CN115648611A - Forming device and method for LED lamp panel - Google Patents

Abstract

The invention provides a forming device and a forming method of an LED lamp panel, wherein the forming device comprises a forming jig and a winding mechanism; the forming jig comprises a base and a plurality of positioning columns arranged at intervals along the periphery of the base, an accommodating space for accommodating the LED lamp panel is formed by the plurality of positioning columns and the base, and the plurality of positioning columns are arranged in one-to-one correspondence with the plurality of lamp beads positioned on the outermost circle of the LED lamp panel; wire winding mechanism is used for twineing hot melt adhesive tape on a plurality of reference columns to make hot melt adhesive tape and the lamp seam of LED lamp plate set up correspondingly. The technical scheme of this application can solve the problem that influences the display effect among the correlation technique at the lamp seam spraying or print black printing ink effectively.

Description

Forming device and method for LED lamp panel

Technical Field

The invention relates to the field of LED processing, in particular to a forming device and a forming method of an LED lamp panel.

Background

Along with the continuous development of LED display technology, the red, green and blue chip size for LED display is smaller and smaller, and the lamp beads corresponding to the red, green and blue chip size are also smaller and smaller, so that the exposed area of the display substrate is larger and larger, and the difference of the ink colors of the LED module manufactured by the small lamp beads is larger due to the difference of the ink colors between different positions of different display substrates and the same substrate, so that the display effect of the LED screen is influenced.

In order to solve the problem of inconsistent ink color of the LED module, the following two schemes are mainly adopted at present:

one is to add a black mask between the LED module light slits to shield the ink color of the substrate, the scheme has the problems that the scheme can only be suitable for modules with larger pixel spacing, small-spacing modules are difficult to install, and the modularization is obvious after the mask is installed;

another kind of scheme is to print or the spraying black printing ink between LED module light seam, this kind of scheme has the ink colour to be infected with lamp pearl top surface or side when less pixel interval, because the face down mounting LED chip is five-sided luminous, the ink colour of being infected with can seriously influence display effect, simultaneously because LED module pixel interval is littleer and more, the light seam quantity that every module exists is huge, the spraying or print a module need the time longer, this has just LED to the problem that light seam inkjet printing technology production efficiency is low.

Disclosure of Invention

The invention mainly aims to provide a device and a method for forming an LED lamp panel, and aims to solve the problem that display effect is influenced by spraying or printing black ink between lamp slits in the related art.

In order to achieve the above object, according to one aspect of the present invention, there is provided a forming device for an LED lamp panel, the forming device includes a forming jig and a winding mechanism; the forming jig comprises a base and a plurality of positioning columns arranged at intervals along the periphery of the base, an accommodating space for accommodating the LED lamp panel is formed by the plurality of positioning columns and the base, and the plurality of positioning columns are arranged in one-to-one correspondence with the plurality of lamp beads positioned on the outermost circle of the LED lamp panel; wire winding mechanism is used for twineing hot melt adhesive tape on a plurality of reference columns to make hot melt adhesive tape and the lamp seam of LED lamp plate set up correspondingly.

By applying the technical scheme of the invention, the LED lamp panel to be processed is placed in the forming jig, the plurality of positioning columns are arranged in one-to-one correspondence with the plurality of lamp beads positioned at the outermost circle of the LED lamp panel, so that the hot melt adhesive tape can be wound on the plurality of positioning columns by using the winding mechanism to fill the lamp seams on the LED lamp panel, and then the hot melt adhesive tape is heated and cured to form an even covering layer on the surface of the LED lamp panel, so that the ink color on the surface of the LED lamp panel is more even. Specifically, the hot melt adhesive tape can form a liquid structure and then solidify after being heated, and the hot melt adhesive tape can not be adhered to the surface around the lamp bead to influence the display effect. Therefore, the technical scheme of this application can solve the problem that the black ink of spraying or printing influences the display effect between the light seam among the correlation technique effectively.

Furthermore, the upper end of the positioning column is of an arc-shaped structure, and/or the positioning column is higher than the lamp beads.

Furthermore, the base is provided with an avoiding concave part for avoiding the electronic component on the rear side of the LED lamp panel.

Further, the base is of a rectangular structure and comprises a first side, a second side, a third side and a fourth side which are sequentially arranged, the positioning columns comprise a plurality of first positioning columns arranged at the first side, a plurality of second positioning columns arranged at the second side, a plurality of third positioning columns arranged at the third side and a plurality of fourth positioning columns arranged at the fourth side, the first positioning columns and the third positioning columns are arranged in a one-to-one correspondence manner, and the second positioning columns and the fourth positioning columns are arranged in a one-to-one correspondence manner.

According to another aspect of the invention, a method for forming an LED lamp panel is provided, which includes: placing the LED lamp panel substrate on a forming jig; the hot-melt adhesive tapes are sequentially turned back and wound on a plurality of first positioning column groups arranged at intervals by using a winding mechanism so as to fill first lamp seams extending along a first direction on the LED lamp panel substrate, wherein each first positioning column group comprises two positioning columns oppositely arranged in the first direction; the hot-melt adhesive tapes are sequentially folded back and wound on a plurality of second positioning column groups arranged at intervals by using a winding mechanism so as to fill second lamp seams extending along a second direction on the LED lamp panel substrate, wherein each second positioning column group comprises two positioning columns oppositely arranged in the second direction, and the second direction is intersected with the first direction; and heating and curing the hot-melt adhesive tape on the LED lamp panel substrate to form a covering layer on the surface of the LED lamp panel substrate.

According to the technical scheme, the LED lamp panel substrate is placed on the forming jig, then the wire winding mechanism is used for filling the hot melt adhesive tape in the first lamp seam extending along the first direction and the second lamp seam extending along the second direction, and then the hot melt adhesive tape on the LED lamp panel substrate is heated and cured to form a uniform covering layer on the surface of the LED lamp panel substrate. The hot melt adhesive tape can form a liquid structure firstly and then solidify in the heating and solidifying process, and can not be adhered to the surface around the lamp bead to influence the display effect. Therefore, the technical scheme of this application can solve the problem that the black ink of spraying or printing influences the display effect between the light seam among the correlation technique effectively.

Further, in the step of using the wire winding mechanism to turn back the hot melt adhesive tape in turn and wind on a plurality of first positioning column groups arranged along the interval: filling all the first lamp seams in a mode of firstly advancing along the positive direction of the first direction and then advancing along the negative direction of the first direction; and/or in the step of using a winding mechanism to turn back and wind the hot melt adhesive tapes on a plurality of second positioning column groups arranged at intervals: and filling all the second lamp seams in a mode of firstly advancing along the positive direction of the second direction and then advancing along the negative direction of the second direction.

Further, the ratio between the radial dimension of the strip of hot-melt adhesive and the width of the first slit of light is between 1/2 and 3/4, and/or the ratio between the radial dimension of the strip of hot-melt adhesive and the width of the second slit of light is between 1/2 and 3/4.

Further, the step of carrying out heating curing treatment on the hot melt adhesive tape on the LED lamp panel substrate comprises the following steps: and placing the LED lamp panel substrate wound with the hot melt adhesive tape and the forming jig into a vacuum oven for heating.

Further, will be around being equipped with hot melt adhesive tape's LED lamp plate base member and shaping tool place in the step of heating in the vacuum oven: the heating temperature is between 80 ℃ and 120 ℃; the heating time is between 1h and 24 h.

Further, the molding method further comprises: after the hot melt adhesive tape on the LED lamp panel base member is subjected to heating and curing treatment, the LED lamp panel base member and the forming jig are separated, and the edge of the LED lamp panel base member is cut to remove the covering layer located outside the cross section of the LED lamp panel base member.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiment(s) of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic side view of a forming jig of an embodiment of a forming device of an LED lamp panel according to the present invention;

FIG. 2 shows a schematic top view of the molding tool of FIG. 1;

fig. 3 shows a schematic top view of an LED lamp panel placed in the molding jig of fig. 1;

fig. 4 is a schematic top view showing an LED lamp panel placed in the molding jig of fig. 1 and wound with a hot melt adhesive tape; and

fig. 5 shows a flow chart of an embodiment of the method for molding the LED lamp panel according to the present invention.

Wherein the figures include the following reference numerals:

10. a base; 11. avoiding the concave part; 20. a positioning column; 211. a first positioning post; 212. a second positioning column; 213. a third positioning column; 214. a fourth positioning column; 22. a first set of positioning posts; 23. a second set of positioning posts; 30. an LED lamp panel; 31. an LED lamp panel substrate; 311. a lamp bead; 32. sewing the lamp; 321. a first light slit; 322. a second light slit; 40. hot melting adhesive tapes; l1, a first direction; l2, second direction.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 4, the forming device of the LED lamp panel of the present embodiment includes a forming fixture and a winding mechanism; the forming jig comprises a base 10 and a plurality of positioning columns 20 arranged at intervals along the periphery of the base 10, the plurality of positioning columns 20 and the base 10 form a containing space for containing the LED lamp panel 30, and the plurality of positioning columns 20 are arranged in one-to-one correspondence with a plurality of lamp beads 311 positioned on the outermost ring of the LED lamp panel 30; wire winding mechanism is used for twineing hot melt adhesive tape 40 on a plurality of reference columns 20 to make hot melt adhesive tape 40 and the lamp seam 32 of LED lamp plate 30 set up correspondingly.

Use the technical scheme of this embodiment, the LED lamp plate 30 that will treat processing is placed in the shaping tool, a plurality of reference columns 20 set up with being located a plurality of lamp pearls 311 one-to-one of LED lamp plate 30 outer lane, just so can use winding mechanism to make hot melt adhesive tape 40 fill the light seam 32 on the LED lamp plate 30 on a plurality of reference columns 20 with hot melt adhesive tape 40 winding, later heat the solidification to hot melt adhesive tape 40 and can be at the even overburden of surface formation of LED lamp plate 30, so that the china ink on the surface of LED lamp plate 30 is more even. Specifically, the hot-melt adhesive tape 40 forms a liquid structure after being heated and then solidifies, and does not adhere to the surface around the bead 311 to affect the display effect. Therefore, the technical scheme of the embodiment can effectively solve the problem that the display effect is influenced by spraying or printing the black ink between the lamp slits in the related art.

In addition, will twine solid-state hot melt adhesive tape 40 on reference column 20 with a plurality of seams 32 on the corresponding LED lamp plate 30 of filling earlier, then heat curing, compare in the related art in the seam department spraying of lamp or print black printing ink, the step is simpler, the operation degree of difficulty is lower.

Specifically, in the present embodiment, the above-mentioned "hot-melt adhesive tape 40" is a linear structure made of one of epoxy glue, acrylic glue or polyurethane and added with black ink.

Specifically, the winding mechanism in this embodiment includes the cylinder that is used for accomodating hot melt adhesive tape 40 and drives hot melt adhesive tape 40 around establishing the arm on reference column 20. The hot melt adhesive tape 40 twines on the cylinder, and the tip of arm is provided with shower nozzle or the thimble that is used for being qualified for the next round of competitions, and the arm can be followed and predetermine the orbit motion and then be established hot melt adhesive tape 40 around locating column 20.

As shown in fig. 1, the upper end of the positioning post 20 is an arc-shaped structure. Specifically, the top end of the positioning column 20 has a hemispherical structure, so that the hot melt adhesive tape 40 can be effectively prevented from being damaged in the winding process. In addition, even hot melt adhesive tape 40 advances the in-process position to squint, the arc structure also can lead hot melt adhesive tape 40, and the technical scheme of this embodiment is lower to the position accuracy requirement that winding mechanism drove hot melt adhesive tape 40 and advances the in-process promptly.

As shown in fig. 2, the base 10 is provided with a recess 11 for avoiding electronic components on the rear side of the LED lamp panel 30. Also can dodge the electronic components of LED lamp plate 30 rear side when base 10 bearing LED lamp plate 30, and then guarantee the depth of parallelism between LED lamp plate 30 upper surface and the horizontal plane, conveniently carry out the wire winding operation. In addition, when the follow-up heating solidification that adds, put LED lamp plate 30 and shaping tool into the vacuum oven with the heating together, can guarantee effectively that the depth of parallelism between LED lamp plate 30 upper surface and the horizontal plane and then make the overburden of formation more even. Specifically, the avoiding concave portion 11 may be a groove structure or a vertical penetrating forming jig.

As shown in fig. 2, the base 10 is a rectangular structure, the base 10 includes a first side, a second side, a third side and a fourth side, which are sequentially arranged, and the positioning pillars 20 include a plurality of first positioning pillars 211 arranged at the first side, a plurality of second positioning pillars 212 arranged at the second side, a plurality of third positioning pillars 213 arranged at the third side and a plurality of fourth positioning pillars 214 arranged at the fourth side. The shape of base 10 and the shape looks adaptation of LED lamp plate 30, a plurality of first reference columns 211 and a plurality of third reference column 213 set up one-to-one, a plurality of second reference columns 212 and a plurality of fourth reference column 214 set up one-to-one, and every reference column 20 all corresponds to a lamp pearl 311 that is located the outer lane of LED lamp plate 30, makes the clearance between light seam 32 and the reference column 20 corresponding like this, and hot melt adhesive tape 40 can be corresponding with light seam 32 during the wire winding.

Specifically, in this embodiment, reference column 20 is higher than lamp pearl 311, and winding mechanism drives hot melt adhesive tape 40 like this and can advance in the top of lamp pearl 311 when establishing on reference column 20, can not touch lamp pearl 311, conveniently carries out the operation of winding. Meanwhile, the lamp beads 311 and the hot melt adhesive tape 40 are not damaged.

The application also provides a method for forming the LED lamp panel, as shown in fig. 5, the method for forming the LED lamp panel of the embodiment includes:

step S10: placing the LED lamp panel substrate 31 on a forming jig;

step S20: the hot melt adhesive tapes 40 are sequentially folded back and wound on the plurality of first positioning column groups 22 arranged at intervals by using a winding mechanism so as to fill first lamp seams 321 extending along the first direction L1 on the LED lamp panel base 31, wherein each first positioning column group 22 comprises two positioning columns 20 oppositely arranged in the first direction L1;

step S30: the hot melt adhesive tapes 40 are sequentially folded back and wound on a plurality of second positioning column groups 23 arranged at intervals by using a winding mechanism so as to fill second lamp seams 322 extending along a second direction L2 on the LED lamp panel base body 31, wherein each second positioning column group 23 comprises two positioning columns 20 oppositely arranged in the second direction L2, and the second direction L2 is intersected with the first direction L1;

step S40: and heating and curing the hot melt adhesive tape 40 on the LED lamp panel base body 31 to form a covering layer on the surface of the LED lamp panel base body 31.

Use the technical scheme of this embodiment, at first place LED lamp plate base member 31 on the shaping tool, then use winding mechanism to fill in the first light seam 321 that extends along first direction L1 and in the second light seam 322 that extends along second direction L2 with the adhesive tape 40 adhesive tape, then carry out the thermal curing to the adhesive tape 40 on the LED lamp plate base member 31 to form even overburden at the surface of LED lamp plate base member 31. The hot melt adhesive strip 40 forms a liquid structure in the heating and curing process and then solidifies, and the hot melt adhesive strip does not adhere to the surface around the lamp bead 311 to influence the display effect. Therefore, the technical scheme of the embodiment can effectively solve the problem that the display effect is influenced by spraying or printing the black ink between the lamp slits in the related art.

In addition, compare in the correlation technique with liquid ink spraying or print to the light seam position, the technical scheme of this embodiment only need make solid-state hot melt adhesive tape 40 around establish on reference column 20 can, its operation degree of difficulty is lower, and operating efficiency can be higher.

It should be noted that "filling" in the above-mentioned "filling 8230" \8230 "; the first slits 321" and "filling in the first slit 8230; \8230;" filling in the second slit 322 "means that the hot-melt adhesive tape 40 is disposed corresponding to the first slit 321 or the second slit 322, and the hot-melt adhesive tape 40 may be located in the first slit 321 or the second slit 322, or above the first slit 321 or the second slit 322, as long as the projection of the hot-melt adhesive tape 40 in the horizontal plane is located in the projection of the first slit 321 or the second slit 322 in the horizontal plane. The hot-melt adhesive tape 40 is a linear structure made of one of epoxy glue, acrylic glue or polyurethane and added with black ink. In addition, as shown in fig. 3, the "first light slit 321" may not only include a gap between two adjacent rows of light beads 311, but also include a gap between two outermost rows of light beads 311 and a corresponding edge of the LED lamp panel 30; the second light slit 322 may include a slit between adjacent rows of light beads 311, and further include a slit between two rows of light beads 311 on the outermost side and the corresponding edge of the LED lamp panel 30.

Specifically, as shown in fig. 2, in the present embodiment, each of the above-mentioned "first positioning column groups 22" includes a first positioning column 211 and a third positioning column 213 which are oppositely arranged, and each of the above-mentioned "second positioning column groups 23" includes a second positioning column 212 and a fourth positioning column 214 which are oppositely arranged. The first direction L1 is perpendicular to the second direction L2.

In this embodiment, the LED lamp panel base 31 includes the base plate, sets up a plurality of lamp pearls 311 and the electronic components and the interconnecting link of setting in the base plate rear side in the base plate front side.

Specifically, in the step of sequentially turning back the hot-melt adhesive tape 40 around the plurality of first positioning column groups 22 arranged at intervals using the winding mechanism: all the first slits 321 are filled in such a manner as to travel first in the positive direction of the first direction L1 and then in the negative direction of the first direction L1. Of course, after the winding mechanism drives the hot-melt adhesive tape 40 to advance in the positive direction of the first direction L1 and fill a first light slit 321, the winding mechanism can drive the hot-melt adhesive tape 40 to advance in the direction perpendicular to the first direction L1 and move to the position corresponding to the next first light slit 321, and then drive the hot-melt adhesive tape 40 to advance in the negative direction of the first direction L1 and fill the next first light slit 321. Wire winding mechanism drives hot melt adhesive tape 40 and advances according to snakelike route, can once only fill all first seams 321, improves operating efficiency.

Accordingly, in the step of using the winding mechanism to sequentially fold back the hot melt adhesive tape 40 around the plurality of second positioning column groups 23 arranged at intervals: all the second slits 322 are filled in a manner of proceeding in the positive direction of the second direction L2 and then proceeding in the negative direction of the second direction L2. Of course, after the winding mechanism drives the hot-melt adhesive tape 40 to advance in the positive direction of the second direction L2 and fill one second light seam 322, the winding mechanism can drive the hot-melt adhesive tape 40 to advance in the direction perpendicular to the second direction L2 and move to the position corresponding to the next second light seam 322, and then drive the hot-melt adhesive tape 40 to advance in the negative direction of the second direction L2 and fill the next second light seam 322. The winding mechanism drives the hot melt adhesive tape 40 to move along a snake-shaped path, all second lamp seams 322 can be filled at one time, and the operation efficiency is improved.

Note that the above-mentioned "first travel in the positive direction of the first direction L1 and then travel in the negative direction of the first direction L1" does not mean that the winding step must be ended with travel in the negative direction. For example, when the LED lamp panel 30 has three first slits 321, two times of forward direction travel and one time of negative direction travel are required, and the winding step ends with the forward direction travel.

In the present embodiment, the ratio of the radial dimension of the hot melt adhesive strip 40 to the width of the first light slit 321 is between 1/2 and 3/4, and the ratio of the radial dimension of the hot melt adhesive strip 40 to the width of the second light slit 322 is between 1/2 and 3/4. Preferably, the cross-section of the hot-melt adhesive strip 40 is circular, the ratio between the diameter of the hot-melt adhesive strip 40 and the width of the first light slit 321 is between 1/2 and 3/4, and the ratio between the diameter of the hot-melt adhesive strip 40 and the width of the second light slit 322 is between 1/2 and 3/4. If the above ratio is less than 1/2, the heat-fusible adhesive tape 40 may not be able to fill the lamp gap 32 after curing. If the ratio is greater than 3/4, the operation difficulty during winding is high, and the hot-melt adhesive tape 40 may not be correspondingly arranged between the adjacent first positioning column groups 22 or between the adjacent second positioning column groups 23; during heating and curing, the hot melt adhesive may adhere to the circumferential surface of the lamp bead 311, resulting in residual ink on the side surface of the lamp bead. Preferably, the above ratio may be 1/2, 5/8 or 3/4.

Specifically, the step of performing heating curing treatment on the hot melt adhesive tape 40 on the LED lamp panel substrate 31 includes: and placing the LED lamp panel substrate 31 wound with the hot melt adhesive strip 40 and the forming jig into a vacuum oven for heating. During the heating process, the hot melt strip 40 will undergo a chemical reaction, melting and then solidifying to form a uniform coating. Put LED lamp plate 30 and shaping tool into the vacuum oven together and advance the heating, can guarantee effectively that the depth of parallelism between LED lamp plate 30 upper surface and the horizontal plane and then make the overburden of formation more even. In addition, the forming jig can limit the position of the hot-melt adhesive tape 40, so that the hot-melt adhesive tape 40 can be kept at the position corresponding to the lamp seam 32, and the hot-melt adhesive tape 40 is prevented from shifting to further influence the uniformity of a formed covering layer.

In this embodiment, in the step of placing the LED lamp panel substrate 31 and the forming jig wound with the hot melt adhesive tape 40 into the vacuum oven for heating: the heating temperature is between 80 ℃ and 120 ℃; the heating time is between 1h and 24 h. In operation, appropriate heating parameters can be selected within the above temperature range and time range according to the performance of the hot-melt adhesive tape 40.

Further, as shown in fig. 5, the molding method of the present embodiment further includes: step S50: after the hot melt adhesive tape 40 on the LED lamp panel base body 31 is subjected to heating and curing treatment, the LED lamp panel base body 31 and the forming jig are separated, and the edge of the LED lamp panel base body 31 is cut to remove a covering layer located outside the cross section of the LED lamp panel base body 31. And after the redundant covering layer is removed, the LED lamp panel 30 with a smooth outer contour can be formed.

The method for forming the LED lamp panel of the present application is described by taking the preparation of the LED lamp panel 30 with the pixel pitch of p1.25mm as an example:

firstly, the forming jig is made of aluminum alloy material. The middle part of the forming jig is provided with an avoidance concave part 11 which can be used for placing electronic components on the rear side of the LED lamp panel substrate 31; a plurality of positioning columns 20 are arranged around the forming jig, and the top ends of the positioning columns 20 are subjected to smoothing treatment to prevent the hot-melt adhesive tape 40 from being damaged in the operation process; the positioning columns 20 are arranged to ensure that a gap between two adjacent positioning columns 20 is aligned with a gap between adjacent lamp beads 311 on the LED lamp panel 30; the height that reference column 20 is highly higher than lamp pearl 311 makes things convenient for equipment to carry out the wiring overall arrangement.

Then, fix a LED lamp panel 30 that pixel interval is P1.25mm on the shaping tool, the module back has various components and parts of arranging in advance, and the front is the lamp pearl 311 that sets up, and lamp pearl 311 size is 1.0mm, and the gap is 0.25mm between the adjacent lamp pearl.

Then, a winding mechanism is used to fill the black hot melt adhesive tape 40 between the light slits 32 of the LED lamp panel 30, wherein the linear hot melt adhesive tape 40 is made of epoxy adhesive, and the radial dimension of the hot melt adhesive tape 40 is 3/4 of the width of the light slit 32, that is, 0.188mm.

And (3) putting the forming jig and the LED lamp panel 30 which are subjected to the steps into a vacuum oven, and heating for 1.5 hours at 120 ℃.

And finally, separating the forming jig from the LED lamp panel 30 to obtain the LED lamp panel 30 with consistent ink color.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A forming device of an LED lamp panel is characterized by comprising a forming jig and a winding mechanism;

the forming jig comprises a base (10) and a plurality of positioning columns (20) arranged at intervals along the periphery of the base (10), the plurality of positioning columns (20) and the base (10) form a containing space for containing an LED lamp panel (30), and the plurality of positioning columns (20) are arranged in one-to-one correspondence with a plurality of lamp beads (311) located on the outermost circle of the LED lamp panel (30);

the winding mechanism is used for winding a hot melt adhesive tape (40) on the positioning columns (20) so that the hot melt adhesive tape (40) is correspondingly arranged with the lamp seams (32) of the LED lamp panel (30).

2. The molding device as defined in claim 1, wherein the upper end of the positioning column (20) is of an arc-shaped structure, and/or the positioning column (20) is higher than the lamp bead (311).

3. The molding device according to claim 1, wherein the base (10) is provided with an avoidance concave portion (11) for avoiding the electronic components on the rear side of the LED lamp panel (30).

4. The molding device according to claim 1, wherein the base (10) has a rectangular structure, the base (10) includes a first side, a second side, a third side and a fourth side, which are sequentially disposed, the positioning posts (20) include a plurality of first positioning posts (211) disposed at the first side, a plurality of second positioning posts (212) disposed at the second side, a plurality of third positioning posts (213) disposed at the third side and a plurality of fourth positioning posts (214) disposed at the fourth side, wherein the first positioning posts (211) and the third positioning posts (213) are disposed in a one-to-one correspondence manner, and the second positioning posts (212) and the fourth positioning posts (214) are disposed in a one-to-one correspondence manner.

5. The forming method of the LED lamp panel is characterized by comprising the following steps:

placing an LED lamp panel substrate (31) on a forming jig;

the method comprises the steps that hot melt adhesive tapes (40) are sequentially folded and wound on a plurality of first positioning column groups (22) arranged at intervals by using a winding mechanism so as to fill first lamp seams (321) extending along a first direction (L1) on an LED lamp panel base body (31), wherein each first positioning column group (22) comprises two positioning columns (20) oppositely arranged in the first direction (L1);

the hot melt adhesive tapes (40) are sequentially folded back and wound on a plurality of second positioning column groups (23) which are arranged at intervals by using the winding mechanism so as to fill second lamp seams (322) which extend along a second direction (L2) on the LED lamp panel base body (31), wherein each second positioning column group (23) comprises two positioning columns (20) which are oppositely arranged in the second direction (L2), and the second direction (L2) is intersected with the first direction (L1);

and heating and curing the hot-melt adhesive tape (40) on the LED lamp panel substrate (31) to form a covering layer on the surface of the LED lamp panel substrate (31).

6. The molding method according to claim 5,

in the step of using a winding mechanism to sequentially fold back and wind the hot melt adhesive tape (40) on a plurality of first positioning column groups (22) arranged at intervals: filling all the first light seams (321) in a manner of firstly advancing along the positive direction of the first direction (L1) and then advancing along the negative direction of the first direction (L1); and/or the presence of a gas in the gas,

in the step of using the winding mechanism to sequentially fold and wind the hot melt adhesive tape (40) on a plurality of second positioning column groups (23) which are arranged at intervals: all the second light seams (322) are filled in such a way that they first run in the positive direction of the second direction (L2) and then in the negative direction of the second direction (L2).

7. Moulding process according to claim 5, characterized in that the ratio between the radial dimension of the strip of hot-melt adhesive (40) and the width of the first slot (321) is between 1/2 and 3/4 and/or the ratio between the radial dimension of the strip of hot-melt adhesive (40) and the width of the second slot (322) is between 1/2 and 3/4.

8. The molding method according to claim 5, wherein the step of performing heat curing treatment on the hot melt adhesive strip (40) on the LED lamp panel substrate (31) comprises:

and placing the LED lamp panel base body (31) wound with the hot-melt adhesive strip (40) and the forming jig into a vacuum oven for heating.

9. The molding method according to claim 8, wherein in the step of placing the LED lamp panel substrate (31) wound with the hot melt adhesive tape (40) and the molding jig in a vacuum oven for heating:

the heating temperature is between 80 ℃ and 120 ℃;

the heating time is between 1h and 24 h.

10. The molding method according to claim 5, further comprising: and after the hot-melt adhesive tape (40) on the LED lamp panel base body (31) is subjected to heating and curing treatment, separating the LED lamp panel base body (31) from the forming jig, and cutting the edge of the LED lamp panel base body (31) to remove the covering layer positioned outside the cross section of the LED lamp panel base body (31).

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