 7 moves upwards, the connecting rope 11 can pull the driving gear 9 to rotate anticlockwise so as to realize transmission of the driving gear 9 and the driven gear 12, then, when the sliding piece 7 moves downwards to reset, the rotary piece 10 drives the driving gear 9 to rotate clockwise so as to enable the driven gear 12 to generate anticlockwise rotation, because the driven gear 12 is prevented from rotating anticlockwise by the limiting piece 13, the teeth of the driving gear 9 are subjected to resistance, the teeth are retracted into the sliding chute, the first elastic piece is compressed, and through the actions, smooth reset of the driving gear 9 is realized, in addition, the number of teeth of the driving gear 9 and the number of teeth of the driven gear 12 can be adjusted accordingly, so that the driven gear 12 rotates only for half a revolution when the driving gear 9 rotates for a predetermined number of revolutions.
Referring to fig. 3, the rotating member 10 is composed of a casing and a torsion spring, the torsion spring is fixedly installed on the inner circumferential wall of the casing, the left connecting rod of the driving gear 9 extends into the casing and is fixedly connected to the other end of the torsion spring, when the sliding member 7 moves upward, the left connecting rod of the driving gear 9 drives the torsion spring to rotate, and then, when the sliding member 7 moves downward, the torsion spring releases the elastic force, so that the driving gear 9 rotates and resets.
The lower surface of the striking plate 14 contacts the upper surface of the inner member 3, and when the sliding member 7 moves down to the initial position, the striking plate 14 is driven to strike the upper surface of the inner member 3, so that the contact member 15 generates vibration, and the vibration causes the contaminants on the bottom surface of the contact member 15 to be separated from the contact member 15, thereby further reducing the probability of contacting a large number of wafers with the contaminants.
Referring to fig. 2, the sliding member 7 and the telescopic member 6 form a sealed sliding connection (the connection is similar to the connection between an oil cylinder and a piston in the prior art), a cavity in the inner cavity of the sliding member 7 located below the connecting plate 8 is a suction cavity, a second opening is longitudinally formed in the connecting plate 8, a first check valve is fixedly installed in the second opening, the first check valve flows from the cavity in the inner cavity of the sliding member 7 located above the connecting plate 8 to the suction cavity, an air guide hole 16 is formed in the sliding member 7 located below the connecting plate 8, one end of the air guide hole 16 is communicated with the suction cavity, and the other end of the air guide hole 16 is formed in the bottom of the outer side surface of the sliding member 7.
An air cavity 17 is arranged at the position below the accommodating cavity inside the placing table 2, a push plate 18 is arranged in the air cavity 17 in a sealing and sliding manner, a second elastic part is fixedly arranged on the lower surface of the push plate 18, the other end of the second elastic part is fixedly connected with the bottom surface of the air cavity 17, an air inlet 19 is arranged at the inner side position of the air cavity 17 inside the placing table 2, one end of the air inlet 19 is communicated with the cavity at the upper side position of the push plate 18 in the air cavity 17, the other end of the air inlet 19 is arranged at the bottom position of the inner side surface of the placing table 2, a hose 20 is fixedly arranged between the inner side surface of the placing table 2 and the outer side surface of the sliding part 7 together, the length of the hose 20 is larger than the linear distance between the air guide hole 16 and the air inlet 19, the hose 20 is communicated with the air inlet 19 and the air guide hole 16, a second check valve is fixedly arranged in the air inlet 19, and the flow direction of the second check valve is from the hose 20 to the air inlet 19, the inside position of placing table 2 above air cavity 17 is equipped with air outlet 21, air outlet 21 is formed from circular hole and straight hole, the lower side port of straight hole is communicated with cavity body positioned in the upper side position of push plate 18 in air cavity 17, the upper side port of straight hole is communicated with lower side port of circular hole, the upper side port of circular hole is communicated with holding cavity, the upper side port of circular hole is faced to the lower surface of contact element 15, the interior of straight hole is fixedly equipped with three-number one-way valve, the circulation direction of three-number one-way valve is from straight hole to circular hole, the above-mentioned gas discharged from air guide hole 16 can be passed through hose 20, air inlet 19 and two-number one-way valve, and can be fed into air cavity 17, and can be moved downwards to push plate 18 to compress the No. elastic element, then, when contact element 15 is moved downwards to initial position, the No. two elastic element can release elastic force, so that push plate 18 can extrude the above-mentioned gas, and make said gas pass through air outlet 21 and three-number one-way valve, and further sprayed to the bottom surface of the contact 15, whereby the contaminants adhered to the bottom surface of the contact 15 are further caused to fall off, and the probability that a large number of wafers contact the contaminants is reduced.
Referring to fig. 2 and 4, a position of the inner side of the placing table 2, which is located at the upper side port of the annular hole, is provided with a limiting groove 22, an opening and closing member 23 is slidably clamped in the limiting groove 22, the opening and closing member 23 is composed of a closed ring and a push rod, the closed ring and the limiting groove 22 form a sliding clamping connection, the push rod is welded on the upper surface of the closed ring, the upper end of the push rod contacts with the lower surface of the contact element 15, a third elastic element is fixedly mounted on the lower surface of the closed ring, the lower end of the third elastic element is fixedly connected with the bottom surface of the limiting groove 22, the opening and closing member 23 is provided in two sections in a sealing manner, so that when the placing table 2 is opened, the opening and closing member 23 is synchronously opened, in addition, when the contact element 15 moves down to an initial position, the opening and closing member 23 is pushed to move down, so that the upper side port of the air outlet hole 21 is opened, and the gas in the air cavity 17 can be smoothly ejected.
The use method (working principle) of the invention is as follows:
when the wafer detection device works, firstly, a wafer in a containing box is placed on the surface of a contact element 15 through a manipulator, then a negative pressure mechanism (in the prior art) in a carrying platform 1 generates negative pressure in the placing platform 2, so that the wafer on the surface of the contact element 15 is adsorbed and fixed, then, a moving mechanism (in the prior art) drives the carrying platform 1 to horizontally move, and a camera shoots the edge of the wafer, so that the shot image is transmitted to a detection mechanism (such as a computer in the prior art), so that the detection mechanism compares the image with a standard image and judges whether the edge of the wafer has defects or not, through the actions, the detection and shooting operation of the edge of the wafer is further realized, then, the negative pressure in the placing platform 2 disappears, the wafer is taken down, then, a telescopic piece 6 drives a sliding piece 7 and the contact element 15 to move upwards, so that a connecting rope 11 is gradually tensioned, then, the tensioned connecting rope 11 drives the driving gear 9 to rotate counterclockwise, so that the driven gear 12 and the contact element 15 rotate along with the rotation, meanwhile, the driving gear 9 can twist a torsion spring in the rotating element 10, when the sliding element 7 moves up to a limit position, the contact element 15 rotates for a half circle, then, the telescopic element 6 drives the sliding element 7 and the contact element 15 to move down, so that the torsion spring releases elasticity, so that the driving gear 9 is driven to rotate and reset, the contact element 15 cannot rotate because the driven gear 12 is limited by the limiting element 13, and then, when the contact element 15 moves down to an initial position, the impact plate 14 can impact the upper surface of the inner side element 3 to generate vibration, so that pollutants adhered to the bottom surface of the contact element 15 fall into the accommodating cavity, and in the process of moving up the sliding element 7, the suction cavity can suck outside air through the second opening and the first one-way valve, then, when the slider 7 moves down, the air in the suction cavity passes through the air guide hole 16, the hose 20, the air inlet hole 19 and the second check valve and further enters the air cavity 17, and the push plate 18 presses the second elastic member downward, then, when the slider 7 drives the contact member 15 to move down to the initial position, the contact member 15 drives the opening member 23 to move down and compress the third elastic member, so that the upper port of the air outlet hole 21 is opened, and further the second elastic member releases the elastic force, and drives the push plate 18 to press the air in the air cavity 17, so that the air passes through the air outlet hole 21 and the third check valve and is further sprayed to the bottom surface of the contact member 15, finally, the next wafer is placed on the surface of the contact member 15, and negative pressure is applied to the inside of the placing table 2 again, so that the wafer is adsorbed and fixed, meanwhile, part of the negative pressure sucks the pollutants on the bottom surface of the contact member 15 through the accommodating cavity, and further promotes the dropping of the pollutants, which is a work cycle.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a wafer is edge detection for making gets for instance device, includes microscope carrier (1), the last fixed surface of microscope carrier (1) installs places platform (2), one side of microscope carrier (1) is provided with the manipulator for place the wafer on the surface of placing platform (2), the left position of wafer is provided with the camera, is used for shooing the marginal image of wafer, the opposite side of microscope carrier (1) is provided with detection mechanism, is used for detecting whether there is the defect in the image that the camera was shot, its characterized in that: the inner side of the placing table (2) is provided with an inner side part (3), the upper surface of the carrying platform (1) is fixedly provided with an expansion part (6) at a position located on the inner side of the inner side part (3), the outer side of the expansion part (6) is slidably sleeved with a sliding part (7), the output end of the expansion part (6) is fixedly provided with a connecting plate (8), the periphery of the connecting plate (8) is hermetically fixed with the inner wall of the sliding part (7), a driving gear (9) is rotatably arranged at a position located on the upper side of the connecting plate (8) in the inner cavity of the sliding part (7), a rotating part (10) is fixedly arranged on the inner wall of the left side of the sliding part (7), the driving gear (9) is connected with the rotating part (10), a connecting rope (11) is wound on the left side of the driving gear (9), two ends of the connecting rope (11) are fixedly connected with the left side of the driving gear (9) and the inner side of the inner side part (3), a driven gear (12) meshed with the driving gear (9) is rotatably arranged at a position located on the upper side of the sliding part (7), two sides of the sliding part (7) is provided with a driven gear (12) which is fixedly arranged for limiting part (12) and the left and the limiting gear (12) and the left and right limiting plate (14) is arranged on two sides of the driven gear (12), the outer side face of the inner side part (3) and the inner side face of the placing table (2) jointly enclose a containing cavity, a contact element (15) is movably installed at the upper part of the containing cavity in a sealing mode, and the contact element (15) is fixedly connected with the impact plate (14).
2. The image capturing device for edge inspection in wafer manufacturing as claimed in claim 1, wherein: the novel bearing platform is characterized in that the placing platform (2) is provided with two sections in a sealing mode, a filter screen (4) is installed between the bottom surface of the inner side part (3) and the inclined plane of the placing platform (2), the bottom surface of the filter screen (4) is in sealing contact with the inclined plane of the inner side position of the placing platform (2), a fixing plate (5) is fixedly installed on the bottom surface of the filter screen (4), the bottom surface of the fixing plate (5) is fixedly connected with the upper surface of the carrying platform (1), a fixing groove is formed in the position, located below the filter screen (4), of the placing platform (2), and the outer side surface of the fixing plate (5) is attached to the outer side wall body of the fixing groove.
3. The image capturing device for edge inspection in wafer manufacturing as claimed in claim 1, wherein: driving gear (9) comprises wheel body, connecting rod, spout, the teeth of a cogwheel, dog, no. two dogs and elastic component, the wheel body is installed to the position that lies in connecting plate (8) upside in slider (7) inner chamber, the equal fixed mounting in the left and right sides of wheel body has the connecting rod, the right side the connecting rod forms to rotate with the right side inner wall of slider (7) and is connected, the spout has been seted up to the inside circumference equidistance of wheel body, a lateral wall body of spout articulates there is the teeth of a cogwheel, the teeth of a cogwheel can income spout, common fixed mounting has an elastic component between the bottom surface of the teeth of a cogwheel and the lateral wall of spout, the equal fixed mounting in the left and right sides of the teeth of a cogwheel has a dog, the position fixed mounting that lies in the notch on the spout inner wall has No. two dogs, dog and No. two dogs mutually contact for the restriction teeth of a cogwheel excessively stretch out the spout, the side that lies in the clockwise on the teeth of a cogwheel sets up for cambered surface structure, the number of a cogwheel is less than the teeth of a tooth of driving gear (9), the tooth number of a tooth of a connecting rod (11), the left side of connecting rod (11) forms with the connecting rod (11).
4. The image capturing device for edge inspection in wafer manufacturing as claimed in claim 3, wherein: the rotating part (10) is composed of a shell and a torsion spring, the torsion spring is fixedly mounted on the circumferential inner wall of the shell, and the connecting rod is fixedly connected with the other end of the torsion spring on the left side.
5. The image capturing device for edge inspection in wafer manufacturing as claimed in claim 1, wherein: the lower surface of striking plate (14) contacts the upper surface of inside part (3), one section that connecting rope (11) is close to inside part (3) sets up for relaxing.
6. The image capturing device for edge inspection in wafer manufacturing as claimed in claim 1, wherein: slider (7) and extensible member (6) form sealed sliding connection, the cavity that lies in connecting plate (8) below position in slider (7) inner chamber is the suction chamber, the inside of connecting plate (8) vertically runs through and has seted up No. two openings, no. two opening internal fixation install a check valve, the circulation direction of a check valve is for the cavity that lies in connecting plate (8) top position in by slider (7) inner chamber to the circulation of suction chamber, gas guide hole (16) have been seted up to the position that lies in connecting plate (8) below in slider (7) inside, the one end and the suction chamber intercommunication of gas guide hole (16), the bottom position at slider (7) lateral surface is seted up to the other end of gas guide hole (16).
7. The image capturing device for edge inspection in wafer manufacturing as claimed in claim 6, wherein: an air cavity (17) is formed in the position, below the accommodating cavity, in the placing table (2), a push plate (18) is movably installed in the air cavity (17) in a sealing mode, a second elastic part is fixedly installed between the lower surface of the push plate (18) and the bottom surface of the air cavity (17) jointly, an air inlet hole (19) is formed in the inner side position, located in the air cavity (17), in the placing table (2), an air inlet hole (19) is formed in the inner side position, one end of the air inlet hole (19) is communicated with a cavity, located in the position above the push plate (18), in the air cavity (17), in the cavity, the other end of the air inlet hole (19) is formed in the bottom position of the inner side surface of the placing table (2), a hose (20) is fixedly installed between the inner side surface of the placing table (2) and the outer side surface of the sliding part (7) jointly, the length of the hose (20) is larger than the linear distance between the air guide hole (16) and the air inlet hole (19), the hose (20) is communicated with the air guide hole (16) and the air guide hole (16), a second check valve is fixedly installed in the air inlet hole (19) fixedly, the circulation direction of the hose (20), a contact part (21) is formed in the position, above the upper side position, above the air outlet hole (17) in the air cavity (17) and the lower surface of the air cavity (17) and the air cavity, and the air cavity (17) are communicated with a contact part (21), a third check valve is fixedly installed in the air outlet hole (21), and the flow direction of the third check valve is from a straight hole to a circular hole.
8. The image capturing device for edge detection in wafer manufacturing as claimed in claim 7, wherein: place the position that platform (2) inboard is located venthole (21) upside port and seted up spacing groove (22), the slip joint has opening and shutting piece (23) in spacing groove (22), opening and shutting piece (23) comprise closed ring and catch bar, closed ring and spacing groove (22) form the slip joint, the last fixed surface of closed ring installs the catch bar, the upper end of catch bar and the lower surface contact of contact (15), common fixed mounting has No. three elastic components between the lower surface of closed ring and the bottom surface of spacing groove (22), opening and shutting piece (23) are two sections sealed settings.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211188713.6A CN115684199A (en) | 2022-09-27 | 2022-09-27 | Edge detection image capturing device for wafer manufacturing |
| CN202310433596.3A CN116825663B (en) | 2022-09-27 | 2023-04-21 | Edge detection image capturing device for wafer manufacturing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211188713.6A CN115684199A (en) | 2022-09-27 | 2022-09-27 | Edge detection image capturing device for wafer manufacturing |
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| CN115684199A true CN115684199A (en) | 2023-02-03 |
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| CN202211188713.6A Pending CN115684199A (en) | 2022-09-27 | 2022-09-27 | Edge detection image capturing device for wafer manufacturing |
| CN202310433596.3A Active CN116825663B (en) | 2022-09-27 | 2023-04-21 | Edge detection image capturing device for wafer manufacturing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116500047A (en) * | 2023-06-28 | 2023-07-28 | 苏州鸿安机械股份有限公司 | Wafer defect detection equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3090868U (en) * | 2002-06-20 | 2002-12-26 | 華東半導體工業股▲ふん▼有限公司 | Chip placement device with chip reversal function |
| JP2004327674A (en) * | 2003-04-24 | 2004-11-18 | Dainippon Screen Mfg Co Ltd | Substrate inversion unit and substrate treatment apparatus having the same |
| CN114038765A (en) * | 2021-09-15 | 2022-02-11 | 河南通用智能装备有限公司 | Hollow rotary table mechanism of wafer splitting equipment |
| CN215834511U (en) * | 2021-10-09 | 2022-02-15 | 苏州军科域光电科技有限公司 | Clamping mechanism for wafer detection |
| CN216624220U (en) * | 2021-12-22 | 2022-05-27 | 无锡颂林达科技有限公司 | Wafer cleaning feeding and discharging device |
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2022
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116500047A (en) * | 2023-06-28 | 2023-07-28 | 苏州鸿安机械股份有限公司 | Wafer defect detection equipment |
| CN116500047B (en) * | 2023-06-28 | 2023-09-08 | 苏州鸿安机械股份有限公司 | Wafer defect detection equipment |
Also Published As
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| CN116825663B (en) | 2024-01-26 |
| CN116825663A (en) | 2023-09-29 |
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